Yakakwana Ongororo yePCB Via-in-Pad Technology

Munzvimbo iri kufambira mberi nekukurumidza yezvemagetsi, kudiwa kwezvishandiso zvidiki uye zvine simba kwakakurudzira hunyanzvi hwakakura mukugadzira maPCB . Sezvo vagadziri vachitarisana nekumanikidzwa kuri kuwedzera kwekugadzira macircuit anoshanda zvakanyanya mukati mezvirambidzo zvakasimba zvemuviri, matekiniki echinyakare anowanzo kundikana kugadzirisa zvinodiwa zvemagetsi emazuva ano. Imwe nzira itsva yakadaro yakawana simba mukupindura matambudziko aya itekinoroji yeVia-in-Pad. Iyi nzira, apo ma-via (kubatana kwemagetsi pakati pezvikamu zvePCB) anoiswa zvakananga mukati mepamusoro pemapedhi ezvikamu, inopa mabhenefiti akakosha muPCB layouts dzakatetepa, dzinoshanda zvakanyanya.

Via-in-Pad yave kunyanya kufarirwa mumhando yepamusoro-density interconnect (HDI) magadzirirwo, uko kushandiswa kwakanaka kwenzvimbo kwakakosha. Nekuisa vias zvakananga muchikamu mapedhi, zvinoita kuti uderedze saizi yePCB uku uchivandudza chiratidzo chekuvimbika uye kupisa kupisa. Nekudaro, iyo nzira haina matambudziko ayo - kugadzira kuomarara, kuwedzera mitengo, uye zvingangoitika zvekutengesa nyaya zvese zvinoda kungwarira manejimendi.

Gwaro iri richaongorora mabhenefiti nezvakaipa zvetekinoroji yeVia-in-Pad, nzira dzekuwedzera kugona kwayo, uye chikonzero chiri shure kwenzira dzakasiyana dzekuzadza dzakadai se resin fill, electroplated fill, uye solder mask ink.

1. Zvakanakira Via-mu-Pad Technology

1.1 Space Optimization mune Yakakwira-Density Dhizaini

Imwe yemabhenefiti akakosha eVia-in-Pad iko kushandiswa kwakanaka kwePCB real estate. Sezvo zvinhu zvemagetsi zvinova zvidiki uye zvakanyanya kuoma, zvechinyakare kuburikidza nekuiswa, apo vias anoiswa kunze kwechikamu Mapedhi, anodya yakakosha nzvimbo yebhodhi iyo yaigona neimwe nzira kushandiswa kwechiratidzo nzira kana chikamu chekuisa. Nekuisa vias zvakananga muchikamu pads, vagadziri vanogona kugadzira denser uye yakawanda compact marongero.

Mumidziyo yakaita semafoni, zvinopfekwa, zvishandiso zvekurapa, uye mamwe maapplication eIoT, kugadzirisa nzvimbo kwakakosha. Kune maBGA ane mazana emapini kana zvikamu zvepitch, Via-in-Pad inobvumira vagadziri kudzivirira kuzara kwenzira, zvichiita kuti nzira yekutumira masaini ive nyore uye inoshanda.

Maitiro eKukwirisa Space Optimization:

• Shandisa microvias: Microvias, kazhinji idiki pane yakajairika vias, inogonesa kunyange yakakwirira chikamu density. Nekuchera laser microvias mukati memapadhi, vagadziri vanogona kuwedzera kukwirisa nzvimbo mumabhodhi eHDI.
• Layer stack-up kuronga: Kufunga kuronga kwe Kuunganidzwa kwePCB yakakosha pakuwedzera mabhenefiti eVia-in-Pad. Nekugonesa kuiswa kwezvikamu zvemukati uye kuve nechokwadi kuti inoshanda kuburikidza nekugovera, vagadziri vanogona kuderedza kuoma kwenzira.

1.2 Yakavandudzwa Chiratidzo Kutendeseka muMahara-Speed ​​Circuits

Mune yakakwirira-frequency kana yakakwirira-kumhanya dhijitari maseketi, chiratidzo chekuvimbika chinhu chakakosha kunetseka. Zvechinyakare kuburikidza nemadhizaini zvinogadzira nzira refu dzechiratidzo pakati pechikamu mapedhi uye vias, izvo zvinogona kuunza parasitic capacitance uye inductance, inoshatisa chiratidzo chemhando uye kukonzera kunonoka nguva. Kusiyana neizvi, Via-in-Pad inopfupisa nzira yechiratidzo, ichidzikisa zvisingadiwe parasitics uye electromagnetic interference (EMI).

Izvi zvinonyanya kukosha mumhando yepamusoro-frequency dhizaini seRF maseketi, mabhazi edata anomhanya-mhanya, kana anomhanya-mhanya akasiyana pairi, uko kunyangwe misiyano midiki mukuperera kwechiratidzo inogona kukanganisa kuita.

Maitiro ekukwirisa Signal Kutendeseka:

• Strategic kuburikidza nekuisa: Isa vias padhuze neakakosha masaini makwara sezvinobvira kuti uderedze kureba kwekutevera uye parasitic mhedzisiro.
• Kusanganiswa nemapofu kana kuvigwa vias: Mu-multi-layer PCBs, kushandisa mapofu kana kuvigwa vias pamwe chete neVia-in-Pad zvinogona kuderedza kureba kwenzira dzechiratidzo, kuvandudza kushanda kwepamusoro-frequency.

1.3 Kuwedzeredzwa kweThermal Management

Via-in-Pad tekinoroji inobatsirawo zvakanyanya mukutonga kwekupisa, kunyanya mumidziyo ine simba repamusoro senge processors, maLED, uye magetsi emagetsi. Kupisa kupisa kwakakosha kuti uve nechokwadi chekuvimbika kwechikamu uye kudzivirira kutadza kunokonzerwa nekupisa. Kana vias akaiswa mukati chechikamu padhi, vanopa yakananga kupisa nzira kuti kupisa kuyerera kubva chinoumba kuti yomukati mhangura ndege, izvo kuita sokupisa anonyura.

Muzvikumbiro apo kupisa kupisa kwakakosha, senge magetsi amplifiers kana voltage regulators, akawanda vias mukati mepadhi anogona zvakanyanya kuderedza tembiricha yechikamu nekuvandudza thermal conductivity.

Maitiro ekukwirisa Thermal Performance:

• Wedzera nhamba yevias: Multiple vias mukati mepadhi imwe chete inogona kuwedzera kupisa conduction. Vagadziri vanofanira kuisa yakawanda inopisa vias sezvinobvira pasina kukanganisa magetsi kushanda kwechikamu.
• Batanidza vias kune yakakura pasi kana ndege dzemagetsi: Kuve nechokwadi chekuti vias zvakabatana nevhu remukati kana ndege dzemagetsi dzinoita semanyura ekupisa kunobatsira kubvisa kupisa zvakanyanya.

2. Zvakaipa zveVia-in-Pad Technology

Kunyangwe paine akawanda mabhenefiti, Via-in-Pad inopa akati wandei matambudziko anofanirwa kugadziriswa kuti ive nechokwadi chekuvimbika kwePCB kuita.

2.1 Solder Voiding uye Solderability Matambudziko

Imwe yezvakanyanya kukanganisa kweVia-in-Pad inyaya yekuvharisa solder. Voids inogona kuumba panguva yekudzokorora nekuda kwehomwe dzemhepo kana zvinosvibisa zviri kuvharirwa mukati mejoint solder. Aya ma voids anoderedza zvese zvemagetsi uye zvinopisa conductivity zvejoint uye zvinogona kuderedza simba remagetsi rekubatanidza.

Vias yakaiswa mukati memapadhi inogona kugadzira chiteshi kuburikidza iyo solder inogona kudzima panguva yekuyererazve, zvichitungamira kune voids inokanganisa kunaka kweiyo solder. Iyi nyaya inonyanya kunetsa mune yakakwirira-yakavimbika maapplication, senge aerospace kana zvigadziriso zvekurapa, uko kunoenderana mhando yemutengesi yakakosha.

Maitiro ekudzikisa Solder Voiding:

• Kuburikidza nekuzadza maitiro: Imwe yedzakanakisa nzira dzekudzikisa solder voiding ndeyekuzadza vias neine conductive kana isiri-conductive zvinhu. Izvi zvinovimbisa kuti iyo via haigadziri nzira yekuti solder itize panguva yekuyerera.
• Copper capping: Mushure mekuzadza iyo via, padhi inogona kuvharwa nemhangura kuti ipe yakatsetseka, yakatsetseka nzvimbo inovandudza solder joint kuvimbika. Izvi zvinobatsirawo kudzivirira solder wicking.
• Kugadzirisa solder paste application: Yakakodzera solder paste dhizaini yakakosha kuti ive nechokwadi chekuvharika kwakakwana uye kudzivirira yakawandisa solder kudhonzwa mukati me.

2.2 Kuwedzera Kwekugadzira Kuoma uye Mutengo

Kugadzira PCB ine Via-in-Pad yakanyanya kuoma uye inodhura kana ichienzaniswa neyekare PCB magadzirirwo. Maitiro akadai seanonyatso kuburikidza nekuchera, kuburikidza nekuzadza, uye copper capping inoda michina yepamberi uye imwe nguva. Havasi vese vagadziri vePCB vakashongedzerwa kubata zvakaomarara zvinodiwa zveVia-in-Pad, uye kunyangwe izvo zvinowanzobhadharisa mari yekubhadhara masevhisi aya.

Pamusoro pezvo, iyo yakawedzera chaiyo inodiwa mukugadzira inotungamira kune yakakwira kuremara mwero, iyo inogona kuwedzera kuwedzera mari yekugadzira nekuda kwekuitazve kana zvimedu.

Maitiro Ekugadzirisa Mari dzeKugadzira:

• Kudyidzana nevagadziri vane ruzivo: Zvakakosha kusarudza PCB vanogadzira vane ruzivo rwakakura mukugadzira Via-in-Pad mabhodhi. Izvi zvinoderedza njodzi yekuremara uye inova nechokwadi chekubudirira, kugadzirwa kwemhando yepamusoro.
• Gadzirisa nhamba yevias: Nepo Via-in-Pad inogona kupa zvakakosha mabhenefiti, vagadziri vanofanirwa kudzikisa huwandu hwevias yakaiswa zvakananga mumapadhi kunze kwekunge zvichidikanwa. Izvi zvinobatsira kuderedza kuoma kwekugadzira uye mari.
• Shandisa nzira dzekuzadza dzinodhura: Kana iyo vias isingade kuitisa masaini emagetsi, isiri-conductive kuburikidza nekuzadza inogona kushandiswa kudzikisa mutengo uchienzaniswa neinodhura conductive inozadza.

2.3 Kuvimbika Zvinonetsa Munzvimbo Dzakaoma

Via-in-Pad madhizaini anogona kusangana neakavimbika nyaya kana akafumurwa kune yakanyanyisa mamiriro ezvakatipoteredza, akadai sekudengenyeka kukuru, kushanduka kwetembiricha, kana kushushikana kwemagetsi. Kana vias asina kunyatsozadzwa kana capped, vanogona kutungamirira kune vasina simba solder majoini, izvo zviri nyore kukundikana pasi kushushikana.

Muzvishandiso uko kuvimbika kwakakosha, senge mota, aerospace, kana maindasitiri masisitimu, kushata-mhando kuburikidza nekuzadza kunogona kutungamira mukutadza nekufamba kwenguva nekuda kwekupisa bhasikoro, kuneta kwemechini, kana kushushikana-kunokonzeresa.

Nzira Yokuvandudza Kuvimbika:

• Iva nechokwadi chakanaka kuburikidza nekuzadza: Kushandisa emhando yepamusoro yekuzadza zvinhu, senge conductive epoxy yenzira dzakakosha dzechiratidzo kana isiri-conductive resins yekugadzikana kwemichina, inova nechokwadi chekuti vias inonzwika uye inokwanisa kumira kushushikana.
• Comprehensive test: Zvekuvimbika kwepamusoro maapplication, ita yekuwedzera bvunzo, senge thermal cycling, vibration test, uye mechanic stress bvunzo, kuona kushaya simba kusati kwagadzirwa kwakawanda.

2.4 Kufunga Kana Nzvimbo Yakakwana Iripo paPCB

Zvisinei nemabhenefiti eVia-in-Pad tekinoroji, zvinokurudzirwa kusashandisa nzira iyi kana nzvimbo yakakwana iripo paPCB. Chikonzero ndechekuti Via-in-Pad, nepo ichibatsira mu-high-density dhizaini, inowedzera kuomarara kumaitiro ekugadzira, inowedzera mitengo, uye inosuma zvingangovimbika zvinhu senge solder voiding. Kana paine nzvimbo yakakwana iripo, yechinyakare kuburikidza nekuisa-kunze kwechikamu mapedhi-inogona kunge iri yakatwasuka uye inodhura mhinduro. Conventional vias bvumira kuti nyore soldering uye mikana shoma solder-ane chokuita kuremara, zvichiita yose kugadzirwa kwakavimbika uye isingadhuri.

Mune akareruka dhizaini kana yakaderera-density mabhodhi uko zvimhingamipinyi zvenzvimbo hazvisi zvine chekuita, kudzivirira Via-mu-Pad kunogona kurerutsa marongero, kuderedza mutengo wekugadzira, uye kuderedza njodzi yekukanganisa kugadzira.

3. Sei Uchishandisa Resin Kuzadza, Electroplated Kuzadza, uye Solder Mask Ink yeVia-in-Pad?

Mhando ye kuburikidza nekuzadza inoshandiswa muVia-in-Pad tekinoroji zvinoenderana nezvinodiwa zvekushandisa. Imwe neimwe nzira - resin kuzadza, electroplated kuzadza, uye solder mask inki - inopa mabhenefiti akasiyana zvichienderana nezvinhu zvakaita semafuta ekupisa, kuita kwemagetsi, uye mutengo.

3.1 Resin Kuzadza uye Electroplated Zadza

Resin-yakazadzwa vias inosanganisira kushandisa zvisiri-conductive zvinhu, senge epoxy, kuzadza iyo via. Iyi nzira inowanzo shandiswa kana iyo via ichishanda semakanika kana yekupisa conduit asi haidi kuitisa masaini emagetsi. Kuzadza resin kunodzivirira solder wicking, kunopa kugadzikana kwemichina, uye kunobatsira kubvisa kupisa.

Electroplated yakazara vias, kune rumwe rutivi, inozadzwa nezvinhu zvinoitisa semhangura-yakazadzwa epoxy uye yobva yaputirwa nemhangura. Iyi nzira inovimbisa kuenderera kwemagetsi, zvichiita kuti ive yakakosha kune yakakwirira-kumhanya uye yakakwirira-frequency magadzirirwo uko kuchengetedza chiratidzo chekuvimbika kwakakosha.

Advantages:

• Kudzivirira solder voiding: Zvese zviri zviviri resin uye electroplated inozadza inogadzira yakavharwa pamusoro padhi, ichideredza njodzi ye solder voiding panguva yekuyerera.
• Kuwedzerwa kushanda kwemagetsi uye kupisa: Electroplated inozadza inovandudza conductivity yemagetsi, nepo zvese resin uye electroplated inozadza inosimudzira kupera kwemafuta, ichiita kuti ive yakanaka kune yakakwirira-simba maapplication.
• Kuvandudzwa kwesimba remagetsi: Yakazadzwa vias inopa zvirinani tsigiro yezvimiro, kuvandudza kuvimbika kwemajoini anotengeswa, kunyanya munzvimbo dzakaoma.

3.2 Solder Mask Ink Zadza

Mune zvimwe zviitiko, vias anozadzwa ne solder mask inki, imwe inodhura-inoshanda sarudzo kana ichienzaniswa neresin kana electroplated inozadza. Solder mask inki inozadza inoshandiswa kana iyo yekutanga kunetsekana iri kudzivirira solder kubva mukuyerera ichipinda nevhavha, pane kuchengetedza magetsi kana kupisa kuita. Iyi nzira yakakodzera kune yakaderera-inodhura, yakaderera-yekuita zvikumbiro kana prototyping uko kuvimbika kwakanyanya kusingadiwi.

Advantages:

• Cost-inoshanda: Solder mask inki yakachipa uye iri nyore kuisa pane resin kana electroplated inozadza, ichiita kuti ive yakakodzera kune madhizaini uko kushanda kusingakoshese.
• Simple application: Iyi nzira inokurumidza kuita, ichiita kuti ive yakanaka kune prototypes kana yakaderera-vhoriyamu yekugadzira inomhanya.

mhedziso

Via-in-Pad tekinoroji inoita basa rakakosha mumagadzirirwo emazuva ano akakwira-density PCB, ichipa akawanda mabhenefiti maererano nekugadzirisa nzvimbo, kutendeseka kwechiratidzo, uye kutonga kwekupisa. Nekudaro, inounzawo matambudziko akadai solder voiding, kuwedzera kuomarara kwekugadzira, uye zvinogona kuvimbika nyaya munzvimbo dzakaoma. Nekunyatsosarudza kuburikidza nekuzadza nzira-kungave resin kuzadza, electroplated kuzadza, kana solder mask inki-vagadziri vanogona kudzikisira matambudziko aya uye kushandisa zvizere mabhenefiti eVia-in-Pad.

Pamashandisirwo epamusoro-soro, resin kana electroplated inozadza inopa yakanakisa chiyero chemagetsi, chinopisa, uye mashandiro emuchina, nepo solder mask inki inopa mhinduro inodhura kune isingadhure madhizaini. Nekuronga kwakaringana uye nekushandiswa kweakanakisa maitiro, Via-in-Pad tekinoroji inogona kugonesa PCB vagadziri kuti vasangane nezviri kubuda zvinodikanwa zvemazuva ano compact, high-performance electronics industry.