Mugadziri wePCB weOptical Transceiver weMamodule Anogonganisika Akagadzirwa Nemaoko

Highleap Electronics inogadzira uye inounganidza maPCB e transceiver e optical akagadzirwa nemakambani eOEM, vagadziri ve optical-module uye vagadziri vemagetsi vanotsvaga mabhodhi eSFP-family, QSFP-family, QSFP-DD, OSFP uye zvigadzirwa zve transceiver zvepachivande. Tinoshanda nemadhizaini akaburitswa nevatengi uye madhirowa e module kuti tipe maPCB asina chinhu kana ma PCB assembly akazadzwa nevanhu, nehukuru hwekugadzira uye hwekuunganidza hwakatsanangurwa zvakasiyana mukotesheni.

Aya mabhodhi madiki, akakosha pakugadzirwa. PCB yakapihwa haifanire kungopasa bvunzo yekuenderera mberi kwemagetsi: mupendero wekadhi wapera unofanirwa kukodzera chinobatanidza chayo, mupendero webhodhi unofanirwa kukodzera imba yemodule, laminate ne stackup zvinofanirwa kuenderana nezvinodiwa nemagetsi, uye kupedzisa kwepamusoro kunofanirwa kutsigira zvese zvinosungirirwa pamwe nekubatanidza kubatanidza kunodzokororwa kana zvichidikanwa. Highleap inobatanidza zvinodiwa izvi panguva yekuongorora kweinjiniya nekuburitswa kwekugadzira, pane kushandisa bhodhi re optical-transceiver kubva muhuwandu hwaro hwema layer chete.

Chimiro chedu chekugadzira chinosanganisira kugadzirwa kwePCB dzakasimba dzakawanda, maficha ekubatanidza ane density yakakura, kugadziriswa kweimpedance inodzorwa, kupedzisa kwakatarwa kwekubatana, kubatanidzwa kweSMT uye kuongororwa kwekugadzirwa. Kuti uwane mutengo wepurojekiti, tumira data rebhodhi, dhizaini yemakanika, stackup, huwandu uye—kana kubatanidzwa kuchidikanwa—BOM nemagwaro ekubatanidza.

Kupa KwePCB Yekushandisa Optical Transceiver Yezvirongwa zveOEM neModule

Highleap inopa mabhodhi zvichienderana nedhizaini inodzorwa nemutengi, pane kupa PCB imwe chete inochinjika kune yega yega transceiver format. Dhizaini yeQSFP-DD ine geometry chaiyo yehost-edge, kurongeka kwepakeji uye kurongeka kweheat-spreader haigone kutsiviwa nebhodhi rakafanana nekuti rinoshandisa chiyero chakafanana chedata. Basa redu rinotanga nekuona PCB revision chaiyo uye maficha anosarudza kuchinjana mukati mechigadzirwa chaunoda.

Mibvunzo inowanzo bvunzwa inosanganisira module PCB ichangobva kuburitswa ichibva pakugadzira zvinhu zveinjiniya kuenda kukugadzira, dhizaini iripo ichiendeswa kune imwe nzira yekugadzira, kana bhodhi rinoda kuvandudzwa kwemutengo uye kugadzikana kwekutumira mushure mekuchinja kwezvinhu kana chikamu. Pachirongwa chitsva, tinoongorora pasuru yekugadzira uye tinosimbisa mibvunzo yekugadzira inofanira kugadziriswa tisati tashandisa maturusi. Papurojekiti yekutumira-kutumira, tinogona kuenzanisa madhirowa akaburitswa, zvinodiwa zvekugadzira zvekare uye zvinyorwa zvekugamuchirwa zvichienderana nenzira yekugadzira yakarongwa.

Hatifungi kuti chimiro chechinhu chinosarudza huwandu hwemhangura hwakagadzika, zvinhu zve dielectric kana kurongeka kwe microvia. Dhizaini chaiyo yakatenderwa ndiyo inotungamira kuvaka. Vatengi vanoshanda mumapuratifomu akasiyana-siyana e optical-module vanogona zvakare kushandisa chirongwa chedu chekugadzira PCB che optical module kuti vagadzirise kugadzirwa kwepuratifomu uye zvinodiwa pakugadzirwa.

Kuburitswa Kwekugadzirwa kweModule Itsva Zvichienzaniswa neKutamiswa Kwetsime

Bhodhi idzva reOEM uye kuchinjirwa kwekugadzirwa zvakare hazvipinde mubasa redu rekugadzira neruzivo rwakafanana. Purogiramu itsva yemodule inowanzova nedhizaini yemagetsi inotenderwa asi ichiri kuda kuti kugadzirwa kwayo kuongororwe zvichienderana nedhirowa reimba, specification yemakadhi-edge, kuwanikwa kwelaminate uye hurongwa hwekugadzira hwemuunganidzi. Tinotanga nekuenzanisa kugadziriswa kwedata rekugadzira nekuvandudzwa kuri pa stackup, outline, contact plating drawing uye purchase order. Kana edge-contact finish ikaratidzwa chete padhirowa isina kurongeka yekuunganidza, chinodiwa ichocho chinosimudzwa kugadzirwa kusati kwarongwa.

Odha yekuchinjisa midziyo inowanzova nechinhu chechipiri: kuchengetedza zvinhu zvakamboshandiswa nemutengi. Laminate yakafanana neyakagadzirwa nehunyanzvi haisi iyo inongoerekana yatenderwa, kunyanya kana kurasikirwa kwekuisa chiteshi uye kugadzirwa kwe dielectric kuchidzorwa. Saizvozvowo, kushandura ukobvu hwebhodhi rakapedzwa kana maitiro ekubatana negoridhe kunogona kukanganisa kubatana kwekubatanidza kunyangwe chimiro chose chikaramba chisina kuchinja. Saka tinokumbira dhizaini yekugamuchira inodzorwa, dzimwe nzira dzakatenderwa uye chero zvinodiwa zvekutanga zvinofanirwa kufamba nedhizaini. Magwaro aya anoisa miganhu yekotesheni inogamuchirwa, pane kubatwa semapepa esarudzo.

Chii Chinogona Kubatanidzwa Pasi Pechirongwa Chimwe Chepamusoro

Vatengi vanogona kuodha PCB isina chinhu vari vega kana kukumbira kugadzirwa kwakarongeka uye kugadzirwa kwebhodhi rine vanhu vakawanda. Purojekiti yakabatanidzwa inoshandisa kugadziriswa kwePCB kwakafanana mukugadzirwa kwebhodhi, kuwanikwa kwezvikamu uye kuronga kweSMT, ukuwo ichichengetedza nzvimbo dzakasiyana dzekutarisa mhando dzebhodhi risina chinhu nePCBA. Kana vatengi vachipa zvikamu kana vachida chigadzirwa chekuedza, mutoro wekupa uye chiyero chekuedza zvinoonekwa mumagwaro eodha. Hatitsanangure kuunganidzwa kweinjini ye optical, alignment inoshanda ye optical kana qualification ye full-module sechikamu chePCBA delivery yakajairika kunze kwekunge chiyero chebasa chakasiyana chasimbiswa.

Kuvaka Multilayer uye HDI PCB yeDense Transceiver Boards

Highleap Electronics inogadzira maPCB e multilayer optical transceiver zvichienderana nema stackups anoburitswa nevatengi, zvinodiwa nemhangura uye kuburikidza nemamepu. Mu compact transceiver, michina yekugadzirisa, mapower stages, manejimendi circuitry uye connector contacts zvinokwikwidzana nenzvimbo imwe chete yakaganhurirwa. Saka mugadziri anofanira kuongorora feature geometry uye layer interconnections semusanganiswa, pane kubvumidza one-own trace width kana drill size kubva pa generic capacity chart.

Chinangwa chekugadzira ibhodhi rine maconductor anonzwa impedance, nzira yekubuda mugomba rakatsetseka uye kubatana kwakapetwa kunogona kudzokororwa mumapaneru ekugadzira. Nzira yekugadzira inosimbiswa ne laminate chaiyo, kurongeka kwe layer, ukobvu hwakapedzwa, huremu hwemhangura uye chimiro cheburi. Maburi akapfava akapfava anogona kukwana module imwe chete; imwe dhizaini inotenderwa ingada ma via akavharwa kana akavharirwa, laser microvias kana akazadzwa uye akavharirwa via-in-pad. Kunyora nekukurumidza kwakanyanya chete hakuratidzi kuti ndeapi eaya maitiro anodiwa.

Kudzora Kugadzirwa Kwema "Multilayer" Akakosha uye HDI

• Kuburitswa kwesimbi uye dielectric: Dhirowa rakatenderwa rinofanira kuratidza layer yega yega yemhangura neye dielectric, giredhi re laminate, zvinodiwa zvepakati/prepreg, ukobvu hwakapedzwa uye zvinangwa zve impedance. Munguva yekuongorora kweCAM, kuwanikwa kwe dielectric uye mhangura yakapedzwa inotarisirwa zvinofungwa pamwe chete; kushandura ukobvu hwe dielectric kungoshandisa stock iripo kunogona kukanganisa chiteshi chakamboshandiswa. Kutsiva zvinhu uye shanduko dzemagetsi zvinoda mvumo yakanyorwa yemuridzi wedhizaini.

• Kudhirowa mifananidzo nekucheka nemutsetse mutete: Upamhi hushoma hwemuchina wekufambisa nepakati zvinofanirwa kuongororwa zvichienderana nehuremu hwemhangura, kuputirwa kwekunze, maitiro e laminate uye kubhadhariswa kwekucheka. Chinhu che 2/2 mil chinogona kugadzirwa kana paine nzira yakakodzera, asi hachifanirwe kuve mutemo wekugadzirisa nzira dzakajairika. Kuda mutsetse wejometri muma layers akawanda kunogona kusimbisa hwindo rekuita, kuderedza goho uye kuwedzera zvinodiwa zvekutarisa kana kutsiva mapaneru.

• Kuboorwa kwemuchina uye kubviswa kwemhangura: Kuboorwa kwedhayamita yezvishandiso, dhayamita yegomba rakapedzwa, ukobvu hwebhodhi uye huwandu hwemakomba zvakasiyana-siyana pamutengo uye mhando yezvinhu zvinopinda. Zvishandiso zvidiki zvinogona kunonotsa kuboorwa uye kuita kuti danda remadziro rive rakaoma, kunyanya pabhodhi rakakora. Kunyoreswa kwedhayamita, kubviswa kwepad mukati kusingashande kana zvichibvumirwa, mhete dzeannular uye kubviswa kwedhayamita kubva pakuboorwa kuenda kune isina kubatana-mhangura zvese zvinoda kuongororwa kwakarongeka; kuchinja dhayamita yekuboorwa chete hakusi mhinduro yakakwana yeDFM.

• HDI uye kutevedzana kwelamination: Laser microvias uye blind/built connections zvinoiswa pamepu kune mamwe ma layer asati atenderwa kugadzira. Mamwe ma crimp, register, metallization uye sequential lamination stages anogona kuchinja goho, mutengo uye nguva yekutungamirira. Zvivakwa zvakarongwa zvinoda kuongororwa kwakajeka kwezvinhu uye kuvimbika; HDI haina mepu yekubatanidza kana layer haina kukwana kuti chigadzirwa chibudiswe.

• Kupedzisa ne-in-pad: Kuvhura via mu-fine-pitch pad inosonerwa kunogona kubvumira solder wicking. Kubatanidza kana kuvharira tende resolder-mask hazvingoiti kuti pave nepamusoro pakafukidzwa neBGA pad yega yega. Kana dhizaini yakaburitswa ichitaura nezve-filled, planarized uye copper-capped vias, mutengo uye mufambi anofanira kutsanangura kuzadza, kugadzika, kuenzana, kuputira chivharo uye kuongororwa kwakakodzera. Kupedzisa kunodiwa kunorongwa nekubatanidzwa kwebhodhi risati ragadzirwa.

• Kudhirowa kumashure uye kuchinja kwekumhanya kwepamusoro: Kana kuburikidza nemastubs zvichidzorwa nebhajeti rechiratidzo, dhizaini inofanira kutsanangura mambure akanganiswa, mabhora ekudhirowa, stub inobvumidzwa uye nzira yekugamuchira. Kudhirowa kumashure hakusi chinhu chinodiwa nevanhu vese kumaPCB etransceiver, uye timu yekugadzira haigone kuyera kudzika kwayo kubva pahuwandu hwedata. Chero shanduko inokurudzirwa mugeometry yekubatanidza inotenderwa zvichienderana nezvinodiwa nemagetsi zvemutengi.

Kubvumidzwa Kwekugadzira Pamberi Pekugadzira Panel

Kusanganiswa kwe laminate, trace geometry, drilled interconnections uye acceptance tests zvinonyanya kukosha kupfuura chero nhamba ye headline-feature number. Highleap inogona kuratidza kusasarudzwa kwekugadzira muongororo yayo uye kutsvaga mvumo yezvimwe zvinhu zvisati zvagadziriswa maturusi kana zvinhu. Kuti uwane kugona kwemaitiro uye mamiriro ekuongorora, ona kugadzirwa kwePCB nekukurumidza uye sevhisi yekugadzira ye optical transceiver isina bhodhi . Kugona kwekupedzisira kunoenderana nekuvakwa kwakapihwa uye musanganiswa wayo wese wezvinhu.

MaContacts eKadhi-Edge, Gold Plating uye Precision Mechanical Features

Mupendero wakatarisana nehost wePCB inochinjika inochinjika iinterface yemagetsi uye yemakanika inodzorwa. Bhodhi rinogona kupasa bvunzo yekuenderera mberi kwemagetsi asi rikasabatanidzwa nekuti geometry yekubatana, ukobvu hwakapedzwa, nzvimbo yebevel kana dhatamini yekunze hazvibvumirane nehousing yekusangana uye connector. Highleap inoongorora maficha aya sechikamu chetsanangudzo yekugadzira pane kutora macontact edge sesarudzo yakajairika yekupedzisa pamusoro.

Kuguma kwekubatana kunewo mhedzisiro yakananga pakururama kwekotesheni. ENIG pamapedhi ezvikamu zvinogoneka kusungirirwa uye kuputirwa kwegoridhe kwakasarudzwa pakubatanidza matinji zvinodikanwa zvakasiyana pakugadzirisa. Odha yekutenga inoti "kupedzisa kwegoridhe" chete inosiya scope yekuputira isina kujeka uye inogona kukonzera kupindurwazve kana dhirowa rekubatanidza raongororwa. Dhirowa yakazara ye edge-interface inofanira kuratidza kuti kupedzisa kwega kwega kunodiwa kupi uye kuti ndeapi mativi akakosha kuti akwane.

Zvinodiwa pakugadzira nekuongorora makadhi akakosha

• Kuisa chifukidziro chekubatana: Mufananidzo unofanirwa kutsanangura nzvimbo yekubatanidza, rudzi rwekupedzisa runodiwa, pasi peplate uye ukobvu hwegoridhe pazvakatsanangurwa, uye nzvimbo dzakabviswa nemaune kubva mukuita ikoko. Kuisa chifukidziro uye kuisa chifukidziro chekusarudza zvinogona kuwedzera mashandiro kupfuura bhodhi reENIG rakajairika. Nzira yekugamuchira yakabvumiranwa inofanira kuenderana nezvinodiwa chaizvo zvekubatanidza-kupfeka pane kuvimba nechitarisiko chebhodhi rapera.

• Geometry yeBevel neInsertion: Zvigunwe zvecontact zvinogona kuda bevel yakatarwa, kurongeka uye nzvimbo yemupendero zvichienderana ne connector datums. Nzira yekugadzira inofanira kubvumira machining yakakwana uye kuchengetedza nzvimbo dzecontact dzakaputirwa. Bhodhi rakatenderera kana "standard bevel" isina kutaurwa haifanirwe kutsiva mufananidzo wemugadziri weconnector, nekuti kunyangwe shanduko diki dzegeometry dzinogona kukanganisa kukodzera kweinsertion uye mashandiro econtact.

• Ukobvu hwakapedzwa panzvimbo yekusangana: Ukobvu hunoratidzwa pa stackup hunofanira kuenzaniswa nehuwandu hwekubatana hunobvumidzwa ne connector, kusanganisira chero chinhu chemukati kana kuti copper building. Ukobvu hwega hausi vimbiso yekuti hunokodzera. Highleap inogona kuona nzvimbo dzekuyera dzakakosha uye zvinyorwa zvekuongorora zvakarongwa usati wagadzira dhizaini.

• Kurongeka kwemutsetse, nzvimbo dzinoiswa uye dhatamini dzinokosha: Mipendero yebhodhi, zvinhu zvekuisa, zvidzikiso zvidiki uye zvinhu zvekuenderana kweconnector zvinofanirwa kudzorwa kuti zvienderane nedata remhangura. Faira rine mupendero weGerber unopesana nedhirowa yemakanika rinochengetwa kuti rijekeswe. Kutenderwa kwemutsetse kunogamuchirwa uye dhatamini dzinofanirwa kutaurwa pachinzvimbo chekuvimba netendero dzisina kutaurwa dzebhodhi.

• Kutwasuka uye kubata mamodule matete: Mabhodhi mapfupi akatetepa anogona kunzwisiswa nekutsigirwa kwepaneru, kumanikidzwa kwenzira uye kugoverwa kwemhangura munzvimbo. Dhizaini yepaneru inokurudzirwa inofunga nezvekubata nekuburitsa pasina kukanganisa nzvimbo yakakosha yekubatanidza. Kana bow/twist yekupedzisira kana flatness iri chinodiwa chinoshanda, mamiriro ekuyedza uye muganho unobvumidzwa ndewemudhirowa wakatenderwa; mirairo ye "flat board" yakajairika haigone kuyerwa nguva dzose.

• Zvinyorwa zvekuongorora uye zvisarudzo zvisina kuenderana: Kupera kwegoridhe-contact finish, ukobvu, saizi yemufananidzo uye hunhu hwebevel zvinogona kuda zvinyorwa zvakasiyana zvichienderana nezvinodiwa nemutengi. E-test yega haigone kusimbisa kushanda kwecontact kana kukodzera kwemuchina. Kana dhizaini yekugadzira uye connector specifications zvisingawirirane, timu yekugadzira inokumbira sarudzo yakadzorwa pane kusarudza dudziro yakachipa uye kutumira bhodhi.

Bvisa Edge Interface seChiratidzo Chimwe Chinotenderwa

Kune maodha akadzokororwa, data rekugadzira rinodzorwa nekuvandudzwa, dhizaini yekubatanidza, marongero egoridhe neminwe uye nzira yekuongorora inogamuchirwa inofanira kuramba iri pamwe chete. Kuchinja kwezvinhu kana kupedzisa kunogona kukanganisa kuenderana kwemuchina kunyangwe kana hunyanzvi hwemhangura husina kuchinja. Kuti uwane tsananguro yakadzama yekubata simbi, ona ruzivo rwekugadzira PCB yegoridhe neminwe yeHighleap . Chero shanduko inokanganisa interface inoongororwa nemuridzi wedhizaini usati watangazve kugadzirwa.

Kusangana kwePCB yeOptical Transceiver uye Kurongeka Kwekugadzira

Highleap inogona kugadzira bhodhi risina chinhu yoga kana kuibatanidza nePCB assembly ye transceiver ye optical . Kana PCBA yabatanidzwa, kugadzirwa kwechinhu ichi kunosanganisira kupedzisa kwenzvimbo, mapatani eSMT land, kugadziriswa kwe-in-pad, dhizaini yepaneru yemusangano uye kuwanikwa kwezvikamu zvakatarwa. Izvi zvinodzivirira dambudziko rinowanzoitika rekutumira manyuko: bhodhi rinogona kugadzirwa sePCB isina chinhu asi rinokonzera matambudziko ekugadzirisa kana kugadzirisa pamutsetse wemusangano wakatenderwa.

Kune maPCBA anotsanangurwa nevatengi, chiyero chekubatanidza chinogona kusanganisira kutenga zvikamu, kudhinda nekuisa solder, kuisa SMT uye kuyererazve, mashandiro ekupinda nepaburi kana zvichidikanwa, AOI, X-ray yemajoini esolder akavanzwa, uye kuyedzwa kwemagetsi kana kushanda kwebhodhi uko maitiro akatenderwa aripo. Mapurojekiti ane maBGA madiki, maQFN, maconnector epitch fine kana mapassive ane density yakawanda anogamuchira ongororo yemaitiro epakeji. BOM nemufananidzo wekubatanidza zvinofanirwa kuratidza kurongeka, kubata zvikamu zvisiri zvestandard uye chero zvikamu zvinoda ma profiles ekupisa akakosha kana dziviriro panguva yekudzokororazve.

Kurongeka kwemaziso, kuenzaniswa kwakakwana kwetransceiver-module, kuyedzwa kwesimba remagetsi uye kuyedzwa kwe-bit-error-rate hazvisi chikamu chepurasitiki isina chinhu kana PCBA . Zvinoda nzira yakatsanangurwa zvakasiyana, michina yekuyedza uye chiyero chekugamuchira. Sevhisi yakazara yePCB yetransceiver yemagetsi inotarisa kutsvagisa zvikamu, NPI, kuunganidza uye zvinounzwa padanho rebhodhi zvakadzama.

RFQ yekugadzira pamwe chete uye kuunganidza inogona kubatwa seprojekiti yakarongeka ukuwo ichichengetedza matanho akasiyana ekugamuchirwa. Humbowo hwemhando yebhodhi risina chinhu hunosimbisa mhedzisiro yekugadzira PCB; kuongororwa kwekuunganidza kunoratidza kuiswa uye kunaka kwekusungirirwa; chero mashandiro emagetsi/optical echikamu chemodule anoramba ari pasi pehurongwa hwekugamuchira hwemutengi hwakasiyana.

Sarudzo dzekugadzira dzinosarudza goho reSMT

Kana chinhu chakumbirwa chiri bhodhi re transceiver rakazadzwa nevanhu, Highleap inobatanidza ongororo yekugadzira neongororo yemusangano usati waburitsa chigadzirwa. Kupedzwa kwepad, kunyoreswa kwesolder-mask, planarity ye via-in-pad uye dhizaini yepaneru zvinokanganisa kudhinda nekuisa paste. PCB inopasa bvunzo yemagetsi asi ine ma via akavhurika muma critical pads kana kusakwana kwekutsigira kwemuchina kunogona kugadzira zvikanganiso zveSMT zvinodzivirirwa. Njodzi idzi dzinoongororwa zvichienderana ne land pattern yakatenderwa nemutengi uye data re component package.

Zvinhu zvinobata mubatanidzwa ndizvo zvinonyanya kuzivikanwa. Pamidziyo yeBGA kana QFN ine pitch yakanaka, ongororo yemaitiro inogona kusanganisira nzira yekuvhura stencil, kurongeka kwezvikamu, huwandu hwekupisa hunotarisirwa, kugadzikana kwekuyerera kwemvura uye mukana wekutarisa. Kana laminate isina kurasikirwa zvakanyanya kana kuti yakasanganiswa iine maitiro akasiyana ekupisa kubva kuFR-4 yakajairwa, inofanira kuongororwa sechikamu chekuvaka kwePCB-plus-assembly pane kufunga nezvemaitiro akafanana ekudzoka kwemvura. Shanduko dzinokanganisa kugona kwekusvetukira kana rutsigiro rwebhodhi dzinotenderwa padanho rakakodzera reinjiniya.

Magedhi Akasiyana Ekugamuchira ePCB, PCBA neModule

Bhodhi risina chinhu rinounzwa rinogona kuyerwa kuti rione kuenderera mberi, kupatsanurwa, saizi uye mhedzisiro yemakuponi yakabvumiranwa. Kana raunganidzwa, kuzivikanwa kwechikamu, kuiswa, majoini esolder uye mashandiro emagetsi ebhodhi akatarwa zvinoumba gedhi rekugamuchira rakasiyana. Kushanda kwe transceiver optical kwakazara—kusanganisira optical coupling, receiver sensitivity, output power uye BER—kuda imwe test scope uye, kazhinji, michina inopfuura PCBA line yakajairika. Odha imwe chete inogona kuronga matanho aya, asi inofanira kudoma kuti ndeipi yakapihwa Highleap kuti iendeswe.

Kufanirwa kwePrototype, Kuenderana kweLot uye Kudzora Kutumira

Highleap inotsigira mapurogiramu ePCB emhando yepamusoro, ekuedza, uye ekudzokorora. Maitiro ekugadzira echinhu chekutanga akasiyana nemaitiro ekuraira module inodzokororwa: batch yekutanga inofanira kusimbisa chivakwa chakatsanangurwa uye hunhu hwakakosha hwemakanika/magetsi, nepo maodha ekudzokorora achifanira kuchengetedza zvinhu zvakatenderwa, maitiro, kugadzirisa uye maitiro ekuongorora. Kutamiswa kwemutengesi hakufanirwe kubata shanduko yelaminate inorasikirwa zvishoma, copper profile kana contact plating sechinhu chinotsiva chisiri chekutengeserana.

Zvichienderana nezvinodiwa neodha, zvinhu zvinodzora kugadzirwa zvinogona kusanganisira kuongorora kwemukati mechikamu, AOI, bvunzo yemagetsi isina bhodhi, kuyerwa kwakakosha, kusimbiswa kweplating kana cross-section, uye kuponi dze controlled-impedance. Ronga chaiyo yemuenzaniso uye kirasi yekugamuchira zvinofanirwa kubvumirana mumagwaro eodha. Kuponi dzekuedza dzinogona kuratidza pfuma yekugadzira yakatsanangurwa, asi mhedzisiro ye impedance chete haibvumidze chiteshi che module chese che high-speed.

Kuti tigadzirise zvinhu zvakare, tinoongorora huwandu hwezvinotarisirwa, kugadzikana kwekugadzirisa, zvimwe zvinhu zvakatenderwa, kuwanikwa kwezvinhu uye magwaro epamusoro-soro. Kana dhizaini iine zvinodiwa zvakakosha pakupedzisa kana kuisa zvinhu, izvo zvinofanirwa kuonekwa sehunhu hunodzorwa mukuburitswa kwezvigadzirwa. Kurongedza nekugadzirisa zvinogonawo kukosha kune mabhodhi matete kana nzvimbo dzekubata-bata; nzira inodiwa yekudzivirira inofanira kubvumwa isati yatumirwa pane kungofungidzirwa.

Danho rekutaura zvinhu rinofanirwa kuratidzwa padanho risingawanzoitiki. Kuisa zvinhu zvisina kujairika pachinhu chimwe chete, kuburikidza nekuzadza nekuvhara, kunyorwa kwezvinhu zvakasimba, mishumo yekuedza yakatsaurirwa uye kutumirwa nekukurumidza zvinogona kuita kuti pave nemabasa asina kuverengerwa mufungidziro yakajairika. Highleap inoongorora ruzivo urwu isati yasimbisa mutengo nenguva yakatarwa, saka hurongwa hwekugadzira hunoratidza bhodhi rakarairwa nemutengi.

Uchapupu hweChinyorwa Chekutanga Uchipesana neUchapupu Hwenguva Dzose Hwevanhu

Nyaya yekutanga inofanira kuratidza kuti nzira yekugadzira inogona kugadzira zvinhu zvinonyatsodzora module: ukobvu hwekubatana uye plating, mupendero wekuisa bhodhi, zviyero zvakakosha zvekunze, zvimiro zvakatemwa zve impedance, kubatana kwemukati uye kuvakwa kwezvinhu zvakapedzwa. Humbowo hahuna kufanana kune yega yega purogiramu. Mamwe maodha anongoda kuongororwa kwakajairika uye kuyedzwa kwemagetsi kwebhodhi risina chinhu; mamwe anoda mishumo yehukuru, makuponi e impedance, kusimbiswa kwechikamu chidiki kana zvinodiwa nevatengi. Highleap inobvumirana pane izvo zvinobuda zvisati zvagadzirwa pane kupa chikumbiro che "kuyedza kwakazara" chisina kutaurwa.

Kudzokororwa kweodha kunoda kurangwa kwemaitiro kupfuura chimwe chirevo che generic qualification. Kugadziriswa kweGerber ne drill, kubvumira laminate alternates, zvinodiwa zve surface-finish, kudhirowa kwepaneru kwakatenderwa uye frequency yekuongorora zvinofanirwa kuramba zvichidzorwa. Mupi wezano anogona kuramba achikurudzira kuvandudzwa kwemaitiro, asi shanduko dzinokanganisa kukodzera, mashandiro emagetsi, kugona kusungirirwa kana humbowo hwekugamuchira zvinoongororwa zvisati zvaitwa. Ndizvo zvinoita kuti mhedzisiro yeprototype irambe iine kukosha kana odha ikava chirongwa chekugadzira chakarongwa.

Kuenderera mberi kwekupa panguva yekuchinja kwekugadzirisa

Mutengi wemodule anogona kuburitsa BOM itsva kana kugadziriswa kwedzimba asina kuchinja nemaune dhizaini yemagetsi yePCB. Kugadziriswa ikoko kunogona kushandura geometry yepad, nzvimbo yekubatana kana nzvimbo dzekupisa. Highleap inokumbira kuzivikanwa kwakajeka kwekudzokorora uye manotsi ekuchinja kudzivirira kuti zvivakwa zvekare nezvitsva zvisasanganiswe. Kune mapurogiramu anodzokororwa, mavara ekutumira, mareferensi enzvimbo uye kurongedza kwekudzivirira kwenzvimbo dzekubatana dzakaputirwa zvinogona kutsanangurwa sechikamu chechibvumirano chekutumira. Kana substrate yakakosha ikasawanikwa, imwe nzira inoratidzwa ine mhedzisiro yayo yekukodzera pachinzvimbo chekutsiviwa chinyararire.

Kumbira Kugadzirwa kana Kugadzirwa kwePCB yeOptical Transceiver

Tumira Highleap Electronics data razvino reGerber/ODB++ uye mafaira ekuboorera, stackup yakaburitswa, dhizaini yebhodhi, zvirevo zve laminate nemhangura, ruzivo rwemakadhi-edge/contact-plating, zvinodiwa zve controlled-impedance, uye huwandu hweprototype kana hwekugadzira. Kana imba yemodule ichiisa zvinodiwa zvakakosha, sanganisira dhizaini yemakanika yakakodzera uye saizi dzinofanirwa kusimbiswa. Taura zvinyorwa zvekuongorora, zvinodiwa zvekugamuchira uye kwaunoenda kana zvichibvira.

Kutevedzana kweRFQ Kwakagadzirira Kugadzirwa

1. Bvisa pasuru yekupedzisira yeGerber/ODB++ neNC drill, pamwe nekudzokorora dhizaini nebhodhi.
2. Ipai marongerwo ekusangana kwenhengo, manotsi ekusarudza mapuratifomu, mutsetse wekuongorora uye kushivirira ukobvu.
3. Tsvaga huwandu hwezvinhu zvakagadzirwa uye kana zviri kutumirwa zviri bhodhi risina chinhu kana kuti PCBA yakaungana.
4. Kune PCBA, sanganisira BOM yakatenderwa, data rekuisa, mapurogiramu uye chiyero chekuongorora chakabvumiranwa.

Pamabhodhi akaiswa vanhu, wedzera BOM inodzorwa nekuvandudzwa ine nhamba dzezvikamu zvemugadziri, dzimwe nzira dzakatenderwa, mafaira e centroid/pick-and-place, mifananidzo yekuunganidza, chero mafaira epurogiramu, uye maitiro ekuyedza ebhodhi anodiwa. Taura zvakajeka kana zvikamu zvinopihwa neHighleap kana kuti zvakatumirwa nemutengi, uye kana chinokumbirwa chiri PCB isina chinhu, PCBA yakaunganidzwa kana gungano repamusoro rakasiyana rakanyatsokodzera.

Highleap inogona kuongorora kugona kwekugadzira, kuona zvinhu zvisiripo kana kuti zvinodiwa pakugadzira, uye kutaura nezvebasa rakabvumiranwa rekugadzira zvinhu zvakafanana uye kugadzirwa kunoitika nguva nenguva. Tumira mafaira ako ePCB e transceiver yemaziso kuti uwane mutengo une huwandu hwaunoda uye zvinodiwa pakutumira. RFQ yakazara inotibatsira kutaura nezvekuvakwa kwebhodhi chaiko uye kudzivirira shanduko dzinodzivisika mushure mekuburitswa kwekugadzirwa.

RFQ Yakazara Inoderedza Kudzokorora uye Kubata Kwekugadzira

Mapakeji ekugadzira anonyanya kubatsira anosanganisira zvinodiwa zvemakanika, zvemagetsi uye zvekupedzisa pasi peimwe nzira yekudzokororwa. Ruzivo rwebhodhi runoratidza jometri yemhangura neyekudhirowa; stackup inosimbisa kuvakwa kwezvinhu nedielectric; dhizaini yekunze inosimbisa kukodzera; uye zvirevo zvekupedzisira zvinosimbisa mapedhi anosonerwa uye kubatana kwekupfeka. Kana chimwe cheizvi chikapesana, Highleap inogona kumutsa mubvunzo weinjiniya isati yasimbisa mazwi ekutengeserana. Huwandu hwekugadzira hunofanira kusanganisira prototype uye kuputswa kwevhoriyamu kunotarisirwa, nekuti kutenga zvinhu, kushandiswa kwepaneru uye chiyero chekuongorora zvinogona kuchinja nehukuru hweodha.

Pakukumbira kwePCBA kwakabatanidzwa, BOM inofanira kuona nhamba dzezvikamu zvemugadziri zvinotenderwa uye dzimwe nzira; mafaira ekubatanidza anofanira kutaura kurongeka kwezvikamu, zvirambidzo zvakakosha zvekusonesa, mapurogiramu uye mamiriro ekuyedza ebhodhi. Mutengo unogona kusiyanisa kugadzirwa kwebhodhi risina chinhu, zvikamu zvakatengwa, mashandiro ekubatanidza uye bvunzo dzesarudzo. Izvi zvinopa hwaro hunoshanda hwekuongorora mutengo weyuniti, maturusi uye nguva yekutungamira pasina kuvhiringidza kupihwa kwePCBA nekugadzirwa kwemodule yakazara ye optical.