Maitiro eCopper Foil uye Surface Inopedza Inobata Yakakwira-Frequency PCB Kuita

ziviso

Mukugadzirwa kwePCB ine mafrequency akakwirira , kudzikamiswa kwechiratidzo uye kugadzikana kweimpedance zvinokanganiswa zvakanyanya nekuomarara kwepombi yemhangura uye rudzi rwekupera kwenzvimbo inoshandiswa. Sezvo mafrequency ekushanda achipfuura 5 GHz kuenda kuma millimeter-wave ranges, kunyangwe kusiyana kudiki muhunhu hwepamusoro pe conductor kunoshandura mukurasikirwa kunoyerwa kwekuisa uye kuora kwekurasikirwa kwekudzoka. Kunzwisisa kuti zvinhu izvi zvinokanganisa sei mashandiro e high-frequency kwakakosha kuti uwane macircuit ane kurasikirwa kwakaderera uye akavimbika mumashandisirwo akasiyana kubva ku5G infrastructure kusvika kuma automotive radar systems. Paunenge uchiongorora sarudzo dze copper dzeLoPro dzeRogers RF boards , tsanangura kuvakwa kwe copper kunoshandiswa mu loss model uye simbisa kuti inoenderana nezvinhu zvakarairwa kugadzirwa.

1. Basa reMhangura Foil muHigh-Frequency PCBs

1.1 Mhando dzeCopper Foil

Kusarudzwa kwemhando yemhangura foil inonyanya kutarisisa iwo ekutanga kurasikirwa maitiro eyakakwira-frequency PCB. Imwe neimwe foil mhando inopa akasiyana epamusoro roughness profiles uye maitiro ekutengeserana-offs:

• Electro-deposited mhangura -Kushata kwepamusoro 4-8 μm, chiyero chezvishandiso zvakajairika pazasi 5 GHz.
• yakakungurutswa annealed mhangura - Hukasha pazasi 2 μm, yakagadziridzwa nemuchina kuitira kutsetseka kwepamusoro mumagadzirirwo ari pamusoro pe5 GHz.
• Reverse-yakagadziriswa foil - Yakagadziridzwa mazino chimiro padivi rekubatanidza ine yakatsetseka chiratidzo chepamusoro, kuenzanisa kunamatira uye kuita.
• Very-low-profile/Ultra-low-profile copper - Hushasha 0.5-1.5 μm, premium sarudzo yemafrequency anopfuura gumi GHz.

1.2 Kukasharara Kwepasi uye Chiratidzo Kurasika Mechanism

Kuomarara kwepamusoro kunokanganisa mashandiro ePCB ane frequency yakakwira kuburikidza nekubatana kwayo neganda, uko magetsi anosangana pedyo nepamusoro pemuchina wekufambisa sezvo frequency ichiwedzera. Kudzika kweganda kunodzikira kusvika pasi pe 0.7 micrometers pa 10 GHz mumhangura, inoverengerwa se √(2/ωμσ). Kana kuomarara kwepamusoro kwasvika kana kupfuura kudzika uku, nzira yemagetsi inoshanda inoreba zvakanyanya, zvichiwedzera kuramba kwepamusoro uye kurasikirwa kwekuisa. Kune mashandisirwo ema millimeter-wave anoda kudzikiswa kushoma, mhangura yakaputirwa kana kuti yakaderera zvakanyanya inova yakakosha pane kusarudza. NeHVLP foil mukugadzirwa nekubatanidzwa kwePCB , profile yemhangura yakarairwa inofanira kuenderana nepfungwa dzekurasikirwa kwechiratidzo uku ichiri kutsigira zvinodiwa zvekubatanidza nekugadzirisa zvakabvumiranwa.

2. Kupesvedzera kweSurface Finish pane Yakakwira-Frequency Performance

2.1 Mhedziso yeCommon Surface Finishes

Yakakwira-frequency PCB yekugadzira inoshandisa akati wandei epamusoro pekupedzisira sarudzo, imwe neimwe inoratidzira akasiyana emagetsi maitiro:

• ENIG - Electroless nickel (3-5 μm) ine goridhe rekunyudzwa, yakasimba asi yemagineti.
• ENEPIG -Inowedzera palladium layer pakati penickel negoridhe kuti iwedzere kuvimbika kwewaya bonding.
• Kunyudza Sirivha -Sirivha yakatetepa yakananga pamhangura, isiri-magnetic ine yakanaka conductivity.
• Kunyudza Tin - Copper-tin intermetallic layer, isiri-magnetic ine mwero pasherufu hupenyu.
• OSP - Organic coating isingasviki 0.5 μm gobvu, kushoma kwemagetsi maitiro asi hupenyu hushoma hwesherufu.

2.2 Mhedzisiro paChiratidzo cheKutendeseka

Hunhu hwemagineti hwemafinishi akavakirwa panickel hunounza kurasikirwa kwemasaini kunoyerwa mumagadzirirwo ePCB ane frequency yakakwira . Ma layers enickel asina electro anoratidza kupindirana kuri pakati pe100 ne500 zvichienderana nehuwandu hwephosphorus, zvichiita kuti pave nekuderera kwe2 GHz kuburikidza nekurasikirwa kwakanyanya kwemhedzisiro yeganda. Kunyudzwa kwesirivha neorganic solderability preservative kunodzivirira chirango ichi kuburikidza nehunhu husina magineti uye ukobvu hushoma, zvichiita kuti zvive zvakanaka kune nzira dzeRF signal dzakakosha.

2.3 Pamusoro Pekupedzisira uye Impedance Kudzora

Ukobvu uye dielectric zvimiro zvekupedzisa kwepasi zvinopesvedzera hunhu impedance mune yakakwira-frequency PCB kutapurirana mitsara. Electroless nickel kunyudza goridhe rinowedzera ese simbi uye dielectric akaturikidzana kune anoisa maconductors, zvinoda muripo mukuteedzera geometry kuchengetedza chinangwa chakanangana. Isiri-magineti inopera yakasanganiswa neyakatsetseka yemhangura foils inovimbisa impedance kuenderana uku ichideredza kupinza kurasikirwa zvirango.

3. Kudyidzana kwezvinhu uye Kugadzirisa Kugadzirisa

3.1 Yakasanganiswa Mhedzisiro yeMhangura uye Pedzisa

Kurasikirwa kwakawanda mumagadzirirwo ePCB ane frequency yakakwira kunokonzerwa nekuomarara kwepamusoro pemhangura uye kusangana kwekupedzisira kwenzvimbo. Kuyerwa kunoratidza kuti mhangura isina chimiro chakanyanya ine organic solderability preservative inopa kurasikirwa kwakaderera kwekupinza pane reverse-treated foil ine electroless nickel immersion gold pamusoro pe10 GHz. Nickel layer inosanganiswa nekuomarara kwemhangura kugadzira kurasikirwa kwekuwedzera uko mumwe nemumwe anoisa chiratidzo anowedzera kuora kwechiratidzo. Kune mashandisirwo ema millimeter-wave anopfuura 20 GHz, mhangura ine chimiro chakanyanya chakaderera yakabatana nesirivha kana OSP finishes inopa hunhu hwakanaka hwechiratidzo.

3.2 Mazano Anoshanda Ekugadzira

Material optimization yemapurojekiti ePCB akakwira-frequency inoda kunyatsotsanangurwa uye sarudzo dzehungwaru:

• Kumbira data yakadzama yehukasha - Tora ese ari maviri Rz (yakanyanya kureba) uye Ra (avhareji roughness) zvakatemwa kubva kune vanogadzira.
• Dzivisa nickel paRF nzira - Rondedzera kwete-magineti kupedzisa kweakakosha masaini chiteshi kunyangwe yakaderedzwa oxidation kuramba.
• Balance cost maringe nekuita - Yekutanga mhangura uye yekupedzisa musanganiswa kazhinji inowedzera mutengo une mwero uchiunza kurasikirwa kwakanyanya.
• Simbisa maitiro e impedance -Akaundi yekupedzisa ukobvu mumagetsi simulation kuti ive nechokwadi chekufanotaura kwe impedance.

4. Nyaya Mienzaniso

Iyo 5G yakakura MIMO radio module dhizaini inoratidza mabhenefiti ekugadzirisa zvinhu. Nekudoma yakanyanya-yakaderera-profile mhangura ine organic solderability inochengetedza pane antenna feed network pa28 GHz, dhizaini yakawana 0.3 dB per inch yekuisa kurasikirwa kurasikirwa ichienzaniswa neyakajairwa electro-yakaiswa mhangura ine electroless nickel kunyudzwa goridhe, kuwedzera kutaurirana uye kudzikisa simba amplifier zvinodiwa.

Automotive millimeter-wave radar masisitimu pa77 GHz inoda kuenzanisa kuita kwemagetsi nekuvimbika kwemuchina. Dhizaini yekugadzira yakashandiswa yakakungurutswa yemhangura ine electroless nickel electroless palladium kunyudzwa goridhe, uko yepakati palladium layer yakapa waya yekubatanidza kuenderana uku yakaderedzwa kushata kwemhangura yakaramba ichirasika yekuisa kurasikirwa kweradar yekumberi-kumagumo wedunhu kuburikidza nekuomesera kwekuongorora mota dzemotokari.

mhedziso

Kuita kwepamusoro-frequency PCB dhizaini kunoenderana zvakanyanya nemhangura foil pamusoro pehunhu uye yakashandiswa pamusoro pekupedzisira. Nzvimbo dzakakasharara dzemhangura uye magineti nickel akaturikidzana zvese zvinopa zvakayerwa kusaina kudzikisira pagigahertz frequencies, ine musanganiswa mhedzisiro kana yasanganiswa. Dhizaini mainjiniya anofanirwa kuongorora sarudzo dzezvinhu pakutanga mukusimudzira, kuenzanisa mashandiro emagetsi zvichienderana nemutengo wekugadzira uye kuvimbika zvinodiwa.

Highleap Electronics inopa kugona kwakazara kwekugadzira maPCB ane frequency yepamusoro :

• Yakaderera-kurasikirwa kwezvinhu kusarudzwa -Kuwana VLP/ULP mhangura foils uye isiri-magnetic pamusoro inopedza yakagadziridzwa yeGHz maapplication.
• Precision impedance control - Inodzorwa dielectric ukobvu uye inoteedzera geometry yekuenderana hunhu impedance pane ese ekugadzira mapaneru.
• Mishonga yepamusoro yepamusoro -Mazhinji ekupedzisa sarudzo anosanganisira ENIG, ENEPIG, kunyudza sirivheri, uye OSP ine zvakanyorwa zvemagetsi zvivakwa.
• RF-yakatarisana nedhizaini rutsigiro -Kubvunzurudzwa kweinjiniya pakusarudza zvinhu, stackup optimization, uye kurasikirwa kwebhajeti kuongororwa.

Bata Highleap Electronics kuti mukurukure zvinodiwa nePCB yenyu uye kuti mushandise hunyanzvi hwedu mukugadzirisa kuvimbika kwemasaini eRF nema millimeter-wave applications.