Metal Core PCB Manufacturing | A Complete Process Guide

Nhanganyaya yeMetal Core PCB Manufacturing

Kugadzira Metal Core PCB kunomiririra chikamu chakakosha chekugadzirwa kwebhodhi redunhu rakadhindwa rakagadzirirwa mashandisirwo anoda kutarisirwa kwepamusoro kwekupisa. Kusiyana nemabhodhi echinyakare eFR-4 , maPCB esimbi anobatanidza aruminiyamu, mhangura, kana simbi zvinopa kugona kwakanyanya kwekuparadza kupisa kunodiwa kune magetsi ane simba guru.

Musiyano mukuru uyu mukuvaka unoita kuti maMCPCB akakosha mu LED lighting systems, power conversion modules, uye automotive electronics uko kushanda zvakanaka kwe therm kunokanganisa zvakananga mashandiro uye hupenyu hurefu. Maitiro ekugadzira anoda kudzorwa kwakanyatsojeka padanho rega rega kuti pave nekuenzana kwakanaka pakati pekuparadzaniswa kwemagetsi uye thermal conductivity.

Kunzwisisa aya akasarudzika simbi musimboti PCB magadzirirwo ekugadzira anogonesa mainjiniya nevagadziri kuti vagone kukwidziridza masiketi avo edunhu kuitira kunyanyisa kupisa uye kushanda kwemagetsi. Gwaro iri rinoongorora nhanho yega yega yakakosha mukugadzira, ichipa manzwisisiro mune tekinoroji maitirwo anosiyanisa mhando yeMCPCB kugadzira.

Kugadzirira kwezvinhu muMetal Core PCB Kugadzirwa

Kusarudzwa kwe Substrate uye Kugadzirira

Hwaro hweMetal Core PCB Manufacturing hunoshanda hunotanga nekungwarira kusarudzwa kwezvinhu uye kugadzirira. Metal substrates inochekwa kune chaiyo zviyero zvinoenderana nezvinodiwa zvepaneru, nesarudzo yenyama inopesvedzera zvakananga mashandiro ekupisa uye mutengo-kushanda.

Zvinhu zvitatu zvikuru zve substrate zvine hunhu hwakasiyana:

• Aluminium alloys inopa yakaringana mwero wekupisa kwekupisa (kubvira pa 1.0 kusvika 2.5 W/m·K), huremu huremu, uye kushanda zvakanaka kwemutengo, zvichiita kuti ive sarudzo yakajairika yeLED uye general thermal application.
• Mhangura substrates unza kupisa kwepamusoro (kusvika ku400 W/m·K) pazvinodiwa zvekupisa zvakanyanya asi nemitengo yakakwira zvakanyanya uye huremu.
• Iron-based materials ipa chaiwo magineti emagetsi zvivakwa uye coefficient yemafuta ekuwedzera anofananidzira kune aka hunyanzvi maapplication anoda kugadzikana kwedimensional.

Dielectric Layer Kugadzirira

Iyo dielectric insulation layer inoda kutariswa kwakaenzana panguva yekugadzirira zvinhu mumcpcb yekugadzira maitiro. Iyi thermally conductive asi yemagetsi insulating material inowanzo sanganisira epoxy resins yakazadzwa neceramic particles inogonesa kutamisa kupisa uku uchichengetedza magetsi ega.

Iyo yemhangura foil ukobvu kusarudzwa kunoenderana neazvino-kutakura zvinodiwa uye etching kugona. Sarudzo dzakajairwa dzinobva pa1 oz kusvika 3 oz huremu hwemhangura kune yakawanda simbi yepakati PCB yekugadzira maapplication, ine inorema mhangura inoshandiswa kune yakakwirira-ikozvino magetsi emagetsi.

Kuchera Mashandiro muMetal Core PCB Kugadzira

Precision Hole Kuumbwa

Precision kuchera mashandiro mumcpcb yekugadzira process inoda midziyo yakasarudzika inokwanisa kubata iyo yakaoma simbi substrates pasina kukanganisa gomba mhando. Mechanical drilling with carbide kana diamond-yakavharwa mabits inoramba iri iyo yakajairwa nzira yekupfuura-maburi, kuchengetedza dhiresheni chaiyo kunyangwe kuoma kwe substrate.

Laser drilling inopa mabhenefiti kune madiki kuburikidza nemafomu mune yakakwirira-density dhizaini uko miganho yemakanika inorambidza kudhirowa bhiti saizi. Maparamendi ekuchera anofanirwa kuverengera kuoma kwesimbi core kudzivirira kuumbwa kweburr uye kuve nechokwadi chekuchenesa madziro emadziro anogonesa kuvimbika kupuranga kana kuisa chikamu.

Post-Drilling Treatment

Maitiro ekuchenesa mushure mekuboorwa anova akakosha zvikuru muMetal Core PCB Manufacturing kubvisa marara esimbi anogona kukanganisa kuparadzaniswa kwemagetsi. Kubatanidza maburi muMCPCBs kunowanzo shanda mabasa emagetsi kwete panzira dzekupisa, sezvo substrate yesimbi inobata kupararira kwekupisa kwekutanga.

Musiyano uyu unopesvedzera kuburikidza nemaitiro ekuisa uye unova nechokwadi chekuti nzira dzekupisa nemagetsi dzakagadziridzwa dzakazvimirira. Kubviswa kwemarara kwakakodzera kunodzivirira zvingangoita zvipfupi pakati pedunhu redunhu uye simbi musimboti panguva dzinotevera dzekugadzirisa matanho.

Lamination process muMetal Core PCB Manufacturing

High-Pressure Bonding

Lamination ndiyo inonyanya kukosha mukugadzirwa kwemcpcb, uko substrate yesimbi, dielectric layer, uye circuit copper zvinobatana zvachose pasi pekupisa nekumanikidzwa kwakadzorwa. Maparamita elamination anotarisa zvakananga kunaka kwethermal interface pakati pezvikamu, zvichikanganisa kufambisa kwethermal kubva kuzvikamu kusvika kusimbi.

Kupisa tembiricha kunowanzo kubva 170 ° C kusvika 210 ° C zvichienderana neiyo dielectric material system, ine dzvinyiriro dzakagadziriswa kubvisa voids pasina kukanganisa simbi substrate. Iyo nguva yemaitiro uye kudzvanywa mbiri inofanirwa kugadziridzwa kune yega yega musanganiswa wezvinhu kuti uwane yakakwira bond simba uye kupisa kwekuita.

Thermal Management Panguva yekutonhodza

Iyo yekutonhora kutenderera inotevera lamination inoda kungwarira manejimendi kudzivirira delamination kana mukati kushushikana kusimudzira. Yemazuva ano simbi yepakati PCB yekugadzira inoshandisa yakarongwa kutonhora profiles iyo inoverengera mutsauko wekuwedzera kupisa pakati pemhangura, dielectric, uye simbi zvidimbu.

Uku kutarisisa kwekudziya kwekudziya panguva yekugadzira kunoshandura zvakananga kune yakavandudzwa kuvimbika munzvimbo yekushanda yechigadzirwa. Kudzorwa kutonhora mitengo inodzivirira warpage uye inova nechokwadi chekugadzikana kwedimensional mukati mehupenyu hwebhodhi.

Solder Mask Chikumbiro muMetal Core PCB Kugadzira

Coating uye Curing Process

Solder mask coating muMetal Core PCB Manufacturing inoshandisa zvikonzero zviviri zvekupa magetsi ekudzivirira uye kutsanangura nzvimbo dzinotengeswa dzekubatanidza chikamu. Iyo nzira yekushandisa, ingave yekudhinda skrini kana kuvhara keteni, inofanirwa kuwana ukobvu hwakafanana pane iyo yakaoma simbi substrate pamusoro.

Kurapa masheti eiyo solder mask inoda kugadziridzwa kana ichienzaniswa neFR-4 mabhodhi, sezvo iyo simbi yepakati yekupisa misa inopesvedzera kugovera kwekupisa panguva yekurapa. Maprofiles ekurapa anoshandisa tembiricha dziri pakati pe140°C kusvika 160°C nenguva dzekugara dzakarebeswa kuti ive nechokwadi chekuzara kwepolymerization.

Makobvu Optimization

Iyo solder mask ukobvu inokanganisa zvakananga kuita kwebhodhi kwekupedzisira kupisa uye kuvimbika kwegungano. Masiki akatetepa anopa kupisa kuri nani kubva muzvikamu asi anopa kushomeka kwekudzivirira kwemuchina, zvinoda kunyatso optimization zvinoenderana nezvinodiwa zvekushandisa.

Yakakodzera masiki kunamatira kune dielectric layer uye dimensional kurongeka kwekuvhura kunovimbisa yakavimbika soldering uye kwenguva refu kwezvakatipoteredza kuramba. Kudhindwa kwechinyorwa chekuzivikanwa kwechikamu kunotevera solder mask application, uchishandisa UV-inorapika ingi dzinoshingirira tembiricha yegungano.

Pamusoro Pedzisa Sarudzo yeMetal Core PCB Kugadzirwa

Sarudzo dzepamusoro pekupedzisira mumcpcb yekugadzira maitiro zvakanyanya kupesvedzera kuvimbika kwegungano uye kuita kwemafuta. Sarudzo yacho inofanirwa kuenzanisa solderability, sherufu yehupenyu, thermal conductivity, uye mari inotariswa yakanangana nezvinodiwa zvekushandisa.

Sarudzo dzepamusoro pekupedzisira dzinosanganisira:

• ENIG (Electroless Nickel Immersion Gold) inopa yakanakisa flatness kune yakanaka-pitch zvikamu, yepamusoro sherufu hupenyu inopfuura mwedzi gumi nemiviri, uye yakavimbika waya yekubatanidza kugona, zvichiita kuti ive yakanakira yakakwirira-yakavimbika MCPCB magungano anoda kuchengetwa kwakawedzerwa.
• HASL (Hot Air Solder Leveling) inopa yakasimba solderability uye mutengo wakanakira asi inogona kugadzira ukobvu mutsauko unobata zvinopisa zvekushandisa, zvine mutobvu-yemahara vhezheni inosarudzwa kutevedzera RoHS.
• OSP (Organic Solderability Preservative) inopa nzvimbo dzakati sandara uye kutevedzera kwezvakatipoteredza nehupenyu hupfupi hwesherufu, inokodzera mapurojekiti ekukurumidza kutendeuka uko mabhodhi anomhanya nekukurumidza kuungana.

Sarudzo yekumusoro yekupedzisa haingokonzerese kutengeswa chete asiwo iyo inopisa interface pakati pezvikamu zvakaunganidzwa nePCB. Mamwe mapedzisiro anopa zvirinani kunyorova maitiro anonatsiridza kupisa kuchinjika kubva muchikamu chinotungamira kuburikidza neanotengeswa majoini kune emhangura trace muMetal Core PCB Kugadzira.

Kuedza uye Kudzora Kwemhando muMetal Core PCB Kugadzira

Yemagetsi Verification

Yakakwana yekuyedza mapuroteni anosiyanisa nyanzvi Metal Core PCB Kugadzira kubva pasi pekugadzirwa. Kuyedzwa kwemagetsi kuburikidza nekubhururuka kuferefeta kana gadziriso-yakavakirwa nzira inosimbisa kuenderera kwedunhu uye kuzviparadzanisa nevamwe, kunyanya kutarisisa dielectric breakdown voltage pakati pematanho edunhu uye musimboti wesimbi.

Miedzo iyi inosimbisa kuti insulation layer inochengetedza kunaka kwayo pasinei nekumanikidzwa kwekupisa uye kwemakanika kwemaitiro ekugadzira. Zvinodiwa zvemagetsi ekupwanyika zvinodarika 2500V kune akawanda mashandisirwo eMCPCB , uye mwero wakakwira wekuchengetedza mota kana maindasitiri emagetsi.

Thermal uye Mechanical Testing

Thermal performance test inosimbisa maitiro ekupisa kupisa kwakakosha kune MCPCB mashandiro. Ongororo iyi inogona kusanganisira kuyerwa kwekupisa kana kufungidzira kwekupisa pasi pemamiriro emagetsi kuona kuti kupisa kunoyerera sekugadzirwa kwakagadzirwa kubva kunzvimbo dzinopisa kuenda kusimbi substrate.

Mechanical inspections tarisa delamination, copper adhesion simba, uye dimensional kurongeka papanera. Peel simba kuyedzwa kunovimbisa kuti dielectric-to-metal bond inosangana nedikita yakatarwa, inowanzopfuura 8 N/mm yekushanda kwakavimbika.

Kutevedzera IPC-6012 Kirasi 2 kana Kirasi 3 zviyero zvinova nechokwadi chakaenderana mhando yakakodzera kune zvinodiwa zvekushandisa. Zvinyorwa zvemaitiro ekudzora uye bvunzo mhinduro inopa kuteedzera kwakakosha kune yakakwirira-yakavimbika simbi yepakati PCB yekugadzira.

Mhedziso: Kunaka muMetal Core PCB Kugadzira

Metal Core PCB kugadzira kunosanganisira akati wandei maitiro, imwe neimwe yakakosha kuti uwane yakakwana yekupisa, yemagetsi, uye mechanic kuita. Kubva pakusarudzwa kwezvinhu kusvika pakuyedzwa kwekupedzisira, kunyatso kudzora maitiro kunovimbisa kuti MCPCB inosangana nezvinodiwa zvemagetsi emagetsi epamusoro.

Highleap Electronics Kugona

• Yakakwana MCPCB Manufacturing - Maitiro epamberi anosanganisira kuchera, etching, lamination, kupera kwepamusoro, uye kuyedza.
• Thermal & Electrical Optimization - Kuenzanisa kupisa kupisa, kuparadzaniswa kwemagetsi, uye kuvimbika kwemuchina kuburikidza nekunyatso kudzora maitiro.
• Kuguma-kusvika-Kuguma Rutsigiro - Kubva pane prototype kusvika pakugadzirwa kwakawanda, kuve nechokwadi design-for-manufacturing kubatana uye kuenderana kwemhando.
• Nyanzvi Injiniya Chikwata - Nhungamiro yehunyanzvi kugadzirisa matambudziko akaomarara ekupisa mune yakakwirira-simba maapplication.

Kushanda pamwe chete neHighleap Electronics kunoita kuti mainjiniya nevagadziri vezvigadzirwa vawane hunyanzvi hweMCPCB uye hunyanzvi hwakaratidzwa. Bata timu yedu nhasi kuti tikurukure kuti tingatsigira sei chirongwa chenyu chinotevera chemagetsi ane simba guru nemhinduro dzePCB dzesimbi dzakavimbika.