Gwaro rePCB Surface Finish reSarudzo 7 Dzakajairika

Chii chinonzi PCB Surface Treatment?

PCB pamusoro pekurapa inoreva kubatanidzwa kwesimbi pakati pemhangura isina chinhu yebhodhi rakadhindwa redunhu nenzvimbo inotengeswa. Bhodhi redunhu rine chigadziko chemhangura chepamusoro icho, pasina chivharo chekudzivirira, chinowanzoita oxidation, saka kudiwa kwehutsanana hwepamusoro.

PCB pamusoro pekurapa idanho rakakosha mukugadzira PCB uye kuita gungano, ichishanda mabasa maviri makuru: kuchengetedza maseketi emhangura akafumurwa uye nekupa nzvimbo inotengeswa kuti zvinhu zvibatanidzwe kuPCB. Kurapa kwepamusoro kunowanikwa pamucheto wekunze wePCB, pamusoro pemhangura yemhangura, ichiita se "kupfeka" kwemhangura.

Mhando dzePCB Surface Treatment

Hot Air Solder Leveling (HASL)
Tin Plating (Immersion Tin)
Electroless Nickel Immersion Gold (ENIG)
Organic Solderability Preservatives (OSP)
Kunyudza Sirivha (ImAg)
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Ndarama Yakaoma (Electrolytic Hard Gold)

PCB Surface Kurapa Maitiro

Hot Air Solder Leveling (HASL)

HASL ndeimwe yeanonyanya kushandiswa pamusoro pekurapa nzira muindasitiri. Inouya mumhando mbiri: imwe ine lead-tin uye imwe isina. HASL ndeimwe yeakachipa anowanikwa PCB pamusoro pekurapa marudzi.

Kuti uwane nzvimbo yakatsetseka yeHASL, bhodhi redunhu rinonyudzwa mune yakanyungudutswa solder (tin / lead), inovhara zvese zvakafumurwa zvemhangura pabhodhi. Mushure mokusiya solder yakanyungudutswa, mhepo inopisa-yepamusoro-soro inofuridzirwa pamusoro pepamusoro kuburikidza nemhepo banga, iyo inopfavisa iyo solder deposits uye inobvisa yakawandisa solder kubva padunhu rebhodhi pamusoro.

Zvikamu zvakakosha zvekudzora panguva iyi zvinosanganisira tembiricha yekudziya, kupisa kwebanga remhepo, kudzvanywa kwebanga remhepo, nguva yekunyudza, kumhanya kwekusimudza, nezvimwe.

Zvakanakira zveHASL:

• Yakawanda inopa
• Reworkable
• Yakanakisa sherufu hupenyu
• Yakanakisa solderability
• Mari isingadhuri/yakaderera
• Inobvumira hwindo rakakura rekugadzirisa
• Yakareba nguva yekuchengetedza
• Mushure mekupedzwa kwePCB, mapedhi akafukidzwa zvizere nerata asati atengeswa
• Inokodzera kutungamirira-isina soldering
• Yakura pamusoro pekurapwa sarudzo
• Inobvumira kuongororwa kwekuona uye zviyero zvemagetsi

Zvakaipa zveHASL:

• Kusaenzana pamusoro
• Haina kukodzera kurira kwakanaka
• Ine lead (HASL)
• Thermal kuvhunduka
• Solder bhiriji
• Yakavharwa kana kuderedzwa PTH (yakapetwa kuburikidza neburi)
• Hukobvu/kuonekwa misiyano pakati pemapedhi makuru nemadiki
• Haina kukodzera SMD uye BGA idiki pane 2000 mamirioni emainji
• Haikodzeri zvigadzirwa zveHDI
• Haikodzeri kubatanidza waya

Tin Plating (Immersion Tin)

Immersion tin (ImSn) isimbi inopera inoiswa nekemikari yekuchinjisa reaction yakananga pagadziko resimbi yedare redunhu, iri mhangura.ISn inodzivirira iri pasi pemhangura kubva mukuokisisa mukati mesherufu yayo inotarisirwa hupenyu. Sezvo vatengesi vese vari tin-based, tin layer inogona kuenderana nemhando ipi neipi ye solder.

Nekuwedzera organic additives kune tin immersion solution, iyo tin layer inova granular, ichikunda matambudziko endebvu dzemarata uye kutama kwetin, ukuwo iine kugadzikana kwakanaka kwekupisa uye solderability. kuchipa yakanaka solderability, pasina flatness uye intermetallic mukomboni diffusion matambudziko.

Zvakanakira zveTin Plating:

• Yakanakisa flatness (yakakodzera SMT), yakakodzera kune yakanaka pitch / BGA / diki zvikamu
• Tekinoroji yekurapa yepakati-yepakati-inodhura-isina
• Yakakodzera kudzvanya utsanana
• Inochengetedza yakanaka solderability mushure mekufamba kwakawanda kwekupisa
• Inokodzera kuchinjika mitsetse yekugadzira
• Inokodzera yakanaka geometry machining, lead-yemahara musangano

Kuipa kweTin Plating:

• Sensitive kubata
• Hupenyu hupfupi hwesherufu, ndebvu dzemarata mushure memwedzi mitanhatu
• Inoparadza kune solder mask layer
• Hazvikurudzirwe kushandiswa nemasiki ano peelable
• Haisi sarudzo yakakodzera yekubata switch
• Kuyedzwa kwemagetsi kunoda kuseta yakakosha (soft probe kumhara)

Electroless Nickel Immersion Gold (ENIG)

ENIG (Electroless Nickel Immersion Goridhe) kurapwa kwepamusoro kwagara kuri sarudzo yakanakisa yenzvimbo yakatsetseka (yakafuratirwa) uye sarudzo dzisina lead-isina.
ENIG inhanho-matanho maviri, inovhara chidimbu chitete chenickel pamusoro pemhangura yemhangura uye yobva yaifukidza nechidimbu chegoridhe. Nickel inoshanda sechivhariso chemhangura uye inzvimbo inotengeswa zvinhu, nepo goridhe inodzivirira nickel panguva yekuchengetedza.

Electroless Nickel Immersion Gold (ENIG)

Ukobvu hwemukati hweNi hunowanzo 3-6μm, uye ukobvu hwekunze hweAu hunowanzo 0.05-0.1μm.

Ni inoumba chipingamupinyi chinodzivirira pakati pe solder nemhangura.

Basa reAu nderekudzivirira oxidation yeNi panguva yekuchengetedza, nekudaro ichiwedzera hupenyu hwesherufu, asi iyo goridhe yeplating maitiro zvakare inoburitsa yakanakisa yepasi flatness.

Kuyerera kuyerera kwe ENIG kunotevera: Kuchenesa -> Etching -> Catalyst -> Electroless Nickel -> Goridhe Plating -> Residue Kuchenesa.

Nepo iyi yekupotera iine hupenyu hurefu hwesherufu uye yakanakira electroplating kuburikidza-maburi, inonetsa uye inodhura maitiro ayo asingashandezve uye anozivikanwa kukonzera kurasikirwa mumasaini RF maseketi.

Zvakanakira zve ENIG:

Nzvimbo yakatsetseka
Tungamira-isina
Inokodzera PTH (yakapetwa kuburikidza neburi)
Hurefu hwesherufu

Zvakaipa zve ENIG:

dhura
Not reworkable
Dema pad/black nickel
Kukuvadza kubva kune vatorwa
Kurasikirwa kwechiratidzo (RF)
Complex process

Organic Solderability Preservatives (OSP)

OSP (Organic Solderability Preservatives) kana anti-corrosion agents anowanzo kuisirwa kumhangura yakafumurwa pachishandiswa nzira yebhandi rekutakura, inodzivirira pamusoro pemhangura kubva kuoxidation nechidimbu chakatetepa chezvinhu.

Iyi firimu inofanira kunge iine zvinhu zvakadai se-anti-oxidation, thermal shock resistance, uye hunyoro hunodzivirira kuchengetedza mhangura kubva kune ngura (oxidation kana sulfidation, nezvimwewo) pasi pemamiriro ezvinhu.

Zvisinei, panguva inotevera yepamusoro-tembiricha solder, iyi firimu inodzivirira inofanira kunge iri nyore uye nekukurumidza kubviswa nekuyerera kubvumira nzvimbo yakachena yemhangura kuti ibatane pakarepo neyakanyungudutswa solder, ichiita mubatanidzwa wakasimba munguva pfupi.

Mune mamwe mazwi, OSP inoshanda sechivharo pakati pemhangura nemhepo.

Iyo general process yeOSP ndeye: degreasing -> micro-etching -> acid washing -> pure water rinsing -> organic coating -> kuchenesa.

Zvakanakira zveOSP:

• Nzvimbo yakatsetseka
• Maitiro akareruka, akanyanya kutsetseka pamusoro, akakodzera lead-isina soldering uye SMT
• Reworkable, akakodzera horizontal kugadzira mitsetse
• Cost-inoshanda
• Kuratidzirana zvakanaka

Zvakaipa zveOSP:

• Hukobvu haugone kuyerwa
• Haikodzeri PTH (yakapetwa kuburikidza neburi)
• Hupenyu hupfupi hwesherufu
• Inogona kukonzera ICT nyaya
• Mhangura yakafumurwa pagungano rekupedzisira
• Sensitive processing
• Haikwanise kutengeswa (yakagadziriswazve) kanopfuura kaviri
• Haikodzeri tekinoroji yekutsikirira uye kusunga waya
• Kusagadzikana kwekuona uye magetsi ekuongorora

Kunyudza Sirivha (ImAg)

Sirivha yekunyudza inoiswa kumaPCB emhangura nekunyudza mutangi resirivha ion uchishandisa isiri-electrolytic chemical surface treatment. Iyo isarudzo yakanaka yemabhodhi edunhu ane EMI kudzivirira uye inoshandiswawo mumidziyo yekutaurirana.

Iyi nzira inonyanya kukodzera kumatunhu ane microwave frequencies uye mitsara yekutumira.

Kunyudzwa kweSilver kunopa nzvimbo yakati sandara, inotengeswa, uye zvinhu zvemagetsi zvakanakisa. Sirivha inonyudza maitiro inogona kushandiswa pane yakakura siyana yemabhodhi edunhu, anosanganisira akaomesesa uye anochinjika edunhu mabhodhi.

Iyo general process yekunyudza sirivha ndeye: degreasing -> micro-etching -> sirivheri deposition -> rinsing.

Zvakanakira Kunyudza Silver:

• Inokodzera kurira kwakanaka
• Inokodzera kuchinjika mitsetse yekugadzira
• Yakanakira kuungana-isina kuungana, yakanaka solderability, uye yakakodzera SMT
• Flatness
• Hupenyu hurefu hwesherufu, yakanaka kune maviri-mativi mabhodhi, waya inosunga, yakakodzera ICT
• Yakanaka pakuchengeta mhando yechiratidzo mumaseketi epamusoro-frequency

Zvakaipa zveImmersion Silver:

• Hupenyu hupfupi hwesherufu, yakaoma kuchengeta (mavara matema, anoda vacuum packaging)
• Kuraswa kwemakemikari
• Oxidation panguva yekuchengetedza
• Sensitive kubata
• Ag3Sn kugadzirwa
• dhura
• Haina kukodzera kubata switch uye masks ano peelable
• Haikodzeri kubatanidza waya yegoridhe
• Kuongororwa kweICT kunogona kukonzera kusashanda
• Maitiro ekudzora matambudziko

Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)

ENEPIG chirongwa chakaoma chinosanganisira matatu akaturikidzana: nickel, palladium, uye goridhe, inopa yakanakisa conductivity nekudzivirira.

Kuyerera kwe ENEPIG ndiko: Kuchenesa -> Etching -> Catalyst -> Electroless Nickel -> Palladium -> Gold Plating -> Residue Cleaning.

ENEPIG ndiyo yakanyatsokodzera pamusoro pekurapa kwepamusoro-yakavimbika uye yakakwirira-yekumhanyisa zvigadzirwa, uko kupfava kwayo, yakakwira mhangura inopikisa, uye yakanaka anti-corrosion zvinhu zvinonyanya kukosha.

Zvakanakira zve ENEPIG:

Yakanakisa yekubatanidza waya
Inokodzera kurira kwakanaka uye zvikamu zviduku
Inokodzera kusungirira waya yegoridhe
Zvakanaka kune PTH
Yakanakira tekinoroji yekutsikirira uye waya yekubatanidza
Inokodzera ICT uye bvunzo dzemagetsi
Hurefu hwesherufu
Tungamira-isina

Zvakaipa zve ENEPIG:

Mari yakakwira
Haikodzeri kubata switch
Kuongororwa kweICT kunogona kukonzera kusashanda
Inoda yakagadzikana kugadzirwa nharaunda
Haikodzeri wave soldering

Ndarama Yakaoma (Electrolytic Hard Gold)

Goridhe rakaoma imhando yePCB pamusoro pekurapa iyo inoshandisa dhizaini yegoridhe yakasanganiswa nehushoma hwemamwe simbi kuwedzera kusimba kwayo. Maitiro aya anosanganisira electroplating dhizaini regoridhe pamusoro pePCB, iyo inozoputirwa nedhizaini ye electrolytic nickel kuwedzera kuoma kwayo uye kusapfeka.

Goridhe rakaomarara rinowanzo shandiswa mumashandisirwo apo PCB ichave iri pasi pekudzokororwa kuiswa uye kubviswa, senge mune zvinobatanidza uye switch. Iyo yakaoma yegoridhe coating inobatsira kudzivirira goridhe kuti isasakara nekufamba kwenguva, kuve nechokwadi chekubatanidza magetsi akavimbika.

Zvakanakira Hard Gold:

Yakanakisa durability uye kupfeka kuramba
Inokodzera maapplication anoda akadzokororwa kuiswa uye kubviswa
Yakanaka kune yakakwirira-yakavimbika zvikumbiro
Inokodzera ICT uye bvunzo dzemagetsi
Inokodzera tekinoroji-inokwana tekinoroji uye waya yekubatanidza
Inokodzera kurira kwakanaka uye zvikamu zviduku

Kuipa kweHard Gold:

Mari yakakwira
Haikodzeri wave soldering
Haikodzeri kubata switch
Ukobvu hushoma

Nzira yekusarudza PCB Surface Finish?

Kusarudzwa kwepamusoro pePCBs ndeimwe yematanho akakosha mukugadzirwa kwePCB , sezvo ichikanganisa zvakananga goho remagadzirirwo, huwandu hwekugadzirisa patsva, mwero wekukundikana panzvimbo, kuyedzwa, mwero wezvakaraswa, uye mutengo. Kuti uve nechokwadi chemhando yepamusoro uye mashandiro echigadzirwa chekupedzisira, zvese zvakakosha nezvekuungana zvinofanirwa kutariswa pakusarudza kutsetseka kwepamusoro.

Shandisa chinyorwa chino kana uchienzanisa sarudzo dzakawanda dzekupedzisa zvichienderana nemutengo, nguva yekushanda, kupfava, uye zvinodiwa pakugadzira. Kana sarudzo iri HASL zvakanyanya kana ichienzaniswa neENIG, verenga kuenzanisa kweHASL kana ENIG ; kuti uwane kugona kwekugadzira uye manotsi ekotesheni, shandisa sarudzo yekupedzisa kwePCB.

PCB Surface Pedzisa

Solder Pad Flatness Sezvambotaurwa, kumwe kupera kwepamusoro kunogona kutungamirira kune nzvimbo dzisina kuenzana, izvo zvinogona kukanganisa kushanda, solderability, nezvimwe zvinhu. Kana kupfava kuri chinhu chakakosha, funga nezve kupedzwa kwepamusoro nematenda uye mayunifomu akaturikidzana. Muchiitiko ichi, sarudzo dzakakodzera dzinosanganisira ENIG, ENEPIG, uye OSP.

Solderability uye Wetting

Kugona kusungirira chinhu chakakosha pakushandisa maPCB. Zvakaratidzwa kuti magadzirirwo epamusoro akadai seOSP neENEPIG anokanganisa kugona kusungirira, nepo mamwe akaita seHASL akakodzera.

Goridhe kana Aluminium Wire Bonding

Kana PCB yako ichida waya yegoridhe kana yearuminiyamu, unogona kunge wakaganhurirwa ku ENIG ne ENEPIG.

Mamiriro Ekuchengetedza

Sezvambotaurwa, kumwe kupera kwepamusoro (seOSP) kunogona kuita kuti PCB iite brittle panguva yekugadzirisa, nepo vamwe vachiwedzera kusimba. Kuchengeta uye kubata zvinodiwa kunofanirwa kutariswa pachine nguva, uye kupera kwepamusoro kunoita kuti PCB iite brittle inofanirwa kushandiswa chete kana kuchengetedza uye kubata zvinodiwa zvinogona kusangana pasina njodzi.

Soldering Cycles

Kangani iyo PCB ichatengeswa uye kugadziridzwazve? Mazhinji ekupedzisa kwepamusoro akanakira rework. Nekudaro, dzimwe nzira dzakaita senge kunyudzwa kwerata hadzina kufanira kushandazve.

PCB Surface Pedzisa-RoHS Kutevedzera

Kutevedzera RoHS kwakakosha pakusarudza kupedzisa kwepamusoro kuchashandiswa. Kazhinji, kupedzisa kwepamusoro kwese kunoshandisa lead hakukodzeri kutevedzera RoHS uye kunofanira kudzivirirwa.

Zvichienderana nezvinodiwa uye hunhu hwePCB chigadzirwa chako, unogona kushandisa tafura iyi kusarudza iyo yakakwana yepamusoro pekupedzisira sarudzo.

mhedziso

Kusarudzwa kwemhando dzekupedzisa pamusoro kuti pave nekutsetseka kwepamusoro kunofanirwa kuve kwakakodzera kuti kuite mabasa akasiyana-siyana. Rudzi rwega rwega rwekugadzirisa pamusoro rune zvarunobatsira nezvarunokanganisa. Kune mamwe matekiniki ekugadzira ekugadzirisa matambudziko anokonzerwa nekusakwana kwekutsetseka kwepamusoro. Semuenzaniso, kune simba shoma reOSP , kune mhinduro dzakadai sekuchinja plating yebhodhi kana wave soldering alloy, kuwedzera preheating yekumusoro, nezvimwewo. Chinokosha ndechekufunga nezvezvinhu zvese zvinogoneka kuti uwane kushanda kwaunoda.