Yakavimbika HDI Flex PCB Mugadziri | Highleap Electronic

Kweanopfuura makore gumi, Highleap Electronics anga ari mutungamiri muchizvarwa chinotevera µVia tekinoroji. Sechinyakare laser kuburikidza neplating inosvika painogumira, yedu HDI flex PCBs iri kutyaira ramangwana rekuita kwemagetsi uye kuvimbika. Nekushandisa µVia idiki se50 μm uye mhangura yakatetepa se8 μm, tiri kusunda miganhu yehutsi mumapakeji emagetsi.

Pamberi pe tekinoroji yeFPC (Flexible Printed Circuit), Highleap Electronics inogonesa kuita kuti zvishandiso zve3D zvidiki zvikwanise kukotama zvishoma uye Ultra-HDI. Kubudirira uku kunobvumira kugadzirwa kwezvipfeko zvidiki, zvakabatanidzwa zvakanyanya uye mashandisirwo ezviratidzo zvemhando yepamusoro.

Iine rekodhi rekodhi mumaseketi anochinjika, tinopa zvigadzirwa zvine akaturikidzana kuverenga kubva pa1 kusvika 16, tichishanda neakanyanya-tete polyimide foils (akatetepa se12.5 µm) uye chaiyo anonamira bond plys. Yedu laser-yakadhiriwa vias idiki se35 µm muhupamhi inogona kuzadzwa nemhangura kugadzira epamberi via-in-pad zvimiro, kuve nechokwadi chekuvimbika kwepamusoro uye kudzokorora muchigadzirwa chese.

Zvakanakira HDI Flex PCBs

Yakakwira-Density Interconnect (HDI) inochinjika maseketi inopa huwandu hwezvakanakira pane akajairwa anochinjika maseketi, anosanganisira:

1. Mutengo Wakaderera uye Saizi Diki: Kuwedzera kwehuwandu hwemasekete kunogona kubvisa mamwe ma layer, zvichichengetedza kusvika ku40% zvichienzaniswa nemagadzirirwo asiri eHDI.

2. Kurongedza Zvikamu Zvepamusoro: HDI inobvumira kugona kweI/O yepamusoro uye kugona kwekuita zvinhu zvakanaka.

3. Sarudzo Dzakawanda Dzekugadzira Uye Kuchinjika: Ma microvia akavharika uye akavharika anobvumira kutungamira kwe conductor pazvikamu zvemukati pasi pema vias, zvichigadzira nzvimbo yakawanda yekugadzira pachikamu chimwe nechimwe.

4. Kuvandudzwa Kwekushanda Kwemagetsi uye Kusimba Kwemasaini: Ma microvia ari mumasekete ekumhanya zvakanyanya anovandudza kushanda kwemagetsi nekubvumira nzira pfupi dzemasekete, kuderedza stub, uye kuderedza crosstalk neruzha.

5. Kushanda Kwakanaka Kwekupisa uye Kuvimbika: Microvias inoderedza kushushikana kwekupisa kwez-axis pakati pezvikamu zviri pedyo.

6. Kubudirira Kwakawedzerwa Kwemari: Saizi yepaneli yeHighleap Electronic ine 18” x 24” (45.7 cm x 61 cm) inowedzera huwandu hwepaneli, zvichiwedzera kushanda zvakanaka kwemaitiro ekubatanidza.

HDI Flex PCB Kugona Kuongorora

KuHighleap Electronics, tekinoroji yedu yeHDI Flex PCB inogadzirwa kuti ikwire-density, compact dhizaini ine mashandiro anoshamisa. Isu tinopa maPCB anochinjika kubva pa3 kusvika ku16 akaturikidzana, akagadzirirwa kusangana nezvinodiwa zvemagetsi emazuva ano.

Yedu HDI Flex PCBs inoratidzira microvia saizi idiki se50 μm yapera, ine mutsara wakanaka uye spacing pa50 μm. Yepamberi sequential kuvaka tekinoroji inobvumira mapofu akavimbika uye akavigwa vias, nepo mhangura kuburikidza nekuzadza inovimbisa kusimba kwenguva refu. Ona tafura iri pazasi kuti uwane yakadzama yezvedu HDI Flex PCB kugona, yakagadziridzwa yemhando yepamusoro-inoshanda maapplication.

Zvishandiso Zvinoshandiswa muHDI Flex PCBs

Zvishandiso zvinoshandiswa muHDI Flex PCBs zvakanyatsosarudzwa kuti ive nechokwadi chekushanda kwepamusoro uye kuvimbika mumashandisirwo akasiyana siyana. Pazasi pane mhedziso yezvinhu zvakakosha zvinoshandiswa mukugadzira maitiro:

• Kavha/Substrate
• Polyimide Firimu: Inowanikwa muhukobvu hwe ½ mil (12μm), 1 mil (25μm), 2 mil (50μm), 3 mil (75μm), uye 5 mil (125μm)
• Liquid Photoimageable Coverlay (LPI): Inoshandiswa kune chaiyo uye yakasimba kuchengetedza kwepamusoro.
• kondakita
• mhangura: Inopihwa muhukobvu hwakasiyana: 1/8 oz. (5μm), 1/4 oz. (9μm), 1/3 oz. (12μm), 1/2 oz. (18μm), 1 oz. (35μm), 2 oz. (71μm), 3 oz. (107μm)
• Stiffener
• Epoxy-Glass (FR-4), Polyimide-Glass, Polyimide, Copper, Aluminium: Inoshandiswa kuwedzera kutendeseka kwechimiro uye kutsigira kuchinjika.

Tekinoroji Zvakakwirira zveHDI Flex PCBs

• Turnkey flex mhinduro yakanangana ne3D miniaturization
• Yakavimbika kwazvo, yakasimba kwazvo multilayer flex/microvia substrates
• Ultra-yakaonda base zvinhu
• Yakazadzwa kuburikidza uye yakaturikidzana nenzira iripo
• Complex mechanic/assembly anobatsira maficha, anosanganisira akakosha profiles, peta mitsara, kucheka-kunze, uye dzakatetepa kubhenda nzvimbo / mapako.
• Putira-kupoteredza mapuranga
• Chip-on-flex (COF), chip-scale packaging (CSP) substrates, uye BGAs
• Yakasiyana-siyana yekupedzisa kwepamusoro, kusanganisira OSP, ENIG, ENEPIG, E-AU, uye DIG.
• Kubhururuka kunotungamira
• Kupeta bvunzo yemaseketi anochinjika
• Ultra-fine line flex cables

Sei Uchishandisa Mapofu Via Flex PCBs

Mumazuva ano anochinjika PCB magadzirirwo, yakakwirira-density zvikamu-zvakafanana neayo anowanikwa muPCB akaomesesa-anowanzo kudiwa. Kugarisa izvi zvinoriumba, bofu uye/kana kuvigwa vias zvinokosha kuti routing chiratidzo mitsetse zvinobudirira mukati magadzirirwo. Imwe yemadhiraivha akajairika kune ichi chinodiwa ndeye 0.4mm pitch BGA package.

Mapofu vias anobvumira masaini kuti afambiswe kubva kuBGA SMT pad kuenda kune rinotevera layer uyezve kunze. Mune yakakwira pini kuverenga maturusi, mamwe mapofu uye akavigwa vias kazhinji anodiwa kuti ave nechokwadi chechiratidzo chekufambisa uye kuita kwakavimbika.

Nekudaro, kushandisa aya vias mune inochinjika PCB madhizaini kunopa akasiyana matambudziko achienzaniswa neakaomarara maPCB, nekuda kwekusiyana kwezvinhu uye maitiro ekugadzira. Iko kuchinjika kweiyo substrate, pamwe chete nechaiyo yekuchera uye nzira dzekuisa dzinodiwa, inoita kuti kugadzira bofu kuburikidza ne flex PCBs kuve kwakanyanya hunyanzvi.

Basa reVia-mu-Pad mune Yakakwira-Layer Count Flex PCB Dhizaini

Kune magadzirirwo ePCB anochinjika ane huwandu hwakawanda hwema layer anoshandisa ma layer ekunze ane density yakakura, nzvimbo yekuwedzera inoshandiswa kuma pads akasiyana uye zvikamu zveSMT inoderedza nzvimbo iripo yekubuda kwe trace fan. Kugadzira via-in-pad muma PCB anochinjika uye akasimba kunogona kuwedzera huwandu nekushandisa ma vias sema mounting pads. Ma flat vias akazadzwa nemhangura kana sirivheri anobvumira zvikamu zvekusonesa zvakananga kuburikidza nemaburi.

Kunyangwe via-in-pad tekinoroji inogona kuburitsa yakawedzera pamusoro penzvimbo yenzira yenzira, pane mashoma mapoinzi ekuziva kana uchishandisa iyi mhando yekuvaka ine flex. Vagadziri vanowanzozadza yakaoma PCB vias eSMT pads ine conductive epoxy, mhangura ndiro iwo, uye vobva varongedzera iwo flat. Nekudaro, iyi nzira haiwanzo kushandiswa pane flex microvias kana laser vias nekuda kwekunetsekana mukubvisa zvisingadiwe zvakasara pane inochinjika PCB pani.

Iyo nyowani uye yakagadziridzwa maitiro e flat via-in-pad pane multilayer flex PCBs inosanganisira kuzadza vias nemhando yakakosha yemhangura plating. Iyi plating chemistry inozadza laser kuburikidza kubva pasi kumusoro, ichigadzira ine musoro yakapfava pamusoro penzira. Kunyangwe mamwe madiki dimpling achiwanzoonekwa, haape dambudziko kune vanounganidza. Iyi tekinoroji yeplating inoshandiswa pane dzakasiyana siyana uye dzakaomarara-flex PCBs.

Kuti uwane ongororo yakakwana yekugadzira, shandisa chinyorwa chino pamwe chete nerutsigiro rwekugadzira zvemagetsi uye flex PCB kugadzira paunenge uchitarisa zvinodiwa pa stackup, assembly, kana bvunzo.

mhedziso

Kazhinji, Highleap Electronic's HDI flex PCBs uye tekinoroji itsva yeblind via zviri kuchinja mamiriro enzvimbo dzemagetsi dzinochinjika, zvichipa kuwedzera kuchinjika, kuvimbika, uye kushanda kwemagetsi echizvarwa chinotevera. Nekutarisa pakufambira mberi kwetekinoroji uye kugutsikana kwevatengi, Highleap Electronic inoramba ichitungamira indasitiri mukupa mhinduro dzemazuva ano dzezvinodiwa zvebhodhi remaseruji akaomarara, akasimba, uye akaomarara eUltra-HDI/microvia mumaindasitiri akasiyana-siyana.