Sequential Lamination: HDI PCB Build-Up Process Guide

ziviso

Kuisa lamination muzvikamu zvakasiyana inzira yakakosha mukugadzirwa kweHDI PCB iyo inobvumira kubatana kwezvikamu zvakawanda kuburikidza nekuisa lamination yakawanda uye kuburikidza nekutenderera kwekugadzira. Iyi nzira yepamusoro inobvumira vagadziri kugadzira mabhodhi edunhu ane density yakakura ane marongero akaomarara ekufambisa asingakwanisike kuburikidza nenzira dzemazuva ano dzekugadzira single-press.

Sezvo midziyo yemagetsi ichida kushanda kukuru muzvinhu zvidiki zvemafomu, sequential lamination yave yakakosha pakugadzira mabhodhi emazuvano eHDI ane zvikamu zvakatsetseka uye maI/O akakwira. Maitiro acho anoda kunyatso kudzora pamusoro pekunyoresa kurongeka, kusarudzwa kwezvinhu, uye kutonga kwemafuta mukati mega rega-yekuvaka-up denderedzwa kuti ive nechokwadi chekubatana kwakavimbika uye kuchengetedza dimensional kugadzikana.

Chii chinonzi Sequential Lamination muHDI PCB?

Sequential lamination ndiyo maitiro ekuvaka mamwe ematunhu masiketi pane yakakosha substrate kuburikidza neinodzokororwa kutenderera kwe dielectric lamination, laser drilling, uye copper plating. Kusiyana nemabhodhi echinyakare akawanda akatsikirirwa mukushanda kumwe chete, mabhodhi eHDI anovakwa zvishoma nezvishoma, achiwedzera zvidimbu mumatanho anodzorwa kuti aumbe akaturikidzana kana akaturikidzana mamicrovias anogonesa yakanaka-pitch yakatwasuka yekubatanidza.

Sequential Kuvaka-Up Architecture

Izvo zvinokonzeresa zvimiro zvinowanzotsanangurwa se 1+N+1, 2+N+2, kana chero-layer HDI zvigadziriso, uko manhamba anomiririra kuvaka-up layers yakawedzerwa parutivi rumwe norumwe rwepakati. A 1+N+1 chimiro chinosanganisira imwe lamination cycle padivi, nepo 2+N+2 inosanganisira maviri. Yese yekuwedzera kutenderera inowedzera yekubatanidza density uye kuchinjika kwenzira asi zvakare inokwidza maitiro kuoma uye kunyoresa kudzora zvinodiwa. Iyo musimboti, kazhinji iine maviri kusvika mana masiginecha akaturikidzana, anoshanda semakanika uye magetsi hwaro hweiyo inoteedzana kuvaka-up maitiro.

Kuyerera kweMatanho ega ega Lamination Cycle

• Kugadzirira Kwepamusoro- Mechanical kana kemikari roughening yemhangura iripo inovimbisa kunamatira kwakakodzera kune inotevera dielectric layer.
• Dielectric Lamination - A resin-coated copper foil (RCC) kana pikicha-imageable dielectric firimu inowirirana uye yakashongedzwa pasi pekudzora tembiricha uye kumanikidza mamiriro.
• Kuchera Laser - Mikrovia ine madhayamita e75–150 µm inoboorwa kuti ibatane nepasi pemhangura pads.
• Desmear uye Copper Deposition - Plasma kana kemikari desmear inochenesa kuburikidza nemadziro, ichiteverwa neelectroless copper plating kumisikidza conductivity.
• Patani Plating uye Etching - Yekuwedzera mhangura inoputirwa kuti igadzire ma trace uye kuzadza microvias, yobva yaiswa kutsanangura matunhu maficha.
• Surface Planarization - Kemikari kana mechanical planarization inogadzira nzvimbo yakatsetseka kune inotevera lamination cycles.
• Kudzokorora Kutenderera - Iyo yekuvaka-up maitiro inodzokororwa kusvika iyo inodiwa layer yekuverenga yawanikwa, nekutenderera kwega kwega kunowedzera density asiwo kuunza kunyoreswa uye kushushikana kwekushisa.

Imwe neimwe sequential lamination cycle inowedzera dhizaini density asi zvakare inosuma kunyoreswa uye nekupisa kushushikana matambudziko anofanirwa kutariswa nemazvo.

Sequential Lamination process Inoyerera muHDI Kuvaka-Up

Iyo inoteedzana lamination process inotanga neyakagadzirwa kugadzirwa, uko yakajairwa multilayer substrate inogadzirwa kuburikidza nemukati dhizaini imaging, oxide kurapwa, uye lamination yeprepreg uye copper foil. Iyo musimboti, kazhinji iine maviri kusvika mana masiginecha akaturikidzana, inopa kugadzikana kwemichina uye inoshanda sehwaro hwekuvaka-up mashandiro.

Mushure mekuchera, kupeta, uye kupedzwa kwepasi kuti kuite kuburikidza-gomba kubatanidzwa, zvitarisiko zvekunyoresa zvemaziso zvinowedzerwa kuti ive nechokwadi chekurongeka panguva dzinotevera dzelamination.

Kutanga Lamination Cycle

Yekutanga kuvaka-up inoshandura musimboti kuita 1+N+1 chimiro nelaminating dielectric zvinhu pane ese ari kunze. Resin-yakavharwa nemhangura foils kana yakaoma-firimu dielectrics inopindirana uchishandisa optical kana X-ray masisitimu anonongedza mamaki ekunyoresa akagadzirwa pamusimboti.

Lamination inoitwa pasi petembiricha inodzorwa uye kudzvanywa kuti ive nechokwadi chekuzara resin kuyerera pasina voids. Mushure mekutonhodza, laser drilling inoumba microvias inobatanidza kune ekunze layer pads yepakati, kazhinji iine ± 25 µm yekurongeka kwechokwadi.

• Kugadzirira pamusoro -Roughening inowedzera kunamatira pakati pepakati uye dielectric layer.
• Alignment control -Optical masisitimu anochengetedza kurongeka kwenzvimbo mukati mekutsanangurwa.
• Lamination press - Inodzorwa tembiricha uye kudzvanywa inovimbisa yakazara resin kurapwa uye kubatana.
• Laser microvia kuchera - Vias ye75-150 µm inoumbwa kuti isvike pachinangwa.
• Mhangura metallization -Desmear, electroless mhangura, uye pateni plating inogadzira nzira dzinofambisa.

Yakazotevera Lamination Cycles

Gare gare matenderera anotevera mafambiro akafanana asi wedzera kuomarara sezvo mitsva yedielectric layer yakamisikidzwa pamusoro peiyo yapfuura kuvaka-up. Mune 2+N+2 kumisikidzwa, microvias inogona kurongedzerwa yakananga pamusoro pekutanga-level vias kana kudzedzereka kumapadhi ari padyo.

Dimensional shifts kubva pakudziya kwadzokororwa kunoda kugadziridzwa kwakanaka kwekunyoresa kuchengetedza layer-to-layer kurongeka. Kutenderera kwega kwega kunosanganisira kuchera laser, copper plating, planarization, uye kugadzirira kwepamusoro kuchengetedza kunamatira uye kuvimbika.

Kutenderera kwekupedzisira kunoitwa nemifananidzo yekunze, kuchekwa, kushandiswa kwemasiki ekusolder, uye kupedzwa kwenzvimbo. Kuchengetedza kurongeka kwenzvimbo kuburikidza nematanho ese elamination kwakakosha kuti kuve nechokwadi chekugadzikana kwezvikamu uye kubatana kwakasimba muzvivakwa zvakaoma zveHDI.

Matambudziko Ouinjiniya muSequential Lamination

Kuomarara kwehunyanzvi hwekutevedzana kwelamination kunounza matambudziko akati wandei akakosha ayo vagadziri vanofanirwa kugadzirisa kuburikidza nekudzora maitiro chaiwo uye kusarudza zvinhu . Matambudziko aya anowedzera nekutenderera kwega kwega kwekuwedzera uye anoda nzira dzakarongeka dzeinjiniya kuti varambe vachigadzira goho uye vakavimbika.

Kunyoresa uye Dimensional Control

Kunyoresa kurongeka kunotsanangura miganhu yekugona yekutevedzana lamination. Kutenderera kwega kwega kwekupisa kunounza shanduko yemhando kubva kumhangura uye dielectric kuwedzera, kuyerera kweresin, uye yakaunganidzwa kushivirira kwemidziyo.

Optical kunyoresa masisitimu anokwenenzvera yega yega yekumisikidza uye yekuchera nhanho uchishandisa fiducial tarisiro kubva kumashure akaturikidzana, nepo X-ray masisitimu anobata opaque zvinhu. Vagadziri vepamberi vanoshandisa statistical process control kufanotaura uye kururamisa yakarongeka dimensional shift.

• Thermal cycle effects -Kuwedzera uye kudonha kubva kudzokororwa kudziyisa kunoda muripo mumitsetse inotevera.
• Kugadzikana kwezvinhu -Yakaderera-CTE dielectrics uye inofananidzwa nemhangura foils inoderedza kunyoresa kudonha.
• Tooling nemazvo -Yakarurama kurongeka masisitimu inochengetedza interlayer chinzvimbo mukati mekushivirira kwakasimba.
• Gadzirisa mhinduro -Chaiyo-nguva yekutarisa inogonesa kururamisa kwakasimba kwekukanganisa kwekugadzirisa.

Kuwedzeredza kushivirira kunowanzo dzikamisa sequential lamination kune matatu kana mashoma ekuvaka-kutenderera padivi kusati kwaita chinzvimbo kushatisa kune yakanaka-pitch HDI dhizaini.

Material Kuenderana uye Adhesion

Material kugarisana kwakakosha kune yakavimbika sequential lamination. Iyo CTE yepakati, dielectric, uye mhangura inofanirwa kunyatsoenderana kuti ideredze kushushikana panguva yekupisa bhasikoro.

Kugadzirira kwepamusoro kunovimbisa kunamatira kwakaringana, nehutsinye hunodzorwa hunosimudzira kupindirana pasina kukanganisa kuita kwe impedance. Resin masisitimu anofanirwa kuramba kukuvara kwekuchera laser, kuramba achienderana nemakemikari neplating maitiro, uye kuchengetedza kugadzikana kuburikidza neakawanda kutenderera kutenderera.

Dhizaini Mafungiro eSequential Lamination

Sequential lamination inoisa zvipingamupinyi pane HDI stack-up uye dhizaini dhizaini. Kutariswa kwekutanga kwemiganhu yemaitiro kunobatsira kuve nechokwadi chekugadzira, goho, uye kuvimbika kwenguva refu. Iyo yakasarudzwa yekuvaka-up architecture inokanganisa zvakananga mutengo, nguva yekutungamira, uye kuita.

Stack-Up Structure Selection

Vagadziri vanofanirwa kutora yakapusa kuvaka-up inosangana nedunhu density zvinangwa. Iyo 1+N+1 chimiro chinopa musanganiswa wakaenzana wehuremu, mutengo, uye goho, nepo 2+N+2 kana chero-layer dhizaini inogonesa kuwanda kwepamusoro nekudhura kwekusimba kwemaitiro uye marefu ekugadzira madhizaini.

Core ukobvu hunofanirwa kudzikiswa kuti uvandudze kurongeka kwekunyoresa uku uchichengetedza kugadzikana kwemichina. Dielectric ukobvu hunofanirwa kuenzanisa impedance control, laser yekuchera miganho, uye kuburikidza neaspect ratios. Kusarudzwa kwezvinhu kunofanirwa kukoshesa kugadzikana kwemafuta, inofananidzwa neCTE, uye kuenderana mumaseseji ekutenderera.

Via Strategy uye Kuiswa

Microvia kumisikidza inokanganisa zvakanyanya kuvimbika uye kugadzirwa. Yakakanuka vias inogovera kushushikana uye kuderedza njodzi yekupaza kupararira asi inoda imwe nzvimbo yekufambisa. Akaturikidzana vias anofanirwa kuganhurirwa kumatanho maviri, ane yakakwana pad nzvimbo yekugamuchira kunyoresa kushivirira.

• Gadzirisa kuburikidza nemagadzirirwo -Sarudza zvimiro zvakadzika zvekusimudzira kuvimbika kwemakanika.
• Chengetedza mvumo -Bvumira kushivirira kuvaka kubva kune akawanda lamination kutenderera.
• Deredza kuvaka-up layers -Matanho mashoma anovandudza goho uye kuderedza mutengo.
• Account ye via fill - Via-mu-pad inoda yakazadzwa uye yakarongwa microvias.
• Kudzora impedance - Chengetedza dielectric ukobvu yunifomu pamatanho.

Kubatana neKugadzira

Kubatana kwekutanga nemugadziri wePCB kwakakosha. Maitiro-chaiwo dhizaini mitemo yehukuru, hukuru hwepadhi, kurongeka kwekunyoresa, uye miganho yekumisikidza inofanirwa kutungamira sarudzo.

Kusarudzwa kwezvinhu kunofanirwa kuenderana nemugadziri akakodzera seti yezvinhu uye kugona kwemidziyo. Magadzirirwo ekugadzira-yekugadzira anobatsira kuona njodzi dzegoho dzakadai sekusiyana kwekunyoresa, kuburikidza neaspect ratio nyaya, kana thermally stressed stack-ups.

Vagadziri vane ruzivo vakaita seHighleap Electronics vanogona kubatsira mukugadzirisa magadzirirwo ema stack-up uye ma parameter e lamination kuti vawane HDI yakavimbika ine maitiro akasiyana-siyana.

Kuvimbika uye Kuedzwa muSequential Lamination

Sequential lamination inosvitsa yakasarudzika yekuvimbika matambudziko ichienzaniswa neyakajairwa multilayer PCBs. Multiple thermal cycles uye zvinhu zvinosangana zvinogona kugadzira zvinogona kutadza zvibodzwa zvinofanirwa kusimbiswa kuburikidza nekuyedzwa kwakaringana.

Common Kukundikana Modes

Microvia kupaza ndiyo inonyanya kunetseka, kunyanya mukumisikidzwa kuburikidza nemagadzirirwo. Kuchovha bhasikoro panguva yegungano kana kushanda kunokonzeresa kusawirirana kwekuwedzera pa-via-to-pad interface, zvichitungamira mukutsemuka kuumbwa uye zvinogona kuvhurika maseketi. Interlayer delamination inogona kuguma nekunamira kwakashata, kusvibiswa kwepasi, kana zvinhu zvisingaenderane, nepo Conductive Anodic Filament (CAF) kukura kunogona kuitika munzvimbo dzine hunyoro pasi pekusarura kwemagetsi kana kusvibiswa kweionic kuripo pakati pematanho.

Validation uye Kudzora Kwemhando

Microsection ongororo inobvumira kuongororwa kwakananga kwe kuburikidza nekuvimbika, resin kuzadza, uye interlayer bonding. Iyo inosimbisa kuti yega yega lamination cycle yakawana yakakodzera layer yekubatanidza pasina voids kana kusarongeka.

Nzira dzekuyedza dzekuvimbika dzinosanganisira:

• Thermal cycling -Inoteedzera kuyerera uye kushushikana kwekushanda kuona kuburikidza nekuneta kana kuputika.
• Interconnect Stress Testing (IST) -Inomhanyisa kutadza masisitimu pasi pekupisa uye kushushikana kwemagetsi.
• Cross-section inspection - Inosimbisa kuputirwa kwemhangura, kuzadza mhando, uye kuenderana kwekunamatira.
• Resistance monitoring - Inoona kudzikira zvishoma nezvishoma kusati kwakundikana.

Vagadziri vanoitisa iyi bvunzo panguva yekukodzera uye kugadzirwa kuchengetedza maitiro kugadzikana uye kuvimbika. Kudzorwa lamination kudzvanywa, kunyoreswa kwakaringana, uye sarudzo dzakakodzera dzezvinhu zvakakosha kuti uve nechokwadi chekushanda kwenguva refu kwesequentially laminated HDI PCBs.

mhedziso

Sequential lamination inogonesa HDI zvivakwa zvinotsigira yakakwirira yedunhu density uye yakanaka-pitch zvikamu kuburikidza neinodzorwa kutenderera kwelamination, laser drilling, uye copper plating. Kunyange ichipa hukuru hwekubatanidza kugona, inosumawo maitiro akaomarara anoda kunyoreswa chaiko, kuenderana kwezvinhu, uye kutonga kwemafuta. Yakagadziridzwa stack-up dhizaini uye yakasimbiswa zvinhu zvakakosha pakuchengetedza goho uye kuvimbika kwenguva refu.

Highleap Electronics Sequential Lamination Kugona

Highleap Electronics inopa mhinduro dzekupedzisira dzeHDI PCBs dzinotevera:

• Advanced process control -Kunyoreswa kwakaringana uye akakwenenzverwa maprofayiri eakawanda-kutenderera anovaka.
• Unyanzvi hwezvinhu -Yakakodzera zvinhu zvine inofananidzwa CTE uye yakaratidza lamination kuita.
• Dhizaini rutsigiro - DFM ongororo uye stack-up optimization yekugadzira uye mutengo unoshanda.
• Quality assurance -Kuvimbika kuyedzwa kunosanganisira kuyambuka-chikamu, kupisa bhasikoro, uye IST.
• Flexible zvigadziriso - Tsigiro ye1+N+1, 2+N+2, uye chero-layer HDI zvimiro.

Chikwata cheinjiniya cheHighleap chinoshanda pamwe chete nevatengi kuti vape mhinduro dzePCB dzakavimbika uye dzakasimba dzakagadzirwa kuti dzishande zvakanaka uye dzigone kugadzirwa. Bata timu yedu yehunyanzvi kuti mukurukure nezvechirongwa chako chinotevera cheHDI.