Kufambira mberi muFlexible PCB Materials uye Manufacturing

Mumakore achangopfuura, nyika yePCB inoshanduka (akadhindwa edunhu mabhodhi) yakaona kukura kwakakosha uye kufambira mberi kwetekinoroji. Zviitiko izvi zvakakonzera kuwedzera kwemugove wemusika uye kuwedzera maapplication nekuda kwemabhenefiti ega ega ekuchinja, kuonda, uye kureruka dhizaini. Muchinyorwa ichi chakazara, isu tichaongorora zvinhu zvekutanga zvinoshandiswa mumaPCB anochinjika, kuvandudzwa kwekuita kwavo, uye mamiriro ari kubuda eiyo inoshanduka PCB tekinoroji yekugadzira.

Kuvandudza Kuita kuburikidza ne Substrate Materials

Kushanda kwemaPCB anochinjika kunoenderana zvikuru nehunhu hwezvinhu zvinoshandiswa musubstrate. Masubstrate anoita basa rakakosha sezvo achishanda senzira yekufambisa zvinhu pamwe nemidziyo yekudzivirira kupisa pakati pemacircuit. Uyezve, anofanira kuratidza kugona kukotama nekukombama, izvo zvakakosha kune maPCB anochinjika.

Zvinhu zvinoshandiswa zvakanyanya pakugadzira maPCB anochinjika zvinosanganisira firimu rePolyimide (PI) nefirimu rePolyester (PET), pamwe nemamwe mafirimu epolymer akaita sePolyethylene Naphthalate (PEN), Polytetrafluoroethylene ( PTFE ), uye Aramid zviri kuwanawo mashandisirwo. Sarudzo yezvinhu zvesubstrate inofanira kunge yakavakirwa pakunyatsoongorora mashandiro azvo uye kushanda zvakanaka kwemari.

Polyimide (PI) Firimu

Polyimide firimu, thermosetting resin, inotungamira substrate zvinhu zvekuchinjika copper-clad laminates (FCCL). Kusiyana neakawanda thermosetting resins, PI haipfave kana kuyerera pakupisa kwakanyanya, ichiita kuti ive yakasarudzika yakakodzera maPCB anochinjika. PI inozvirumbidza yakakwira yekupisa kupikisa uye yakanakisa magetsi maitiro. Nekudaro, ine dhizaini maererano nekunyura kwehumidity uye kubvarura simba. Akakwidziridzwa PI mafirimu ane yakanyanya kuderera humidity absorption pa0.7%, zvichienzaniswa neyakajairwa chiyero che1.6%. Vanoratidzawo kugadzikana kwakadzikama, nekushivirira kwakaderedzwa kubva ± 0.04% kusvika ± 0.02%.

Polyester (PET) Firimu

PET resin inopa yakanaka mechanic uye magetsi kuita. Mhedzisiro yayo huru ndeye kushomeka kwayo kupisa kwekudzivirira, zvichiita kuti isakodzere kune yakananga soldering uye magungano maitiro. Nekudaro, kuita kwePolyethylene Naphthalate (PEN) kwakakwirisa kune iyo yePET asi inodonha pahunhu hwePI, zvichiita kuti ive imwe nzira yakakodzera mune mamwe maapplication.

Liquid Crystal Polymer (LCP)

Kune magadzirirwo eRF akapfava uye magadzirirwo eflex ane frequency yakakwira, Highleap inogona zvakare kuongorora purojekiti yekugadzira yeLCP PCB pamwe chete ne flex stackup uye assembly package.

Kugadzirisa zvipimo zvePolyimide substrates, Liquid Crystal Polymer (LCP) yabuda seimwe inovimbisa imwe nzira. LCP chinhu chinonzi thermoplastic chinogona kugadziriswa kuita mafirimu matete akakodzera maPCB. Inoratidza kunyura kwakadzika (0.04%) uye dielectric constant ye2.85 (1GHz), zvichiita kuti ive yakakodzera kune yakakwirira-frequency digital circuits. Zvivakwa zveLCP, zvinosanganisira kuenderana kwepamusoro-soro, kugadzikana kwemafuta, uye kunyura kwakadzika, zvakakonzera kutorwa kwayo mukugadzira PCB inoshanduka.

Halogen-Yemahara Substrate Zvishandiso

Indasitiri yemagetsi yaona shanduko ichienda kune mutoro wekuchengetedza nharaunda. Mitemo yakaita seRoHS (Restriction of Hazardous Substances) neWEEE (Waste Electrical and Electronic Equipment) yakarambidza kushandiswa kwezvinhu zvine njodzi mumidziyo yemagetsi. Nekuda kweizvozvo, zvinhu zvisina halogen substrate zvinoenderana nezvinodiwa nenharaunda zvakagadzirwa uye ikozvino zvinoshandiswa zvakanyanya muPCB dzakasimba uye dzinochinjika.

Kuvandudza Substrate Materials

Sezvo kudiwa kwemaPCB anochinjika kuri kuramba kuchikura, kutsvagisa nekuvandudza kuri kuenderera mberi kutsvaga zvinhu zvitsva zve substrate zvinogona kuwedzera kushanda kwemasekete anochinjika. Nemhando dzinopfuura 2000 dzemafirimu epurasitiki anowanikwa pasi rese, hapana mubvunzo kuti pane mukana wekuwana zvinhu zvinogona kupfuudza miganhu yekugadzirwa kwePCB inochinjika.

Basa reAdhesive muFlexible PCBs

Kune polyimide flex builds dzinoda sisitimu yekunamatira yakatsanangurwa, maitiro eDuPont Pyralux LF flexible-circuit anobatsira zvakanyanya pakushandisa zvinhu zvisati zvaburitswa.

Adhesive chinhu chakakosha muPCB inoshanduka, sezvo ine basa rekubatanidza foil yemhangura uye substrate zvinhu firimu. Zvinamira zvakaiswa muzvikamu zvakasiyana, zvinosanganisira PI resin, PET resin, modified epoxy resin, uye acrylic resin. Pakati peizvi, epoxy resin yakagadziridzwa uye acrylic resin ndiyo inonyanya kushandiswa nekuda kwesimba rayo rekunamatira.

Maviri-Layer PI Substrate Material

Traditional flexible copper-clad laminate (FCCL) inowanzova nezvikamu zvitatu: polyimide, adhesive, uye foil yemhangura. Nekudaro, iyo inonamira layer inogona dzimwe nguva kukanganisa kuita kwePCB inoshanduka, kunyanya maererano nekuita kwemagetsi uye kugadzikana kwedimensional. Kugadzirisa nyaya iyi, maviri-layer flexible CCL (2L-FCCL) isina adhesive yakagadzirwa. Kufambira mberi uku hakungonatsiridze kugarisana kwezvakatipoteredza kwemaPCB anochinjika asi kunosanganawo nezvinodiwa zvekutengesa-isina lead nekusimudza tembiricha kubva pa220 ° C kusvika 260-300 ° C. Kuenzanisa pakati pe2L-FCCL isina adhesive uye 3L-FCCL ine adhesive inopihwa muTafura 1 pazasi.

Nzira nhatu dzinowanzo shandiswa kugadzira 2L-FCCL:

1. electroplating
2. Kupfeka firimu
3. Nyoni

Imwe neimwe nzira ine zvayakanakira uye inosarudzwa zvichienderana nezvinodiwa chaizvo. Electroplating, semuenzaniso, yakanakira kugadzira kugadzirwa uye yakatetepa substrate zvinhu, ichipa inodhura-inoshanda mhinduro. Firimu yekuputira yakanakira kugadzirwa kwehuwandu, inopa mutengo-kubudirira. Lamination, kune rumwe rutivi, inokunda mukugadzira mapuranga maviri-mativi.

Liquid Crystal Polymer (LCP) Substrate Material

Liquid Crystal Polymer (LCP) chinhu chitsva che substrate chinotsvaga kugadzirisa zvipimo zvepolyimide substrates. Firimu reLCP rakaputirwa nefoiri yemhangura uye rinodzvanywa rinopisa kuti rigadzire mativi maviri kana maviri-mativi emhangura-clad laminates (CCL). LCP-based CCLs inopa zvivakwa zvakasarudzika, zvinosanganisira yakaderera mvura yekunyudza mwero we 0.04% chete uye dielectric inogara inoenderana nepamusoro-frequency dhijitari maseketi (2.85 pa1GHz). Zvivakwa zveLCP zvinoita kuti ive sarudzo yakanaka kune yakakwira-frequency application mumaPCB anochinjika.

Halogen-Yemahara Flexible Substrate Zvishandiso

Mitemo yezvakatipoteredza yakamanikidza indasitiri yemagetsi kuti ichinje kune halogen-isina substrate zvinhu. Kubva 2003, EU yakaisa RoHS uye WEEE mirau, kurambidza kushandiswa kwezvinhu zvitanhatu zvine njodzi uye kudzora magadzirirwo emarara emagetsi nemidziyo yemagetsi. Iyi mirairo yakakanganisa zvinhu zvinoshandiswa muPCBs, kusanganisira inoshanduka maPCB. Nekuda kweizvozvo, zvikamu zvakasiyana zvePCB inoshanduka, seFCCL, chivharo, prepreg, solder mask, uye mabhodhi ekusimbisa, anofanirwa kusangana nemoto kuramba uye halogen-isina zvinodiwa.

Kufambira mberi muCopper Foil

Conductivity chinhu chakakosha muPCB inoshanduka, uye foil yemhangura inoshanda seyakanyanya kuitisa zvinhu. Pamusoro pemhangura, alloy zvinhu zvakaita sealuminium, nickel, goridhe, uye sirivheri dzimwe nguva zvinoshandiswa. Kusarudzwa kwefoiri yemhangura kunobva pane chaiyo yekushandisa uye nzira yekugadzira.

Electro Deposit (ED) Copper Foil

ED copper foil ndeimwe yeanonyanya kushandiswa kuitisa zvinhu mumaPCB anochinjika. Iyo inoratidzirwa nehove-scale crystal structure, zvichiita kuti iite foil yemhangura yakatsetseka nekuoma kwakanaka. ED copper foil yakanyatsokodzera kune dynamically flexible PCBs inoda kuchinjika kwakanyanya.

Yakakungurutswa uye Yakanamirwa (RA) Copper Foil

RA yemhangura foil, kune rumwe rutivi, inoratidzira columnar crystal chimiro, zvichikonzera kunyange uye flat chimiro. Rudzi urwu rwemhangura foil yakanakira roughening uye etching maitiro. RA copper foil inowanzo shandiswa mune yakakwirira-density inoshanduka PCBs.

Zvirikuitika Zvinodiwa muCopper Foil

Sezvo kudiwa kweakakwira-density inochinjika maPCB ane akakwenenzverwa mbichana kubva pa40μm kusvika 50μm kuwedzera, zvinodiwa zvitsva zvinoiswa pakugadzira foil yemhangura. Izvi zvinodikanwa zvinosanganisira kuderera kwepasi roughness uye Ultra-yakatetepa mhangura foil kuti isangane nezvinodiwa zvehuwandu-vhoriyamu PCB kugadzirwa.

Conductive Silver Paste

Flexible PCB kugadzirwa kunosanganisira kushandiswa kweinki inodhinda, iyo inodhindwa pane insulating firimu kugadzira waya kana nhovo dzekudzivirira. Conductive sirivheri paste ndiyo yekutanga zvinhu zvinoshandiswa pachinangwa ichi. Izvo zvakakosha kuti iyo yakadhindwa conductive layer iratidze kushomeka kushoma, inovimbisa kubatana kwakasimba, uye inochengetedza kuchinjika. Uyezve, kudhinda kunofanira kuitwa nyore nyore, uye kurapa kunofanira kukurumidza.

Yemazuva ano conductive sirivheri paste inosangana nezvinodikanwa izvi, zvichiita kuti kuumbwa kwemaitiro ekuitisa pane thermosetting kana thermoplastic polymer mafirimu, machira, uye bepa. Iyi tekinoroji inowedzerawo pakugadzira magiraidhi anoshandiswa muRFID zvigadzirwa. Zvigadzirwa zvekupedzisira zvine conductive sirivheri paste zvakayedzwa zvine simba kuchengetedza-tembiricha, humidity kuramba, uye yakakwirira uye yakaderera-yekushisa bhasikoro kuita. Conductive sirivheri paste inoenderana nekuchengetedzwa kwezvakatipoteredza zvinodiwa uye mutengo-kubudirira.

Photosensitive Polyimide (PI) Coverlay

Traditional PI/adhesive coverlays vakatarisana nezvinogumira mukusangana nezvinodiwa zvehigh-density, dimensionally kugadzikana, uye nharaunda inochinjika PCBs. Mukupindura, Photo-Imageable Coverlay (PIC) yakagadzirwa. PIC, zvichienderana neakagadziridzwa epoxy kana acrylic resins, yakawana mukurumbira nekuda kwekugadziriswa kwayo kwepamusoro, simba rekubatanidza rakanakisa, uye kuchinjika. Nekudaro, aya maPIC ane zvisingakwanisi, kusanganisira kudzika kwakadzika pakadzika-density PCBs, yakaderera girazi tembiricha yekuchinja (Tg), uye kushoma kwemafuta kuramba.

mhedziso

Flexible PCBs dzauya kure kure maererano nemidziyo uye matekinoroji ekugadzira. Kufambira mberi mune substrate zvinhu, foils yemhangura, conductive pastes, uye zvivharo zvakavhura mikana mitsva yekukwirira-density, high-frequency, uye zvakatipoteredza flexible PCBs. Sezvo kudiwa kwemagetsi anochinjika kuri kuramba kuchikura, zviri pachena kuti kuenderera mberi kwekutsvagisa uye kuedza kwekusimudzira kunotungamira kune humwe hutsva muzvinhu uye maitiro.

Kune inoshanda uye yakavimbika inochinjika PCB kugadzira, funga kusvika kune Highleap Electronic. Neanopfuura makore gumi echiitiko mukugadzira PCB inoshanduka, isu takashongedzerwa kusangana nezvido zvako uye nekupa mhinduro dzemhando yepamusoro. Bata nesu nhasi kuti tikurukure yako inochinjika yedunhu bhodhi kugadzira uye zvinodiwa negungano kana kukumbira inochinjika PCB quote. Remangwana remagetsi anochinjika rakajeka, uye isu tiri pano kuti tikubatsire kuunza mazano ako matsva muhupenyu.