Gwaro rekusarudza HASL vs ENIG Surface Finish

Kusarudzwa kwekugadzirwa kwepurasitiki pamusoro pechinhu kunokosha zvikuru pakusarudza mashandiro, kugara kwenguva refu, uye kuvimbika kwechigadzirwa chebhodhi redunhu rakadhindwa. Pakati pezvakawanda zviripo, Hot Air Solder Leveling (HASL) neElectroless Nickel Immersion Gold (ENIG) zvinoonekwa sezvimwe zvezvigadzirwa zvinonyanya kushandiswa zvakanyanya pamusoro pechinhu.

Chii chinonzi HASL (Hot Air Solder Leveling)

HASL inosanganisira kupfekedza PCB neturu yerata/lead solder. Izvi zvinowanikwa nekunyudza bhodhi mubhati yakanyungudutswa ye solder uye ipapo kuenzanisa kubva kune yakawandisa solder uchishandisa mhepo inopisa mapanga.Maitirwo anotanga nekugadzirwa kwePCB, ichiteverwa nekuisa solder, kuenzana, uye kutonhora. Nhanho imwe neimwe yakakosha pakusimbisa yunifomu uye inopindirana coating.
Mukana wekutanga weHASL kushambadzira kwayo kwakanakisa, zvichiita kuti ive yakanakira nzira dzakajairwa dzekutengesa. Kana ichienzaniswa nekumwe kupedzisa, HASL haina kudhura uye inowanikwa zvakanyanya, zvichiita kuti ive mhinduro inodhura kune akawanda maapplication. Iyo solder layer inopa dziviriro yakanaka kubva kune oxidation, ichipa hupenyu hurefu hwePCB.

Chii chinonzi ENIG (Electroless Nickel Immersion Gold)

ENIG inosanganisira kuisa chidimbu chitete chenickel chinoteverwa nechidimbu chegoridhe pamusoro pemhangura yePCB. Maitiro anotanga nekucheneswa kwemhangura, inoteverwa nekemikari yekuisa nickel uyezve goridhe. Iyo nickel layer inoshanda sechipinganidzo kumhangura uye inzvimbo iyo solder ichasungirirwa, nepo goridhe inodzivirira nickel panguva yekuchengetedza.
ENIG inopa nzvimbo yakati sandara, iyo yakakosha pakumisikidza zvakanaka-pitch pamusoro pemasevhisi epamusoro uye kune maapplication anoda mwero wepamusoro wekurongeka.
Iyo goridhe layer inopa kuchengetedzwa kwepamusoro kubva mukuora, zvichiita kuti ENIG ive sarudzo yakasimba kune dzakasiyana siyana nharaunda.
ENIG's flatness inoita kuti ive yakakodzera PCBs ine yakakwira chikamu density.

HASL vs ENIG

Kugadzikana uye Hurefu

HASL: Inozivikanwa nekusimba kwayo, iyo solder layer muHASL inopa dziviriro yakanaka kubva kune oxidation, ichipa hupenyu hurefu hwesherufu.
ENIG: Iyo goridhe layer mu ENIG inopa yakanakisa corrosion kuramba, zvichiita kuti ive sarudzo yakasimba kune yakaoma nharaunda.

Conductivity uye Surface Flatness

HASL: Nepo HASL ichipa yakanaka conductivity, kupfava kwayo kwepamusoro kunogona kusiyana, izvo zvingave zvisina kunaka kune yakanyanya kunaka-pitch zvikamu.
ENIG: ENIG inokunda mukupa nzvimbo yakati sandara, yakakosha kune yakakwirira-chaiyo maapplication, uye yayo yakaturikidzana chimiro inovimbisa yakavimbika conductivity.

Kufungisisa kweMutengo

HASL: Iyo inowanzo kudhura-inoshanda, zvakanyanya nekuda kwekuita kwayo kushoma kuoma uye zvinhu zvakachipa.
ENIG: Kushandiswa kwesimbi dzakakosha segoridhe kunoita kuti ENIG idhure. Nekudaro, mabhenefiti ayo anogona kururamisa mutengo mune akawanda ekupedzisira-ekupedzisira application.

Application Kukodzera

HASL: Inokodzera zvemagetsi zvakajairwa uko yakanaka pitch zvikamu zvisiri zvekutanga. Kudhura kwaro kunoita kuti ive yakanakira kugadzirwa kwakakura.
ENIG: Inofarirwa mu-high-density PCBs uye yezvikumbiro zvinoda kunyatsoiswa chikamu, senge munharembozha nemidziyo yekurapa.

Mafungiro Ezvakatipoteredza uye Utano

HASL: Yechinyakare HASL inoshandisa lead, ichiisa nharaunda uye hutano zvinonetsa. Lead-isina HASL sarudzo dziripo.
ENIG: Haina lead-isina, zvichiita kuti ive sarudzo ine hushamwari.

Misiyano muKubata HASL uye ENIG Maitiro neCAM Injiniya

Mukugadzirwa kwePCB, mainjiniya eCAM anofanirwa kutarisisa zvinodiwa zvakasiyana zvemaitiro uye ruzivo rwakasiyana pavanenge vachibata Hot Air Solder Leveling (HASL) uye Electroless Nickel Immersion Gold (ENIG) surface finishes. Pakuita kweHASL, dhizaini yemapedhi inofanira kufunga nezvekuyerera kwesolder uye ukobvu, saka saizi dzemapedhi dzinowanzo kuve dzakakura zvishoma kuti ive nechokwadi chekuti solder yakavharwa zvakakwana. Pamusoro pezvo, nekuda kwekugona kudzikiswa kwehukuru hwemapedhi panguva yeHASL process, muripo wakakodzera wehukuru hwemapedhi unodiwa. Sarudzo yemhando yesolder uye kutonga kweukobvu kwakakosha; HASL inowanzo shandisa solder ine lead kana lead-free, nehukobvu hwayo hwakanyatso tariswa kuti ive nechokwadi chekuti ukobvu hwekupedzisira hwePCB hunosangana nezvinodiwa zvedhizaini. Mainjiniya eCAM anofanirwa kuita ongororo yekupararira kwekupisa kudzivirira mhedzisiro yakaipa pane zvimwe zvikamu zvePCB panguva yekupisa mhepo uye anofanirwa kutarisisa zvakanyanya kune flatness yenzvimbo.

Peji rino ndiro kuenzanisa kwakananga kweHASL neENIG. Kana ENIG yatosarudzwa, ongorora ENIG PCB surface finish ; kana zvimwe zvigadziko zvichiri kugoneka, enzanisa nesarudzo dzePCB surface finish uye sarudzo yeHighleap's PCB surface finish.

Mukupesana, kune iyo ENIG maitiro, padhi dhizaini inofanirwa kutarisa ukobvu uye kufanana kweiyo goridhe layer, nemapadhi saizi anowanzo kuve akajeka. ENIG inoda kurongeka kwepamusoro muhukuru hwegomba, sezvo iyo goridhe layer isingachinji zvakanyanya saizi yegomba mushure mekuvharwa. Panyaya yezvinodiwa zvemaitiro, ENIG inoshandisa kemikari nickel uye goridhe plating, uye mainjiniya eCAM anofanirwa kuve nechokwadi chekuti mhando dzemakemikari anodiwa uye kudzika kwacho kwakanyatso kuratidzwa mumafaira, nekutonga kwakasimba pamusoro pekukora kweplating kuti isangane nekuita kwemagetsi uye corrosion kuramba zvinodiwa. Panguva yekuongorora faira, zvinodikanwa kuita ongororo yekugovera ikozvino kuti ive nechokwadi chekuisa yunifomu uye kumaka nzvimbo dzakakosha mumafaira kuti ive nechokwadi chekutsetseka kwegoridhe.

Mukugadzirwa kwepanelization uye solder mask mabhiriji, kune zvakare misiyano yakakura pakati pemaitiro maviri aya. Kune iyo HASL maitiro, dhizaini yepaneru inofanirwa kufunga nezvekupisa kwekushushikana kwekugovera kudzivirira PCB warping kana deformation nekuda kwekuwedzera kwekupisa, uye dhizaini yemupendero inofanirwa kugadzirisa kudonhedza uye kufashama kwekutengesa. Mune solder mask bhiriji dhizaini, upamhi hwebhiriji hunoda kukwidziridzwa zvakafanira kudzivirira solder kuyerera pasi pebhiriji panguva yekuenzanisa, zvichikonzera zvikabudura. Kune iyo ENIG maitiro, dhizaini yepaneru inofanirwa kuve nechokwadi cheyunifomu electroplating uye yakanaka plating mhinduro kutenderera kudzivirira kusaenzana kweplating ukobvu kana mabhubhu akabatwa. Iyo ENIG maitiro inobvumira yakatetepa solder mask bhiriji hupamhi sezvo kemikari goridhe plating process isingabatanidze kuyerera kwe solder, ichibvumira kusimba kwebhiriji nzvimbo, iyo inovandudza PCB density uye kubatanidzwa. Kunzwisisa misiyano iyi inobatsira mainjiniya eCAM zvirinani kugadzirira uye kuona mafaera, kuve nechokwadi chekugadzira PCB yakatsetseka.

Pakuronga kugadzirwa, zvinobatsirawo kuenzanisa nyaya iyi nekugadzirwa kwegoridhe repamusoro rePCB neRF PCB usati wapedzisa kugadzira kana kugadzira pasuru.