Mugadziri wePCB weOptical Module we400G, 800G uye 1.6T Programs

Highleap Electronics inopa kugadzirwa kwePCB ye optical module uye kuunganidzwa kwePCB kune hardware ye optical inofambiswa nevatengi. Basa redu rekugadzira rinosanganisira maPCB akaomarara akawanda, masisitimu ezvinhu anorasikirwa zvishoma, macircuitry anodzorwa-impedance, maHDI interconnects, maficha emhangura akapfava, kubhoorwa kwakanyatsogadzirwa uye kupedzisa kwepamusoro kwakatarwa. Isu tinotsigira kuvaka kweinjiniya, maodha epilot uye kudzokorora kugadzirwa kune package yekugadzira inotenderwa pane kutengesa bhodhi re generic rinonzi rinokodzera puratifomu yega yega ye optical-module.

Kune mapurogiramu ekugadzira e400G, 800G uye 1.6T, zvinodiwa zvekumhanya zvakanyanya zvinogona kuita kuti shanduko yekugadzira iite sediki ive yakakosha mukutengeserana. Kutsiva kweLaminate, hunhu hwe copper-foil, dielectric tolerances, kuburikidza nezvivakwa uye kugadzirwa kwepamusoro-soro zvinogona kukanganisa kuvaka kwakaburitswa. Ongororo yedu yeinjiniya inoenzanisa zvinodiwa izvi nenzira yakanyorwa yekugadzira Highleap isati yasimbisa mutengo weodha, kugona kwayo uye purogiramu yekuendesa.

Vatengi vanogona kukumbira kugadzirwa kwebhodhi risina chinhu kana kuti mutengo wePCBA wakarongeka. Ipai mafaira ekugadzira akaburitswa, purogiramu yezvinhu uye purogiramu yekuunganidza, zvinodiwa zvechiratidzo nekuongorora, huwandu hunotarisirwa uye chero mafaira ekuunganidza kuitira kuti mutengo uratidze PCB chaiyo ye optical-module.

Kugadzirwa kwePCB yeOptical Module yeMapuratifomu eHardware Akawanda

Highleap inopa maPCB akagadzirwa ezvigadzirwa zve optical-module zvinoshandiswa mu data-center, fiber-network uye telecom. Basa redu rekugadzira harina kusungirirwa kune imwe chete transceiver housing kana marketing data-rate label: mabhodhi maviri anotsanangurwa se "800G module PCBs" anogona kushandisa akasiyana emagetsi ekugadzira nzira, zvikamu zvemapakeji, mabhodhi ekugadzira uye maitiro ekugadzira. Dhirowa rebhodhi rinoburitswa rinosarudza zvatinogadzira.

Kune mapurogiramu eOEM module, tinogona kutsigira kutevedzana kwemasampuli ekugadzira, kuvakwa kwezvitupa uye kudzokorora mapoinzi. Pakutanga, basa rekugadzira rinowanzo tarisa pakusimbisa kuwanikwa kwelaminate, kugona kwekuunganidza zvinhu uye kubatana kwehuwandu hwakawanda. Mushure mekuomesa dhizaini, kusimbiswa kunoenda pakubata zvinhu zvakatenderwa, geometry ye impedance, ukobvu hwebhodhi, kupera, goho uye kutevedza zvinoenderana nemirairo yekugadzira.

Aya mapurojekiti akasiyana, kwete mabikirwo ezvinhu zvisingachinjiki. Hatiti zvigadzirwa zvese zve400G zvinoshandisa laminate imwe chete kana kuti label ye1.6T inongotungamira otomatiki marongerwo e microvia imwe chete. Kune zvinodiwa zvekugadzirwa kwezvigadzirwa, Highleap inochengetedzawo ruzivo rwakasiyana pa800G optical module PCBs uye 1.6T optical module PCBs.

Zvirongwa zvePuratifomu Zvine Miganhu Yakasiyana Yekufanirwa

Highleap inopa maPCB e optical-module kune zvinodiwa nevatengi zvezvigadzirwa zvemapurogiramu emodule anomhanyisa, anosanganisira 400G, 800G uye 1.6T. Kurongeka uku kunodzorwa nekuvandudzwa kwepuratifomu chaiyo: kuverengwa kwemigwagwa chete hakuratidzi kuti ndeipi laminate, ukobvu hwePCB, chimiro chekubuda kwepakeji kana magwaro ekuyedza anodiwa. Imwe purogiramu inogona kusimbisa nzira dzinogadzirwa dzisina kurasikirwa zvakanyanya pabhodhi remazuva ano re multilayer; imwe inogona kusanganisa zvishandiso zvekugadzirisa masaini e fine-pitch, HDI yakatevedzana nezvinhu zvakasanganiswa. Tinotora chivakwa chekugadzira chakatenderwa, kwete "standard 800G stackup" inofungidzirwa.

Zvivakwa zvekuvandudza, kuwedzerwa kwemapuratifomu uye mapurogiramu ekugadzira anodzokororwawo zvakasiyana mukutengeserana. Purojekiti itsva ingangoda kuongororwa kwezvivakwa zvakawanda zve laminate, nepo chigadzirwa chakaburitswa chingarambidza kutsiva izvo zvingaita kuti channel characterization isashande. Kana module platform iri kuchinja kubva kune prototype supplier kuenda kune kudzokorora kugadzirwa, Highleap inoongorora magiredhi ezvinhu akatenderwa, nzira dzema coupon uye manotsi ekugadzira isati yaisa mutengo wekutamiswa. Kuwanikwa kweCCL grade inotsiva hakuiti kuti giredhi iroro rigamuchirwe neOEM.

Kune mabhodhi emodule akagadzirwa nekanika uye anobatana, sevhisi yedu yePCB inofukidza zvinodiwa zvakasiyana zve "host-edge" uye "enclosure-fit".

Kubatanidza Zvinodiwa paPuratifomu nePCB Deliverys

Tinoparadzanisa mvumo ye laminate/stackup, kugadzira mapuranga asina chinhu uye kuunganidza mapuranga. Kune mapurojekiti ane bhajeti remagetsi rakamanikana, mutengo wekugadzira unogona kuratidza kuvakwa kwe dielectric kwakakumbirwa uye makuponi ekuyedza ekugadzira akabvumiranwa, asi haugone kuvimbisa nzira yemagetsi yemodule yakapedzwa. Kana purojekiti ichidawo kubatanidzwa kweSMT, mutengi anotumira BOM yekubatanidza, zvirevo zvepakeji uye maitiro ekuyedza kuitira kuti mabasa iwayo agone kutaurwa zvakasiyana. Musiyano uyu unotsigira chibvumirano chekugadzira chakavimbika uku uchichengetedza chiyero chakabatana neizvo fekitori inogona kusimbisa.

Zvinhu zvePCB Zvinorasikirwa Nemutengo Wakaderera, Kudzora Kuunganidzwa Kwezvinhu Zvakafanana uye Kugadzira Nzira dzeSignali

Highleap inogadzira maPCB e optical module achipesana nezvinhu zvakaburitswa uye kugadzirwa kwemagetsi, pane kupa "laminate" imwe chete yakajairika kumapurojekiti ese e400G, 800G kana 1.6T. Mukugadzirwa kwemamodule ane kumhanya kukuru, mashandiro esignal-path anogona kutsamira pakusanganiswa kwezvimiro zve dielectric, copper surface profile, trace geometry, reference planes, plated transitions uye manufacturing tolerances. Chimwe nechimwe chezvinhu izvi chinofanira kuramba chichiteverwa kune stackup inotenderwa nemutengi.

Dambudziko rekugadzira harisi kungotenga laminate ine zita. Giredhi rakatarwa rinofanira kuwanikwa mumisanganiswa inoshanda yepakati neyakagadzirwa kana yebondply, uye chero chivakwa chemusanganiswa wezvinhu chinofanira kuongororwa kuti chienderane zvakanyanya, ukobvu uye kugadzikana kwehukuru. Chinhu chinotsiva chakafanana chingasaburitsa nzvimbo imwechete ye dielectric kana maitiro ekupinza-kurasikirwa. Kuenzana kwemutengesi uye kutsiva zvinhu saka sarudzo dzeinjiniya, kwete shanduko dzenguva dzose dzekutenga.

Zvinhu Zvinokosha uye Kudzora Kuunganidzwa Kwezvinhu Zvakafanana Pakugadzira PCB yeOptical Module

• Matanho e laminate ne bonding akaburitswa: Sarudza mamakisi chaiwo echinhu, hunhu hwe dielectric hwakakodzera, resin/bonding system, ukobvu uye dzimwe nzira dzinobvumidzwa. Highleap inogona kuongorora kuwanikwa kwekutenga uye misanganiswa ye lamination yakakurudzirwa yekuvaka kwakatenderwa. Kana mutengi atosimbisa chiteshi kana seti yezvinhu, chinotsiva chinotumirwa kuti chibvumidzwe pane kuunzwa chinyararire panguva yekushaikwa kwechinhu.

• Hunhu hwefoiri yemhangura uye geometry yemuchina wekufambisa: Hunhu hwefoiri yemhangura, ukobvu hwefoiri yehwaro, hunhu hwekupedzisira hwefoiri yemhangura uye kucheneswa kwesimbi zvinogona kukanganisa kuderedzwa kwechiratidzo uye impedance yakawanikwa. Dhirowa rinokumbira foiri yakaderera kana huremu hwemhangura rinofanira kuratidza zvikamu zvinodzorwa. Kugadziriswa kwemaitiro kwakanangana nekugadzirwa kunofanirwa kuongororwa zvichienderana nezvinodiwa zvekurasikirwa uye impedance zvakatsanangurwa, kunyanya kune nzira dzinonzwa.

• Kuenzana kwepakati, prepreg uye layer: Purogiramu yelayer inofanira kuenzana nekuparadzaniswa kwe dielectric, kugoverwa kwemhangura, ukobvu hwese uye nzira chaiyo ye lamination. Dhirowa yakaita seyakaenzana haivimbise otomatiki kugadzirwa kana mhuri dzakasiyana dze dielectric dzikasanganiswa. Pamberi pekuburitswa kwepaneru, chivakwa chinofanira kunge chakatsanangurwa zvinhu zvekudzvanya uye zvinangwa zvekudzora ukobvu zvakakodzera kugadzirwa kakawanda.

• Geometry yeImpedance uye kuenderera mberi kwereferensi: Zvinangwa zveImpedance zvine magumo maviri uye zvakasiyana zvinofanirwa kubatanidzwa kune zvikamu zvakakodzera uye hunyanzvi hwakatenderwa. Kuchinja kuhupamhi hwemutsetse, ukobvu hwedielectric kana geometry yereferensi kunogona kuchinja mhedzisiro yemagetsi. Fekitori inogona kupa muripo kana kugadziriswa kwakaongororwa, asi muridzi wedhizaini yemagetsi anofanira kubvumidza shanduko kumanet anodzora uye chero magadzirirwo ecoupon ane chekuita nazvo.

• Zvinyorwa zvezvinhu uye manejimendi ekuchinja maroja: Pamaodha akadzokororwa, purogiramu yezvinhu uye zvinotsiviwa zvinotenderwa zvinofanirwa kuchengetedzwa nekuvandudzwa kwebhodhi. Kuzivikanwa kweroja uye mamwe marekodhi ekutevera anopiwa kana zvichidikanwa nezvinodiwa nekutenga. Kuronga patsva nhamba imwechete yezvikamu nesystem yakasiyana ye dielectric kunogona kuda kugadziriswa kwemagetsi uye hakufanirwe kutorwa senzira yekurongedza patsva.

• Kuongororwa kwemagetsi: Makuponi anodzorwa-anopindira, kuzivikanwa kwezvinhu uye zviyero zvine chekuita nekurasikirwa zvinogadzirisa mibvunzo yakasiyana yekugamuchira. Kupasa kuponi ye-impedance hakuratidzi kurasikirwa kwekuisa kwemodule yakaunganidzwa, uye bvunzo dzisina bhodhi hadziratidze simba re optical kana BER. Kana mamwe makuponi ekuyera, mishumo kana miganhu zvichidikanwa, geometry yavo, nzira, sampling uye mitengo zvinobvumiranwa vasati vagadzira.

Chengetedza Chinhu Chimwe Chekutanga Kubva paPrototype kusvika paKugadzirwa kweVolume

Sevhisi yekugadzira PCB yeHighleap isingadhuri zvakanyanya inopa mamiriro akakodzera ekuvaka bhodhi risina chinhu. Pachirongwa chemodule chinomhanya zvakanyanya, kuburitswa kunofanirwa kubatanidza zvinyorwa zvezvinhu, kugadzirisa stackup, chirongwa che impedance uye humbowo hwekuongorora hunodiwa. Izvi zvinoita kuti kutamiswa kwesource gare gare, shanduko dzezvinodiwa uye zvisarudzo zvisina kuenderana zvive nyore kufungidzira pasina kukumbira bhajeti relink rakavimbiswa kubva kuzita re laminate chete.

HDI, Microvias, Fine-Line Processing uye Component Interface Features

Mabhodhi eOptical module anowanzo sanganisa mapakeji ane nhamba yakakura, zvikamu zvesimba rakawanda uye shanduko dzinodzora dzinomhanya zvakanyanya mukati mechikamu chidiki chemakanika. Highleap inoongorora ma microvia maps, mapatani epasi, geometry yemhangura uye kunyoreswa kwelayer-to-layer vasati vasimbisa nzira yekugadzira HDI. Mamwe mapurojekiti anoda kubatana kwakacherwa nelaser uye kuvakwa kwakatevedzana; mamwe anogona kugadzirwa uchishandisa maburi akajairwa. Dhizaini chaiyo, kwete label ye transmission-rate, ndiyo inosarudza kuti ndeipi nzira inodiwa.

Ongororo yekubudirira kwekugadzira inoongororawo kudyidzana kuri nyore kupotsa mumatafura akasiyana ehunyanzvi. Mifananidzo yemitsetse midiki, madhiri madiki, mhangura yemuno ine simba uye zvivakwa zvakazadzwa kuburikidza nepad zvinogona kuitika zvega asi zvinogadzira hwindo rakamanikana remaitiro akabatanidzwa. Kugadzikana kwezvinhu, chiyero chekuboorera, ukobvu hweplating, geometry yepad uye goho rinotarisirwa zvinofanirwa kufungwa pamwe chete usati watenga odha uye waronga.

Mashandiro Ekugadzira HDI Yakakosha uye Kuwanda Kwevanhu Vane Huremu Hwakawanda

• Kugadzira mapping yekubatanidza neLaser-via uye layer-connection: Microvia yega yega isina kujeka kana kuti built connection inoda start layer yakajeka, stop layer, target land geometry uye danho rekukanda rakagadzirirwa. Stack diagrams neNC drill data zvinofanira kuenderana. Sequential build-up inogona kuwedzera ma imaging, lamination, drilling uye plating stages, saka chikumbiro chinotsanangurwa se "8-layer HDI" hachina kutsanangurwa zvakakwana kuti chive nemutengo wakatarwa kana nguva yekutungamirira.

• Zvivakwa zve microvia zvakakamurwa kana zvichienzaniswa ne staggered microvia: Magadzirirwo akatenderwa anokanganisa kurongeka, kuzadza, kuputira uye qualification. Zvivakwa zvakakamurwa zvinogona kuva nepfungwa dzakasiyana dzekuvimbika kubva kuzvivakwa zvakakamurwa, kunyanya pasi pekupisa. Highleap inoongorora musanganiswa wakarongwa uchienzaniswa nehurongwa hwezvinhu uye chiyero chekuongorora chakabvumiranwa; kushandura chimwe chivakwa kuita chimwe kuchinja kwedhizaini kunoda mvumo.

• Kubuda kweBGA uye mutsetse/nzvimbo diki: Pasi peDSP yakakora kana imwe pitch package, upamhi hweconductor, clearance, annular ring uye via placement zvese zvinofanirwa kuenderana nePCB land pattern chaiyo. Mutemo we2/2 mil unowanikwa nehunyanzvi unogona kuwedzera maekisheni emifananidzo uye etching uye haufanirwe kushandiswa panzira dzisina kukosha pasina chikonzero. Dzimwe nzira dzeinjiniya dzinofanira kuchengetedza zvinodiwa zvemagetsi zvakaburitswa.

• Saizi yekuboorera, chiyero cheaspect uye nzvimbo yemukati: Chishandiso chemuchina che 0.20 mm hachina kuenzana negomba rakapedzwa re 0.20 mm. Ukobvu hwebhodhi, kuputira, huwandu hwemaburi uye nzvimbo shoma yemhangura inokanganisa kugadzirwa uye kufambisa. Munzvimbo dzisina vanhu vakawanda, bhora guru rinogona kuvandudza mhedzisiro, asi chete kana geometry yepad, zvinodiwa negomba rakaputirwa uye nzira yemutengi zvichibvumira shanduko.

• Kuzadza nepadhi, kurongedza uye chivharo chemhangura: Buri rakavhurika riri pasi pepadhi rinogocherwa zvakanaka rinogona kukonzera kupwanywa kwepadhi; kuvharwa kwepadhi kana kuvharwa kwepadhi hakungoiti kuti padhi rakati sandara, rakavharirwa nemhangura. Kana dhizaini yacho ichida mavhaira akazadzwa uye akavharirwa, maitiro acho anosanganisira kugadzirira kwakawedzerwa, kuzadza, kugadzika, kuenzana, kuumbwa kwesimbi uye kuongororwa kwakakodzera. Tsanangudzo yekurapa nepadhi inopihwa mumagwaro ekugadzira nekugadzira.

• Humbowo hwekudzora nekuburitsa zvinhu: Inner-layer AOI, microsectioning pazvakatarwa, certification yeplating, electrical continuity/isolation testing uye impedance measurements zvinoshanda zvakasiyana. E-test inopasa haigone kuratidza cap planarity, plated-barrel integrity kana kurasikirwa kwayo yoga. Chero chirongwa chekuongorora chakakosha chinobvumiranwa maererano nenjodzi chaiyo yekukundikana uye zvinodiwa nevatengi vasati vatumira.

Chengetedza Kuomarara kweHDI Munzira Yemaitiro Yakatenderwa

Highleap's HDI PCB manufacturing scope inosanganisira maprocessing options akafanana. Kune PCB ye optical module yekugadzira, zvinodiwa zvemap, stackup, pad finish uye assembly zvinofanirwa kuramba zvakaenderana. Chinodiwa chekunonoka cheBGA vias dzakazadzwa ne resin chinogona kuchinja mutengo wekugadzira uye zuva rekutumira, saka maficha iwayo anofanira kusimbiswa odha yekutenga isati yagamuchirwa.

Optical Module PCB Dimensions, Surface Finish uye Mechanical Integration

Bhodhi rinozadzisa zvinodiwa zvaro zve stackup rinofanirawo kusangana nemamiriro ekugadzira emodule. Highleap inogadzira zvinoenderana nehurongwa hwakapihwa, ukobvu uye zvinodiwa zvenzvimbo, kusanganisira makadhi-edge kana bhodhi-ku-bhodhi pazvakatsanangurwa. Izvi zvinova zvakakosha zvikuru kana bhodhi richifanirwa kuenderana ne compact housing, connector datum, thermal interface uye high-density component placement.

Kana nzvimbo yemagetsi inoshandisa mupendero wekubatanidza wakapetwa, mufananidzo unofanirwa kuratidza kupera kwekubatana kwakasarudzwa, ukobvu uye jiometri. Makontena ekubatanidza egoridhe rakaoma uye mapedhi ekutengesa eENIG akasiyana maitiro ekugadzira uye anogona kuda matanho akasiyana ekugadzira. Mutengo wacho unofanirwa kufukidza musanganiswa chaiwo wekupera, kwete kutora nzira imwe chete yegoridhe. Mapedhi ezvikamu zveFine-pitch anogona zvakare kumanikidza zvakanyanya kuburikidza nekurapa, zvinodiwa pakuvhura mask kana kupedzwa kwenzvimbo yakatsetseka zvinokanganisa kugadzirwa uye kugamuchirwa kwekubatanidzwa.

Zvinhu zvinopisa zvinofanira kushandurwa kuita zvinhu zvinogadzirwa: kugoverwa kwemhangura, ma "thermal-via arrays", ukobvu hwebhodhi hunobvumirwa, nzvimbo dzekubatana dzemuno uye nzvimbo dzinobviswa michina. Mutengesi haagone kusimbisa mashandiro ekutonhodza kwe "optical module" yese kubva padhirowa rekugadzira PCB chete. Asi Highleap inogona kugadzira zvinhu zvakatarwa zvePCB uye kuzviisa pamwe chete nedhirowa rekuunganidza rakatenderwa uko masevhisi ese ari maviri anorairwa.

Kana imba ikaganhurira ukobvu hwemucheto, uta nekushanduka, kana kuti coplanarity yemunzvimbo, zviyero izvozvo zvinofanirwa kutaurwa pachena. Kushivirirana kwePCB kwakajairika hakufanire kufukidza imwe optical-module interface. Nzira yekuyera inodiwa, frequency yekuongorora uye mishumo zvinofanirwa kubvumirana sechikamu chekugamuchirwa kwekugadzirwa, kudzivirira gakava mushure mekunge mayuniti aunganidzwa kuita dzimba.

Kukwana Kwepakeji Yakamanikana uye Kugadziriswa Kwekubata

MaPCB e-optical-module anomhanya zvikuru anogona kunge aine zvirambidzo zvakasimba zvepakeji-ku-bhodhi, zvinosanganisira kubatana kwakanaka, zvikamu zvitete, kuchengetedza kubatanidzwa kwakamanikana kana kuti bhodhi rakatsetseka rinodzorwa. Highleap inoongorora dhizaini chaiyo yemechanical datum, kwete chete zvidimbu zvakapedzwa. Kubatana kwemativi akaomarara akafukidzwa negoridhe, kana zvatsanangurwa, zvinoda tsananguro yakasiyana yemaitiro kubva kuENIG pama solder pads. Nzvimbo yavo yekuputira, ukobvu, bevel yemucheto uye zvinodiwa pakuyera zvinofanirwa kuiswa muRFQ yekutanga.

Ukobvu hwakapedzwa uye bow/twist zvinoongororwa nerutsigiro rwekuungana. PCB inogona kugutsa stackup yayo yezita asi ichiri nedambudziko renzvimbo yakawandisa yepakiti diki kana module enclosure. Kana mutengi akaona zvikamu zvakakosha kana maficha ekubatanidza, hurongwa hwekugamuchira kugadzirwa hunogona kutarisa kuyera pahukuru ihwohwo, nenzira yekubvunzurudzwa yakabvumiranwa pane kutarisa chitarisiko chakajairika.

Zvinhu Zvinopisa Zvichienzaniswa Nekushanda Kwemagetsi

Kudira mhangura uye nzvimbo dzinopisa zvinogona kubatsira kutamisa kupisa kubva kumidziyo inoshanda, asi zvinobatana nematanho ekutarisa anomhanya uye mapakeji ekubuda. Kana dhizaini yemutengi yakaburitswa ichida mari dzemhangura, huremu hwemhangura hwakasanganiswa kana kucheka kusingawanzoitiki, maitiro iwayo akakosha anofanirwa kuongororwa kuti aonekwe kuti anogona kugadzirwa sei uye kutaurwa zvakasiyana. Highleap inogona kuongorora kana chivakwa chakadaro chinoenderana ne substrate yakasarudzwa uye stackup, asi chinhu chekupisa hachisanganiswi otomatiki nekuti purojekiti yacho inonzi optical module PCB.

Kusimbiswa Kwekugadzirwa uye Hunhu Hwekugadzirwa Kudzokorora

Kune mabhodhi e optical-module, mhando inotsanangurwa nezvinodiwa pakugadzirwa—kwete nenhamba yemiedzo yakanyorwa mutsananguro yekushambadzira. Nzira yekugadzira yeHighleap inogona kusanganisira kuongorora kwemukati, AOI, kutarisa kwehutete hwemaburi akaputirwa, kuyedzwa kwemagetsi kwebhodhi rakapedzwa uye kuyerwa kwakatsanangurwa nevatengi. Kana zvichidikanwa, makuponi e impedance, zvikamu zvidiki, zvinyorwa zvezvinhu kana mishumo yehukuru hwakakosha inogadzirwa zvichienderana nehurongwa hwekuongorora hwakabvumiranwa.

Chivakwa chekutanga kana chequalification chinofanira kusimbisa musanganiswa wakatenderwa we laminate, foil, stackup, plating, via processing, solder mask, surface finish uye board outline. Kana purogiramu yemutengi yaburitswa, shanduko dzekugadzira dzinofanira kuongororwa kuti dziwanikwe here. Kuchinja giredhi re laminate, foil profile, bonding sequence kana copper thickness pasina mvumo kunogona kuita kuti fungidziro dziri shure kwemhedzisiro yemagetsi yaimbogamuchirwa dzisashande.

Highleap inoshanda kubva pakugadziriswa kwemafaira akarongwa uye zvinyorwa zvekugadzira zvakabvumiranwa zvemaodha anodzokororwa. Tinogona kukurukura nezvekuchengetwa kwezvinhu, huwandu hwakawanda hwekuburitswa, hurongwa hwekufanotaura uye kurongedza kwekutumira sechikamu chechirongwa chebhizinesi. Kune zvinhu zvehunyanzvi zvinorasikirwa zvishoma, kuonekwa kwekutanga kwezvinodiwa kunobatsira nekuti kutenga zvinhu uye kufanirwa kwezvigadzirwa zvinogona kunge zviri zvipingamupinyi zvakakura kupfuura nguva yekuchera PCB kana yekuchera.

Kana PCBA yabatanidzwa, hurongwa hwekugamuchira kugadzirwa hunofanira kuparadzanisa kusimbiswa kwekugadzirwa kwebhodhi risina chinhu kubva pakugadzirwa kweSMT uye chero bvunzo dzemagetsi dzekuwedzera. Basa redu rekubatanidza PCB re transceiver re optical rinogona kutaurwa nezvemabhodhi ane vanhu vakasarudzwa nevatengi. Kurongeka kwemodule yakazara ye optical, kuyerwa kwe optical uye BER qualification zvinodiwa zvakasiyana zvepurojekiti, kwete kungoti PCB inoshandiswa mu optical module.

Kubva Pakubvumidzwa Kwenyaya Yekutanga Kuenda Pakudzokororwa KwemaLots

Kubvumidzwa kweprototype kunoratidza kuti musanganiswa wezvinhu, mhangura, chibooreso, kunyoresa uye maitiro ekupedzisa zvinogona kusangana nedhirowa remutengi. Zvichienderana nepurogiramu yakatarwa, package yekuongorora yeHighleap inogona kusanganisira inner-layer AOI, bvunzo yekupedzisira yemagetsi, kuongororwa kwemativi, kuyerwa kwechikamu uye mhedzisiro ye impedance coupon. Nzira, saizi yemuenzaniso uye zvinodiwa zvekugamuchira zvinofanirwa kubvumirana mupakeji yekutenga. Humbowo hwebhodhi risina chinhu hahusi hwega hunosimbisa dhayagiramu yeziso re optical module yakazadzwa, chiyero che bit-error kana simba re optical.

Pakuvakazve, stackup yakatenderwa uye kugadziriswa kunoramba kuri chinhu chinotarisirwa. Kana foil yemhangura, laminate kana prepreg zvikasawanikwa, chinotsiviwa chinosimudzwa kuti chiongororwe chisati chabatanidzwa. Shanduko dzinochinja nzira kana package interface hadzifanirwe kuvanzwa mukati mezvinyorwa zvekutenga. Kuzivikanwa kwenzvimbo, kuteverwa kwezvinhu uye magwaro ekutumira zvinogona kutariswa zvichienderana nechirongwa chemhando yeOEM; bhodhi rega rega haridi mishumo yakafanana, saka Highleap inotaura humbowo chaihwo hwakumbirwa.

Zvinochinja-chinja zvemutengo nenguva yekugadzirwa zvinokanganisa kuenderera mberi kwekugadzirwa

PCB yemodhi inokurumidza zvikuru ingada kubhukishwa kwekutanga kwezvinhu zvakatarwa zvisingarasikirwe zvakanyanya. Saka mitengo yekugadzira inofanira kusiyanisa nguva yekutangira yezvinhu kubva panguva yekugadzirisa chigadzirwa. Kuunganidzwa kwakarongeka, kucherwa kwemuchina, kuzara kwe microvia uye kurongedza zvinhu zvakasiyana-siyana zvinogona kuunza matanho asingamanikidzwe zvakanangana nehurongwa hwekumhanya. Kune chigadzirwa chinotarisirwa kufanotaura, kubvumirana pamusoro pehuwandu hwezvinhu uye zvimwe zvinhu zvinobvumidzwa zvinobatsira kudzikamisa kuwanikwa kwechinhu pasina kushayisa simba zvinodiwa nemutengi.

Kumbira Mutengo weKugadzira PCB weCustom Optical Module

Kuti uwane mutengo wekugadzira, ipa mafaira azvino eGerber X2, ODB++ kana akaenzana, data rekuboorera reNC, layer stackup uye purogiramu yezvinhu, ukobvu hwakapedzwa, huremu hwemhangura, special kuburikidza nemanotsi uye controlled-impedance table. Isa mufananidzo wemodule kana carrier outline une critical dimension uye surface-finish zvinodiwa. Kana imwe laminate, foil kana bonding system ichidikanwa, ione negiredhi uye taura mitemo yekutsiva.

Kutevedzana kweRFQ Kwakagadzirira Kugadzirwa

1. Bvisa purogiramu ye laminate ne dielectric yakatenderwa, copper profile uye zvinodiwa zve impedance.
2. Mamepu ekuisa ma layer vias, ma filled pads, backdrilling nezvimwe zvinhu zvakakosha zvinobatanidzwa.
3. Tsanangura mishumo yekugamuchirwa kwezvigadzirwa, kutora sampuli uye kudiwa kwekuedza kusvika pahuwandu hwezvigadzirwa.
4. Tumira chero zvimwe zvinotsiva kuti zvikwanise kutsanangurwa pane kuzvitora sezvinongotsiva otomatiki.

Kuti muenzanise mitengo uye muronge purogiramu, taurai huwandu hwemuenzaniso, huwandu hwemuongorori, huwandu hunofungidzirwa hunodzokororwa, humbowo hwekuongorora hunodiwa, mamiriro ekugadzirisa uye zuva rekutumira rakananga. Ratidzai mashandiro asina kurongeka akadai sekuunganidza zvakatevedzana, mavias akazadzwa neresin uye akavharirwa, kuputira kwakasarudzwa, nzvimbo dzakakosha, backdrilling uye dimensional tolerances. Kana odha yacho iine PCBA, wedzerai BOM, data rekuisa, kudhirowa kwekuunganidza, mabasa ekutsvaga uye kufukidza bvunzo kwakatenderwa.

Highleap Electronics inogona kuongorora pasuru yakazara yekugadzira, kuona mibvunzo yemaitiro kana yezvinhu, uye kupa mutengo wakavakirwa pabhodhi risina chinhu rakabvumiranwa kana kuti bhodhi rakaunganidzwa. Kumbira kugadzirwa kwePCB ye optical module uye mitengo yekubatanidza pamwe chete nezvinodiwa neprojekiti yako. Mutengo unobuda wakabatana nenzira chaiyo yekugadzira uye zvinounzwa, pane mutengo wakajairika wakabatana nechiratidzo chemutengo wedata.

Quote Against a Controlled Platform Revision

Kubvunzurudzwa kwekugadzirwa kunofanirwa kusanganisira rudzi rwezvinhu uye giredhi chaiyo apo pakagadzirwa, kuunganidzwa uye ukobvu hwakapedzwa, zvinodiwa nemhangura ne dielectric, zvirevo zve channel/impedance, mepu yekubatanidza, uye zvese zvinoboorwa, kuzadza, kuvhara uye zvinyorwa zve backdrill. Ruzivo rwemakanika senge miganhu yekubatana negoridhe, nzvimbo dzekuisa, kuchengetedza uye zviyero zvakakosha zvakapedzwa zvinofanirwa kusungirirwa kune imwe PCB revision. Kana kuponi yekuyedza kana mushumo wekutevedzera zvinodiwa, sanganisira nzira uye muganho wekugamuchirwa pane chikumbiro chakajairika che "high-speed testing."

Kana Highleap ichizopa mabhodhi akaunganidzwa, ipai BOM yakaburitswa uye dzimwe nzira dzakatenderwa, mafaira ekubatanidza, zvinodiwa pakubata zvikamu uye ongororo yepamusoro yebhodhi. Chirevo chekupedzisira chinogona kuratidza mhando dzakasiyana dzekugadzira, zvikamu, kuunganidza uye muripo wekuongorora. Kune mapurogiramu e400G, 800G ne1.6T ane shanduko dzakawanda, isa RFQ yega yega nechirongwa chaicho uye dhizaini yekuvandudza kuitira kuti fungidziro uye zvinyorwa zvekugadzira zvirambe zvakafanana.