Kugadzira PCB yeIsola Agilex7 yeHigh-Speed ​​​​FPGA neAI Hardware

Highleap Electronics inopa kugadzirwa kwePCB uye kugadzirwa kwePCB kumabhodhi anomhanyisa anotsanangura Isola Agilex7, Isola low-loss laminates, kana Agilex 7 FPGA-related stackups.

Tumira tafura yako yeGerber, ODB++, stackup, material callout uye impedance. Chikwata chedu cheinjiniya chichaongorora kuwanikwa kwezvinhu, kugona kwestackup, HDI structure, back-drill zvinodiwa, BGA fanout uye zvinodiwa nePCBA usati watenga mutengo.

Kusimbiswa Kwezvinhu uye Kuunganidzwa Kwezvinhu

Pakukumbira kweIsola Agilex7 PCB yekugadzira, danho rekutanga rekugadzira nderekusimbisa zvinhu uye kurongedza zvinhu sezvavanoda mutengi. Mamwe maRFQ anoshandisa "Agilex7" kutsanangura bhodhi reIntel Agilex 7 FPGA, nepo mamwe achishandisa sechikamu chezita remukati rezvinhu kana puratifomu. Saka chirevo chinofanira kunge chakavakirwa pakudhirowa, runyorwa rwezvinhu zvakatenderwa uye faira rekuunganidza zvinhu pane kungotarisa pazwi rekuti "keyword" chete.

Highleap Electronics inoongorora callout yezvinhu, ukobvu hwe dielectric, huremu hwemhangura, huwandu hwe layer, impedance table, kuburikidza nerudzi uye surface finish isati yasimbisa mutengo nenguva yekuiswa. Kana dhirowa richitsanangura Isola laminate, tinoongorora kana core ne prepreg zvakumbirwa zvinogona kuwanikwa uye kugadziriswa zvichienderana nechimiro chebhodhi.

Kuti uwane ruzivo rwakafanana, gwara redu rePCB rinopa ruzivo rwakanyanya rinotsanangura kuti ma laminates asinganyanyi kurasikirwa anowanzo ongororwa sei pamabhodhi edhijitari anokurumidzisa.

Zvinodiwa zveAgilex 7 FPGA Board

Kutsvaga kwakawanda kweIsola Agilex7 PCB kugadzirwa kwakabatana nemabhodhi eAgilex 7 FPGA kana eaccelerator anomhanya zvakanyanya. Mabhodhi aya anowanzo sanganisa mapakeji eBGA anopenya zvakanaka, DDR memory, PCIe, Ethernet, power regulation, wachi uye maconnector ane density yakawanda paPCB imwe chete ine multilayer.

Highleap Electronics isati yagadzirwa, wongororo:

• Nzira yekubuda muBGA uye kuburikidza nehurongwa pasi peFPGA kana SoC package
• Kuenderera mberi kwePCIe, Ethernet, memory uye clock routing
• Matanda ekugovera magetsi, kuenzana kwemhangura nenzvimbo dzekuisa mafuta muchikamu chekupisa
• Kubuda kweconnector, zvikamu zveconnector zvemucheto uye nzvimbo dzinomhanya dzemezzanine
• Kuisa mapaneru, maburi ekushandisa, mafiducials uye njanji dzekuunganidza dzekugadzira SMT

Kune zvigadzirwa zvemakomputa zvemhando yepamusoro, mapeji edu ekugadzira mabhodhi eFPGA uye mapeji ekugadzira maPCB eAI computing anofukidza zvinodiwa zvekushandisa zvine chekuita nazvo.

Sarudzo dzeLaminate yeIsola Low-Loss

Kana RFQ ichida zvinhu zveIsola, laminate chaiyo inofanira kusimbiswa kubva padhirowa remutengi kana AVL. Sarudzo dzezvinhu zveIsola zvinokurumidza dzinogona kusanganisira I-Tera MT40, Tachyon 100G, Astra MT77 nedzimwe masisitimu akakodzera zvichienderana nehurefu hwechiteshi, bhajeti rekurasikirwa, chinangwa chemutengo uye kuwanikwa.

Highleap Electronics inogona kutaura nezvezvinhu zveIsola zvakatarwa kana zviripo uye zvatenderwa kuvaka. Kana nguva yekutora zvinhu ikava dambudziko, tinogonawo kubatsira kugadzirira ongororo yeinjiniya yeimwe nzira inotenderwa. Kutsiva hakufanirwe kuitwa pasina mvumo yemutengi nekuti Drk, Df, copper foil, prepreg flow, lamination behavior uye impedance results zvinogona kuchinja.

• Kugadzirwa kwezvinhu chaiko: inoshandiswa kana chirongwa chekudhirowa kwemutengi kana chirongwa chekukodzera chisingabvumidze zvimwe zvinotsiva.
• Ongororo yezvinhu zvakaenzana: inoshandiswa kana timu yekugadzira ichibvumira chimwe chinhu chinotsiva chakatenderwa mushure mekuenzanisa kweinjiniya.
• Kuunganidzwa kwemhando dzakasiyana: inoshandiswa kana machira echiratidzo akasarudzwa chete achida zvinhu zvishoma kurasikirwa nepo mamwe machira achigona kushandisa laminate yakasiyana inotenderwa.

Mabhuku anobatsira anosanganisira kugadzirwa kweIsola I-Tera MT40 PCB , zvinhu zveIsola Tachyon 100G PCB uye mashandisirwo eIsola Astra MT77 PCB.

Kudzorwa kweImpedance uye Ongororo yeBack-Drill

Mabhodhi eIsola anomhanya zvikuru anofanira kuongororwa kuti aonekwe kuti anodzorwa here kana kuti kwete asati aburitswa mafaira ePCB. Upamhi hwetrace, ukobvu hwedielectric, ukobvu hwecopper, solder mask, reference plane design uye copper roughness zvese zvinogona kukanganisa mhedzisiro yekupedzisira.

Highleap Electronics inotarisa tafura ye impedance ichipesana ne stackup uye inogona kugadzira makuponi e impedance zvichibva pane imwe nzvimbo yekugadzira yakatenderwa. Kune vanomhanya zvakanyanya kuburikidza nekuchinja, kubhoorera kumashure kunogonawo kudiwa kuderedza mastubs akasara panzira dzakakosha.

Ona mapeji edu pamusoro pekugadzirwa kwePCB inodzorwa , nzira yekubatanidza maPCB , uye tekinoroji yekuchera maPCB kuti uwane rumwe ruzivo nezvemaitiro acho.

HDI, BGA Fanout uye Dense Routing

Mabhodhi eAgilex 7 FPGA uye mabhodhi ekumhanyisa anomhanya anowanzoda kubuda kweBGA yakawanda, nzira pfupi dzekufambisa uye kugoverwa kwesimba kwakasimba. HDI inoonekwa kana nzira dzemazuva ano dzichidya nzvimbo yakawanda yekufambisa kana kuti dzisingakwanise kutsigira maitiro eBGA ekutiza.

• Microvias: inoshandiswa pakubvisa BGA yakakora uye zvikamu zvekubatanidza zvine density yakakura kana zvichidikanwa nehurongwa.
• Mapofu uye akavigwa: inoshandiswa kana nzira dzekufambisa dzichida kuchengetedzwa mumagadzirirwo e multilayer.
• Kuburikidza ne-in-pad: yakaongororwa kuti ionekwe kuti zvivakwa zvakazadzwa, zvakavharirwa uye zvakarongwa pasi pemapakeji akapfava.
• Sequential lamination: inoongororwa kana chimiro kana kuti stackup zvisingagone kuvakwa muchikamu chimwe chete che lamination.
• Zvikamu zvekupisa uye zvesimba: yakaongororwa kuti ione kana mhangura yakaenzana, kupisa kwakawanda uye kuvimbika kwekuunganidza.

Kuti uwane mapeji ane chekuita nehunyanzvi, ongorora kugadzirwa kweHDI PCB , kupofumadzwa uye kuvigwa kuburikidza nekugadzirwa kwePCB uye gwara reHDI remaPCB emotherboard eseva.

Kuungana kwePCB, Kuongorora uye Kutsigira Bvunzo

Mapurojekiti eFPGA neAI anomhanya zvakanyanya anowanzoda kubatanidzwa kwePCB mushure mekugadzirwa. Highleap Electronics inogona kuongorora PCBA scope pamwe chete nePCB stackup kuitira kuti sarudzo yezvinhu, kupedzisa pamusoro, maitiro eBGA, nzira yekuongorora uye zvinodiwa zvekuyedza zvienderane usati wagadzira.

Rutsigiro rwegungano

• Musangano weSMT wezvikamu zveBGA, QFN, LGA, DFN, memory, wachi, simba uye connector
• Ongororo yegungano reM.2, board-to-board, Ethernet, USB-C, edge uye high-speed mezzanine connectors
• Stencil, solder paste, reflow uye ongororo yekuronga mapakeji e "fine-pitch"
• Kuongororwa kweX-ray kweBGA nezvikamu zvakagumira pasi pevhu kana zvichidikanwa

Kutsvaga rubatsiro uye kuyedza

• Ongororo yeBOM yenhamba dzezvikamu zvemugadziri, zvimwe zvinotenderwa uye zvimwe zvisingatsiviwe
• Mhando dzezvikamu zvine chikamu che "partial-turnkey", "full-turnkey" kana "consigned component models"
• Rutsigiro rwepurogiramu kana mafaira efirmware uye maitiro apihwa
• Kugadzirira bvunzo kunoshanda zvichibva pane zvinodiwa nevatengi, software, maitiro ebvunzo uye zvinodiwa zvekupasa/kukundikana

Mapeji akakodzera ebasa anosanganisira BGA PCB assembly , electronic component sourcing , functional testing yePCB assembly uye turnkey PCB assembly.

Rutsigiro rweKutamisirwa kweVatengesi kune Zvivakwa Zviripo

Mibvunzo yakawanda yeIsola Agilex7 PCB inokonzerwa nemapurojekiti aripo anoda mupi mutsva wePCB. Kutamiswa uku kunogona kukonzerwa nekuwanikwa kwezvinhu, matambudziko ekukohwa, nguva yekushanda, miganho yekutsigira PCBA, kumanikidzwa kwemitengo kana mhinduro isina kukwana yeinjiniya kubva kumupi wekare.

Kubudirira kwekutamisa vatengesi kunofanira kuchengetedza chinangwa chemagetsi nekanika chakatenderwa chedhizaini yekutanga ukuwo vachiona matambudziko ekugadzira zvinhu zvisati zvagadzirwa.

Rondedzero yeRFQ Files

Kuti utaure mashoko epurojekiti yekugadzira PCB yeIsola Agilex7 nemazvo, tumira pasuru yakazara yekugadzira kana zvichibvira. Ruzivo rwakakwana runobatsira kusimbisa nzira yezvinhu, kugona kwekugadzirisa, mutengo, nguva yekutungamira uye chiyero chePCBA.

• Mafaira ekugadzira eGerber X2, ODB++ kana IPC-2581
• Dhirowa rakarongwa rine zvinhu zveIsola kana runyorwa rwezvinhu zvakatenderwa
• Tafura yeImpedance ine zvinangwa zvinogumira chimwe chete uye zvakasiyana
• Faira rekuboorera, kuburikidza netsanangudzo uye zvinodiwa zvekuboorera kumashure
• Zvinyorwa zvekugadzira zvine IPC class, surface finish, solder mask, kuburikidza nezvinodiwa zvekuzadza uye coupon
• Rondedzero yenet yakakosha kana manotsi eSI ePCIe, SerDes, Ethernet, DDR, HBM, CXL, wachi kana nzira dzeRF
• BOM, CPL uye dhizaini yemusangano kana PCBA ichidikanwa
• Mafaira ekuronga, maitiro ekuyedza, ruzivo rwechigadzirwa kana zvinodiwa neFAI kana zviripo
• Muenzaniso, chiyero chekutanga uye huwandu hwekugadzirwa hunotarisirwa
• Zvinyorwa zvemutengesi wekare kana zvinyorwa zvekugadzira zvakatenderwa kana iri purojekiti yekutamisa

Highleap Electronics inogona kunyora mashoko ekugadzirwa kwePCB, PCB assembly, turnkey PCBA kana rutsigiro rwekuchinjisa vatengesi mushure mekuongorora dhizaini yako.

Tumira Mutengo weIsola Agilex7 PCB kana kuti taura neHighleap Electronics kuti uwane stackup, kuwanikwa kwezvinhu, impedance, HDI, BGA assembly kana functional test review.