PCB Gomba Sarudzo yeKukwirisa PCB Kuita uye Mutengo

Kuboora maburi muPCB hakusi kungogadzira nzvimbo dzemagetsi dzema "component leads" chete; chikamu chakakosha chekuona kuti bhodhi rese rinoshanda zvakanaka. Pamusoro pekugadzirisa zvikamu, maitiro aya anosanganisirawo kugadzira ma "vias" - maburi madiki anobvumira masaini emagetsi kupfuura pakati pezvikamu zvakasiyana muPCB ine zvikamu zvakawanda . Maburi aya akakosha pakugadzira kubatana kwakavimbika pakati pezvikamu, uye kunyatsoita basa rekuboora kunokanganisa mashandiro emagetsi ebhodhi uye kunaka kwemuchina.

Nekuwedzera kuomarara kwemaPCB emazuva ano, ayo anowanzo ratidza zvidimbu zvakawanda uye high-density interconnection (HDI), kuchera kwave kuita yakasarudzika uye yehunyanzvi maitiro. Mhando dzakasiyana-siyana dzemakomba dzinodiwa pamabasa akasiyana-siyana, uye nzira dzepamusoro dzekuchera dzinodiwa kuti zvizadzise zvinodiwa neaya magadzirirwo akaomarara. Ngatinyure mumhando dzakasiyana dzemakomba ePCB uye nzira dzakaomarara dzekuchera dzinoshandiswa mumagadzirirwo anhasi ekugadzira.

Mhando dzePCB Holes

1. Kuburikidza neburi (Plated and Non-Plated through-Hole)

A Kuburikidza neHole ndiyo inonyanya kukosha uye inoshandiswa zvakanyanya mhando yegomba muPCB. Inoreva gomba rinopinda zvachose kuburikidza nebhodhi, kubva kumusoro kusvika kune pasi. Maburi aya akakosha pakubatanidza zvinhu zvine ma lead (akadai seresistor, capacitor, uye ICs) kana kugadzira kubatanidza magetsi pakati pezvikamu zvakasiyana zvePCB.

• Maburi Ane Plated Through-Holes (PTH): Maburi aya akafukidzwa nesimbi inofambisa mvura mukati memadziro awo emukati, zvichivabvumira kushanda sekubatanidza magetsi pakati pezvikamu zvakasiyana zvePCB. Maburi anowanikwa anowanzo shandiswa kuisa zvikamu zvine lead, zvakaita sezvinobatanidza nemidziyo mikuru inopinza. Kuputira uku kunoita kuti magetsi afambe kubva kune rumwe rutivi rwePCB kuenda kune rumwe kana pakati pezvikamu zvemukati mumabhodhi ane zvikamu zvakawanda.

• Non-Plated through-Holes (NPTH): Asina-akapfatwa kuburikidza-maburi haana conductive plating pamadziro uye anoshandiswa zvakanyanya kuita zvemakinari, senge mounting screws kana zvikamu izvo zvisingade magetsi ekubatanidza pakati peturu. Izvo zvakajairika mumashandisirwo apo gomba rinoshandiswa chete kutsigirwa kwemuchina, sePCB standoff point, kana kurongeka kwemidziyo.

2. Vias

Vias imhando yakakosha yegomba rinoshandiswa zvakananga kugadzira magetsi ekubatanidza pakati pematanho e-multi-layer PCB. Iwo madiki zvakanyanya pane kuburikidza-maburi echikamu chinotungamira uye haashandiswe pakukwirisa zvinhu asi chete kune interlayer magetsi routing.

Vias inogona kuiswa zvakare mumhando mitatu mikuru zvichienderana nekushanda kwavo uye nzvimbo mukati mePCB:

• Blind Vias: Mapofu vias batanidza imwe ekunze akaturikidzana PCB kune imwe kana kupfuura zvemukati akaturikidzana, asi havasi kuwedzera kuburikidza bhodhi rose. Iri rudzi rwe via rinonyanya kubatsira mu multilayer PCBs uko vagadziri vanoda kubatanidza ekunze zviteshi kune zvemukati maseru pasina kutambisa nzvimbo nekuwedzera gomba kuburikidza nePCB yese. Iwo anowanzo shandiswa mumabhodhi e-high-density interconnect (HDI) uko nzvimbo yezvivakwa iri pamutengo mukuru.

• Kuvigwa Vias: Akavigwa vias anobatanidza zvidimbu zvemukati pasina kusvika kunze kwePCB. Izvi zvinobvumira kubatanidza kwemukati kwakaomesesa uku uchisiya ma layers ekunze akasununguka pakuiswa kwechikamu kana nzira. Kuvigwa vias zvinongoonekwa panguva yekugadzira muitiro uye kuva "kuvigwa" mukati rokupedzisira bhodhi kana akaturikidzana vari laminated pamwe chete.

• Kuburikidza neVias: Kuburikidza neVias ndiyo yakajairika mhando yeVia uye kutambanudza kubva kune imwe yekunze rukoko rwePCB kuburikidza nepakati pese mukati kusvika kune yakatarisana yekunze layer. Kunyange dzakafanana neakapfachuka nemu-maburi, kuburikidza nevias anowanzo diki uye anoshandiswa kune magetsi ekubatanidza pane kukwirisa zvinhu.

3. Microvias

Microvias imhando yepamusoro yekushandisa muHDI PCBs, ine madhayamita kazhinji idiki pane 150 microns (0.15 mm). Iwo akagadzirwa achishandisa laser drilling uye akakosha kune miniaturized zvemagetsi senge smartphones, zvinopfekeka, uye zvimwe zvishandiso zvinoda zvakanaka-pitch zvikamu uye yakakwirira-density yekubatanidza.

Microvia inouya nenzira dzinoverengeka:

• MaMicrovias Akapofumara: Aya anobatanidza chikamu chekunze kune chikamu chemukati chiri pedyo, chakafanana nemablind vias, asi pachiyero chidiki zvikuru. Anowanzo shandiswa kuendesa masaini pakati pezvikamu muHDI PCBs uye akakosha pakuderedza zvinodiwa munzvimbo mumagadzirirwo akakora.

• Yakaturikidzana Microvias: Akaturikidzana mamicrovias anosanganisira akawanda mamicrovia akaiswa akananga pamusoro peimwe, kazhinji muzvikamu zvakatevedzana. Ivo vanogonesa kupindirana kwakatwasuka pakati peakawanda PCB akaturikidzana uye anoshandiswa kana dense routing ichidikanwa.

• Yakakanyiwa Microvias: Yakakanuka mamicrovias akafanana neakaturikidzana mamicrovias asi ari kurerukirwa zvishoma kubva kune mumwe nemumwe mumatanho ari padyo. Iyi tekinoroji inoshandiswa kuderedza kushushikana paPCB zvinhu zvinokonzereswa nekubatanidza akawanda vias mustack, izvo zvinogona dzimwe nguva kutungamira kune michini kushaya simba mumagadzirirwo epamusoro-density.

• Yakazadzwa Microvias: Kuwedzera kuvimbika kweiyo microvias, kunyanya mu-high-frequency kana yakakwirira-ikozvino maapplication, dzimwe nguva inozadzwa nezvinhu zvinoitisa (semuenzaniso, mhangura kana epoxy). Iyi nzira inogadzira kubatana kwakasimba kwemagetsi uye inovandudza kupisa kwemafuta, izvo zvinogona kubatsira pakusimba kwesimba uye kuita kwechiratidzo.

4. Backdrilled Vias (kana Stub Vias)

Kudzorera kumashure inzira inoshandiswa kubvisa chikamu chisina kushandiswa chevhavha, kunyanya mumabhodhi e-high-speed signal apo kuvimbika kwechiratidzo kwakakosha. Mune yakajairwa kuburikidza ne-vias, chikamu chenzira chinodarika chekupedzisira chinoda kubatanidza magetsi chinogona kuita se "stub," izvo zvinokonzeresa kuratidzwa kwechiratidzo uye kukanganisa kushanda kwepamusoro-frequency.

• Kudzosera kumashure kunobvisa izvi zvisingakoshi zvikamu zveiyo via, kuderedza kurasikirwa kwechiratidzo uye kuvandudza kutendeseka kwechiratidzo. Iyi tekinoroji inonyanya kukosha muPCB anoshandiswa kune yakakwirira-kumhanya madhijitari, senge network michina uye kufonera.

5. Teardrop Via (kana Teardrop Hole)

Teardrop vias kana maburi emisodzi anosanganisira kugadzira teardrop-shaped pad uko trace inosangana neburi. Iyi nzira inowedzera simba remagetsi uye kuvimbika kwekubatana pakati pekutsvaga uye gomba, kuderedza dambudziko rekukuvara nekuda kwekunetseka kana kusaruramisa panguva yekuchera.

• Teardrop vias inonyanya kubatsira kune yakakwirira-vibration nharaunda kana panguva yePCB gungano maitiro, uko kushushikana kwemagetsi kunogona kunetesa chiyero kana nzira. Nekufamba zvishoma nezvishoma kubva pakutsvaga kuenda kugomba, teardrop vias inoderedza mukana wekutsvaga kutyoka kana kudhirowa zvisizvo.

6. Countersink uye Counterbore Holes

Kunyange zvisingaite sedzimwe mhando dzemakomba ePCB, sink uye maburi e counterbore anoshandiswa kana paine zvinodiwa zvemuchina, senge zvekukwirisa screws kana imwe hardware.

• Countersink Holes: Aya anoshandiswa kugadzira conical recess muPCB, achibvumira flat-head screws kuti igare yakapfava kana pazasi pepamusoro pebhodhi. Iri rudzi rwegomba rinoshandiswa mumashandisirwo apo zvikamu kana hardware inoda kuiswa pasina kubuda pamusoro pepamusoro.

• Counterbore Holes: Aya anoshandiswa kugadzira yakadzika-pasi recess, iyo inobvumira socket musoro kana cap screw kugara pazasi pepamusoro pePCB. Counterbore maburi anonyanya kushandiswa mumamiriro ezvinhu apo musoro wescrew kana bhaudhi inoda kudzoreredzwa nekuda kwemakanika.

7. Via-in-Pad (VIP)

Via-in-Pad inzira iyo iyo via inoiswa zvakananga pasi pechikamu padhi, kwete munzvimbo iri padyo. Iyi nzira iri kuwedzera kushandiswa muHDI uye compact dhizaini nekuti inochengetedza nzvimbo yepamusoro uye inobvumira nzira inoshanda munzvimbo dzakasimba.

• In VIP magadzirirwo, vias kazhinji akazadzwa conductive kana asiri conductive zvinhu uye ipapo capped nemhangura kupa sandara pamusoro soldering zvinoriumba. Iyi tekinoroji inonyanya kubatsira mumagadzirirwo ane yakanaka-pitch BGAs (bhora gidhi arrays) kana zvimwe pamusoro-yepamusoro mativi apo inowanikwa bhodhi nzvimbo iri shoma.

• Kubatsira kwekutanga kweVIP ndiko kudzikiswa kwehurefu hwekutevera uye parasitic inductance, iyo inogona kuvandudza kutendeseka kwechiratidzo uye kuderedza kutapurirana mitsara mhedzisiro mumagadzirirwo ekumhanya.

8. Tente Vias

Tenting zvinoreva tsika yekuvharisa vias ne solder mask kudzivirira solder kuyerera mumakomba panguva yegungano. Izvi zvinowanzoitwa kuburikidza ne-vias izvo zvisina kuitirwa kutengeswa asi zvinoda kuchengetedzwa kubva pakusvibiswa kana kuvandudza kunaka kwePCB pamusoro.

• Tenda inogona kuvhara zvizere kana zvishoma chikamu chevhavha. Tende rakazara rinosanganisira kuvhara yese nekuvhura, nepo kusatendeka kunosiya kaburi kadiki kekubuda negasi kana kuongorora.

9. Makomba ekuedza

Maburi ekuyedza maburi madiki, asingashande akagadzirwa kuti aongororwe kana kuti aonekwe nezvinangwa zvehunhu panguva yekugadzira PCB . Maburi aya anobvumira vagadziri kuti vaone nemaziso maburi emukati kana kusimbisa kusimba kwemaburi akaputirwa. Maburi ekuyedza anowanzoiswa munzvimbo dzisina kukosha dzePCB uye haashande chero basa remagetsi kana remakanika muchigadzirwa chekupedzisira.

PCB Drilling Techniques

Kuchera makomba muPCBs inhanho yakakosha mukuita kwekugadzira, kuve nechokwadi chese mekiniki kutendeseka uye kubatana kwemagetsi. Zvichienderana nemhando yegomba, nhamba yezvikamu, uye kuoma kwekugadzira, nzira dzakasiyana dzekuchera dzinoshandiswa. Pazasi pane tarisiro yakawedzerwa yemazuva ano PCB yekuchera matekinoroji, kusanganisira mashandisirwo emhando yepamusoro yekubatisa matekinoroji uye mahybrid masisitimu kuti asangane nekuwedzera kurikuda kudiwa kwekugadzira.

1. Mechanical Drilling

Mechanical kuchera ichiri imwe yeinonyanya kushandiswa nzira dzekugadzira makomba mahombe muPCB, senge-maburi, maburi asina kuputirwa, uye mamwe vias. Inosanganisira kushandiswa kweyepamusoro-speed drill bit, inowanzo gadzirwa ne tungsten carbide, inotenderera nekumhanya kukuru kupinda muzvikamu zvePCB.

Nekudaro, sezvo madhizaini ePCB anowedzera kunetsa uye saizi yegomba ichiderera, kuchengetedza kusimba uye nemazvo ezviboorero zvave zvakaoma. Kuti zvigadzirise izvi, vagadziri vakaunza tekinoroji yekukoira yezviboorero, kunyanya diki diki senge 0.1 mm uye pazasi.

Coating Technologies yeDrill Bits

Kuti uwedzere hupenyu hwemabhiti ekubooresa uye nekuvandudza mashandiro, kunyanya kune madhayamita madiki senge 0.1 mm, marudzi akati wandei emachira akagadzirwa:

• Dhaimondi-Senge Carbon (DLC) Coating: DLC coating inoiswa pamusoro pechibooreso mabhiti kuwedzera kuoma uye kuderedza kusakara. Uku kupfekedza kunotevedzera zvimwe zvimiro zvedhaimondi, senge kuomarara kwakanyanya uye kuderera kwakadzika, izvo zvinobatsira kuwedzera hupenyu hwechibooreso uye kuchengetedza mipendero yakapinza yekucheka. DLC-yakavharwa mabits anonyanya kubatsira pakuchera yakaoma PCB substrates seFR4 kana ceramic-yakazadzwa zvinhu.

• Titanium Nitride (TiN) Coating: TiN coating ndiyo imwe yeanonyanya kupeta mabhiti ekuboora muPCB kugadzira. Ichi chivharo chinopa kuwedzera kuomarara, kuderedzwa kukweshana, uye kunatsiridza kupisa kwekudzivirira. Aya mabhenefiti anokonzeresa hupenyu hurefu hwematurusi, kunyanya mukumhanyisa, yakakwirira-vhoriyamu yekuchera apo kupisa kunowedzera kunogona kukanganisa kushanda.

• Titanium Aluminium Nitride (TiAlN) Coating: TiAlN-yakavharidzirwa mabhiti ekubooresa anotonyanya kupisa kupfuura mabhiti akavharidzirwa neTiN, zvichiita kuti aenderane nemhando yepamusoro yekuchera zvikumbiro. TiAlN machira zvakare anopokana zvakanyanya neoxidation, achibvumira mabheti ekudhirowa kuti agare kwenguva refu, kunyanya mumashandisirwo anosanganisira kuchera kuburikidza nemidziyo yakaoma kana mirwi yakakora yePCB.

• Multi-Layer Coatings: Mazuva ano mabheti ekuboora anowanzo kuuya neakawanda-layer coatings ayo anosanganisa akasiyana zvinhu kukwidziridza kuoma, kupisa kupisa, uye kuderedza kukwesha. Aya machira anopa chiyero pakati pekuoma uye hupenyu hurefu, kunyanya mumamiriro ezvinhu apo zvinhu zvePCB zvinoputika kana kuti chibooreso chinofanira kupinda mukati memhangura uye substrate yakawanda.

Uchishandisa aya matekinoroji ekuputira, vagadziri vanogona kugadzira mabheti anochengetedza iwo ekucheka chaiko kwenguva yakareba, kuderedza kudiwa kwekudzokororwa uye kuderedza kugadzirwa kwenguva.

Mechanical Drilling Matambudziko uye Solutions

• Diki Hole Drilling: Sezvo PCB inodhizaina ichidzika uye ichida kushivirira kwakasimba, kuchera kwemakanika kunotarisana nekupikiswa nemakomba madiki pane 0.1 mm. Kukwirisa-kumhanya kudhirowa neakasarudzika machira anobvumidza madiki madiki saizi, asi kune madiki madiki microvias, ma drills anogona kunetseka, uye kuchera laser kunowanzo kufarirwa.
• Drill Wear: Drill bit wear idambudziko rinogara riripo mukuboora mechanika, kunyanya pakugadzirwa kwemhando yepamusoro. Kugara uchigadzirisa uye kutsiva mabheti akasakara nemamwe akavharidzirwa kunoderedza njodzi dzekuremara senge maburrs, madziro ane maburi, uye kusarongeka.
• Stack Drilling: Mechanical drilling inogona kuvandudzwa nekudhirowa akati wandei panguva imwe chete, inozivikanwa sekunge stack drilling. Nekudaro, izvi zvinoda kunyatsojeka kuti ive nechokwadi chekumisikidzwa kwegomba, kunyanya kana akaturikidzana akasiyana ane dielectric kana ukobvu hwemhangura.

2. Laser Drilling

Laser drilling inzira chaiyo chaiyo inoshandiswa kunyanya kuchera maburi madiki senge microvias, ayo akakosha muHDI (high-density interconnect) PCBs. Laser drilling inoshandisa yakanangidzirwa laser matanda kupfungaira zvinhu uye kugadzira akachena, makomba akakwana, kazhinji madiki pane izvo zvemichina zvinogona kuwana.

Mhando dzeLaser Anoshandiswa muPCB Drilling:

• CO₂ Lasers: Aya anoshandiswa kubvisa zvisiri zvesimbi zvinhu senge dielectric layers muPCBs. Vanoshanda nekupfutisa izvo zvisiri-conductive zvinhu pakati pemhangura layer. CO₂ lasers inokurumidza uye inoshanda pakubvisa dielectric asi haishande pakucheka mhangura.

• UV Lasers: UV lasers (ultraviolet lasers) akanyanya kujeka uye anogona kushandiswa kudhiza kuburikidza ese ari maviri emhangura uye asiri-simbi akaturikidzana. Ivo vanokwanisa kugadzira maburi madiki, kunyange asingasviki 20 microns mudhayamita, zvichiita kuti ive yakakodzera kune microvias inodiwa muHDI PCBs.

Zvakanakira Laser Drilling:

• Yakanyanya Kurongeka: Kuchera Laser kunopa kusingaenzaniswi kurongeka, kunyanya kugadzira microvias. MaLaser anogona kugadzira maburi anowirirana ane kushivirira kwakasimba, kuderedza mukana wekukanganisa senge kusarongeka kana hukuru hwegomba.
• Kwete-Kubata Maitiro: Sezvo laser drilling iri isiri-yekubata nzira, hapana chekupfeka chekushandisa, kusiyana nemichina yekurovera. Izvi zvinobvumira kuenderana kwegomba mhando pamusoro penguva refu yekugadzira inomhanya.
• High Aspect Ratios: Kuboorwa kweLaser kwakanakira makomba ane chiyero chepamusoro (yakadzika-kusvika-dhayamita reshiyo), izvo zvakakosha pakugadzira zvakadzika vias mu multilayer PCBs.

Laser Drilling Matambudziko:

• Kumhanyisa Kwemakomba Makuru: Nepo kuchera laser kuchikunda pamakomba madiki, kunogona kunonoka pane kucheresa mechanic kune akakura kuburikidza-maburi. MaHybrid masisitimu anosanganisa ese ari maviri emakanika uye laser drilling anowanzo shandiswa kuenzanisa nemazvo uye kunyatsoita.
• Mutengo: Midziyo yeLaser inodhura kana ichienzaniswa nemichina yekurovera, zvichiita kuti ive sarudzo inodhura, kunyanya kune akareruka maPCB apo kunyatsoita kusingakoshese.

3. Kudzora Kudzika Kwakadzika

Kudhirowa kwakadzika kwakadzora inzira inoshandiswa kugadzira mapofu kana kuvigwa vias, uko gomba risingawedzere nzira yese kuburikidza nePCB. Iyi nzira yakakosha kune akawanda-layer PCBs uko kwakanyatso kubatanidza pakati pematanho chaiwo anodiwa.

Mafungiro Akakosha eKudzora Kudzika Kwakadzika:

• Precision Kudzika Kudzora: Kudzora kwakadzika kuchera kunosanganisira kumisa chibooreso pane chakati tsvikiti, chinoda michina yakaringana. Chero kukanganisa kudzika kwakadzika kunogona kuguma nekanzira isingabatanidzi zvakanaka kana kupinda muzvikamu zvisingatarisirwe.
• Kusanganiswa neLaser Drilling: Mumabhodhi e-high-density, kuchera kwakadzika kunodzorwa kunogona kusanganiswa nelaser drilling kuti ive nechokwadi chekuti vias madiki anogadzirwa nehupamhi hwepamusoro, nepo vias hombe kana maburi achiboorwa nemichina.
• Tool Wear: Kunyangwe nekudzora kudzika kwakadzika, kuchengetedza kupinza uye kurongeka kwezviboorero zvimedu zvakakosha, kunyanya kune yakaoma, akawanda-layer board.

4. Sequential Lamination uye Drilling

In sequential lamination, the layers of a multi-layer PCB inogadzirwa uye yakanyungudutswa pamwechete mumatanho, nekuchera kunoitika panzvimbo dzakasiyana mukugadzira kuvigwa nekuturikidzana vias. Iyi nzira inonyanya kukosha kune HDI magadzirirwo.

• Kuvigwa Vias: Vias kubatanidza chete mukati akaturikidzana vari chibooreso pashure chaiyo subset akaturikidzana ari laminated, ipapo anotevera akaturikidzana anowedzerwa pamusoro, kuviga vias.
• Yakaturikidzana Microvias: Akaturikidzana mamicrovias anosanganisira kudhirowa vias layer nedhiri uye nekuarongedza kuti agadzire vertical chinongedzo pakati pematanho ari pedyo. Iyi nzira inonyanya kuwanda muHDI PCBs, uko kunodiwa kukwirisa-density routing.

Sequential lamination inobvumira nzira yakaoma kunzwisisa, yakakwirira chikamu density, uye yakakura kushanda kwemagetsi munzvimbo diki. Nekudaro, maitiro aya anonyanya kutora nguva uye anodhura nekuda kweakawanda lamination uye yekuchera matanho anodiwa.

5. Plasma Etching

Plasma etching inzira yepamberi inoshandiswa kubvisa zvinhu kubva paPCB pamusoro kana mukati memakomba akacherwa, kazhinji yekuchenesa nekutsvedzerera madziro evias uye microvias. Plasma, gasi ionized, kemikari inopindirana nezvinhu zvepamusoro uye inobvisa zvinhu zvisingadiwe senge resin yakawandisa kana dielectric zvinhu.

• Desmearing: Plasma etching inowanzo shandiswa mushure mekudhirowa kwemuchina kuchenesa madziro emukati evias, kubvisa resin smears yakasara kubva pakudhirowa. Iyi nhanho yakakosha kuti ive nechokwadi chekubatanidza magetsi emagetsi kana vias yakaputirwa.
• Dielectric Removal: Plasma etching inogona zvakare kushandiswa kubvisa dielectric zvinhu pakati pemhangura layer panguva yekugadzirwa kwemicrovias, ichisiya nzira yakachena yekubatanidza magetsi.

Nepo plasma etching ichipa kunyatsojeka, inzira inononoka uye inodhura zvakanyanya kana ichienzaniswa nemaitiro echinyakare ekuzvidza.

6. Back Drilling

Kuchera kumashure kunoshandiswa kubvisa chikamu chisina kushandiswa cheplad-through-hole (PTH), kunyanya mu-high-speed PCBs apo kutendeseka kwechiratidzo kune hanya. Iyo stub isingadikanwi yakasiiwa neburi-gomba inogona kukonzera kuratidzwa kwechiratidzo uye kushatisa masaini akakwirira-frequency, saka kuchera kumashure kunobvisa iyi nyaya nekubvisa yakawandisa mhangura inopfuurira kupfuura inodiwa layer.

• Precision Kudzora: Kuchera kumashure kunofanirwa kuitwa nehupamhi hwepamusoro kubvisa chete chikamu chisina kushandiswa che via pasina kukuvadza chinongedzo chinodiwa. Iyi tekinoroji yakakosha kudzikisa kurasikirwa kwechiratidzo mu-high-frequency PCBs anoshandiswa munharembozha uye data network.

7. Hybrid Drilling Systems

Hybrid drilling masisitimu anosanganisa mabhenefiti emuchina uye laser drilling, zvichibvumira kushanduka kwakawanda mukugadzira. Aya masisitimu anoshandisa michini yezvibooresa kune akakura kuburikidza-makomba uye akapfava makomba, nepo lasers anoshandiswa kugadzira madiki microvias uye yakakwirira-chaiyo vias. Iyi nzira inowedzera kushanda nesimba uye inodhura-inoshanda uchichengetedza iyo chaiyo inodiwa kune yakaoma magadzirirwo.

Iyo Impact yeGomba Sarudzo muPCB Dhizaini

Mukugadzirwa kwePCB, kusarudza mhando chaiyo yemakomba kunokanganisa zvakanyanya mashandiro ebhodhi, mutengo wekugadzira, uye kuoma kwekugadzira. Vagadziri vanofanirwa kuyera zvinhu zvakasiyana-siyana pavanenge vachifunga kuti ndeupi rudzi rwegomba rekushandisa, kusanganisira kuita zvinodiwa, kugona kwemaitiro ekugadzira, mutengo wekugadzira, uye dhizaini yakaoma. Kupfuura sarudzo pakati pemabofu vias uye kumashure kucheresa, zvimwe zvinotariswa zvinosanganisira mechanical versus laser drilling, back drilling maringe nekuvigwa vias, uye kuronga HDI (high-density interconnect) stack configurations. Pazasi, isu tinokurukura nzira dzekusarudza akajairika magomba marudzi kubatsira vagadziri kukwirisa ese emhando uye mutengo wekugadzira.

1. Back Drilling vs. Kuvigwa Vias

Sarudzo pakati pekuchera kumashure nekuvanza ma-vias ndiyo yakakosha pakugadzirisa mutengo, kuvimbika kwechiratidzo, uye kuoma kwekugadzira mumaPCB ane layer yakawanda. Kuchera kumashure kunonyanya kushanda kune magadzirirwo anomhanyisa apo kuderedza kuratidzwa kwechiratidzo kwakakosha. Nekubvisa chikamu chisina kushandiswa chevanza, kuchera kumashure kunobvisa "stub" inogona kukanganisa kuvimbika kwechiratidzo. Kazhinji haina kuoma kupfuura ma-vias akavigwa, ayo anoda matanho akawanda e-lamination uye plating, zvichiita kuti kuchera kumashure kuve nyore mukugadzira kwepamusoro-soro uko kuderedza matanho ekugadzira kwakakosha.

Kune rumwe rutivi, ma-vias akavigwa akakosha mumagadzirirwo anoda kubatana kwemukati memadziro pasina kukanganiswa kwenzvimbo. Zvisinei, kushandiswa kwawo kunounza kuomarara kwakawanda uye mutengo nekuda kwekudiwa kwemaitiro chaiwo e-multi-step lamination. Kunyange zvazvo ma-vias akavigwa anopa kubatana kwakanaka kwemukati memadziro, achitsiva nekuboorera kumashure pazvinogoneka kunoita kuti maitiro ekugadzira ave nyore, anoderedza mari, uye anokurumidzisa kugadzirwa. Kuboorera kumashure kazhinji ndiyo sarudzo inofarirwa mumagadzirirwo anoisa pamberi mashandiro echiratidzo, nepo ma-vias akavigwa akakodzera zviri nani magadzirirwo akamanikana anoda kubatana kwemukati memadziro pasina kukanganiswa kwenzvimbo.

Zvinokurudzirwa : Kune magadzirirwo anomhanya zvikuru apo kusimba kwechiratidzo kwakakosha, kuchera kumashure ndiyo sarudzo yakanakisisa, zvichipa kuoma kwekugadzira kwakaderera uye kudzora mutengo kuri nani. Mavhiya akavigwa ari nani kuchengeterwa magadzirirwo akaomarara, ane zvidimbu zvakawanda uko kunoda kubatana kwemukati mezvikamu, pasinei nekuoma kwekugadzira kwakawedzera.

2. Mapofu uye Akavigwa Vias: Mechanical Drilling kana Laser Drilling?

Ma-vias asingaonekwe uye akavigwa anowanzo shandiswa mukugadzira maPCB kubatanidza ma-layer emukati ne-layer ekunze. Pakusarudza mashandisirwo emhando idzi dze-vias, vagadziri vanofanira kusarudza pakati pekuboorera kwemuchina ne-laser drilling. Kuboorera kwemuchina kwakanakira ma-vias makuru, zvichipa kushanda zvakanaka pa-diameter yakakura uye ma-layer mashoma, nepo kuchera kwe-laser kwakakodzera ma-vias madiki uye magadzirirwo e-high-density, zvichipa kunyatsojeka mumabhodhi ane-layer akawanda. Kuboorera kwe-laser, kunyangwe kuchidhura zvakanyanya, kunowedzera mashandiro ebhodhi uye kushandiswa kwenzvimbo, kunyanya kuma-microvia mumagadzirirwo eHDI.

Zvinokurudzirwa : Shandisai kuchera nemechanical kune ma via makuru (dhayamita >0.2 mm) muzvikamu zvishoma, uye kuchera nelaser kune madhizaini madiki, ane density yakakura ane ma microvia, kunyanya mumabhodhi eHDI ane zvikamu zvakawanda uko kushanda zvakanaka kwenzvimbo kwakakosha.

3. HDI Stack-Up Planning: Matunhu Mashoma Ane Matuki Akawanda vs. Mamwe Matunhu ane Mapanji Mashoma

Mudhizaini yeHDI, kusarudza pakati pematanho mashoma ane akawanda kuburikidza nemastacks uye akawanda akaturikidzana ane mashoma mashoma anokanganisa PCB kuita uye mutengo. Kudzikisa maseru ane akawanda mastacks kunotungamira kune yakatetepa, yakawanda compact mabhodhi asi inowedzera laser drilling uye kugadzira kuoma. Sezvineiwo, kushandisa mamwe maseru ane mashoma kuburikidza nemastacks kunorerutsa kuchera asi kunowedzera mutengo wezvinhu uye ukobvu hwebhodhi.

Zvinokurudzirwa : Pamagadzirirwo anoda kubatana kwemasaini akasimba, machira mashoma ane machira akawanda anopa hunyoro asi anowedzera kuoma kwekugadzira. Pamapurojekiti makuru ekugadzira kana anodhura zvakanyanya, machira akawanda ane machira mashoma anoderedza kuoma kwekugadzira uye njodzi yekugadzira, zvichiita kuti ive yakakodzera kugadzirwa kwakawanda.

mhedziso

Kusarudza mhando dzegomba chaidzo muPCB dhizaini, senge kuchera kumashure kunopesana nekuvigwa vias, mechanical versus laser drilling, kana optimize HDI stack masisitimu, kwakakosha pakuenzanisa kuita, mutengo, uye kuoma kwekugadzira. Nekunyatsotarisisa zvinodiwa nedhizaini yako, unogona kuita sarudzo dzine ruzivo dzinowedzera kutendeseka kwechiratidzo, kuderedza matanho ekugadzira, uye kuderedza mitengo. Kungave kusarudza kucheresa kumashure kwedhizaini yekumhanya-mhanya kana kusarudza kuchera laser mumabhodhi eHDI, sarudzo yega yega inoita basa rakakosha mukuunza chigadzirwa chepamusoro-soro, chinodhura. Kudyidzana nevagadziri vane hunyanzvi vakaita seHighleap Electronic inova nechokwadi chekuti PCB dhizaini yako inosangana nezvibodzwa zvese zvekuita uye zvimhingamipinyi zvebhajeti, ichipa epamusoro-tier kugadzira hunyanzvi pasina kukanganisa pamhando.