Basa rekugadzira nekugadzira PCB re1.6T Optical Module

PCB ye1.6T optical module inofanira kutakura nzira dzemagetsi dzinomhanya-mhanya dzechizvarwa chinotevera mumodule yakamanikana zvakanyanya. OSFP inogona kutsigira 1.6 Tb/s nenzira sere dzemagetsi dze200G-class, nepo OSFP-XD inogona kusvika 1.6 Tb/s ichishandisa nzira gumi nenhanhatu dze100G-class. Magadzirirwo chaiwo anosarudza zvinodiwa nePCB, chinongedzo, chiteshi uye kupisa.

Highleap Electronics inogadzira uye inounganidza PCB. Hatigadzire laminate, mainjini e optical, lasers, DSPs kana connectors. Isu tinogadzira zvinhu zvakasimbiswa uye zvikamu zvakatenderwa kuita PCBA yemodule yakapedzwa.

Highleap inogona kugadzira PCB ye1.6T optical module here? Ehe, zvichienderana neongororo ye224G-class channel, package escape, connector geometry, low-loss stackup, HDI, thermal design, assembly tooling uye zvinodiwa pakuedza.

1.6T Module Architectures uye PCB Impact

Nzira dzekirasi ye8 × 200G

Nzira dzemagetsi shoma asi bandwidth yakakwira kwazvo panzira imwe neimwe, zvichiwedzera kurasikirwa uye kunzwa kwekuburitswa kwemagetsi.

Nzira dzekirasi ye16 × 100G

Kuwedzera kwehuwandu hwenzira dzekufambisa mashoko, manejimendi yekutaurirana kwepakombiyuta uye mapini ekubatanidza ari mumodule.

Optics dzakadzoserwa nguva

Zvikamu zveDSP kana retimer zvinowedzera simba, kupisa uye kubuda kweBGA kwakawanda.

Magirazi emutsetse

Kuderedza nguva yemagetsi kunogona kuderedza simba asi kunoisa zvinodiwa zvakanyanya pamagetsi emagetsi kubva kumagumo kusvika kumagumo.

Basa reOIF re224G riripo parizvino rinotarisa mashandisirwo emagetsi echizvarwa chinotevera anogona kubhurwa uye anogona kubhurwa. PCB inofanira kuburitswa ichipesana neinterface inoshanda uye magwaro eform-factor, kwete label ye1.6T.

Mhedzisiro inoshanda chisarudzo chakajeka chekusaenda/kusaenda: shandisa mhinduro yakakumbirwa kana zvinodiwa pakuita kana kutevedzera zvinodiwa; sarudza chivakwa chakareruka chakatenderwa kana chisingade. Kutonga ikoko kunoitwa kubva pabhodhi nedata rechigadzirwa, kwete kubva pakufungidzira kuti zvirevo zvepamusoro-soro zvinogara zvichigadzira PCB yakanakisa.

Module ye1.6T haifanirwe kuburitswa kubva pahuwandu hwebandwidth chete. Kuwanda kwenzira dzemagetsi uye mwero wepanzira yega yega zvinosarudza pinout yekubatanidza, DSP escape, huwandu hwema layer pairs ekumhanya kwepamusoro uye kurasikirwa kwekuchinja kunobvumidzwa. Dhizaini yakavakirwa panzira dzakawanda padanho remumugwagwa wakaderera inogona kugadzira zvirambidzo zvakasiyana zve routing uye power-distribution kubva padhizaini yakavakirwa panzira shoma, dzinokurumidza. Saka Highleap inoongorora magadzirirwo chaiwo ari mumafaira isati yasimbisa stackup kana HDI route.

Matambudziko ePCB ePrimary 1.6T Optical Module

• Kurasikirwa kwechiteshi che224G-class: dielectric, copper, connector uye via loss zvese zvinova zvakakosha.
• Kusaenderera mberi kwekushandisa: Kuchinja kwepakeji neconnector kunoda ongororo ye3D field uye kutonga kwakasimba kwekugadzira.
• Kubuda kweHDI kwakasimba: ma microvia geometry, ma capture pads uye ma reference transitions zvinofanira kuva zvakavimbika.
• Kuwanda kwekupisa: mamodule epamusoro anogona kudzima simba guru muchikamu chidiki.
• Warpage uye coplanarity: kukanganisa BGA soldering, optical alignment uye mechanical fit.
• Kuedza kupinda: Kugadzira zvinhu zvinomhanya zvakanyanya kunoda makuponi akarongwa, magadzirirwo azvo uye mapurani ekutarisa.

Chinangwa chechikamu ichi ndechekutaura nezvehunyanzvi uye zvekutengeserana: tsanangura kuti sei nyaya yacho ichikosha, ratidza kuti Highleap inoidzora sei, uye ipa mutengi nzira iri nyore yekutanga ongororo nemafaira aripo kare.

Nyaya iyi inobatsira kana ikashandiswa kuita sarudzo yekugadzira. Highleap inotarisa huwandu hwekupisa hwakatenderedza DSP neinjini ye optical, nzira dzemagetsi dze 200G, ma interconnect mapfupi asi asingachinjiki uye HDI escape uye via-in-pad structures, yobva yanyora mhedzisiro yakabvumiranwa mu stackup, process route uye inspection plan. Kutenga kunowana mhinduro yakajeka uye quotation pane tsananguro yedzidziso chete.

Dambudziko riripo nderekudyidzana pakati pezvirambidzo. Kuderedza kureba kwetrace kunogona kumanikidza kuti package ibude zvakasimba; kuwedzera mhangura yekupa simba kunogona kukanganisa impedance kana kuwedzera warpage; kuendesa kupisa kure neDSP kunogona kupesana nekuisa optical-injini. Iyi haisi mibvunzo yakasiyana yekugadzira. Mainjiniya wedu akapihwa basa anoronga wongororo dze high-speed, HDI, thermal uye assembly kuitira kuti imwe shanduko isagadzire imwe disable imwe nzvimbo mumodule.

Zvinodiwa zvekushandisa zvinhu, mhangura negirazi zvisinganyanyi kurasikirwa

Kusarudzwa kwezvinhu kunofanirwa kuenderana nehurongwa hwenzira dze224G kana 112G. Masisitimu ethermoset ane kurasikirwa kwakanyanya , mhangura isina kusimba, girazi reDk shoma uye resin inodzorwa zvinogona kudiwa. Chivako chakasarudzwa chinofanira kutengwa uye kudzokororwa mukugadzirwa.

Padanho iri redata, kukora kwemhangura uye mhedzisiro yekuruka hazvigone kutorwa sezvinhu zvechipiri. Highleap inosimbisa foil, girazi uye fungidziro ye stackup nemutengi CAM isati yaburitswa.

Kukosha kwedata remagetsi hakukwani kana bvunzo dzemagetsi dzisingakwanise kuona warpage yakatenderedza mapakeji epitch kana zvikanganiso zve assembly pasi pe via-in-pad BGAs. Ongororo yacho inofanira kushandisa core chaiyo kana prepreg, copper profile, finished thickness uye via route. Apa ndipo panodzivirira mutengi kubva kune mumwe nemumwe kuti akwanise kududzira magwaro akawanda emutengesi ari ega.

Kubuda kweongororo kunofanirwa kunge kuri muunganidzwa unogona kugadzirwa uye runyorwa rupfupi rwezvinhu zvinodzorwa. Highleap inonyora hunhu hwezvinhu zvakabvumiranwa, geometry, nzira yemaitiro uye hwaro hwekuongorora, yobva yabatanidza zvimwe zvese mukati meCAM, kugadzirwa, mhando uye kubatanidzwa.

1.6T Module Stackup uye HDI Design

Kudzokorora ndiyo bvunzo huru yekugadzira. Muenzaniso unogona kushanda kunyangwe kana hwindo rekugadzirisa rakawanda, asi kugadzirwa kwehuwandu kunoratidza kusiyana kwezvinhu, kugoverwa kwemhangura, kurodha uye kuputira panel. Tinoisa impedance nekuronga kuponi yekurasikirwa, kubatana kwekugadzira, laser-drill uye filled-via control uye connector uye package datum inspection mukuburitswa kwekugadzira kuti tipe kuenzanisa kwakasimba pakati pezvinhu.

Zvinhu zvakasiyana-siyana zvehunyanzvi muchikamu chino hazvigone kuongororwa zvakazvimirira. Kuchinja kwehuwandu hwekupisa kwakakomberedza DSP neinjini ye optical kunogona kuchinja mashandiro enzira dzemagetsi dze 200G, nepo mapfupi asi anonzwa kusagadzikana uye HDI escape uye via-in-pad structures zvichikanganisa geometry uye mhedzisiro yebvunzo inoonekwa pabhodhi rapera. Highleap inoongorora kuvakwa chaiko kwekugadzira saka stackup uye muripo zvinobva pazvinhu zvinotengwa kwete mienzaniso yemazita.

Chii Chinoitika Kana 1.6T Yatorwa Sebhodhi re800G Rine Zvikamu Zvinokurumidza?

Njodzi yacho ndeyekuvaka, kwete kuwedzera. Per-lane bandwidth, Nyquist frequency, maitiro econnector, package escape uye thermal power change. Kushandisa zvakare 800G stackup pasina ongororo itsva ye channel kunogona kukonzera insertion-loss, return-loss, crosstalk, power-integrity uye thermal failure.

Saizvozvowo, kuchinja chete kuita zvinhu zveDf-lower hakugadzirise kuburitswa kusina kunaka, kwakawandisa kuburikidza ne stub kana weak reference transition.

Mhinduro yakakura yakadai sekusimbaradza kushivirira kwese kunowanzova kutambisa mari. Chiito chakarurama chinoenderana nekuti chikonzero chikuru chiri chipfupi asi chinonzwa kusagadzikana, HDI escape uye via-in-pad structures, thermal density yakakomberedza DSP uye optical engine kana 200G-class electrical lanes. Matongero akatarwa anovandudza goho uye anoita kuti chikonzero chikuru chitevedzerwe pasina kushandura dhizaini yese kuita nzira inodhura zvisina kufanira.

Njodzi idzi dzinofanira kuderedza kushanda nesimba kunodiwa kuti utaure nefekitori, kwete kuisimudza. Kana Highleap yangogamuchira mafaira eGerber kana edhizaini, tinotarisa hukama hwekugadzira stackup, laser-drill uye filled-via control, connector uye package datum inspection uye impedance uye loss coupon planning chete. Sarudzo dzinokanganisa mashandiro, kutevedzera mitemo, mutengo kana kutumira zvinhu ndidzo dzinodzoserwa kumutengi.

Kugadzira PCB yeHighleap 1.6T Optical Module

Highleap inotsigira ma multilayer ane low-loss uye ultra-low-loss, HDI, sequential lamination , laser drilling , filled via-in-pad, back drilling, fine-line imaging, controlled impedance, profile control uye optional high-frequency coupon testing. Kufamba kwemaitiro kunoburitswa chete mushure mekuongorora package, stackup uye channel limits.

Chikumbiro chekugona chinokosha chete kana chakabatana nenzira inodzorwa nechitoro. Highleap inobatanidza kubatana kwekugadzirwa kwezvikamu, laser-drill uye filled-via control, connector uye package datum inspection uye impedance uye loss coupon planning kune incoming inspection, lamination, drilling, plating, imaging uye final certification. Kutevedzana chaiko kunoramba kuri pasi pemvumo yezvinhu nekuvakwa kwebhodhi.

Magadzirirwo akasiyana anoda mahwindo akasiyana ekugadzirisa zvinhu. Ukobvu hwebhodhi, kemikari yezvinhu, kuenzana kwemhangura, magadzirirwo emaburi uye saizi yepaneru zvinogona kuchinja mamiriro ekugadzirira, kudzvanya uye kuputira. Mainjiniya akapihwa anoronga CAM, kugadzirwa uye mhando kuitira kuti mutengi agamuchire mhinduro imwe chete yekugadzira panzvimbo pemibvunzo yakasiyana kubva kudhipatimendi rega rega.

Kugadzira Kwakarurama kwe1.6T Modules

Mabasa ekubatanidza anosanganisira SPI, kuiswa kwepitch fine, BGA/LGA reflow , AOI, X-ray, kuiswa kweconnector neshield, zvinhu zvethermal-interface, programming uye bvunzo dzekushanda dzakatsanangurwa nevatengi. Kurongeka kwemaziso kwakasarudzika, kubata laser kana bvunzo yekushanda kwemaziso inoda michina inotenderwa nevatengi, mirairo yebasa uye zvinodiwa zvekugamuchira.

Kuronga kupisa uye kurongedza ma warpage

Dhizaini yemastencil, chimiro chekufefeterazve, rutsigiro rwebhodhi, kuenzana kwemhangura, kuiswa kwezvikamu uye kuiswa kweheat-spreader zvinoongororwa pamwe chete. Miganhu yekugadzirisazve inofanira kutsanangurwa NPI isati yasvika.

Miganhu yekugadzirisa patsva inofanira kufungwa nezvayo usati wagadzira. Kugara uchipisa kunogona kukanganisa mapedhi, laminate kana zvikamu zvinonzwa hunyoro, kunyanya pazvinobatanidza zvipfupi asi zvisingaenderane neHDI escape uye via-in-pad. Saka, ongororo yegungano inotarisa stencil, profile, processing uye viewing usati wasarudza nzira yekugadzirisa inogamuchirwa.

Miganhu yekugadzirisa zvinhu inofanira kufungwa nezvayo usati wagadzira. Kugara uchipisa kunogona kukanganisa mapedhi, laminate kana zvikamu zvinonzwa hunyoro, kunyanya zvakatenderedza HDI escape uye kuburikidza ne-in-pad structures uye thermal density yakatenderedza DSP ne optical engine. Saka, ongororo ye assembly inoongorora stencil, profile, component handling uye viewing usati wasarudza nzira inogamuchirwa yekugadzirisa.

Bvunzo yePCB ye1.6T uye Kufanirwa

Kugamuchirwa kwebhodhi risina chinhu kunogona kusanganisira bvunzo yemagetsi, impedance, microsection, dimensional inspection uye representative S-parameter kana insertion-loss coupons. Kutevedzera module-level kunoda zvishandiso nemidziyo yakasarudzika.

Highleap inogona kugadzira mabhodhi ekutevedzera mitemo kana ma coupons ekuyedza kudata revatengi, asi haigone kufungidzira mask yekutevedzera mitemo kubva kuzita rechigadzirwa. Frequency range, reference impedance, port definition, de-embedding uye pass/fail criteria dzinofanirwa kupihwa.

Kuponi inofanira kumiririra chinhu chiri kudzorwa. Layer pair, copper, dielectric thickness, routing geometry uye panel position zvinofanira kuenderana ne critical circuit. Mainjiniya edu anosimbisa kana standard impedance coupon yakakwana kana kuti dedicated loss, resonator kana customer test structure ichidiwa.

Kuburitswa kwacho kunofanira kutaura kuti mhedzisiro isina muganho ichaongororwa sei. Zvinyorwa zvezvinhu, zviyero, chikamu chakasiyana, data rekuisa mapurasitiki uye kuongororwa kwemusangano zvinogona kudiwa. Nzira yakatsanangurwa yekukwira inoita kuti bvunzo ishande pane kuunganidza zviyero pasina mhinduro yakabvumiranwa yekugadzira.

Tanga Ongororo yePCB ye1.6T uchishandisa Gerber kana PCB Design Files

Chirongwa che1.6T chinoda ruzivo rwakawanda, asi kutanga kwacho kunofanira kunge kuri nyore. Tumira mafaira eGerber kana mafaira ekutanga ePCB . Kana zvinyorwa zvekugadzira zvatovepo, hapana rimwe gwaro rekugadzira rinodiwa padanho iri.

Injiniya wako anokubatanidza nenyanzvi dzakakodzera

Highleap inopa mainjiniya basa newe zvakananga uye kuronga ongororo nechikwata chedu chePCB, HDI nechikwata chekugadzira. Tichaongorora magadzirirwo enzira, nzvimbo yekubatanidza, zvinhu, mavhisi, zvirambidzo zvekupisa uye PCBA scope, tobva takumbira ruzivo runodiwa chete kuti zvikwanisike uye kuti mutengo wacho ushande sei. Mafaira ekuunganidza nekuyedza anogona kuwedzerwa sezvo ongororo yepurojekiti ichienderera mberi.

Kutenga hakutarisirwi kuti kupedze magwaro ekusimbisa masaini, RF kana lamination usati watibata. Mushure mekuongorora mafaira ebhodhi, tinobvunza mibvunzo yakatarisana nezvehuwandu hwekupisa hwakatenderedza DSP neinjini ye optical, nzira dzemagetsi dze 200G-class, ma interconnect mapfupi asi asingachinji kana HDI escape uye via-in-pad structures chete kana zvachinja kugona, mutengo, kutumirwa kana kugamuchirwa.

1.6T Module PCB Mutengo uye Zvirongwa zveVatyairi

Zvinhu zvinorasikirwa zvishoma, mhangura isina chimiro chakanaka, maHDI cycles akawanda, ma microvia akazadzwa, ma tight profile tolerances, high-speed coupon, special connectors, advanced BGAs uye test equipment drive cost. Kuwanikwa kwezvinhu nezvikamu zvinogona kuva chinhu chikuru pachirongwa. Mutengo wekutengesa zvinhu wakasimba unoda hunyanzvi hwakaburitswa.

Goho rinofanira kutariswa kubva pamuenzaniso kusvika pahuwandu. Zvinhu zvine chekuita nekurasikirwa kwakawandisa kwekudzoka pakuburitswa kana kuputirwa kwemapakeji akatenderedza fine-pitch zvinogona kuwedzera marara, kugadziriswazve uye kurasikirwa kwezvikamu. Kuvakwa kwakanyorwa kwakasimba kunowanzova nemutengo wakaderera pane dhizaini yakasimba inoda kuchinjwa kakawanda mushure mekubatanidzwa.

Kotesheni iyi inoratidza nzira yakakwana inodiwa kuti uwane goho rinogamuchirika. Zvinhu zvikuru zvinosanganisira zvinhu zvinorasikirwa zvakanyanya, mhangura isina chimiro chakawanda, lamination yakatevedzana, microvias dzakazadzwa, fine geometry, inspection uye test coverage. Mutengo wezvinhu zvacho chikamu chimwe chete; lamination yekuwedzera, special drilling, tight registration, test time and test coupons zvinogona kuva nemigumisiro yakaenzana kana yakakura.

Module ye1.6T Inoda Unyanzvi Hwekubatanidza Pamwe Chete muPCB nePCBA

Bhodhi, chinongedzo, pasuru, injini yemaziso, dhizaini yekupisa uye maitiro ekugadzira zvakabatana zvakasimba. Highleap inopa nzira yekugadzira nekubatanidza PCB uku ichiremekedza mabasa emupi wezvinhu uye mupi wezvikamu.

Vatengi havafanirwe kuzadza pasuru iyoyo yeinjiniya vasati vataurirana. Mafaira ekugadzira eGerber kana PCB akakwana kuti vatange. Mainjiniya akapihwa basa anoronga ongororo, anotsanangura zvisarudzo zvinoda mvumo uye anoronga kugadzirwa, kuwanikwa kwezvikamu, kuunganidzwa uye kuyedzwa.

Bhodhi rakapedzwa rinofanira kuburitswa senzira imwe chete yemagetsi, yemakanika uye yekugadzira. Highleap inobatanidza mafaira evatengi ne connector uye package datum inspection, impedance uye loss coupon planning, production stackup correlation uye verification method yakabvumiranwa. Magwaro iwayo anobvumira prototype inobudirira kudzokororwa kana volume yawedzera kana odha yadzoka gare gare.

Mibvunzo Inonyanya Kubvunzwa

Ko module yega yega ye1.6T optical yakavakirwa panzira sere dzemagetsi dze224G here?

Kwete. Magadzirirwo azvo anoenderana nechimiro uye mashandiro azvo; OSFP neOSFP-XD zvinogona kusvika 1.6T nekuwanda kwenzira dzakasiyana.

Ko Highleap inogadzira mainjini e optical here kana kuti laminate isinganyanyi kurasikirwa?

Kwete. Tinogadzira maPCB nemaPCBA tichishandisa zvinhu zvakatenderwa uye zvikamu zvakatorwa kana kuti zvakatumirwa.

Unogona here kugadzira maPCB e module anokwanisa 224G?

Ehe, zvinoenderana nechaneli, stackup, connector, HDI uye ongororo yekuyedza.

HDI ne via-in-pad zvinodiwa here?

Kazhinji, asi kwete pasi rose. Kukwira kwepakeji uye magadzirirwo ekubuda ndizvo zvinosarudza chimiro.

Mafaira api anodiwa kuti utange kuongorora PCB ye1.6T optical module?

Tumira mafaira eGerber kana mafaira ekugadzira ePCB emuno kutanga. Kana paine zvinyorwa zvekugadzira, zvakakwana kuti utange. Mainjiniya weHighleap acharonga chero ruzivo rwekuwedzera rwePCB, kuunganidza kana bvunzo newe.

Nderupi ruzivo runodiwa usati wasarudza zvinhu?

Mwero wemugwagwa, kusvika, bhajeti rekurasikirwa nechiteshi, chinongedzo, pasuru, nzvimbo yekuunganira, dhizaini yekupisa uye zvirambidzo zvehunyanzvi.