Mutengo weTaconic TLY PCB uye Quotation yePCBA

Mutengo weTaconic TLY PCB uye mutengo wePCBA

Highleap Electronics inopa mitengo yeTaconic TLY PCB ye77 GHz radar, mmWave antennas, satellite RF, aerospace modules uye zvigadzirwa zve microwave zvinorasikirwa zvishoma. Mitengo inogona kusanganisira TLY laminate chaiyo, kugadzirwa kwePCB kwakanyatsogadzirwa, kuongororwa kwekutanga, kuwanikwa kwezvikamu, RF assembly, X-ray, kuyedzwa kwakatsanangurwa nevatengi, kurongedza uye kutumira.

Hapana mutengo mumwe chete weTLY unoshanda. TLY-3, TLY-5, TLY-5A, TLY-5Z uye zvivakwa zvekare zvakasiyana mu data re dielectric, kuwanikwa kweukobvu, copper, handling panel, PTH reliability, material leave uye mashandisirwo. Highleap prices the released grade uye process pane kuisa mhuri muboka pasi pemutengo mumwe chete.

Musiyano Unoenderana Nemutengo weTLY-3, TLY-5 uye TLY-5Z

Data reAGC riripo parizvino rinoisa TLY-3 neTLY-5 sezvinhu zvePTFE zvakarukwa zvine girazi rakaderera zvikuru, zvisinganyanyi kurasikirwa zvekushandisa radar, satellite, cellular uye aerospace. TLY-5Z inoshandisa chimiro chakarukwa chakazara negirazi chakagadzirirwa kuwedzera Z-axis yakaderera uye kugadzikana kwakapfava kwepurasitiki. Kusarudza pakati pazvo kunoshandura dhizaini yemagetsi uye mutengo wekugadzira.

Giredhi razvino Ruzivo / nzvimbo dzakaburitswa Kukanganisa kukuru kwemashoko akataurwa
TLY-3 Dr 2.33 ± 0.02; Df 0.0012; zvinhu zveRF/mmWave zvine mwero wakaderera zvikuru. Ukobvu chaihwo, mhangura, goho repaneru, chimiro chakanaka uye chiyero chekugamuchirwa kweRF.
TLY-5 Dr 2.2 ± 0.02; Df 0.0009; zvinhu zvinorasikirwa zvakanyanya zvinoshandiswa pa77 GHz nemmWave. Kubata zvinhu zvakatetepa, chimiro chemhangura, zviyero zvakakosha uye zvinodiwa pakuedza.
TLY-5Z Dr 2.2 ± 0.04; Df 0.0015; zvinhu zvine axis yeZ yakaderera zvine PTH-stability positioning. Kugadzirwa kwePTH, ukobvu, zvinodiwa nekanika uye modhi yemagetsi inotenderwa.
Nhaka/imwe TLY Shandisa pepa reruzivo rwevatengi rinodzorwa uye sosi yakatenderwa. Kutengeswa, MOQ, zvitupa, zvitupa uye mutengo wekuchinja.

Mareferensi epamutemo: AGC TLY-3, AGC TLY-5 uye AGC TLY-5Z.

Mutengo weTaconic TLY PCB neGiredhi neKuvakwa

Mhuri yeTLY ine magadzirirwo akasiyana ePTFE ane Dk yakaderera. Mapeji eAGC aripo iye zvino anoratidza TLY-3, TLY-5 uye TLY-5Z, ane maitiro akasiyana eDk, Df, density, Z-axis uye nzvimbo yekushandisa. Saka "mutengo weTLY PCB" unoda giredhi chaiyo uye kuvakwa kwayo.

Zvinogona Kusanganisira Highleap TLY Quotation

Nzvimbo yeprojekiti Rutsigiro rwepurojekiti yeHighleap
Kutenga zvinhu Giredhi chaiyo, ukobvu, mhangura, MOQ, chitupa uye kuwanikwa
Precision kugadzirwa Kubata mapaneru matete, RF etching, PTH, maficha emakanika, bvunzo yemagetsi uye kuongorora
Umboo hwemhando Zviyero zvakakosha, mushumo wenyaya yekutanga, zvinyorwa zve impedance/RF uye X-ray kana zvataurwa
gungano Zvikamu, stencil/NRE, MMIC/QFN/BGA, RF connectors, nhoo uye kucheneswa kunodzorwa
Testing Kuronga mapurogiramu, bvunzo dzekushanda uye kusimbiswa kweradar/mmWave zvinoenderana nevatengi
Kuendesa/rutsigiro Maitiro emuenzaniso uye huwandu, kurongedza, mafambiro emota, kuteverwa uye kudzora kurongeka kwekudzokorora

Highleap Rigid RF PCB Kugadzira Kugona

Miganhu yefekitori yakaburitswa pazasi inopa hwaro hwekuongorora mutengo weTLY. Kubata kwePTFE yakatetepa, RF critical dimensions, copper isina kunyatsojeka, rutsigiro rwepaneru uye kuyedza zvinogona kupfupisa hwindo rekushanda kweTLY. Ona tafura yakazara yeHighleap rigid PCB yekugona kuti uwane zvirevo zvefekitori yakaburitswa.

Chinhu chekugadzira Kugona kwakabudiswa kweHighleap Mamiriro epurojekiti yeRF/PTFE
Maximum layer count Kusvikira ku60 layer Kuwanda kwezvikamu zveRF/PTFE kana hybrid stackup kunosimbiswa mushure mekuiswa kwelamination, kunyoreswa, kuburikidza nekuongorora zvinhu.
Nzvimbo/nzvimbo shoma yemukati mechikamu 2/2 mirimita (0.05/0.05 mm) Maitiro eRF akaburitswa anoenderanawo nekukora kwemhangura, rudzi rwefoil, muripo we etch uye kushivirira kwehukuru hwakakosha.
Nzvimbo/nzvimbo shoma yekunze 2/2 mirimita (0.05/0.05 mm) Maburi madiki eRF uye maumbirwo akabatana zvinoda kuti purojekiti ishande uye kuti zviongororwe zvinoenderana nezvinodiwa.
Board ukobvu siyana 0.2-8.0 mm Ukobvu huripo hwekuvaka Taconic/AGC hunoenderana negeji ye laminate, nzira yekubatanidza uye stackup inotenderwa.
Kushivirira ukobvu hwebhodhi ± 0.1 mm pasi pe 1.0 mm; ± 10% pa 1.0 mm zvichikwira Kuburitswa kweRF connector uye enclosure interfaces zvinofanira kutaura chero chinhu chakaoma chinodiwa padanho rechigadzirwa.
Saizi shoma yebhodhi rapera 10 × 10 mm Maseketi madiki anogona kuda kutumirwa mupaneru yekugadzira kana array kuti igadziriswe uye iunganidzwe.
Saizi yepamusoro yebhodhi yakapedzwa 22.5 × 47.5 mu (571.5 × 1206.5 mm) Mabhodhi ePTFE ane mafomu makuru anoda kuongororwa kwakasiyana kwehukuru hwepepa rezvinhu, kunyoreswa, kuti rakatsetseka sei, kuti zvinhu zvinofambiswa sei uye kuti zvinotumirwa sei.
Mhete shoma yemuchina yekuboorera / mhete yeannular 0.15 mamirimita / 0.127 mm Dhizaini yekupedzisira inoenderana nekukora kwebhodhi, chiyero cheaspect, zvinodiwa pakuputira uye maitiro ekuboorera anoenderana nezvinhu.
Mhete shoma yelaser / annular ring 0.075 mamirimita / 0.075 mm Ma microvia eLaser anogona kuenzaniswa nehukobvu hwe dielectric, dhizaini ye capture-pad, kuvakwa kwemhangura uye ongororo ye sequentially-lamination.
Chiyero cheMechanical-drill Kusvikira ku 20: 1 Chiyero chinogoneka chekuvaka RF/PTFE chinofanira kusimbiswa nehukuru hwegomba hwakapedzwa, ukobvu hwebhodhi uye zvinodiwa zveplating.
Chiyero cheLaser-drill 1:1 Microvia geometry inoburitswa chete mushure mekuongororwa kwe stackup uye kuvimbika.
Mhangura yepamusoro yemukati/yekunze Kusvikira 10 oz Mhangura yepamusoro haigone kusanganiswa otomatiki nenzvimbo/nzvimbo yakanakisisa kana PTFE yega yega yakagadzirwa.
Kushivirira kwePTH / NPTH PTH ±0.075 mm; NPTH ±0.05 mm Maburi ekubatanidza neRF grounding anofanira kuratidza dhayamita rakapedzwa uye chero chinhu chipi zvacho chinodiwa kuti chikwane.
Kushivirira kwenzvimbo dzakaita sedenderedzwa ± 0.1 mm Maburi emumucheto, maburi, nzvimbo dzinopinzwa uye nzvimbo dzinobatanidza zvinogona kuda hurongwa hwakatsaurirwa hwekudzora mativi.
Kushivirira kweimpedance inodzorwa Imwe chete uye musiyano: ±5 Ω pa ≤50 Ω; ±7% pamusoro pe50 Ω Kushivirira kwakataurwa kunoshanda kune stackup yakatenderwa, nzira yekukuponi uye nzira yekuyera.
Kupera kwepamusoro kunowanikwa ENIG, ENEPIG, OSP, HASL, sirivha yekunyudza, gaba rekunyudza, goridhe rakapenya, minwe yegoridhe rakaoma negoridhe Kusarudzwa kwekupedzisira kunoongororwa kuti uone kurasikirwa kweRF, kusungirirwa, kubatana kwewaya, kubatana kweconnector uye zvinodiwa zvakatipoteredza.

Ziviso yekugona-kusanganisa: kukosha kuri patafura imiganhu yekugona kwemufekitori wega wega. Kuwanda kwezvikamu, 2/2 mil geometry, 10 oz copper, saizi yepamusoro yepaneru, 20:1 aspect ratio uye kuvakwa kwebhodhi rakatetepa hazvifungidzirwe kuti zvinogoneka panguva imwe chete. Highleap inosimbisa musanganiswa unoshandiswa mushure mekuongorora chaiwo material, stackup, copper, drill, RF tolerance, surface finish uye assembly package.

Muenzaniso wemhuri Nzvimbo dzakaburitswa Zvinoreva zvekutengeserana
TLY-3 Zvinhu zvePTFE zvakarukwa zvegirazi zvakaderera zvikuru zveDk, Drk 2.33 ±0.02 Magadzirirwo akasiyana ejometri nemidziyo kubva kumagiredhi eDk-2.2.
TLY-5 Zvinhu zvine dhayi shoma, zvinorasikirwa zvishoma, dhayi 2.2 ± 0.02 Zvakajairika mukukurukurirana kwe mmWave/radar; ukobvu uye mhangura zvichiri kudzora mutengo.
TLY-5Z Kuvakwa kweLow-Dk, lower-Z-axis-expansion uye low-density construction Inogona kusarudzwa kuti ishandiswe sePTH stability kana kuti ine mashandisirwo akareruka; haina mutengo wakafanana neTLY-5 yakajairwa.
Kodhi yemutengi yekare kana yemutengi Zvinogona kureva TLY yekare kana kuti mukati Inoda TDS inodzorwa uye sosi inotenderwa isati yapihwa mutengo.

Highleap inotaura giredhi, ukobvu, mhangura, tsime, zvinodiwa zvechitupa uye zvimwe zvinobvumidzwa mukotesheni. Hapana nhengo yemhuri yeTLY inotsiviwa chete nekuti zita rayo kana zita rayo rekuti Dr riri pedyo.

Kukobvu Kwezvinhu, Mhangura, uye Kushandiswa Kwemapaneru

Mutengo weTLY unokanganiswa zvakanyanya nehukobvu hwelaminate uye sarudzo yemhangura. Matinji matete e mmWave, mhangura isina chimiro chakanaka/yakamonerwa uye magadzirirwo epepa asina mwero anogona kunge akasiyana pakuwanikwa, mutengo mudiki wekutenga uye kugona kubata.

Kuparadzanisa Mutengo weZvinhu kubva kuNjodzi dzeKugadzira

Mutengo wakaderera we laminate hauvimbise mutengo wakaderera wePCB kana kuvaka kwacho kukaderedza goho repaneru, kuda kubatwa kwakasimba, kuwedzera njodzi yePTH kana kuchinja zvinodiwa pakuyedza RF. Highleap inotsanangura madhiraivha iwayo uye inogona kuenzanisa sarudzo dzeTLY nemutengo wePCB we laminate wakaderera kana dzimwe nzira dzakatenderwa kana muridzi wedhizaini akabvumidza dzimwe nzira.

  • ukobvu chaihwo hwe dielectric uye kushivirira;
  • mhando yefoiri yemhangura, huremu uye chimiro chepamusoro;
  • zviyero zvebhodhi rakapedzwa uye huwandu pabhodhi rekugadzira;
  • maturusi ekushandisa, makuponi, mafiducials uye zvinodiwa zvepaneru yemusangano;
  • kurongeka kwebhodhi uko chimiro chakarukwa kana geometry yeantenna inokosha;
  • goho rinoshanda mushure mekurongeka, makuponi ekuyedza uye maficha ekunze-kutanga.

Highleap inoongorora mashandisirwo ezvinhu pamwe chete nemuenzaniso wepamusoro wePCB cost uye sarudzo yeRF copper foil . Mazano ekuderedza mitengo anotarisa pane zvakajairika zviripo uye mashandisirwo ari nani epaneru, kwete shanduko isingatenderwe mukushanda kwemagetsi.

Kugadzira uye Mutengo Wemhando Yepamusoro weTLY Circuits

Mutengo wekugadzira weTLY unopfuura pepa rePTFE. Kubata zvinhu zvakatetepa, kufungidzira nemazvo, kubhadharisa etch, kugadzirira maburi akaputirwa, maficha elaser, hybrid lamination, rutsigiro rwenzira uye humbowo hweRF zvinogona kukosha.

Nzvimbo yemutengo Nei zvichidikanwa Maitiro ekuidzora
Kufungidzira/kutema kweRF kwakanyatsojeka mmWave geometry inogona kunzwisiswa nekuchinja kudiki kwehukuru Tsvaga chete zvinhu zvakakosha uye zvinoyerwa.
PTH kana kuburikidza nekugadzirisa Kugadzirira zvinhu zvakasiyana-siyana uye kuvimbika kwegomba Shandisa maburi/aspect ratios anogadzirwa uye chiyero che microsection chakatsanangurwa.
Kuisa kwehybrid Sisitimu yekubatanidza, kuyerera, kumanikidzwa uye kunyoreswa Ipai muunganidzwa wakaburitswa uye dzivisai kudzvanya kusingakoshi.
Makuponi eRF/bvunzo Inosimbisa zvinodiwa zve impedance, kurasikirwa kana chikamu Bvumiranai nzira yekuyedza uye kutora sampuro musati mashandisa.
Mechanical rutsigiro Mapaneru matete anoda zvinhu zvekushandisa uye nzira dzekudzivirira Gadzirai mapaneru akasimba uye rutsigiro rwekutumira.
Quality zvinyorwa Kutevedza, FAI, zvinyorwa zvehukuru uye zvemagetsi Taura humbowo hunodiwa pachibvumirano kwete mishumo yakajairika.

Maitiro ekushivirira RF eHighleap uye sarudzo dzekuongorora RF PCB zvinoshandiswa kutsanangura humbowo hunodiwa pakugadzira.

Kuronga Mutengo weTLY Prototype, NPI, uye Volume

Mitengo yemuenzaniso weTLY inosanganisira zvinhu zvishoma, mainjiniya, maturusi uye gadziriro muhuwandu hushoma. NPI inowedzera ongororo yechinyorwa chekutanga, kudzidza kwekuunganidza uye kugadzira bvunzo. Mutengo wehuwandu unogona kuvandudzika nekutenga kwekufungidzira, kudzokorora maturusi, kugadzirisa mapaneru uye hurongwa hwekuburitsa hwakagadzikana.

Stage Chinangwa chikuru chemutengo Highleap quotation output
kumumvuri Zvishoma zvinhu uye mhinduro yekukurumidza yeinjiniya Sarudzo dzakajairika uye dzekukurumidzira dzine humbowo hwakakosha.
Kusimbiswa kweRF Zviyero zvakakosha, makuponi, kutanga kwekubatanidza uye bvunzo yeRF Chirongwa chekutanga uye bvunzo yakasiyana/NRE.
Mutyairi wePCBA Kuwanikwa kweBOM, stencil, chigadzirwa, kuongorora uye kuronga Bhodhi risina chinhu, gadziriro, gungano uye kupatsanurwa kwebvunzo.
vhorumu Kubudirira kwepaneru, kufanotaura kwezvinhu, mitengo yezvinhu uye kufambira mberi kwekutumira Kuderedzwa kwehuwandu uye mitengo yekuburitswa kwakarongwa.
Chirongwa chehupenyu hurefu Kuenderera mberi kwezvinhu, kutonga shanduko uye kuteverwa Nzira yekubhukha/yechipiri inofanira kutenderwa.

Mutengo wePCBA unogadzirwa kubva muBOM nemusanganiswa wepakeji uchishandisa zvinhu zvinodhura zvePCB assembly uye sevhisi yeHighleap's turnkey PCB assembly.

Kumbira Mutengo weTaconic TLY PCB

Nguva Yekutungamira: Zvinhu Nebvunzo Zvinowanzoisa Nzira Yakakosha

Nguva yekutungamira TLY inoenderana negiredhi chaiyo, ukobvu, mhangura, huwandu hunodiwa, kuoma kwekugadzirwa, zvikamu zvekuunganidza uye bvunzo yeRF. Highleap inosimbisa zvinhu izvozvo isati yaita zuva.

Highleap inosimbisa kuti zvinhu zvinotengeswa nguvai mushure mekuwanikwa kwezvinhu, kugona kwekugadzira zvinhu zvakanaka, mamiriro echikamu chekugadzira zvinhu uye kugadzirira bvunzo zvinozivikanwa. Kugadzirwa nekukurumidza, kuunganidza zvinhu zvekutanga uye kutumirwa kwezvinhu zvinotengeswa nemitengo yakasiyana uye zvinorongwa sezvinhu zvinounzwa zvakasiyana uko zvinoderedza njodzi yechirongwa.

  • ongororo yezvinhu zvakakosha uye kugadzirwa kwezvinhu kuburikidza kugadzira PCB nekukurumidza;
  • kutumira zvinhu zvisina chinhu kana zvinhu zvekutanga kuti zviongororwe neRF pakutanga;
  • chikamu chekuunganidza chakasiyana kana zvikamu kana zvigadziriso zvine nguva yakareba yekutungamira;
  • kupatsanura huwandu hwezvinhu kana kusimbiswa kwekugadzirwa kwacho kuchigona kutanga odha isati yakwana;
  • fungidziro uye kuronga zvinhu zvakachengetwa kuti zvidzokororwe kudiwa.

Chirevo chinoratidza fungidziro yezuva uye chero chiito chemutengi chinodiwa kuti purogiramu irambe iripo, senge mvumo yekuunganidza zvinhu, mvumo yezvikamu zvakasiyana, kuburitswa kwezvishandiso zvekuyedza kana kugamuchirwa kwekutumira kwakapatsanurwa.

Kumbira Mutengo weTLY PCB uye Purogiramu yePCBA

Tumira giredhi reTLY chairo, zvinodiwa nezvinhu/ukobvu/mhangura, Gerber/ODB++, dhizaini yekugadzira, stackup, RF geometry kana impedance, drill/route data, surface finish, huwandu, zuva rakananga, nzvimbo yekutumira, BOM, centroid, mifananidzo yekuunganidza, firmware uye test specification kuburikidza neHighleap quick quote kana kubata Highleap.

Pakugadzira TLY-5 mmWave, ongorora kugadzirwa kweTLY-5 PCB . Kuti uenzanise mamwe maRF laminates, shandisa kuenzanisa zvinhu zveRF PCB.

Highleap inogona here kutora mutengo weTLY PCB kubva pahukuru hwebhodhi chete?

Bhajeti shoma rinogona kukwanisika. Mutengo wekambani unoda giredhi chaiyo, ukobvu hwe dielectric, mhangura, data rekugadzira, huwandu, kupedzisa uye mhando/chiyero chekuyedza.

Ndeipi TLY grade yakachipa?

Hapana mhinduro yakajairika. Giredhi, ukobvu, mhangura, stock, goho repaneru, maitiro uye qualification zvinosarudza mutengo wese.

Ko Highleap inogona kupa prototype yeTLY inokurumidza here?

Kugadzirwa nekukurumidza kunogona kuwanikwa mushure mekuburitswa kwezvinhu nehunyanzvi. Mashoko aya anoti zvinhu zvakakosha pakugadzira nekubatanidza.

Ko Highleap inogona kusanganisira RF assembly uye bvunzo here?

Ehe. BOM, njodzi dzepakeji, fixture, calibration, frequency uye kugamuchirwa miganhu zvinofanirwa kupihwa kana kutaurwa sekuvandudzwa kwekuyedza.

Ruzivo rupi runodiwa pamutengo wekambani weTLY PCB?

Ipa giredhi chaiyo, ukobvu, mhangura, Gerber/ODB++, kudhirowa, kuunganidzwa, zviyero zvakakosha zveRF, huwandu, kuendeswa kwakatarwa, BOM, madhirowa ekuunganidza uye zvinodiwa zvekuyedza.

Ko Highleap inogona kupa zano rekudzikisa mitengo pasina kuchinja mashandiro eRF here?

Highleap inogona kuongorora mashandisirwo epaneru, magadzirirwo emidziyo yakajairika, kugoverwa kwemvumo, mwero wekuongorora, kugoverwa kwakapatsanurwa uye kurongedza kwekubatanidza. Chero chinhu, ukobvu, mhangura kana shanduko yemagetsi inoda mvumo yemutengi isati yaburitswa mutengo.

get-instant-quote

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Nzira yekuwana sei quote yePCBs

Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:

    • Gerber, ODB++, kana .pcb, spec.
    • BOM rondedzero kana iwe uchida kusangana
    • uwandu
    • Kuchinja nguva
Pamusoro pekugadzira PCB, isu tinopa huwandu hwakakwana hwemagetsi masevhisi, anosanganisira PCB dhizaini, PCBA, uye turnkey mhinduro. Kunyangwe iwe uchida rubatsiro neprototyping, dhizaini yekusimbisa, kutsvagisa chikamu, kana kugadzirwa kwakawanda, isu tinopa yekupedzisira-kusvika-kumagumo rutsigiro kuti uve nechokwadi chekubudirira kweprojekiti yako.

Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.






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