Sei Bofu Via PCBs Impact Electronics Manufacturing

MaVia chinhu chakakosha mukushanda kwebhodhi redunhu rakadhindwa ( PCB ). Iwo maburi anobatanidza zvikamu zvakasiyana zvePCB nemagetsi uye nekupisa. MaVia anobvumira kubatana kwematrace, mapolygon, uye mapedhi muzvikamu zvakasiyana zvebhodhi redunhu, nokudaro zvichivandudza mashandisirwo enzvimbo. Pakati pemhando dzakasiyana dzemaVia, maVia asingaonekwe anoita basa rakakosha. Chinyorwa chino chinoongorora maVia asingaonekwe muPCB, chichipa ruzivo mutsananguro yawo, maitiro, maitiro ekugadzira, mhando, uye mashandisirwo.

Kunzwisisa Vias muPCBs

Vias chinhu chakakosha mukugadzira uye kushanda kwePCBs. Iwo maburi madiki anogona kunge akaputirwa kana kudhiriwa kuti amise kubatanidza kwemagetsi pakati pezvikamu zvakasiyana zvePCB. Izvi zvinongedzo zvakakosha pakubatanidza mapedhi, zviteshi, uye zvikamu muzvikamu zvakasiyana-siyana, zvichibvumira kutapurirana kwemasaini uye simba mubhodhi rese.

Rimwe remabasa anokosha e-vias nderokuita kuti shanduko dzive nezviratidzo nekubatanidza zvikamu zvechiratidzo kana ndege. Izvi zvinobatsira mukufambisa masaini zvakanaka uye zvinobudirira mukati mePCB. Vias inowanzoputirwa mukati nemhangura kugadzira magetsi ekubatanidza mukati me insulating layers yebhodhi.

Zvakakosha kusiyanisa ma-via kubva kuma-plated through-holes ( PTH ), ayo anoshanda zvakasiyana. Ma-PTH anonyanya kushandiswa kubatanidza zvikamu zve-through-hole pabhodhi, nepo ma-via achishandiswa kusimbisa kubatana pakati pezvikamu zvakasiyana zvePCB.

Muchidimbu, vias inoita basa rakakosha mukushanda uye dhizaini yePCB, ichigonesa kutapurirana kwakanaka kwemasaini uye simba pazvikamu zvakasiyana zvebhodhi. Kunzwisisa marudzi akasiyana-siyana e-vias uye mashandisirwo avo kwakakosha pakugadzira nekugadzira maPCB emhando yepamusoro.

Chii chinonzi Mapofu Vias muPCBs?

Blind vias vari specialized mhando vias kuti kutanga kubva kune imwe yokunze huso pamusoro PCB uye kuwedzera chete kuti chaiwo mukati akaturikidzana, pasina kupfuura yose bhodhi. Kusiyana kuburikidza-gomba vias kuti batanidza ose akaturikidzana PCB, bofu vias kupa yakanangwa connectivity pakati vakasarudzwa akaturikidzana. Kugona uku kunoita kuti mapofu anyanye kubatsira mumamiriro ezvinhu apo kugadzirisa nzvimbo paPCB kwakakosha.

Basa rekutanga remapofu muPCB dhizaini nderekuwedzera huwandu hwekubatana pakati pekunze nemukati akaturikidzana uku uchideredza kudiwa kwemamwe maitirwo enzira. Nokuita kudaro, mapofu vias inobatsira kune mamwe marongerwo anobudirira uye kuderedza kuoma kwese kwebhodhi rekugadzira. Semuyenzaniso, mabhofu vias anogona kubatanidza pamusoro pepamusoro peturu kune inotevera dhizaini pazasi payo, ichipa dzimwe nzira dzekufambisa nekuvandudza mashandisirwo enzvimbo.

Zvimiro zveBofu Vias

Blind vias, rudzi rwekupfuura rinoshandiswa mumabhodhi edunhu akadhindwa (PCBs), inopa akati wandei akasiyana maficha anoita kuti ave akakosha muPCB dhizaini:

Upamhi nenzvimbo yakaderera yekutevera: Ma "blind vias" anogonesa vagadziri kuderedza upamhi hwe "traces" uye nzvimbo iri pakati pavo. Izvi zvinobvumira kuwedzera kwehuwandu hwe "routing density" paPCB, izvo zvinogona kuve zvakakosha mumagadzirirwo ane nzvimbo shoma.

Maburi akawanda kupfuura bhodhi rekare: Ma-blind vias anobvumira ma-via akawanda panzvimbo imwe neimwe zvichienzaniswa nema-via ekare anofukidza ukobvu hwese hwePCB. Izvi zvinowedzera kuburikidza nehukuru hwemagadzirirwo zvinopa kushanduka kukuru kwedhizaini uye zvinogona kubatsira kugadzirisa kusimba kwechiratidzo uye kugoverwa kwesimba.

Kuwanda kwemapad uye waya: Nekuti ma blind vias anongosvika kune mamwe ma layer ePCB, anogonesa kuwanda kwemapad uye waya dziri pabhodhi. Izvi zvinogona kutungamira kumagadzirirwo akamanikana uye anoshanda zvakanaka, kunyanya mukushandiswa kwe high density.

Mhinduro isingadhuri: Pasinei nekuoma kwadzo kwakawedzerwa, ma-blind vias anogona kuva mhinduro isingadhuri yekugadzirisa magadzirirwo ePCB. Nekuderedza huwandu hwema layer anodiwa mudhizaini, ma-blind vias anogona kubatsira kuderedza mitengo yekugadzira uku achisangana nezvinodiwa zvekushanda.

Mabofu vias anopa akati wandei akakosha mabhenefiti muPCB dhizaini, kusanganisira yakawedzera density yenzira, dhizaini yakakura kuchinjika, uye mutengo-kushanda. Aya maficha anovaita chishandiso chakakosha chevagadziri vanotarisa kukwenenzvera kuita uye kugona kwePCB magadzirirwo avo.

Kugadzira Mapofu Vias muPCBs

Kugadzira mapofu muPCBs kunoda kutevedzera kune yakatarwa nhungamiro kuti ive nechokwadi chekushanda kwakakodzera uye kuvimbika. Heino mhedziso yakadzama yemaitiro acho:

1. Matanho ekutanga ekugadzira PCB: Maitiro acho anotanga nekugadzirwa kwePCB core, inoumba hwaro hwaro hwePCB. Iri musimboti rinowanzo gadzirwa ne substrate zvinhu senge FR-4.
2. Mitemo yeMapofu Vias: Paunenge uchigadzira mapofu, mitemo yakawanda inofanira kuteverwa:
   • Mabofu vias anofanira kutanga kubva kumusoro kana kuzasi layer yePCB.
   • Havafaniri kupfuura nenhamba isinganzwisisike yezvikamu.
   • Mabofu vias haafanire kuyambuka ukobvu hwese hwePCB.
   • Blind vias haafanire kutanga kana kupera pakati kana pakati pe PCB substrate.
3. Kugadzira Mapofu Vias: Blind vias anodhiriwa kana kugadzirwa muPCB kuti abatanidze machira emukati nechepamusoro. Kunyatso funga kunofanira kupiwa kukura uye kudzika vias nechokwadi zvakakodzera metallization unhu uye kushanda.
4. Vias Diameter uye Kudzika: The dhayamita uye kudzika vias bofu zvinokosha. Kudzika kwemapofu kuburikidza hakufanirwe kudarika 1, sezvo yakadzika vias inogona kutungamirira mukukanganiswa kana zvimwe zvinhu. Huru vias inoratidza yakakura dielectric gap pakati pePCB layer.
5. Drilling process: The mapofu vias anowedzerwa PCB kuburikidza kuchera muitiro. Zvakakosha kuve nechokwadi kuti kudzika kwechibhorani kwakaringana kugadzira kubatana kwakasimba pasina kukanganisa kuvimbika kwePCB.
6. Kushandisa Drill File: Rimwe faira rekuboora rinoshandiswa kutsanangura mapofu kuburikidza negomba. Saizi yegomba inoratidza chinhambwe chiri pakati pezvikamu zvemukati nekunze zvePCB.
7. Kurongedza PCB Layers: Prepreg zvinhu zvinoshandiswa kurongedza PCB akaturikidzana, kuve nechokwadi chekuti mapofu akanyatsobatanidzwa muPCB chimiro.

Nokutevera nhungamiro idzi uye maitiro, vagadziri vanogona kugadzira vias bofu muPCBs zvinobudirira, kuve nechokwadi chekuita kwakakwana uye kuvimbika.

Mhando dzeMapofu Vias

Mabofu vias anouya mumhando dzakasiyana, imwe neimwe iine yayo yekugadzira nzira uye maitiro:

• Controlled-Depth Bofu Vias: Aya vias akasikwa zvakafanana kune kuburikidza-gomba vias asi ane zvishoma musiyano. Iyo drill inoshandiswa kugadzira maburi inoiswa kuti ipinde zvishoma kuburikidza nebhodhi redunhu. Tekinoroji yemazuva ano inovimbisa kuti maficha haazosangana nechibhorani. Mushure mekuchera, gomba rinoputirwa nemhangura. Nepo inodzorwa-yakadzama bofu vias kupa zvakanakira, akadai chaiyo kudzika kudzora, vangasava nguva dzose yakanakisisa sarudzo nokuda zvinodiwa makomba akakura zvakakwana.
• Laser-Drilled Bofu Vias:Laser-Drilled Bofu Vias: vias izvi zvinowanzogadzirwa pashure laminating ari PCB, asi pamberi okunze layer undergoes etching uye lamination. Mhando dzakasiyana dze lasers dzinogona kushandiswa kugadzira maburi aya, aine mhedzisiro inowirirana. Laser-drilled bofu vias inopa yakanyanya kurongeka uye yakakodzera kune yakaoma PCB dhizaini.
• Photo-Defined Bofu Vias: Kusikwa kweizvi vias kunosanganisira laminating a photosensitive resin kune pakati. Iwo mafotosensitive sheets ane pateni inoratidza panofanira kuitwa maburi. Bhodhi rinobva raoneswa chiedza, zvichiita kuti zvinhu zvasara paPCB zviome. Zvadaro, bhodhi rinoiswa mune etching solution kubvisa zvinhu kubva mumakomba. Mushure mekuisa mhangura mumakomba, iyo PCB yekunze layer inogadzirwa. Photo-inotsanangurwa bofu vias inopa chaiyo kutonga uye inokodzera yakakwirira-density PCB magadzirirwo.
• Sequential-Lamination Blind Vias: Aya vias anogadzirwa achishandisa rakatetepa laminate, yakafanana nemaitiro epamativi maviri PCB. Zvinhu zvinoumbwa padivi rinozove chikamu chechipiri chebhodhi, paine pepa remhangura kune rimwe divi richigadzira danga rekutanga. Nepo iyo sequential-lamination nzira inopa mamwe mabhenefiti, akadai sekuwedzera layer count uye kuoma, haiwanzo kushandiswa nekuda kwekudhura kwayo.

Mhando yega yega yemapofu kuburikidza ine zvayakanakira nezvayakaipira, uye sarudzo yekushandisa zvinoenderana nezvinodiwa chaizvo zvePCB dhizaini.

Zvakakosha Kufunga nezvePCB Vias

Paunenge uchisarudza kuburikidza nemhando yePCB dhizaini yako, akati wandei akakosha anofanirwa kuverengerwa kuti ive nechokwadi chakakwana chiratidzo chekuvimbika, kugadzira, uye kuvimbika:

Kuvimbika Kwechiratidzo : Ma "Vias", pasinei nekureba kwawo kupfupi, anogona kukanganisa zvakanyanya kuvimbika kwechiratidzo, kunyanya mukushandiswa kwe "high-frequency applications". Semuenzaniso, "through-buri" kuburikidza nekubatanidza "layers" mbiri dzepamusoro mu "ten-layer PCB" inopfuura ne "layers" sere dzesimbi, zvichikonzera kukanganiswa. Zvakakosha kuziva nekugadzirisa matambudziko akadaro kuti "signal" irambe ichishanda zvakanaka. Kushandisa maturusi ekugadzira maPCB epamusoro akadai seCadence Allegro kunogona kubatsira kuona nekuderedza matambudziko ekuvimbika kwechiratidzo usati wagadzira.

Chiyero cheAspect : Chiyero cheaspect via muPCB chinhu chakakosha chinokanganisa kugadzirwa kwayo, kuvimbika kwayo, uye mutengo wayo. Chinotsanangurwa sechiyero chedhayamita yeburi re via (D) nehukobvu hwePCB (H), iyo yakaenzana nehurefu hwebharero re via. Chiyero chepamusoro chinoratidza via yakareba uye yakamanikana, izvo zvinogona kukonzera matambudziko panguva yekuisa plating uye kukanganisa kunaka kwese kwevia.

Munguva yekugadzira, iyo kuburikidza nemaburi inoputirwa nemhangura kuti ipe magetsi ekubatanidza pakati pezvikamu zvePCB. Maitiro ekuputira anosanganisira matanho akati wandei, anosanganisira kuchera makomba, kuchenesa maburi, kushandisa conductive kabhoni layer, uye electroplating mhangura. Makomba mahombe anonyanya kunetsa pandiro nekuti mushonga wemakemikari une maion ecopper unofanira kuyerera mugomba, uye madhiramu marefu anoita kuti zviome kuti mushonga wacho usvike pakati pebhomba.

Pamakomba ane dhayamita 10 miriyoni kana pamusoro, aspect ratio ye1:10 inogashira, nehupamhi hwebhodhi ukobvu hwe3 mm. Kune maburi madiki, senge 8 mil kana 6 mil, yakaderera chikamu ratios inodiwa, pamwe neatete maPCB. Semuenzaniso, 8 mil buri rinogona kunge riine aspect ratio ye1:8, nehupamhi hwebhodhi ukobvu hwe1.6 mm.

Muchidimbu, chikamu chechiyero chevhavha chinhu chakakosha kutariswa muPCB dhizaini, sezvo ichikanganisa maitiro ekuisa, kuvimbika, uye mutengo webhodhi. Vagadziri vanofanira kunyatsosarudza chikamu chechiyero zvichienderana negomba dhayamita uye bhodhi ukobvu kuti ive nechokwadi chekubudirira kwePCB yekugadzira maitiro.

Kuwanda Kwenzira : Nzvimbo dzakamanikana dzePCB, kunyanya idzo dzine ma pin-count ball grid arrays (BGAs), dzinoda nzira yekunyatso fambisa kuti dzisavhare nzira. Kushandisa nzira dze blind vias kunogona kukosha mukubvumira nzira yekubuda yeBGAs, kuve nechokwadi chekuti pin yega yega yakabatana zvakanaka. Zvakakosha kugadzira mapuraneti enzira nematanho ekudzivirira kuvharika pasi pezvikamu zvakadaro.

Ring Yakaganhurirwa : Saizi yerin'i yakaganhurirwa, nzvimbo yepedhi remhangura yakakomberedza gomba rakaboorwa, chimwe chinhu chakakosha kufunga nezvacho. Chibooreso chemuchina chinogona kutsauka panguva yekuboorwa, zvichikonzera kuputika kwechibooreso kana ring yakaganhurirwa isina kukwana. Kuva nechokwadi chekuti rin'i yakaganhurirwa yakakura zvakakwana kunobatsira kudzivirira kuputika kwechibooreso uye kunoita kuti pave nekubatana kwakavimbika.

Kufunga nezvezvinhu izvi pakusarudza nekugadzira vias zvePCB yako kuchabatsira kukwidziridza kuvimbika kwechiratidzo, manufacturability, uye kuvimbika, pakupedzisira zvichibatsira mukubudirira kwese kwePCB yako dhizaini.

Kuita Zvakanakisa Kushandisa Vias Yedhizaini Yako

Vias inoita basa rakakosha mukugadzirwa kwePCB, ichipa nzira dzekudziya uye magetsi emagetsi kuti afambise mukati mezvikamu. Nepo vias akawanda akatenderedza kana denderedzwa, chikamu Mapedhi kwavanobatana anogona siyana muchimiro. Kushandisa PCB dhizaini pasuru ine yakazara kuburikidza ne manejimendi mashandiro, senge Cadence's Allegro PCB Mharidzo, yakakosha kune yakakodzera kuburikidza nesarudzo.

Kune mapedhi anotakura zvazvino, kuburikidza nejometri yakakosha pakuona chiratidzo chemagetsi paramita. Kunzwisisa zvazvino zvinotakura zvinodikanwa zvemateki ako kiyi pakuona kuti vias inogona kutamisa masaini nekuvimbika kwepamusoro, kurasikirwa kushoma, uye mukati memiganhu yeampacity. Kushanda kuronda upamhi uye spacing zvinokoshawo, sezvo vias azere matunhu pakati pepamusoro zvinoriumba.

Kuomerera kune IPC-2222 zviyero zvehushoma gomba saizi kwakakosha. Mushure mekuona hudiki hwegomba saizi, IPC-2221 Standard equations inofanirwa kushandiswa kuona pad dhayamita. Zvinokurudzirwawo kuderedza nhamba vias anoshandiswa kudzivisa zvinorehwa bhodhi michina uye magetsi zvinhu.

Kudyidzana nemugadziri wako wePCB kwakakosha pakugadzira bhodhi. Drill hole kugona kunogona kusiyana pakati pevagadziri, kunyanya zvine chekuita nereshiyo reshiyo uye saizi shoma yegomba. Kunyatsosarudza kuburikidza nemhando uye saizi kwakakosha pakugadzira madhizaini anokwirisa nzvimbo uye anozadzisa zvinangwa zvekuita. Kunzwisisa hukama pakati pekufamba kwepamusoro uye nzira kuenda uye kuburikidza nendege kwakakoshawo pakufambisa kunoshanda.

Zvishandiso zveMapofu Vias muPCBs

Ma-blind vias anoshandiswa zvakanyanya munzvimbo dzakasiyana-siyana dzakakosha pakugadzira nekugadzira maPCB , kusanganisira:

1. Kuderedza PCB Layers: Imwe yeanonyanya kushandisa yemapofu vias kudzikisa huwandu hwePCB maseru anodiwa. Nekubvumidza zvisaririra kuti zvifambiswe kubva kune ekunze akaturikidzana kusvika kune yemukati akaturikidzana, mapofu vias anogonesa vagadziri kuti vakwanise kuzadzisa chinodiwa chekubatanidza pasina kuwedzera mamwe matinji, nokudaro kuderedza bhodhi ukobvu uye mutengo.
2. BGA Breakout: Blind vias anowanzo shandiswa kufambisa maronda kubva kubhora regrid array (BGA) zvikamu kusvika mukati mezvikamu zvePCB. BGAs vane pini yakakura kuverenga uye inoda nhamba huru yekubatanidza, iyo inogona kunyatsogadziriswa uchishandisa mapofu mabhofu kuti uwane mukati mezvikamu zvekufambisa.
3. Aspect Ratio Reduction: Mabofu vias anoita basa rakakosha mukudzikisa chikamu chechikamu chePCBs. Aspect ratio inoreva chiyero cheukobvu hwePCB kusvika padhayamita yegomba rakacherwa. Nekushandisa bofu vias, vagadziri vanogona kuderedza ukobvu hwePCB, zvichikonzera kureruka uye mamwe compact board.
4. High-Density Interconnect (HDI) Mabhodhi: HDI mabhodhi anoda yakakwira routing density uye simba rekutakura masimba. Mapofu vias akakosha muHDI mabhodhi kuti uwane inodiwa yekubatanidza pakati pematanho uchichengetedza compact fomu chinhu. HDI mabhodhi anowanzo shandiswa mumashandisirwo ane nzvimbo shoma, senge ma smartphones, mahwendefa, uye zvimwe zvinotakurika zvemagetsi zvigadzirwa.

Pakazere, mapofu evhavha chinhu chinochinja-chinja uye chakakosha chemazuva ano PCB dhizaini, zvichiita kuti vagadziri vakwanise kuwana yakakwirira routing densities, kuderedza bhodhi ukobvu, uye kunatsiridza kuita kwese uye kuvimbika.

mhedziso

Mabofu vias anobatsira mukunatsiridza PCB magadzirirwo nekupa mamwe enzira mikana uye kuderedza kudiwa kweakawandisa akaturikidzana. Ivo vanounza akawanda mabhenefiti, akadai sekuvandudza density yenzira, kudzikiswa kwemutengo, uye kuwedzera dhizaini inoshanduka. Izvo zvakakosha kuti PCB vagadziri uye vagadziri vanzwisise maitiro ekugadzira, akasiyana marudzi, uye mashandisirwo emapofu ekuwedzera dhizaini dhizaini, kuita hukuru hwepamusoro, uye kuve nechokwadi chekubhadhara mari.