Kugadzirisa Kugadzirwa kwePCB neLaser Vias uye Mari

MaPCB microvia ekuboora nelaser haasi ekuvandudza kugadzirwa kwaunosarudza nekuda kwemukurumbira - imhinduro chaiyo kumatambudziko chaiwo ekufambisa, uye kuisarudza usinganzwisise mitemo yekugadzira yakabatana nayo kunoita kuti pave nemitengo inodzoka ne40% yakakwira kupfuura zvaitarisirwa, zviratidzo zveDFM zvinononotsa prototype yako, uye kutadza kushanda kunobva kuma void-filled stacked vias akapasa bvunzo yega yega yefekitori. Gwaro iri rakanyorerwa vagadziri vePCB nemainjiniya ehardware avo vanoziva kare kuti microvia chii uye vanoda mitemo yekugadzira inoshanda, mitengo, CAM workflow reality, uye failure modes - kwete primer pa laser physics.

Tora Ongororo yeHDI DFM Yemahara

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1) Dhizaini yako yePCB inoda kucherwa neLaser riini?

1.1 Matambudziko Matatu Ekufambisa Nzira Anogadziriswa Nekudhonza NeLaser

Simbisa kuti ndeapi matambudziko matatu aya aripo pakugadzira kwako usati wazvipira kugadzira HDI:

Dambudziko 1 — Nzira yekubuda muBGA yakavharwa nemaburi ekupinda. BGA ine 0.50mm ine spacing yepakati nepakati ye0.50mm. Nzira yekubuda mugomba inoda dhayamita yepad ye0.60mm (0.30mm drill + 0.15mm annular ring divi rega rega). Iyo yakakura kupfuura pitch — haugone kuisa path-hole via mumutsara wega wega weBGA. Microvia ye0.15mm ine land pad ye0.30mm inogadzirisa izvi. Pa 0.40mm pitch kunyange 0.15mm inova yakasimba, uye 0.10mm inodiwa.

Dambudziko 2 — Kusimba kwechiratidzo pamusoro pe5–10 GHz kunoda ma-via asina stub. Bhodhi remakanika rinotakura chiratidzo kubva kuL1 kuenda kuL4 pabhodhi rine 16-layer rinosiya stub yemhangura isina kushandiswa (L5–L16) inorira pamafrequencies akakwira. Kuboora kumashure kunobvisa yakawanda yacho, asi kureba kwestub kuchiri kugadzira kuratidzwa pamusoro pe10 GHz. Blind via yakaboorwa nelaser haina zero stub nekuvakwa. Kune nzira dzeSerDes, DDR5, kana RF pamusoro pe5 GHz pamabhodhi ane stub akawanda, ma-blind via anogona kunge ari chinodiwa chekusimbisa chiratidzo, kwete sarudzo yehuwandu.

Dambudziko rechitatu — Nzvimbo yebhodhi inofanira kuderera asi mashandiro haagone. Dzimwe nguva mapuranga akakora anofamba zvakanaka padanho repamusoro-soro asi anoda nzvimbo yakawanda ne20% kupfuura inobvumirwa nekamuri. Chivakwa cheHDI chine huwandu hwe microvia-in-pad chinogona kudzoreredza nzvimbo iyoyo. Bhodhi reHDI rinodhura zvakanyanya pa sikweya inch asi mutengo wese unogona kuderera kana kuderedzwa kwenzvimbo kwacho kwakakura zvakakwana.

1.2 Kana Kuboorera neLaser Kuri Sarudzo Isina Kururama

• Muenzaniso chete kana pasi pemayuniti makumi mashanu: Nguva yekutungamirira HDI mazuva 8-14 zvichienzaniswa ne5-7 emazuva akajairwa e multilayer. Kuti zvionekwe kuti zvinoshanda sei, kuvaka kwakajairwa kunokusvitsa ikoko nekukurumidza.
• Bhodhi rinofamba zvakanaka rine maburi ekupinda: BGA ine mabhora makumi matanhatu nemana ine nzvimbo isina kumanikidzwa yebhodhi inogona kubuda nemidziyo yekubvisa mapfupa uye chivakwa chine mativi matanhatu - nehafu yemutengo wekuvakwa kweHDI.
• Magadzirirwo apo kuwedzera kwehuwandu hwezvinhu hakugadzirisi mari yeprimiyamu: Mamwe madhizaini eHDI anowedzera 50–80% pamutengo we "bare-board" wekubudirira kwe "routing" uko kwaigona kuwanikwa nekuwedzera ma "standard layers" maviri panzvimbo pezvo.

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2) Mitemo yeKugadzira Microvia: Nhamba Chaiyo Dzinodzora Mutengo neMubereko

2.1 Via Dhayamita — Default Yakakura Kunze Kwekuti Pitch Inoshanda Zvisirizvo

Vagadziri vazhinji vanongoda kushandisa ma microvia e 0.10mm nekuti magadzirirwo e HDI anoratidza 0.10mm. Iko kukanganisa — 0.10mm idiki inokonzerwa nemiganhu ye pitch, kwete default. 0.10mm yega yega 0.15mm inoshandiswa apo 0.15mm yaizoshanda inobhadhara mari yekuboorera (inenge 1.6 × mutengo wekuboorera we 0.15mm via) pasina rubatsiro rwe routing.

Mutemo wekusarudza dhayamita:

• 0.10mm: Kana BGA pitch ≤ 0.40mm ichiimanikidza chete, kana kuti nzvimbo yepasi yemukati mechikamu chayo yakaganhurirwa zvakanyanya.
• 0.125mm: Nzvimbo yepakati inoshanda ye 0.40–0.45mm pitch fanout apo nzvimbo inobvumidza
• 0.15mm: Zvinowanzo shandiswa pakushandisa HDI routing — goho riri nani, mutengo wakaderera wekuboorera, uye kuputira mhangura zviri nyore

2.2 Saizi yeLand Pad — Nhamba Inowanzova Isina Kururama

Nzvimbo yekupoterera yakakomberedza nzira yekuona mwenje inofanira kugamuchira zvinhu zviviri zvinokonzera kukanganisa: kurongeka kwenzvimbo yelaser (±25µm) uye kunyoreswa kwelamination (±50–70µm zvichienderana nehuwandu hwenguva yekuvaka). Izvi zvinounganidzwa zvine mwero kana zvanyanya kuipa.

Kuisa mapedhi zvishoma nezvishoma kunoita kuti dhizaini isanyanye kushaikwa. Mapedhi anokurudzirwa kugadzirwa anowedzera 0.06–0.07mm iyo inorarama nekuchinja kwakajairika kwemaitiro. Nzvimbo yemhangura yakawedzerwa haina mari pakugadzira.

2.3 Kurema kweCopper Foil paMatanda Akaungana

Matanda eHDI buildup anofanirwa kushandisa ½ oz (17µm) copper foil — kwete 1 oz. Pakuboorera CO₂, hwindo recopper (conformal mask) rinocherwa nemakemikari risati raboorera nelaser. Ne 1 oz copper, etch undercut inoshandura dhayamita ye 0.10mm kusvika 0.12–0.13mm inoshanda zvakanaka. Ne ½ oz copper, 0.10mm inogona kugoneka. Taura "½ oz copper pane ese matanda eHDI buildup" muzvinyorwa zvako zvekugadzira. Vagadziri vazhinji vanotevedzera ma stack-up asiri eHDI anotsanangura 1 oz mukati uye havazivi kuti chii chiri kuitika.

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3) Chiyero Chekuonekwa: Chikanganiso Chimwe Chete Chinodhura Zvikuru Mukugadzirwa kweHDI

3.1 Nei Chiyero Chekuyera Chichidzora Kuvimbika — Kwete Kungozvipira Chete

Microvia aspect ratio = ukobvu hwe dielectric ÷ kuburikidza nedhayamita. Sezvo chiyero ichi chichikwira pamusoro pe0.8:1, copper plating chemistry iri kuwedzera kuoma kusvika pasi pe via. Mugumisiro wacho imhangura yakatetepa pabvi re via - chaipo panonyanya kushushikana ne thermal panguva yekuchinja kwekushisa. Nzira yekukundikana haisi yekuvhura pakarepo. I via inopfuura bvunzo yefekitori, inopfuura kuongororwa kunouya, uye inokundikana mushure me 200–400 thermal cycles mumunda.

3.2 Mutengo uye Kuvimbika neAspect Ratio

Maitiro akaitwa nevagadziri netsaona kugadzira ratio dzisina kunaka: kukopa stack-up uko buildup dielectric yaive 75µm, asi mugadziri anotsiva prepreg variant yakakora zvishoma — 100µm pachinzvimbo che 75µm. 0.10mm yakafanana kuburikidza ne: aspect ratio inosvetuka kubva pa 0.75:1 kusvika 1.0:1. Gara uchitsanangura ukobvu hwakacheneswa hwe dielectric (semuenzaniso, “1080 prepreg, cured 60µm ±5µm”), kwete nhamba ye prepreg chete.

3.3 Gadziriso: Sarudza Prepreg Yakakodzera

• 1080 prepreg ine 65–70% resin yehuwandu: Inoporesa kusvika 55–65µm — yakakodzera 0.10mm kuburikidza (aspect ratio 0.55–0.65:1)
• 1080 prepreg pa 55% resin: Inoporesa kusvika 70–80µm — inogamuchirika pa 0.10mm (0.70–0.80:1)
• 2116 prepreg: Inoporesa kusvika 110–130µm — usashandise se sole buildup dielectric ye 0.10mm vias

Kutyorwa kwakawanda kweaspect-ratio DFM kunokonzerwa nevagadziri vanotaura kuti 2116 prepreg mu buildup nekuti ndiyo yaive default mu stack-up tool yavo. Kuchinja kuenda ku1080 prepreg kunodhura zvakafanana uye kunogadzirisa dambudziko racho zvachose.

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4) Mitemo yeVia-in-Pad uye Kukundikana kweAssembly Hapana Anokuyambira Nezve

4.1 Kana Via-in-Pad Inodiwa vs. Kana Zvichida

Via-in-pad inoisa microvia zvakananga mukati meBGA kana QFN land pad kwete parutivi payo. Inodiwa kana BGA pitch iri 0.40mm kana pasi uye pasina nzira yekuronga pakati pemapedhi kuti ibude nenzira yakajairika. HAIDI inodiwa otomatiki kune ese maHDI boards - akawanda maBGA e0.50mm-pitch anobuda aine mablind vias akaiswa pakati pemapedhi, kwete mukati mawo. Via-in-pad inowedzera mutengo kuburikidza nekuzadza copper uye planarization. Usaitaure usina kusimbisa kuti routing inoda izvozvo zvechokwadi.

4.2 Nei Via-in-Pad Isina Kuzadzwa Ichiuraya Kuunganidzwa Kwezvinhu

Chinhu chakavhurika chinopinza solder paste mugomba panguva yekudzoreredza mvura. Solder haidzokeri — inonyorovesa madziro emaburi yoramba iri mukati. Mugumisiro wacho unobva waita kuti pave neBGA joint isina solder: solder yakakwana kuti irambe iripo patembiricha yemumba, asi simba remuchina harina kukwana kuti irarame ichidedera kana kupisa. Iyi nzira yekukundikana inogara ichipfuura bvunzo yemagetsi neX-ray patembiricha yemumba, uye inoonekwa chete mukudzoka kwemunda kana kuyedzwa kwehupenyu nekukurumidza.

4.3 Tsanangudzo yeCopper Fill — Zvinofanira Kuva Muzvinyorwa Zvako Zvepamusoro

Taura zvinhu izvi zvese zvina zvakajeka kana mugadziri wezvinhu achashandisa defaults dzingave dzisina kunaka:

• Nzvimbo dzinoshandiswa paindaneti: Rondedzera nemazita emunyoreri, zita remagetsi, kana kuti zvakanyorwa pamufananidzo wekugadzira — kwete "ma "via" ese ari pasi peBGAs" (akawandisa)
• Nzira yekuzadza: "Kuzadzwa nesimbi yemhangura nemagetsi" — kwete "kuzadzwa nesimbi" (zvinogona kureva kuzadzwa ne resin, izvo zvisingakwani kuti zvipiswe zvakanaka)
• Kuronga: "CMP yakarongwa, kubuda kwe ≤15µm pamusoro pemhangura yakakomberedza" ye 0.40mm pitch; ≤25µm inogamuchirwa ye 0.50mm pitch
• Chinyorwa chisina basa: "≤10% nzvimbo isina chinhu paIPC-6012D" — bvunza ≤8% kune chero application ine >500-cycle thermal inodiwa

4.4 Kuvhara mastencil kunofanira kuderedzwa panzvimbo dzinoshandiswa kutakura mastencil

Kubuda kwakazara (kunyangwe pa ≤15µm) kunotora huwandu hwe solder paste. Aperture ye stencil paste pa via-in-pad BGA pads inofanira kunge iri 80–90% yenzvimbo ye nominal pad kuti ikwanise kudzoreredza. Mainjiniya wako we assembly anoda runyorwa rwenzvimbo ye via-in-pad kuti agadzire stencil aperture nemazvo - ruzivo urwu haruendereri otomatiki kubva kuPCB fab notes kuenda kuchikwata che assembly.

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5) CO₂ vs UV Laser: Ndeipi Inodiwa Nekuisa Stack-Up Yako

5.1 Kuvimba Nezvinhu

Laser yeCO₂ (10.6µm infrared) inobvisa dielectric resin asi inoburitsa copper — inoda hwindo remhangura rakachekwa kare (conformal mask) isati yaboora dielectric iri pasi. Laser yeUV (355nm) inobvisa copper zvakananga uye inoboora copper ne dielectric panguva imwe chete.

Zvinoreva dhizaini: Kana PCB yako yakasungirirwa uchishandisa laminates dzakanyanya kuderera kana kuti PTFE-based muzvikamu zvakaunganidzwa, simbisa kuti mugadziri wako ane UV laser kugona usati wapedzisa kugadzira. Vagadziri vane CO₂ laser chete vacharamba kurongeka kana kutsiva imwe buildup dielectric.

5.2 Mapaneru eHybrid CO₂ + UV

Mamwe magadzirirwo anosanganisa majaira emukati eFR4 akajairwa nejira relaminate rakanyanya kurasikirwa kana kuti machira emhando yepamusoro eRF zvikamu. Kana HDI buildup dielectric munzvimbo yeRF isiri FR4, mugadziri anoda maresipi ekuboorera enzvimbo dzakasiyana: UV munzvimbo dzakasarudzika dzelaminate dzakanyanya kurasikirwa, CO₂ kune dzimwe nzvimbo. Izvi zvinogoneka asi zvinoda manzwi emuganhu wenzvimbo dzakajeka padhirowa yekugadzira. Mashoko asina kujeka akadai sekuti "patch yelaminate yakanyanya kurasikirwa munzvimbo yeRF" anomanikidza mainjiniya weCAM kufungidzira - uye vachashandisa marongero anochengetedza akakodzera nzvimbo dzese.

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6) Mashandisirwo Anoitwa Mainjiniya eCAM Mafaira Ako Ekuchera NeLaser — Uye Zvinovabatsira

6.1 Zvinhu Zvina Zvinoitwa neCAM Engineering Nemafaira Ako eHDI

Kunzwisisa mashandiro eCAM kunoita kuti ugadzirire mafaira anogadzirwa zvakananga pane kutanga ongororo yemaawa makumi maviri nemana kusvika makumi mana nemasere:

Danho 1 — Kusimbiswa kweStack-up. Mainjiniya weCAM anoongorora kana ukobvu hwe dielectric hwakatarwa huchiburitsa ma impedance values ​​akakodzera UYE huchitsigira via aspect ratios mudhizaini. Kana wakataura prepreg ne style number chete (kwete curved thickness), mainjiniya weCAM anoshandisa factory default variant ye style iyoyo - iyo inogona kusiyana neyaishandiswa ne EDA tool yako pakuverenga impedance.

Danho rechipiri — Kubvisa zvinhu ne layer pair. Chirongwa che laser drill chinovakwa nekubvisa zvinhu ne ma shapes anoonekwa pane rimwe layer asi kwete zvakasiyana. Kana dhizaini yako iine ma blind vias anobatanidza ma layer asiri pedyo (chikanganiso chinowanzoitika pakugadzira HDI), apa ndipo painowanikwa — mushure mekunge wamirira zuva rese kuti uwane mutengo.

Danho rechitatu — Mepu yekuripa mari yekunyoresa. Kuwanda kwemhangura isina kuenzana pakati pezvikamu zvemukati kunokonzera kuwedzera kwepaneru isina kuenzana panguva yekuyeresa, zvichichinja nzvimbo dzemhangura chaiyo kubva kumaCAD coordinates. CAM inoverenga mepu yekukanganisa kwepaneru yese uye inogadzirisa nzvimbo dzekuboorera nelaser kuti idzore. Zvikamu zvemukati zvine kugoverwa kwemhangura isina kuenzana (80% pakati, 20% mipendero) zvinoita kuti modhi iyi isanyatsojeka, zvichiwedzera kukanganisa kwenzvimbo.

Danho rechina — Kugadzira mahwindo eConformal mask. Pakuboorera CO₂, CAM inogadzira mahwindo emhangura akatenderedza blind yega yega kuburikidza nenzvimbo — dhayamita yehwindo = kuburikidza nedhayamita + 50–75µm kumativi ese. Kana dhizaini yako yepad yekunze isingasiye mhangura yakakwana yakatenderedza mahwindo aya, CAM icharatidza marginal geometry.

6.2 Zvekuisa Mumafaira Ako Kuti Udzivise Kudzokera-uye-Kudzoka

• Ukobvu hwe dielectric hwakagadziriswa pachikamu chimwe nechimwe, kwete kungogadzirira chete: "1080 prepreg, yakarapwa 60µm ±5µm" — kwete "1080." Izvi zvinovhara chiyero cheaspect uye impedance kuverenga panguva imwe chete.
• Mapeya ebofu kuburikidza nezvikamu anotsanangurwa zvakajeka: "Blind vias Layer 1 →Layer 2 (zviso zvese)" muzvinyorwa zvekugadzira. Mainjiniya eCAM akaona mapeya ezvikamu asina kutsanangurwa zvakanaka zvekuti kufona kwakajeka kunodzivisa chikumbiro chekuongorora.
• Nzvimbo dzinoshandiswa kuburikidza nepadhi dzakaonekwa: Rondedzera uchishandisa marefdes, zita rewebhu, kana PDF yakanyorwa. Pasina izvi, CAM inoshandisa maitiro avo ekuzadza akajairika - angangove resin plug, kwete copper fill.
• Chinyorwa chekuenzanisa kwemhangura kune zvikamu zvisina kusimba: Kana jira risina kunyatsojeka (30% copper nekuda kwezvikonzero zve impedance), cherechedza zvakajeka kuitira kuti mainjiniya weCAM asazviratidze sechikanganiso chingangoitika pakugadzira.

6.3 Chii Chinokonzera Kunonoka Kwakanyanya Kwekuongorora

• Faira remapofu kuburikidza nedhiri harisiyanisi kuti ndeapi ma-vias anomira padanho ripi — CAM inofanira kugadziriswa kubva pa geometry inopindirana
• Stack-up inotsanangura prepreg nemaitiro chete - mugadziri wezvigadzirwa anofanira kusimbisa kuti ndeipi mhando iri muchitoro uye kana ichisangana neaspect ratio.
• Via-in-pad uye standard blind vias hazvisiyaniswi — mugadziri haagone kuona zvinodiwa pakuzadza
• Impedance spec inoreva plane layer isipo mu stack-up yakatumirwa

Hapana chimwe cheizvi chinoda kuchinjwa kwedhizaini. Zvinoda magwaro anotora maminetsi makumi matatu uye anochengetedza maawa makumi mana nemasere.

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7) Zvinokonzera Mutengo weKuboorwa neLaser: Chii Chinosimudzira Mutengo Wako weHDI Kukwira Kana Kudzikira

7.1 Zvinhu Zvishanu Zvinochinja Mutengo

Chinoshanduka 1 — Kuburikidza nekuverenga. Nguva yemuchina weLaser ndiyo dambudziko reHDI. Magirazi ekuona 6,000 pamadziro ekushandisa anotora nguva yakareba kupfuura 3× kupfuura 2,000. Kugadzirisa dhizaini — uchishandisa maburi akavigwa kutsiva magirazi akaunganidzwa kuburikidza necheni, kugovera magirazi pakati pemasaini ari pedyo — kunoderedza kuverenga uye mutengo zvakananga.

Chinoshanduka 2 — Kuburikidza nedhayamita uye nhamba yemapfuti. 0.10mm kuburikidza inoda mapfuti elaser 6–10 (trepanning pattern). 0.15mm kuburikidza inoda 3–5. Papaneru ine mavhiya 3,000, kuchinja ayo asingade 0.10mm kuenda ku0.15mm kunochengetedza inenge 30–40% yenguva yemuchina welaser. Kuderedzwa kwemutengo chaiko uye kunoyerwa.

Chinoshanduka 3 — Huwandu hwematanho e lamination. Kutenderera kwega kwega kunowedzera mazuva 2-3 uye mutengo wakaenzana. Rudzi I (matanho maviri) → Rudzi II (matanho matatu) → Rudzi III (matanho mana+) imwe neimwe inowedzera inenge 25-35% padanho rekuwedzera.

Chinoshanduka 4 — Kudiwa kwekuzadza mhangura. Kuzadza mhangura nemagetsi pamidziyo yakarongwa kunowedzera maawa 18-30 pakufamba kwekuzadza. Kana michina yakarongwa (≥0.20mm yakatsetseka pakati pemapeya ari pedyo) ichishanda mukufambisa kwako, kubvisa zvinodiwa zvekuzadza kunochengetedza 20-35% yemari yeHDI pachikamu chimwe nechimwe.

Variable 5 — Rudzi rweLaser. CO₂ mutengo wakajairika. UV laser (inodiwa kune vasiri FR4 dielectrics) inowedzera 15–25%. Bhajeti reizvi kana muunganidzwa wako ukashandisa laminates dzakagadzirwa nePTFE muma layers akaunganidzwa.

7.2 Mutengo weIndekisi neRudzi rweBuild

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8) Zvikanganiso Zvisere Zvekugadzira Zvinowanikwa Pakuongorora kweDFM

Izvi zvinonyanya kuonekwa muongororo dzeHDI DFM. Zvese zvinogadziriswa zvisati zvagadzirwa — hapana chinoda kugadziriswa kwakazara.

1. Pofumadza kuburikidza nekubatanidza zvidimbu zvisiri pedyo. Nzira yekubvisa mapofu kubva kuL1 kuenda kuL3 muType I build haigone kugadzirwa — laser inomira pamhangura yekutanga yainosangana nayo (L2). Gadzirisa: nzira mbiri dzekubvisa mapofu dzakatevedzana kuburikidza ne staggered kana stacked configuration.
2. Chiyero cheaspect chiri pamusoro pe0.8:1 nekuda kwekusagadzirira zvakanaka. Zvinowanzo kukonzerwa nekusarudza 2116 prepreg (inoporesa kusvika 110–130µm) ine 0.10mm vias. Gadzirisa: chinja buildup prepreg kuita 1080-style pa 60–70µm curved thickness.
3. 1 oz mhangura paHDI buildup layers. Zvinoderedza kunaka kwemahwindo emasiki uye zvinosimudzira dhayamita kusvika 0.12–0.13mm. Gadzirisa: tsanangura 17µm mhangura pazvikamu zvakaunganidzwa mumapepa ekugadzira.
4. Mapedhi epasi akakura zvishoma pasina muganho. Chero shanduko yekunyoresa inokonzera kubuda kwedata. Gadzirisa: shandisa mavalue anokurudzirwa mukugadzira ari muChikamu 2.2.
5. Via-in-pad haina kunyorwa muzvinyorwa zvekugadzira. Mugadziri wezvinhu anoshandisa chivharo che resin chakajairwa kuma blind vias ese; nzvimbo dzinoshandiswa kuburikidza nepad dzinoita zvisirizvo. Gadzirisa: nyora nzvimbo dzinoshandiswa kuburikidza nepad zvakajeka ne copper fill uye CMP planarization yakatarwa.
6. Ma "stacked vias" aishanda panzvimbo dzaka "staggered". Mari yekuwedzera copper fill uye maawa anopfuura makumi matatu ekugadzirisa zvisina basa. Gadzirisa: tarisa kana 0.20mm horizontal offset pakati pe via pairs ichikwanisika — kana hongu, chinja kuita staggered.
7. Ukobvu hwe dielectric hauna kutaurwa, asi maitiro e prepreg chete. Fabricator inoshandisa shanduko yavo yemazuva ano, iyo inogona kusiyana ne75µm inofungidzirwa nechinhu chako cheEDA. Gadzirisa: tsanangura ukobvu hwe dielectric hwakagadziriswa pachikamu chimwe nechimwe nekutsungirira.
8. Kusawirirana kwehuwandu hwemhangura kunokonzera njodzi yekudonha kwenhamba yemagetsi. Matanda emukati ane <25% mhangura pahafu imwe chete anokonzera kuwedzera kwepaneru isina kufanana uye kuunganidzwa kwezvikanganiso zvekunyoresa panguva dzese dzekutsvedza. Gadzirisa: wedzera mhangura yakachekwa munzvimbo dzisina kusimba — haidi kubatanidzwa kune chero mambure.

8.1 Nzvimbo yeHighleap yeKuchera neLaser

Highleap Electronics inopa kugona kwakakwana kwekugadzira HDI:

• CO₂ laser: Masisitimu matanhatu, 0.10mm shoma, 400–600 via/min, maitiro e conformal mask eFR4 nema laminates ese anoenderana neFR4
• UV laser: Masisitimu maviri, 0.075mm shoma, dhayi remhangura rakananga — laminate yakasarudzika ine kurasikirwa kwakaderera, PTFE, inoenderana nepolyimide
• Kuzadza kwemhangura: Kuzadzwa kwemhangura kwakaputirwa nemagetsi neCMP kusvika ≤15µm kubuda; void spec ≤8% (inodarika IPC-6012D Class 3 ≤10%)
• Mhando dzekuvaka: Type I kusvika Type III, anylayer HDI inosvika mana buildup layers pachiso chimwe nechimwe, rigid-flex HDI hybrid
• Ongororo yeDFM: Mutengo wega wega weHDI unosanganisira kutarisa chiyero cheaspect ratio, certification ye layer pair, uye copper fill callout review mukati memaawa makumi maviri nemana — pamwe nemazano chaiwo ekugadzirisa, kwete zviratidzo zvekuramba.

Tumira Mafaira Ako eHDI Kuti Uongororwe uye Utengeserwe neDFM