Kugadzira PCB yemSAP yeFine-Line Circuitry

Highleap Electronics inopa ongororo yekugadzira PCB yemSAP uye mutengo wemagadzirirwo emakona emutsetse mutete uko kuvakwa kweconductor, pitch uye copper kunodiwa kunoda nzira yakagadziriswa yekuwedzera. Kana mutengesi wako wepari zvino asingakwanise kutsigira upamhi hwemutsetse, nzvimbo kana dhizaini yepitch mutete, titumirei mifananidzo yakaburitswa uye stackup kuitira kuti zvinodiwa pakuita zvikwanise kuongororwa zvichienderana nedhizaini chaiyo.

Pakugadzirwa kwePCB yemSAP , nhamba shoma yemutsetse/nzvimbo yoga haikwani. Upamhi hwemuchina wekufambisa, ukobvu hwemhangura, sisitimu ye dielectric, kunyoreswa kwelayer, zvinangwa zve impedance, kurongeka kwepaneru uye zvinodiwa zvekuongorora zvinofanirwa kufungwa pamwe chete. Maitiro eHighleap ekutaura akagadzirirwa kusimbisa kuvakwa kunodiwa uye kusimbisa fungidziro yemaitiro usati waita mutengo nekutumira.

Kugadzira PCB yemSAP vs Kubvisa Kucheka

Bhodhi remazuva ano rine zvidimbu zvakawanda rinovakwa nenzira iri pasi. Rutivi rwese rwakafukidzwa nemhangura, mufananidzo unodhindwa mufirimu rakaoma, mhangura yakaratidzwa inobviswa, uye mhangura yasara ndiyo patani. Saka upamhi hwemutsara wekupedzisira ihupamhi hwemutsara wephotolithography kubvisa chero chinhu chinobviswa ne etch, uye etch haina kumira. Inocheka zvishoma, uye inoita izvi zvisina kuenzana zvichienderana nehukobvu hwemhangura uye chiyero chechinhu chacho.

Maitiro ekuwedzera zvishoma anoshandura pfungwa. Patani yacho inotanga yagadzirwa sechikamu chembeu chakatetepa muchimiro chezvinhu zvinodiwa, uye mhangura inozoputirwa kusvika paukobvu hwakazara. Nekuti mhangura inoputirwa kubva pachikamu chembeu chakatetepa, mSAP inogona kuderedza kuchekwa kwerutivi kunobatanidzwa nekubvisa. Geometry yekupedzisira yemutsara ichiri kutsamira pamifananidzo, chimiro chekudzivirira, ukobvu hwemhangura hwakaputirwa, kubviswa kwechikamu chembeu uye kudzora maitiro; hazvitsanangurwi ne lithography chete.

Izvi ndizvo zvinoita kuti mSAP ive yakasiyana pakushanda. Mhangura yakapedzwa haitsanangurwi ne etch. Inotsanangurwa nemufananidzo, yobva yakura. Ndokusaka mSAP ichigona kugadzira ma "fine-pitch pad arrays" uye "tight traces" ayo nzira yekubvisa inogona kutenderedza kana kuda kugadziriswa zvakanyanya kuti etch irambe iripo.

mSAP vs Standard PCB Kugadzira Magadzirirwo Akanaka

Nekuti jira rembeu rinofanira kudhindwa uye plating inofanira kunge yakafanana, mSAP pa laminate yakajairika inogoneka asi haisiyo nzira yakanakisisa. Maitiro eindasitiri ndeyekuvaka zvivakwa zve mSAP pane sisitimu yezvinhu ine makemikari epamusoro anotsigira maitiro acho: foil yemhangura yakapfava, uye muzvivakwa zvinoshanda zvakanyanya sisitimu ye resin ine kurasikirwa kushoma uye kugadzikana kwakanaka kwe dielectric.

Kana chinodiwa chiri "mitsetse mitete" chete kwete "mitsetse mitete ine impedance inodzorwa pa dielectric yakatetepa", maitiro echinyakare emutsetse mutete pa laminate yepamusoro anogona kuzadzisa chinodiwa nemutengo wakaderera. Nyaya ye mSAP inova yakasimba kana zvinhu zvitete zvakawandisawo, kana mhangura yakakora zvichienzaniswa nehupamhi hwemutsetse, kana kuti geometry iri pamuganhu chaiwo wezvinogona kugadziriswa ne photolithography ne etching.

Maitiro Ekugadzira PCB yemSAP yeFine-Line PCBs

Danho rega rega riripo kugadzirira pamusoro pechinhu chinotevera, uye kurongeka kwacho hakuchinji.

Danho rechina ndipo panonyanya kuoma. Kuisa ma electroplating inzira yepaneru: kugoverwa kwazvino kwepaneru hombe hakuna kumboenzana zvakakwana, saka ukobvu hwemhangura hunosiyana, uye kana ukobvu huchisiyana, upamhi hwemutsetse wapera hunosiyana. Maumbirwo epaneru uye mashandisirwo azvo zvinoenderana nemidziyo yemugadziri, zvidzoro zvekuenzana kwepaneru uye dhizaini chaiyo. Saka zviyero zvebhodhi rapera zvinofanira kuiswa mumutengo kuitira kuti marongerwo epaneru anokurudzirwa uye nzira yekushanda zvigone kuongororwa.

Zvinodiwa zve mSAP Fine Line neNzvimbo pakugadzira PCB

Bhavhu rekuputira mumutsara we mSAP harichinjiki nebhavhu rekuputira remhangura rinoshandiswa pabasa. Zvinowedzerwa mubhavhu zvinodzora mwero wekuputira uye simba rekukanda, uye maitiro akakosha pa mSAP ndeyekuti bhavhu rinokura sei mhangura mumigero yakamanikana pakati penzvimbo dzembeu. Bhavhu rinoputira zvakanaka munzvimbo yakashama rinogona kushayisa mukati mebhavhu rakatsetseka, zvichiita kuti pave negomba rakatetepa kana kuti mukaha pakati pepad ne trace.

Migumisiro mitatu inotevera kune mutengi, uye yakakodzera kunzwisiswa nekuti inoratidzwa paongororo yekudhirowa:

• Chiyero chechikamu mugwara rakarongwa chinokosha. Rutivi rwakasimba rwemapad runoita semakomba matete kune plater. Rutivi rwakanyanya kusimba uye kukwirira kwaro kwakanyanya, ndipo panonyanya kuoma plate zvakaenzana, uye maitiro acho anoenderana nemakemikari chaiwo emugadziri uye dhizaini yepaneru.
• Rutivi rwembeu runodzivirira zvivakwa zvakanaka. Kuisa electroless munzvimbo yakanaka kunogona kunonoka kana kusakwana. Ichi chimhingamupinyi chikuru pahukuru hwechinhu chinogoneka uye hachibviswi ne lithography iri nani.
• Mhangura yakakora yakaoma zvakanyanya. Nekuti plating inofanira kuzadza nzvimbo yacho zvakaenzana kusvika pahuremu hwakazara hwemhangura, kudiwa kwemhangura inorema pazvimiro zvakanaka ndeimwe yemisanganiswa yakaoma zvikuru mukuita uku.

Nzira ine chekuita nekubvisa zvinhu zvakakora inokurukurwa mumaitiro edu ekuona mifananidzo zvakananga nelaser (LDI) , uye divi rekuboorera rebasa rekugadzira zvinhu zvakakora muPCB vias dzedu dzakaboorwa nelaser . Kune mabhodhi anosanganisa mitsetse mitete nechimiro chakaunganidzwa, mubvunzo wekugadzira zvinhu wakazadzwa muHDI stackup design yedu.

Mitemo yekugadzirwa kwePCB yemSAP yeZvikamu Zvidiki

Kugadzira mSAP hakusi kugadzira photolithography yakajairwa ine nhamba dzakasimba. Mitemo yakati wandei inochinja mumhando pane kukosha.

• Mhete ye annular haisisiri muganho wehupamhi hushoma. Nekuti mhangura inokura pane kuchekwa, padhi inogona kuva pedyo nehukuru hwegomba rakapedzwa pasina kuchekwa kushoma kunodya padhi. Izvi ndizvo zvinoita kuti padhi rive rakakora, uye inobatsira zvikuru munzvimbo inodzoserwa kana yagadzirwa zvakanaka.
• Kubhadhariswa kwetsvina hakudiwi nenzira imwecheteyo. Mugadziri akajaira kubhadhara kurasikirwa kwe etch anofanira kutarisazve dhizaini yacho, nekuti chimiro chapera chiri pedyo nechinhu chakaratidzwa.
• Kurema kwemhangura pamativi akanaka kunofanira kunzwisiswa. Kana dhizaini yacho ikakumbira 2 oz copper pamitsetse ye50 µm, danho rekuputira rinofanira kuzadza izvozvo zvakaenzana uye muganhu wemaitiro acho unotetepa. Kazhinji pane hukama hweukobvu-upamhi-hwakakodzera kuongororwa usati waburitswa.
• Kukosha kweImpedance kunofanirwa kuverengerwa zvakare kune mhangura yakapedzwa. Hunhu hweimpedance hunoenderana nehupamhi hwetrace uye ukobvu hwemhangura, uye mSAP copper surface yakapfava pane yakachekwa. Kana chinangwa cheimpedance chakaiswa kubva pakuverenga kwakajairika kwemaitiro, zvakakosha kutarisa zvichienderana ne geometry chaiyo yakapedzwa.

Kudzora kweImpedance kunowanzo kurukurwa pamusoro peRF PCB impedance control yedu uye mukugadzirwa kwePCB kwakakura kwakadzorwa-impedance , uye mhedzisiro yakanaka yemagadzirirwo eRF inotsanangurwa mumirairo yedu yekugadzira RF PCB.

Nguva Yokushandisa Tekinoroji yemSAP yeHigh-Density PCBs

mSAP inowana mari yayo mumamiriro ezvinhu chaiwo, uye mune mamwe maitiro echinyakare emutsara wakanaka palaminate iri nani ndiyo mhinduro ine musoro. Inobhadhara kana dhizaini yacho iine ma "fine-pitch pad arrays" asingagone kugadziriswa nenzira yekubvisa, kana upamhi hwe "trace" huchiisa impedance yayo uye kushivirira kwehupamhi kwakasimba, apo mhangura inofanira kunge yakakora zvichienzaniswa nehupamhi hwemutsara, uye apo chimiro chakasimba zvakakwana zvekuti bhodhi rakajairika rinoda ma "layer" akawanda kupfuura anobvumirwa nedhizaini yemakanika.

Hazvibhadhare kana chinodiwa chete chiri kuderedzwa zvishoma muhupamhi hwemutsara, kana bhodhi rakakura uye huremu hwemhangura hwacho hwakanyanya asi zvinhu zvacho zvakajairika, kana kana vhoriyamu yakakwira zvakakwana zvekuti mutengo wekugadzirisa unotonga uye maitiro echinyakare palamineti yakatsetseka anokwana mukati mehuremu hunodiwa. Muzviitiko izvozvo, maitiro ekugadzira HDI PCB ane laser drilling uye laminate yepamusoro-soro kazhinji ndiyo inonyanya kunzwisisika.

Kusarudzwa kwezvinhu kunoenderana nesarudzo kupfuura zvinotarisirwa nevatengi. Laminate inofanira kunge inoenderana nekemikari yechikamu chembeu, uye kune RF structures, dielectric constant uye loss tangent ye resin system zvinogadzirisa mashandiro anowanikwa zvisinei nekuti copper yakanaka sei. Kusarudzwa kwedu kwezvinhu zvePCB kunosanganisira kuchinjana, uye mhuri dzezvinhu zvine kurasikirwa kushoma kunyanya muzvinhu zvedu zvePCB zvine low-Dk nelow-Df.

Mutengo wePCB we mSAP uye Nguva Yekutungamira Yekugadzira Mitsetse Yakanaka

Pamutengo we mSAP, mutengo hausi we copper chete. Imatanho ekuita uye chirango chepaneru.

• Huwandu hwemifananidzo uye magadzirirwo epurasitiki. Rutivi rumwe nerumwe rwemukati mechimiro chekuvaka runoita mSAP cycle yakazara. Rutivi rwezvikamu zvina pamusoro pepakati runoita mSAP cycle ina, kwete imwe chete.
• Saizi yepaneru. Mapaneru e mSAP madiki nekuti kufanana kwema plate kunoderera munzvimbo dzakakura. Bhodhi risingakodzeri paneru rakajairwa rinogona kudhura zvakanyanya nekuda kwechikonzero ichocho.
• Goho rakanaka pazvivakwa zvakanaka. Kukanganisika pa dense array kunogona kunge kwakanyanya uye kunodhura, nekuti kunowanzoonekwa kunonoka uye kunogona kubvisa panel yese.
• Material. Rudzi rwelaminate necopper foil rune mutengo wepamusoro, uye mutengo webhodhi rakatsetseka wakanyanya kupfuura wekare.
• Kuyera. Zvinhu zvakanaka zvinofanira kuyerwa, uye nzira yekuyera chikamu chemashoko ari kutaurwa.

Kana purogiramu iriyo inorambidza kwete mutengo, ngatitaurei muRFQ. Panel diki, kuunganidzwa kuri nyore, kana kupatsanura kuvaka kuita matanho maviri zvinogona kuchinja nguva yekutungamira zvakanyanya, uye mugadziri anogona chete kugadzirisa izvozvo kana achiziva kuti zvine basa. Maumbirwo enguva yekutungamira yekuvaka uku anotsanangurwa mukufamba kwedu kwePCB.

Mugadziri wePCB wemSAP weFine-Line uye Fine-Pitch Designs

Pakutsvaga mugadziri wePCB wemSAP , mainjiniya vanofanira kuenzanisa kugona kwakasimbiswa kwemaitiro ekugadzirisa zvinhu—kwete kungoti mutsetse mudiki wakashambadzirwa. Highleap inogona kuongorora mibvunzo yekugadzira mSAP PCB inosanganisira nzira dzakapfava, mapatani edense uye geometry yemhangura inodzorwa, yozotsanangura kuti ndeapi ruzivo rwekuvaka uye kuongororwa kwezvitupa zvinodiwa usati waita chibvumirano chekugadzira.

Kuti uwane mutengo wePCB wekugadzira zvinhu zvakanaka , ipai upamhi hwemutsetse wapera uye nzvimbo, ukobvu hwemhangura nechikamu, zvinhu zve dielectric, stackup, huwandu hwechikamu, saizi yebhodhi, zvinodiwa zve impedance uye huwandu hunotarisirwa. Kana dhizaini yacho ichinangana nema pads akanaka kana masaini ekumhanya kwakanyanya, sanganisira ruzivo rwetsoka uye tafura ye impedance. Izvi zvinobatsira kusiyanisa dhizaini inoda mSAP kubva kune inogona kugadzirwa kuburikidza nemaitiro ekare e fine-line pamutengo wakaderera.

Kana dhizaini yacho ichibatanidza nzira yekufambisa zvinhu netambo dzakatsetseka netambo dzine tambo dzakawanda, nzira yekugadzira zvinhu netambo dzeHDI PCB dzeHighleap inogona kunge yakakosha. Kune nzira yekufambisa zvinhu netambo dzakatsetseka, sanganisira zvinodiwa pamwe chete neruzivo rwekugadzira zvinhu netambo dzePCB dzakatsetseka. Shandisa Chikumbiro chemutengo wekugadzira zvinhu netambo kuti utumire dhizaini yakazara.

• Pakeji yemutengo: Mafaira eGerber/ODB++, stackup, line/space targets, copper thickness, impedance table kana zvichibvira, zvinodiwa pakuongorora uye fungidziro yehuwandu.

Mibvunzo Inowanzo bvunzwa Nezvekugadzirwa kwePCB yemSAP

MSAP yakafanana here nechimiro chekuunganidza kana chekutevera lamination?

Kwete, zvakasiyana. Kuisana kwakarongeka uye kuunganidza kunotsanangura kuti zvikamu zvinounganidzwa sei uye zvinodzvanywa. mSAP inotsanangura kuti mufananidzo wemhangura uri pachikamu chinogadzirwa sei. Bhodhi rinogona kuitwa mSAP pasina kuva kuunganidza, uye kuunganidza kunogona kuitwa nekubvisa. Anowanzo shandiswa pamwe chete, ndosaka mazwi acho achisanganiswa mukubvunza.

MSAP inogona kuwana upamhi hwemutsetse hwakaita sei?

Zvinoenderana nehuremu hwemhangura, zvinhu, makemikari epuratifomu uye saizi yepaneru. Pane kutaura nhamba yemusoro wenyaya, mubvunzo unobatsira ndewekuti chii chidiki chiri pabhodhi rako, huremu hwemhangura hwarinotakura, uye huremu hwakaripoteredza hwakaita sei. Izvi zvitatu pamwe chete zvinosarudza kana dhizaini yacho yakasununguka kana kuti isina kusimba.

MSAP inogona kushandiswa here nema "blind and billowed vias"?

Ehe. Zvivako zve via zvinoumbwa nekuboorera nekuputira sezvazviri mune chero nzira yekuvaka, uye zvidimbu zvemhangura zvinogona kugadzirwa ne mSAP. Kubatana kwekutarisa ndiko kuputira madziro e via nekuputira zvidimbu zve planar, sezvo zvese zvichiitika mubhavhu rimwe chete remakemikari uye via inofanira kuputirwa nenzira isingabate kusvibiswa muzvikamu zvembeu.

Ko mSAP inochinja here huwandu hwema layer anogoneka?

Inoshandura muganho unoshanda pakuunganidza kwakasimba, nekuti jira rega rega rinowedzera denderedzwa replating rine njodzi yaro yekukohwa. Miganho yemakanika nezvinhu ichiri kushanda panguva imwe chete. Dhizaini inoda jira dzakawanda uye zvinhu zvakanaka kwazvo inowanzo shandiswa nekuongorora huwandu hwejira sechinoshanduka chedhizaini.

Bhodhi rakapedzwa rinogona kutengeswa uye kuunganidzwa zvakajairika here?

Ehe. mSAP inokanganisa kuumbwa kwemhangura, kwete maitiro ekubatanidza. Zvakakosha kusimbisa kuti kupedzisa kwepamusoro kwakatsanangurwa, sezvo bhodhi rakatsetseka rakasungirirwa pamusoro usingagone kusungirirwa idambudziko rakajairika uye rinogona kudzivirirwa.