Kugadzira PCB yeOptical Transceiver muChina

Highleap Electronics inopa kugadzirwa kwePCB yetransceiver yemaziso muChina kune vatengesi veOEM module nevagadziri vemagetsi vanoda kugadzirwa kwemultilayer inodzorwa, mabhodhi eHDI akapfupikiswa uye kugadzirwa kwePCB dzetransceiver dzinodzokororwa nevatengi. Basa redu rekugadzira mabhodhi risina madziro rinosanganisa ongororo yeinjiniya yeCAM/DFM, kutenga zvinhu zvakatenderwa, multilayer lamination, mifananidzo yemitsetse midiki, kuboora nekuputira, kupedzisa pamusoro, kuyedzwa kwemagetsi uye kuongororwa kwekugadzirwa kwakabvumiranwa.

Kugadzira PCB ye optical-transceiver hakusi kungoda kuenzana nenhamba ye layer. Bhodhi rinogona kuda ukobvu hwakatetepa hwakapedzwa, zvinhu zvisingarasikirwe zvakanyanya, controlled impedance, small vias, selective hard-gold contacts, fine-pitch solder pads uye tight-route outline yakagadzirwa zvakafanana. Highleap inoongorora zvinodiwa izvi pamwe chete isati yagamuchira nzira yekugadzira. Vatengi vanowana quotation zvichibva pane zvakatarwa uye chiyero chekuongorora, pane kufungidzira kuti "high-speed PCB" yega yega inoshandisa maitiro akafanana.

Tinotsigira maodha emhando yepamusoro, kuvaka kwekuyedza uye kugadzirwa kunogara kuchiitwa. Tumirai zvinhu zvakaburitswa, data rekugadzira, kudhirowa, zvinyorwa zvekushandisa uye kupedzisa, huwandu uye zuva rakumbirwa kuitira kuti mainjiniya edu nemakambani ekugadzira agone kuongorora bhodhi chairo.

Ongororo yeUinjiniya Pamberi pekugadzirwa kwePCB yeOptical Transceiver

Highleap inotanga kugadzira optical transceiver isina bhodhi nekuongorora kweinjiniya kwakadzorwa kwepakeji yedhizaini yakaburitswa. Mifananidzo yeCAM, data rekuboorera, purogiramu yezvinhu, kuburikidza nemepu, stackup, bhodhi, zvinodiwa pakupedzisa pamusoro uye zvinodiwa zvekugamuchira zvinofanirwa kutsanangura bhodhi rimwe chete. Mutengo wakavakirwa chete pahuwandu hwema layer, saizi yebhodhi uye zvidimbu zvishoma hazvigone kuratidza kana chivakwa chaicho chagadzirira kugadzirwa kwakasimba.

Ongororo yeinjiniya inoparadzanisawo zvinhu zvinowanzo shandiswa mukugadzirwa kwakasarudzwa kubva kune izvo zvinoda kushanda kwakakosha kana kusarudzika. Chinangwa ndechekudzivirira kuwana kubatana kwakasimba, BGA yakazadzwa uye yakavharirwa kuburikidza, hybrid laminate kana kushivirira kwakasimba zvisingawanzoitika mushure mekunge odha yekutenga yagamuchirwa. Magwaro anogona kupesana anojekeswa nzira yekugadzira uye mazwi ekutengeserana asati apedzwa.

Kuongorora Kwakakosha kweCAM neDFM

• Kugadziriswazve kwemafaira: Gerber kana ODB++ layers, NC drills, slots, rout pays, manuals ekugadzira uye drawing revision zvinotariswa kuti zvienderane here. Kuguma kwekubatana kunoratidzwa chete mudhirowa yemakanika kana kuti via structure isipo pa drill mep kunogona kukonzera kukanganisa kukuru pakugadzirisa. Ruzivo runopesana runodzoserwa kumuridzi wedhizaini pane kugadziriswa nefungidziro yekugadzira isina kunyorwa.

• Kusimbiswa kwezvinhu uye kuunganidzwa kwezvinhu: Grade yeLaminate, kugadzirwa kwe dielectric, huremu hwemhangura ne layer, ukobvu hwekupedzisira hwebhodhi uye dzimwe nzira dzakatenderwa dzinoongororwa pamwe chete. Zvimwe zvinhu zvisinganyanyi kurasikirwa kana kuti zvakasanganiswa zvinogona kuda mamiriro ekudzvanya akatsaurirwa kana nguva yekutenga. Murairo wekuti "shandisa FR-4 inokurumidza" hauna kufanana ne baseline yezvinhu zvakakodzera, kunyanya kune nzira yevatengi yakambobvumidzwa.

• Musanganiswa wezvinhu zvekugadzira: Nzvimbo diki, mhete ye annular, dhayamita yekuboorera, nzvimbo isina gomba kubva kune isina kubatana-mhangura, ukobvu hwemhangura uye kunyoreswa zvinoongororwa semusanganiswa. Chidimbu chidiki chechitoro kana saizi yechishandiso chinoshambadzirwa hachisi humbowo hwekuti dhizaini yese inogona kuvakwa zvine mwero pamiganhu iyoyo. Kana muganhu wemaitiro uri mudiki, musiyano uye chero imwe nzira inokurudzirwa zvakanyorwa kuti vatengi vaongorore.

• Tsanangudzo dzeVia-treatment neHDI: Kubatana kwemaziso nekwakavigwa kunoda mepu yekubatanidza layer uye hurongwa hwakakodzera hwelamination. Kana via-in-pad iripo, mifananidzo inofanira kutsanangura kana kuzadza, planarization uye copper cap zvichidikanwa; plugging yakajairika yesolder-mask haifanirwe kufungidzirwa kuti yakaenzana pasi pe fine-pitch solderable pad. Mabasa aya anokanganisa mutengo, kuongorora uye nguva yekutungamira uye nekudaro zviri mukotesheni yekutanga.

• Zviyero zvakakosha zvekubatana uye zvemakanika: Nzvimbo yekubatana kwemucheto, kupedzisa, ukobvu hwakafukidzwa pahwakatsanangurwa, kubwinya, chimiro uye saizi dzinoenderana nemodule zvinoongororwa zvichienderana nemifananidzo yakaburitswa nemutengi. Mapedhi eENIG uye matinji egoridhe akasarudzwa ane zvinodiwa zvakasiyana zvekugadzira. Nzira yekuongorora inogamuchirwa uye chero data rekubatanidza rinodzorwa zvinosimbiswa usati wagadzira.

• Zvinodiwa pakugamuchira nekutumira: Kuedzwa kwemagetsi, kusimbiswa kweimpedance, zvikamu zvidiki, kuteverwa kwezvinhu, zvinyorwa zvehukuru uye chero mushumo wekuvimbika wakatsanangurwa nevatengi hazvibvumirane nehukuru, nzira uye sampling. Chirevo chakajairika che "kuyedza 100%" kana faira reCAM rakatenderwa hazvitsivi humbowo hwekugamuchirwa hunodiwa. Kuzvipira kwenguva yekutanga kugadzirwa kunofanirwa kutanga kubva padanho rekuburitswa rakabvumiranwa zvakajeka.

Gadzirisa Zvisizvo Zveinjiniya Usati Washandisa Zvishandiso

Ongororo yeHighleap yePCB DFM inogona kuona mipata iyoyo isati yatanga kugadzirwa. Mhedzisiro yacho ipakeji yakatsanangurwa yekugadzira, kunze kwehunyanzvi hwakasimbiswa uye RFQ zvichibva padhizaini chaiyo. Mvumo yemutengi inowanikwa kune chero shanduko inokanganisa hunyanzvi hwemhangura, impedance, mashandiro ezvinhu, kukodzera kweconnector kana kuvimbika; goho riri nani remufekitori harisi chikonzero chekuchinja zvinodiwa zvechigadzirwa chakaburitswa chinyararire.

Kutenga Zvinhu Zvisina Kurasikirwa Kwakawanda uye Kuravira Kwakawanda

Highleap inogadzira maPCB e optical-transceiver ichishandisa sisitimu ye laminate yakatenderwa, ine magiredhi ekumhanya/kurasikirwa kwakaderera uye marongero ehybrid anoongororwa zvichienderana nedhizaini. Mhuri ye laminate yakatarwa nemutengi, mhando ye copper foil, musanganiswa we core/prepreg uye ukobvu hwekupedzisira hwe dielectric hunodzora kuti tinogadza sei zvinhu uye nzira ye lamination. Sarudzo yezvinhu haitsiviwi zvisina tsarukano ne FR-4 grade yakachipa kana ichiumba chikamu chekuvakwa kwemagetsi kwakatenderwa.

Zvinhu zvehunyanzvi zvinogona kuda nzvimbo dzakasiyana dzekuchengetedza, kubata, ma press cycles uye ma bonding conditions kubva pakuvaka kwakajairika. Kusanganisa ma dielectric systems kunowedzera imwe nhanho yekuongorora maitiro: zvinhu zvinofanirwa kuenderana ne bonding akasarudzwa uye maitiro anodiwa ekupisa/mechanical. Highleap inotarisa kuwanikwa kwekutenga uye nzira yekuvaka yakarongwa isati yasimbisa purogiramu yekutumira, kunyanya kana mutengi achida laminate ine zita kana asingabvumidze kutsiva.

Kugoverwa kwemhangura nekuvakwa kwezvikamu zvinoongororwawo kuti zvionekwe kuti zvakanyoreswa here uye kuti zvinhu zvakagadzikana sei. Mabhodhi etransceiver matete anogona kunzwisisa mashandiro epaneru uye kushivirira ukobvu. Mapatani emukati matete anogona kukonzera matambudziko ekucheka nekukanda kana akabatanidzwa nehuremu hwemhangura hwakakosha. Izvi zvinogadziriswa kuburikidza nekushandisa maturusi ekugadzira nekuronga maitiro, kwete nekuvimbisa kuti chinhu chega chega chichagadzirwa otomatiki pamuganho waro wega.

Kana kupindira kwesimbi kwatsanangurwa, stackup uye finished conductor geometry zvinoonekwa sezvinodiwa zvakarongeka. Makuponi akatenderwa, kushivirira kuyerwa uye chiyero chemishumo zvinosimbiswa mumagwaro ekugadzira. Zvishandiso zveHighleap zvekugadzira zvinhu zvePCB zvinopa ruzivo rwakabatana nezvezvinhu uye sarudzo dzekuvaka.

Kudzora Kuumbwa KwemaLayer Kubva Panyaya Yezvinhu Kuenda KuLamination

Kugadziriswa kwacho kwakatenderwa kunosimudzira kutenga zvinhu, kugadzirira mukati mechikamu uye kuchinjika. Kune mapurogiramu e transceiver anoshandisa laminates dzakaderera kana dzakasanganiswa, Highleap inotarisa magiredhi e laminate ne bondply, ukobvu huripo hwe core/prepreg, mhando ye copper foil uye kuenderana kwezvinhu nemaitiro anodiwa. Ma layer emukati anogadzirwa uye anoongororwa lamination isati yaiswa; kana yaiswa, zvikanganiso zvakawanda zvemutsara nenzvimbo zvinonetsa kudzoreredza. Kugadziriswa kwacho kwakadzorwa kunosanganisira nzvimbo inodiwa ye dielectric, huremu hwe copper hwakapedzwa, ukobvu hwekupedzisira uye mvumo yekunyoresa, kwete zita rechiratidzo che laminate chete.

Murwi wehybrid unogona kusanganisa zvinhu zvine maitiro akasiyana ekupisa uye mativi. Saka, maparamita elamination uye kuenderana kwezvinhu zvinoda kusimbiswa kweprojekiti. Kana giredhi rakumbirwa risingawanikwe, chinotsiva chinofanirwa kuratidzwa chinopesana nezvinodiwa zvemagetsi nekuvimbika zvisati zvachinjwa chero odha. Highleap haitore dielectric inodhura zvishoma sekutsiva otomatiki yekuvaka channel inomhanyisa inokodzera mutengi.

Chii Chinochinja Pakati Pemuenzaniso uye Kugadzirwa Kwekugadzira

Muenzaniso unogona kugadzirwa nezvinhu zvepaneru zviripo zviri nyore kana kuti chimwe chinhu chakagadziriswa chakabvumidzwa kuongororwa. Kugadzirwa kwakadzokororwa kunoda kuwanikwa kwakasimba uye kuvaka kwakanyoreswa kunodzokororwa. Tinoongorora mafomati epaneru, kunyoreswa kwezvikamu, magwaro ebatch yezvinhu pazvakatsanangurwa uye zvirambidzo zvemutengi pane zvimwe. Kana chigadzirwa chichida mishumo yeimpedance kana ukobvu, nzira yekuongorora inosanganisirwa muchirongwa chekuvaka. Kusimbiswa kwekuisa-kurasikirwa kwakatsaurwa kunotsanangurwa zvakasiyana; mhedzisiro yeimpedance haisi vimbiso yakazara yekushanda kwemodule-system.

Maitiro ekugadzira Mitsetse Mitsetse Mitsetse, Kuboorera Michina uye HDI

Kugadzira maPCB e transceiver e optical ane density yakakura zvinoreva kudzora zvinopfuura kugona kwe headline trace uye drill. Mapatani emhangura akanaka kwazvo, akawanda kuburikidza ne architectures uye nzvimbo dzakamanikana dzemukati dzinogona kuonekwa mubhodhi diki rimwe chete. Kubatanidzwa kwavo pamifananidzo, etching, drilling, plating, lamination uye inspection kunosarudza kugadzirwa chaiko, goho uye nzira yakakodzera yekugadzira.

Highleap inoongorora mafambiro emuchina wekufambisa negomba zvichienderana nehuremu hwemhangura, ukobvu hwebhodhi, kunyoreswa kwezvikamu uye sisitimu yezvinhu zvakatarwa. Chinhu chinogona kugadzirwa panguva yekuedzwa kwakasarudzika hachisiricho chinhu chakanakisa chekugadzira huwandu hwemagetsi hunodzokororwa. Ongororo yeinjiniya inotarisa pakugadzira kuvakwa kwemagetsi nekwemakanika kunoburitswa nevatengi nematanho ekugadzirisa anodzokororwa uye maitiro akajeka ekusiyanisa.

Kudzora Kugadzira Zvinokosha zveFine-Line neHDI Transceiver PCBs

• Kugadziriswa kwemifananidzo uye ruzivo rwekutsvaga: Upamhi hwekutsvaga nepakati zvinoongororwa zvichienderana nefoil yebase, copper yekupedzisira, nzira yekuisa plating uye maitiro akasarudzwa ekucheka. Kufambisa zvakanaka kwe2/2 mil kunogona kuda kudzora kwakasimba uye kuongororwa kwakawedzerwa, kunyanya pazvinhu zvakakosha. Fekitori haifanirwe kuwedzera mambure anodzorwa ne impedance; uko dhizaini isinganyanyi kuoma, inopihwa mutengi asati aburitsa data.

• Saizi yechishandiso chekuboorera kana tichienzanisa nemaburi apera: Dhayamita yechiboorera yemuchina, saizi yemaburi apera akaiswa, kupera kwemidziyo, ukobvu hwebhodhi uye huwandu hwechiboorera zvinofungwa pamwe chete. Chishandiso che 0.20 mm chingave chinokwanisika asi chinononoka uye chisingaregi kupfuura chishandiso chikuru mune chimwe chivakwa. Chiboorera che 0.30 mm chinogona kuderedza kumanikidzwa kwekugadzira chete kana saizi dzemapedhi, nzvimbo yemagetsi uye zvinodiwa zveplating zvichibvumidza; shanduko dzakadaro hadzimboitiki dzega.

• Kunyoresa maburi kubva kumhangura kusvika kumhangura: Gomba rinogona kusvika padhayamita yaro yepamusoro asi richikanganisa dhayamita yemukati iri pedyo kana kubvumidzwa kwekuboorwa kwegomba nekuboorwa kwegomba zvikadya muganhu uripo. CAM inotarisa nzvimbo dzisina basa dzemhangura, mhete dze annular, nzvimbo yegomba kubva kugomba kuenda kugomba uye ukobvu hwakapedzwa. Nzvimbo dzakamanikana dzemukati dzingada nzvimbo yakagadziriswazve kana shanduko yeunyanzvi inotenderwa pane kungoita chirongwa chakasiyana chekuboorwa.

• Kugadziriswa kwesimbi nekuongorora: Kubviswa kwesimbi, kuiswa kwesimbi uye kuputirwa kwemhangura kwakakosha kuti magetsi arambe achishanda zvakanaka uye agare kwenguva refu. Maitiro anogamuchirwa uye hurongwa hwekuongorora zvinosarudzwa kuti pave nekuvakwa kwebhodhi chairo uye geometry yegomba. Kuongororwa kwekuputirwa kwebhodhi/kupatsanurwa hakugone kuratidza hunhu hwemadziro ebharero rakaputirwa chete; zvikamu zvakachinjika kana humbowo hwekuwedzera hunofanira kuiswa kana zvataurwa nemutengi.

• Kutevedzana kweHDI, ma microvias uye via-in-pad: Microvia yega yega kana kubatana kwakavigwa kwakabatana ne layer pair yayo uye lamination stage. Zvivakwa zvakarongwa, resin-filled uye capped vias, uye backdrilled maburi zvinhu zvakasiyana zvine mashandiro akasiyana ekugadzira. Kune BGA inosonerwa via-in-pad, zvinodiwa zvekupfava uye zvekuvhara zvinosimbiswa nekubatanidzwa; solder-mask tenting haibatwi sechinhu chinotsiva cheplanar pad yakaputirwa.

• Kudzivirira zvikanganiso zviri pakati nepakati: Kuongorora kwemukati mechikamu kunogona kuona zvikanganiso zvemifananidzo zvisati zvaitwa lamination; zvinozotevera zvinotarisa pakuboorwa, kuputirwa, circuitry yekunze kwechikamu uye saizi yekupedzisira. Kana paine zvikanganiso zvikawanikwa, nzvimbo yacho inoongororwa zvichienderana nezvinodiwa zvekugamuchirwa zvakabvumiranwa uye zvinyorwa zvemaitiro akanganiswa - kwete kungopasa nekuti bvunzo yekupedzisira yemagetsi inogamuchirwa. Mutengi anofanira kubvumidza chero kutengeswa kunze kwezvinodiwa zvakaburitswa.

Gadzirisa Kuoma Kwekugadzira Nekugadzirwa Kwehuwandu

Sarudzo dzakadzama dzemaitiro dzakatsanangurwa pasi peHDI PCB manufacturing . Mubvunzo wakakosha wekugadzira weodha ye transceiver ye optical ndewekuti stackup yakabatanidzwa, copper geometry uye via design zvinogona here kuchengetwa nguva dzose pahuwandu hunodiwa uye padanho rekuongorora. Izvi zvinopa quotation yakavimbika kupfuura kubata kuratidzwa kwechinhu cherabhoritari sevimbiso yekugadzira blanket.

Kuisa Mapuratifomu Ekusarudza, Zvigunwe zveGoridhe uye Geometry Yebhodhi Rakapedzwa

Mabhodhi mazhinji e transceiver anogocherwa anoshandisa geometry yegoridhe-contact inofanira kuenderana ne host connector. Highleap inogadzira zvinoenderana nezvinodiwa nemutengi zve contact uye outline, kusanganisira selective plating, edge-bevel kana tight board-thickness maficha kana zvichibvira. Kupera kwe contact kunofanirwa kutsanangurwa nemazvo: ENIG pama component soldering pads haingogumiri pa hard-gold wear-contact specification.

Chinodiwa chekuputira chinofanira kuratidza nzvimbo yegoridhe rakasimba, ukobvu hwenickel/goridhe pahwakatarwa, miganhu yekufukidza uye chero gadziriro yakakosha yekubata. Chirongwa chemaitiro chinotarisawo hukama huripo pakati pekuputira, nzira yebhodhi uye beveling. Matinji akaputirwa pamucheto wekuisa anogona kuda kudzora kupfuura zvinoratidzwa nechinhu chemutsetse wepamusoro; ruzivo rwusipo ndicho chikonzero chinowanzo shandiswa pakudzokorodza mashoko mushure mekuongorora kweCAM.

Zvimwe zvinhu zvakanyatsonaka zvinogona kusanganisira mapurofayi ebhodhi matete, mipendero yakacheneswa painodomwa, maburi akarongwa uye zviyero zvakadzivirirwa zvakatenderedza chinongedzo kana nzvimbo yekuchengetera zvinhu. Highleap inoongorora izvi nemufananidzo wemakanika uye dhizaini yekugadzira. Bhodhi rine simba remagetsi asi risingaenderane nechinhu chakavharirwa chigadzirwa chisingaenderane, saka zviyero zvakakosha uye zvinodiwa pakuyera zvinosimbiswa usati wagadzira zvakare.

Kusarudzwa kwekupedzisa pamusoro kunokanganisawo kuunganidzwa kweSMT kunotevera. Mapedhi akakosha kana maficha ekupisa anogona kuda sarudzo dzekupedzisira uye dzekugadziriswa dzinofanira kuongororwa zvichienderana nemaitiro emuunganidzi. Kana Highleap ichipa zvese kugadzirwa uye kuunganidzwa, ruzivo urwu rwekupa runobatanidzwa mumascope maviri, uye sevhisi yekubatanidza yePCB yetransceiver yakasiyana inowanikwa kune vanoodha bhodhi.

Maitiro Akasiyana eSMT Pads neContact Fingers

Mabhodhi e transceiver e optical anowanzo sanganisa ma pads anosonerwa zvakanaka ne card-edge insertion contacts. Chekutanga chingada ENIG kana imwe finish inotenderwa; chechipiri chingada gold hard selective, nickel underlayer uye contact thing thing ukobvu hwakatarwa. Highleap inoongorora nzvimbo chaiyo ye plating, exclusion masks, edge bevel, conductor-to-edge clearance uye inspection method. Mufananidzo unongoti "gold plating" haugone kusiyanisa zvinodiwa izvi uye unogona kukonzera kuti quote idzokororwe mushure mekuongorora CAM.

Kuendesa Mabhodhi Matete Pasina Kurasikirwa Nekurongeka KweInterface

Mutsetse wemodule wakamanikana unogona kunzwisiswa nekufambiswa kwemechanical, rutsigiro rwepaneru uye kusiyana kweukobvu. Bhodhi rakapedzwa rinogona kuda mupendero unodzorwa wekuisa uye kutsetseka kwenzvimbo pasi pezvikamu kana maficha ekusangana. Highleap inoongorora mipendero yezvishandiso, dhatamu yemupendero, ukobvu hwebhodhi uye zvinodiwa pakuyera usati waburitswa paneru. Kuisa machira ekubatanidza kunogona kuwedzera zvirambidzo pakugadzirisa paneru, saka kupedzisa nekunze kwepaneru zvinofanirwa kuongororwa pamwe chete kwete sezvinhu zvakasiyana.

Kuongorora, Zvinyorwa Zvekutanga uye Kudzora Maitiro Ekugadzira

Maitiro ekugadzira eHighleap anogona kusanganisira inner-layer uye yekupedzisira AOI, kuchengetedzwa kwegomba rakaputirwa, kuyedzwa kwemagetsi kwakagadzirwa, kuongororwa kwakakosha uye mamwe ma controls akatsanangurwa nevatengi. Chirongwa chekugamuchira kugadzirwa kwebhodhi re optical-transceiver chingadawo ma coupons e impedance, ma microsection records, kuteverwa kwezvinhu, mishumo yeukobvu kana kuyerwa kwe plating kwakasarudzwa. Izvi zvinofanirwa kutsanangurwa nemifananidzo yakatenderwa uye chibvumirano chemhando; hatiti package imwe chete yekuongorora inofukidza zvese zvinodiwa zve optical-module.

Mhedzisiro ye coupon ye impedance haina kufanana ne qualification yekurasikirwa ne channel, uye bvunzo ye E-board isina chinhu hairatidze kushanda kwe optical. Miedzo iyoyo inotsanangurwa padanho rakasiyana rechigadzirwa. Kukosha kwezvinyorwa zvekugadzira ndekwekuti zvinoratidza kana Highleap yakagadzira bhodhi zvichienderana nezvivakwa zvakatarwa zve production lot iyoyo.

Kuti tiwane magwaro ekuongorora mhando dzezvigadzirwa, tinosarudza kuti ndeapi maitiro anoda humbowo hwechinhu chekutanga uye kuti ndeapi anogona kuteverwa neongororo yenguva dzose yenzvimbo. Pakudzokororwa kwemirairo, shanduko dzinosanganisira laminate, foil, via process, surface finish kana critical tooling dzinofanira kuongororwa zvichienderana nekugadzirwa kwakatenderwa nevatengi. Zvishandiso zvedu zvePCB zvekuongorora magetsi zvinokurukura chikamu chimwe chete chemaitiro ekugamuchirwa kwebhodhi risina chinhu.

Kusimbiswa Kwakarongwa Pane Kuedza Kwekupedzisira Kumwe Chete

Hunhu hwekugadzira hunotanga bvunzo yekupedzisira yeE isati yaitwa. Zvichienderana nebasa rinogamuchirwa, AOI yemukati inoongorora hunyanzvi, kudzora kubhowa nekuputira kunoongorora kuvimbika kwegomba rakaputirwa, kuongorora kwekuona uye kwemativi kunoongorora puratifomu yebhodhi nekupedzisa, uye kuyedzwa kwemagetsi kunoongorora kuenderera mberi/kuparadzaniswa. Makuponi eImpedance, zvikamu zvakachinjika, kuyerwa kweukobvu uye kuchengetedzwa kwepuratifomu zvinoitwa zvichienderana nezvinodiwa nemutengi. Seti yekusimbisa inosarudzwa kuti ienderane nenjodzi chaiyo: chirongwa chekubatana nemakadhi chinoda humbowo hwakasiyana kubva kubhodhi rechiratidzo risingabviswe.

Zviito Zvekugadzirisa uye Kuenderana Kwezvinhu

Muenzaniso unopasa ongororo inoshanda hauna kukwana kubvumira shanduko dzisina kuziviswa mu laminate, copper profile, kuburikidza nekugadzirisa kana kusarudza plating pane mamwe mabhechi anotevera. Highleap inoshandisa kugadzirisa nekugadzirisa uye kudzora specification kuti ienzanise maodha akadzokororwa ne baseline yakaburitswa. Kana tolerance kana special process isina kujeka, nyaya yacho inomutswa usati wagadzira; kana ongororo ikaona chinhu chisingaenderane nezvinodiwa, kugadzwa kunotevera zvinodiwa nekugamuchirwa zvakabvumiranwa uye chero zvinodiwa nevatengi. Izvi zvinogadzira sarudzo dzinoteverwa pane kutumira chinyararire chimwe chinhu chinotsiva.

Makotesheni ekugadzira PCB eOptical Transceiver uye maodha ekugadzira

Kuti ukumbire mutengo wekugadzira, ipai data reGerber kana ODB++ rinodzorwa, data reNC drill uye rout, layer stackup, zvinodiwa zve laminate uye dielectric, ukobvu hwebhodhi rakapedzwa, huremu hwemhangura, zvinyorwa zve impedance, saizi yemakanika uye specification ye surface-finish. Tsvagai ma plated kana laser-drilled vias, chero backdrill kana via-stub limits, via-in-pad filling/capping, selective hard gold, edge bevel nezvimwe zvinhu zvakakosha. Taura huwandu hwezvinhu zvakaputswa, huwandu hwegore hunotarisirwa, mishumo yekuongorora uye chinangwa chekutumira chinodiwa.

Kutevedzana kweRFQ Kwakagadzirira Kugadzirwa

1. Tumira mifananidzo yakazara yakaburitswa, mafaira ekudhirowa, kuunganidzwa kwezvinhu, mamakisi ezvinyorwa uye kudhirowa kwekubata-kupedzisa.
2. Sarudza zvinhu zvakakosha zvinoda mvumo yeinjiniya uye chero humbowo hwekuongorora hunofanirwa kuitwa.
3. Kumbira kuti pave neongororo yakanyorwa yezvimwe zvinhu zvisati zvaitwa usati wagamuchira mutengo wekupedzisira uye nguva yekutanga yekugadzira.
4. Kuburitsa purogiramu yekuongorora yakatenderwa uye yehuwandu hwezvinhu kuti pave neruzivo rwekutanga rwekugadzira.

Highleap inoongorora zvinodiwa isati yasimbisa nzira yekugadzira, kuwanikwa kwezvinhu, kunze kwehunyanzvi, mutengo weyuniti uye purogiramu. Mutengo unogona kunge wakaderera asi data reinjiniya risina kukwana; mutengo wekugadzira wakatenderwa unoratidza zvirevo zvekupedzisira zvekugadzira. Kana chinhu chinodiwa chikapfuura nguva yakatarwa, tinokurukura imwe nzira yakatenderwa nehunyanzvi kana kuona dambudziko tisati tabvuma odha.

Highleap inopa kugadzirwa kwePCB isina chinhu senzira yakatsanangurwa yekugadzira. Mapurojekiti anoda kutenga zvikamu, kuiswa kweSMT kana bvunzo yebhodhi anogona kutaurwa zvakasiyana sePCB assembly ye transceiver ye optical , nepo sisitimu yedu ye transceiver yePCB inovharawo zvinodiwa zve module-form-factor uye connector-interface. Tumira mafaira ako ekugadzira kuHighleap Electronics kuti uwane quotation yakaongororwa neinjiniya uye hurongwa hwekugadzira.

Mutengo Wekugadzira Unovakwa Sei

Chiratidzo chebhodhi risina chinhu chinotarisa kushandiswa kwezvinhu nepaneru, huwandu hwemaitiro emukati memadziro, kuoma kwekuchera nekuputira, zvirambidzo zvemitsetse midiki, kupedzisa kwakakosha, kusimbiswa kwakarongwa uye huwandu. Matanho ekuwedzera ekuvaka, mavhisi akazadzwa, kuputira kwakadzama kwakadzorwa kana goridhe rakaoma rinogona kuchinja mutengo uye kugona. Zvikumbiro zvekukasira zvinofanirwa kuongororwa zvichienderana nehurongwa chaihwo; kucheneswa, kupiswa uye kuputirwa hazvigone kupfupikiswa nguva dzese pasina kuchinja ruzivo rwengozi.

Isa chero magwaro ekuongorora anodiwa muRFQ yekutanga. Chikumbiro chemishumo yekudzivirira, kuteverwa kwezvinhu kana zviyero zvakakosha zvekubatana mushure mekunge odha yaitwa zvinogona kuwedzera zviyero uye shanduko dzehurongwa. Highleap inogona kusiyanisa kugadzirwa kwakajairika, maitiro akakosha akaongororwa neinjiniya uye chero bvunzo dzakatorwa zvakasiyana kuitira kuti kutenga kuenzanise chiyero chaicho chinogamuchirwa.