Gold Finger PCB Technology: A Complete Guide

Munwe wegoridhe wePCB ndiwo mutsara wemapedhi ekubata ane goridhe anomhanya pamucheto webhodhi redunhu rakadhindwa. Kana bhodhi rakaiswa muslot kana connector inoenderana, mapedhi aya anoumba electrical interface — kutumira simba, data, uye masaini pakati pebhodhi nesystem yehost. Mamodule eRAM, makadhi eGPU, madhiraivha eM.2, makadhi ekuwedzera ePCIe, mamodule ebackplane eindasitiri, uye mamwe akawanda mafomati ekubatanidza bhodhi-ku-bhodhi ese anoshandisa minwe yegoridhe yePCB senzira yavo huru yekubata. Izwi iri rinobva pachimiro uye kurongeka kwemapedhi: akafanana nemutsara weminwe, uye akaiswa negoridhe.

Chinoparadzanisa munwe wegoridhe wakagadzirwa zvakanaka kubva kune unozopera nguva isati yakwana hachisi goridhe pacharo - ipfungwa yekuisa plating, ukobvu hwenickel underplate, geometry ye substrate chamfer, clearance yesolder mask, uye nzira yekugadzira inoita kuti goridhe risvike pakukora kwakakodzera uye kuomarara. Gwaro iri rinofukidza zvirevo zveinjiniya uye maitiro ekugadzira minwe yegoridhe yePCB, kusanganisira mitemo yekugadzira iyo inosarudza kana chinobatanidza minwe yegoridhe chichapona zviuru zvezviitiko zvekuisa kana kuti chichakundikana mukati memazana.

Tora Mutengo wePCB Gold Finger Manufacturing →

Chii chinonzi PCB Gold Finger uye Inoshanda Sei?

Chigunwe chegoridhe chePCB mutsara wemapedhi emhangura akapatsanurwa zvakanaka ari pamucheto webhodhi redunhu rakadhindwa, akaputirwa negoridhe rakaoma remagetsi pamusoro penickel barrier layer. Mapedhi akarongwa kuti aenderane nepatani yepini yekubatanidza mativi kana slot inoenderana. Kana bhodhi raiswa mukubatanidza, mapedhi egoridhe akabatana zvakananga nemagetsi nemapedhi ekubatanidza, zvichipedzisa dunhu.

Kuputira goridhe kunoshanda mabasa maviri. Chekutanga, kufambiswa kwemagetsi kwegoridhe uye kuramba kwayo kuoxidation kunoita kuti kuramba kubatwa kurambe kwakadzikama uye kwakasimba — kunyangwe mushure mezviuru zvenguva dzekuiswa nekubvisa uye makore ekusvibiswa kwezvakatipoteredza. Chechipiri, kuomarara kwegoridhe rakaoma (kunowanikwa nekubatanidza cobalt) kunodzivirira kupera simba kunoitika pese painopinzwa uye inobviswa bhodhi. Goridhe rakapfava (pure ENIG) rinopera kusvika ku nickel layer mumasekonzi mashoma ekupinzwa gumi kusvika makumi maviri pasi pekushandiswa kakawanda.

Zvigunwe zvegoridhe zvakasiyana ne ENIG surface finish inoshandiswa pane mamwe mapuranga nenzira yakakosha: zvigunwe zvegoridhe zvinoshandisa electrolytic (electroplated) hard gold, iyo inogona kuiswa muhukobvu hwakanyatsodzorwa muhukuru hwe 1–3 µm. ENIG inoshandisa immersion gold muhukuru hwe 0.05–0.15 µm — yakatetepa zvakanyanya kuti isashandiswe ne mechanical contact.

Goridhe Rakaoma vs. ENIG: Nei Zvigunwe zveGoridhe Zvisingakwanise Kushandisa Goridhe Rakapfava

Uyu ndiwo mubvunzo unowanzo bvunzwa nemainjiniya pavanoona magwaro ePCB eminwe yegoridhe kekutanga: ENIG inogona kushandiswa here pakubata minwe yegoridhe panzvimbo pegoridhe rakaoma? Mhinduro pfupi ndeyekuti kwete, uye kunzwisisa chikonzero nei kunotsanangura kuti magwaro eminwe yegoridhe ari kudzorwa nei chaizvo.

Musiyano uyu unogadzira chinodiwa chekugadzira chinoparadzanisa vagadziri vePCB vane hunyanzvi kubva kune avo vasingakwanisi kugadzira mabhodhi eminwe egoridhe zvechokwadi: bhodhi rinofanira kugadziriswa nemativi maviri akasiyana ekupedzisa kwepadenga panguva imwe chete. Mapedhi ezvikamu anogamuchira ENIG kuti agone kusungirirwa. Matinji eminwe egoridhe anogamuchira goridhe rakasimba remagetsi kuti rirambe kupera. Maitiro aya maviri anoda kuvharwa kwemapedhi ezvikamu panguva yedanho rekuisa goridhe rakasimba - kudzora maitiro uko kwete mafekitori ese ePCB akaisa.

KuHighleap Electronics, kugona kwedu kugadzira zvinhu zviviri (ENIG body + electrolytic hard gold paminwe inogunzva) inzira yakajairika yekugadzira. Tinoisa goridhe rakaoma panzvimbo yeminwe yegoridhe tichishandisa precision masking, tichisiya ENIG iri pamativi echikamu. Izvi zvinova bhodhi rinozadzisa zvinodiwa zvekugona kusunganidzwa kweSMT uye zvinodiwa zvekubatana kwemupendero panguva imwe chete.

Magadzirirwo eGoridhe reMinwe: Ukobvu, Nickel, uye Alloy

Tsanangudzo yeplate yePCB gold fingers ndiyo inosarudza mashandiro ayo — kuramba kubatana, kugara kwenguva refu, uye kuenderana ne mating connector. Zvinhu zvitatu zvinonyanya kukosha igold thickness, nickel underplate thickness, uye gold alloy composition.

Ukobvu hwegoridhe

Kushandiswa kweminwe yegoridhe kwakajairika kunotsanangura 1–3 µm yegoridhe rakaoma. Rudzi urwu runoratidza kutengeserana pakati pemutengo (goridhe rinotemerwa nehuremu; mari yakakora inodhura zvakanyanya) uye mashandiro (goridhe rakakora rinorarama nguva dzakawanda dzekuisa risati rapera kusvika ku nickel). Kune zvishandiso zvine zvinodiwa zvekupinda zvakatsanangurwa, ukobvu hwakakodzera hunotsanangurwa nezvinodiwa nemugadziri wekubatanidza kana chiyero cheIPC chinoshanda.

Mipimo chaiyo yekushandisa inoisa miganhu yakasimba: DDR5 memory modules paJEDEC MO-002 inotsanangura 0.76–1.27 µm gold pa 3–5 µm nickel underplate. PCI Express edge connectors inowanzo tsanangura 30 microinches (0.76 µm) gold thick. Industrial backplane connectors dzine zvinodiwa zve cycle count (10,000+ insertions) dzinogona kuratidza 50 µm ye electroplated gold (kunyange izvi zvisingawanzoitiki uye zvinodhura; maapplication mazhinji ari mu 1–3 µm range).

Chidimbu chepasi chenickel

Rutivi rwenickel ruri pakati pe copper pad ne gold deposit runoita mabasa maviri: runoshanda sechidziviriro chekupararira (chinodzivirira mhangura kuti isafambe nepakati pe gold layer, izvo zvinokanganisa conductivity yepamusoro) uye runopa substrate yakasimba inotsigira goridhe rakatetepa rinofukidza ne mechanically. Ukobvu hwe nickel underplate hwe goridhe fingers hwakajairwa hunosvika 3–6 µm. Nickel inofanira kuiswa pamberi pe hard gold plating step; haisi chikamu che ENIG process pane mamwe board.

Kuumbwa kwegoridhe regoridhe

Goridhe rakaomarara reminwe yegoridhe yePCB rinoshandisa gold-cobalt alloy ine 0.1–0.5% cobalt nehuremu. Kuwedzera cobalt kunowedzera kuomarara kweVickers kubva pa70 HV (goridhe rakachena) kusvika pa130–200 HV. Kuwedzera uku kuomarara ndiko kuri kuita kuti isapfekwe — goridhe rakaomarara rinochengetedza chimiro charo chepamusoro pasi pekubatana kunodzokororwa kunoitika panguva yekuisa nekubvisa bhodhi.

Zvimwe zvinoshandiswa zvinoshandisa gold-nickel alloys panzvimbo pegold-cobalt, kunyanya mukushandiswa uko cobalt inorambidzwa nemitemo yezvakatipoteredza. Goridhe rakaoma regoridhe-nickel rinowana kuoma kwakafanana uye isarudzo inogamuchirwa kana yakatsanangurwa.

Nzira imwe chete inonyanya kushandiswa yekukundikana kweminwe yegoridhe ndeyekushandisa ENIG (0.05–0.15 µm goridhe rakapfava) panzvimbo pegoridhe rakaoma remagetsi (1–3 µm). Mari yeENIG inopera ichienda ku nickel layer mukati menguva dze10–20. Kusagona kubata kunokwira, zviratidzo zvinoderera, uye kubatana kunokundikana — kunyangwe bhodhi richitaridzika zvakanaka pakuongorora kuri kuuya.

— Kuongorora kutadza kwechinongedzo chePCB kumucheto

Mhando dzePCB Gold Fingers: Standard, Segmented, Stepped, uye Long-Short

Zvinobatanidza minwe yegoridhe hazvisi zvechimiro chimwe chete. Mashandisirwo akasiyana anoda magadzirirwo akasiyana epedhi, uye zvinodiwa pakugadzira zvinosiyana zvichienderana nazvo.

Zvigunwe zvegoridhe zvakajairika (zvakaenzana)

Rudzi rwakajairika — mapedhi ese akaenzana pakureba nehupamhi, akarongwa mumutsara mumwe chete wakatwasuka pamucheto webhodhi. Anoshandiswa muma interfaces akajairwa: DDR memory, PCIe cards, M.2 drives, PCI expansion cards, uye akawanda ma industrial backplane connectors anotevedzera contact spacing standard. Kugadzira kwacho kuri nyore nekuti masking geometry yakafanana.

Zvigunwe zvegoridhe zvakakamurwa

Mapedhi ehurefu hwakasiyana akarongwa mumutsara mumwe chete, zvichigadzira chitarisiko chakapatsanurwa apo mamwe ma contacts mapfupi pane mamwe. Iyi geometry inoshanda basa: mu connectors dzine insertion phased, ma contacts marefu anoita electrical connections asati asvika ma contacts mapfupi panguva yekuisa bhodhi. Izvi zvinobvumira ma power pins kubatana ma signal pins asati asvika (kudzivirira hot-insert transients kubva pakukuvadza ma signal circuits) kana kuti zvinogonesa kuzivikanwa kwebhodhi usati waisa connection yakazara. Inowanikwa mu industrial module connectors, ruggedized backplane designs, uye specialized telecommunications equipment.

Minwe yegoridhe yakatsikwa (yakapfupika kwenguva refu)

Musiyano apo matinji anochinjana pakati pehurefu huviri hwakasiyana mupatani yakatsanangurwa. Inoshandiswa mumakonekita anotsigira hurefu huviri hwakasiyana hwekupinza — nzvimbo yekupinza isina chikamu chemodhi yekumira ine simba shoma uye nzvimbo yekupinza yakazara yekushanda kwakajairika, semuenzaniso. Geometry yematanho inoda kugadzirwa nekungwarira kuchengetedza kururama kwehukuru hwese hwematinji.

Misiyano ine chamfered uye beveled

Mhando dzese dzeminwe yegoridhe dzinoda mupendero wakachekwa pabhodhi (chamfer inotungamira bhodhi kupinda muconnector). Kune kusiyana kuripo mukona yechamfer (30°, 45°, 60°) uye kana chamfer yakaiswa kune rimwe divi rebhodhi kana mativi ese (double-bevel). Dhirowa yemugadziri weconnector inotsanangura geometry yechamfer inodiwa; mugadziri wePCB anoishandisa panguva yedanho rekufambisa nekufambisa.

Mitemo yePCB Gold Finger Design: Chamfer, Clearance, uye Marongerwo

MaPCB egoridhe anoda mitemo chaiyo yekugadzira yakasiyana nemaitiro akajairwa ekurongeka kwePCB. Mitemo iyi iripo nekuti maitiro ekugadzira minwe yegoridhe - kunyanya kucheneruka kwemucheto, kufukidza kwekusarudza, uye kurongedza - anogadzira zvirambidzo izvo zvishandiso zveDFM zvisingaite otomatiki.

Bhodhi remucheto webhodhi

Chamfer (bevel) iri pamucheto wemunwe wegoridhe webhodhi haisi sarudzo - zvinodiwa kuti bhodhi riiswe nemazvo muchinobatanidza chine mipata pasina kukuvadza zvinobatana nechinobatanidza kana mapedhi eminwe egoridhe. Maitiro echamfer akajairwa:

Kona yechamfer (inoyerwa kubva kumeso ebhodhi) inowanzova 30°, 45°, kana 60° zvichienderana nezvinodiwa neconnector. 45° ndiyo inonyanya kushandiswa pakubatanidza PCIe neDDR. Kudzika kwechamfer kunowanzo bvisa 0.5–1.0mm kubva kumeso ega ega ebhodhi. Chamfer ine mativi maviri (kumeso kumwe chete) inoshandiswa kune akawanda ma consumer electronics interfaces. Chamfer ine mativi maviri (kumeso ese) inoshandiswa kune maapplication anoda kuti bhodhi rigone kupinza mune chero imwe nzira.

Chamfer inogadzirwa nemugadziri wePCB panguva yedanho rekugadzirisa/kuronga bhodhi. Mafaira eGerber anofanira kutsanangura zvakajeka geometry yechamfer - haigone kufungidzirwa kubva panzvimbo dzegoridhe dzeminwe chete.

Solder mask clearance

Chifukidzo chesolder hachifanirwe kutambanudza pamusoro pemapedhi egoridhe. Nzvimbo inodiwa pakati pemucheto wechifukidzo chesolder nepedhi regoridhe riri pedyo i0.5mm, uye 1mm ndiyo inokurudzirwa. Nzvimbo iyi iripo nekuda kwezvikonzero zviviri: chifukidzo chesolder chinoiswa pamberi pedanho regoridhe, uye chero kupinda kwemasiki pamapedhi kunogona kudzivirira electroplating bath kuti isasvike munzvimbo yakazara yepadhi; uye pakushanda, maconnector contacts anofanira kubata zvakananga nepedhi rakaputirwa pasina chinhu chinodzivirira mask chinoita kuti pave nechidziviriro.

Kuburikidza nekurambidzwa munzvimbo yeminwe yegoridhe

Hapana ma-vias anofanira kuiswa munzvimbo yeminwe yegoridhe kana mukati me1mm kubva pama-finger pads egoridhe. Ma-vias munzvimbo yeminwe yegoridhe anoita maburi ayo bhavhu remagetsi rinogona kupinda mukati me-copper layers, zvichikonzera kupurinda kusingadzoreki pa-inside layer copper uye zvinogona kukonzera mashoti mapfupi. Anogadzirawo nzvimbo dzisina simba dzemuchina pedyo nemupendero webhodhi, uko bhodhi rinowana simba rekuisa rinodzokororwa.

Geometry yepad uye nzvimbo

Upamhi hwemapedhi eminwe yegoridhe, kureba, uye pitch zvinowanzotsanangurwa ne connector kana slot specification kwete nemugadziri wePCB. Mitemo mikuru yekugadzira inoshanda pasinei ne standard chaiyo ye connector: kuchengetedza urefu hwemapedhi hwakafanana kune ese ma contacts ari mumutsara mumwe chete (kunze kwekunge uchishandisa dhizaini yakakamurwa kana ine matanho); kuchengetedza mipendero yemapedhi yakaenzana nemupendero webhodhi kusvika mukati me ±0.1mm; uye kuchengetedza pitch (pakati-kusvika-pakati spacing) kusvika mukati me connector specification tolerance, iyo inowanzo kuve ±0.1mm ye standard interfaces.

Kuchengetedzwa kweconnector uye kubviswa kwezvikamu zvayo

Nzvimbo yakakomberedza nzvimbo yekubata minwe yegoridhe — nzvimbo inenge iri mukati memuviri wekubatanidza panguva yekuiswa — inofanira kuchengetedzwa isina zvikamu, solder paste, uye conformal coating. Kudzika kwenzvimbo iyi yekuchengetedza kunotsanangurwa netsanangudzo yehupamhi hwekubatanidza. Kazhinji 5–15mm kuchengetedza kubva kumucheto webhodhi kuenda mukati mebhodhi kunodiwa, zvichienderana nerudzi rwekubatanidza.

Magadzirirwo Anoitwa Zvigunwe zvePCB Gold: Kutevedzana Kwekugadzira

Kunzwisisa kutevedzana kwekugadzirwa kwePCB dzeminwe yegoridhe kunobatsira vagadziri kunyora manotsi ekugadzira akarurama uye kunobatsira mainjiniya ekutenga kuti vaone kana fekitori ichikwanisa kupa bhodhi rakasarudzwa zvechokwadi. Maitiro acho anonyanya kushanda kupfuura kugadzirwa kweENIG kwakajairwa nekuti kunoda danho rekuwedzera rekuisa plating uye mashandiro emakanika.

Danho 1: Kugadzirwa kwakajairika kwezvikamu zvakawanda kuburikidza nemhangura yekunze

Bhodhi iri rakagadzirwa kuburikidza nematanho ese akajairwa ekugadzira maPCB — inner layer imaging, lamination, drilling, plating, outer layer imaging uye etching — kuburikidza nenzvimbo apo outer layers copper apera. Nzvimbo dzegoridhe finger pad dzinotsanangurwa mu outer copper layer se standard copper pads.

Danho rechipiri: Kugadziriswa kwe ENIG kwema pads ezvikamu

Bhodhi rinogashira ENIG processing — nickel isina magetsi ichiteverwa negoridhe rekunyudza — pama component pads. Nzvimbo dzegoridhe dzeminwe dzinovharwa panguva iyi kudzivirira ENIG kuti isashandiswe kune vanhu vanozogamuchira goridhe rakaoma. Danho iri rekusarudza masiki ndipo panosangana matambudziko nemafekitori mazhinji asina kugona kwekugadzira zvinhu zviviri.

Danho rechitatu: Kuisa mask yesolder

Chifukidzo chesolder chinoiswa pabhodhi nepaburi rakatarwa rakatenderedza mapedhi egoridhe. Chifukidzo hachishandiswe panzvimbo dzinobata minwe yegoridhe. Chifukidzo chinonatswa chisati chaiswa jira regoridhe rakaoma.

Danho rechina: Kuisa nickel negoridhe rakaoma

Nzvimbo dzekubata minwe yegoridhe dzinowana nickel yakaputirwa nemagetsi (3–6 µm) ichiteverwa negoridhe rakasimba rakaputirwa nemagetsi (1–3 µm kana sezvakatsanangurwa). Iyi inzira yemagetsi inoda magetsi emagetsi — mapedhi emhangura ari munzvimbo yeminwe yegoridhe akabatana nemagetsi kuti magetsi afambe panguva yekuisa jira. Mabhazi ekuisa jira (zvimedu zvemhangura zvakatetepa zvinobatanidza mapedhi eminwe yegoridhe kumucheto webhodhi kuti magetsi abatane panguva yekuisa jira) anowanzo dikanwa; izvi zvinoendeswa kumucheto wemarara ebhodhi uye zvinobviswa panguva yekubvisa mapanesheni.

Danho rechishanu: Kugadzira bhodhi uye kushongedza mativi emucheto

Bhodhi rinoendeswa kumucheto waro wekupedzisira, uye mupendero wemunwe wegoridhe unogamuchira chamfer yakatarwa uchishandisa chishandiso chekubhedhenura. Basa rekubhedhenura rinoitwa mushure mekubhedhenura kudzivirira kusvibisa bhavhu rekubhedhenura nemarara ekubhura. Kona yechamfer nekudzika zvinosimbiswa zvichienderana nezvinodiwa. Ukobvu hwebhodhi pamucheto wechamfer hunoyerwa kusimbisa kuti hunoenderana nekushivirira kwekubatanidza.

Danho rechitanhatu: Kuyedzwa kwemagetsi nekuongorora

Bhodhi rakapedzwa rinoongororwa kuti rinoenderera mberi sei uye kuti rinoona sei (flying probe kana bed-of-nails). Kusagona kubata minwe yegoridhe kunoongororwa uchishandisa Kelvin yewaya ina kana zvataurwa. Kuongororwa kwenzvimbo yeminwe yegoridhe kunoongorora kufanana kweplating, kupindira kwemasiki, uye chamfer geometry. Ukobvu hwegoridhe hunowanzo ongororwa neX-ray fluorescence (XRF) measurement pamabhodhi emuenzaniso kubva panzvimbo yega yega yekugadzira.

Mashandisirwo: Kunoshandiswa PCB Gold Fingers

Zvigunwe zvegoridhe zvePCB zvinoonekwa chero panofanira kubatwa magetsi kakawanda uye zvakavimbika nechinhu chinobatanidza chine mipata. Mashandisirwo acho anotangira pamagetsi evatengi kusvika kunzvimbo dzinoda maindasitiri nedzekudzivirira.

Mamodule ekurangarira ekombuta (DDR, SO-DIMM, DIMM)

MaDDR4 neDDR5 memory DIMM ndiwo anonyanya kushandiswa neminwe yegoridhe. DDR5 DIMM ine macontacts mazana maviri nemakumi masere nemasere pamucheto wayo, imwe neimwe yakasungirirwa kuJEDEC MO-002 specification: 0.76–1.27 µm hard gold pa 3–5 µm nickel. Kuwanda kweinsertion cycle mumaseva (mamodules anotsinhaniswa panguva yekugadzirisa nekuvandudza) uye zvinodiwa zveDDR5 zve impedance zvinoita kuti plating specification chaiyo ive yakakosha.

PCIe, PCI, uye makadhi ekuwedzera

Makadhi eGPU, madhiraivha eNVMe, maadapta enetwork, uye mamwe makadhi ekuwedzera ePCIe anoshandisa zvibatanidza zveminwe zvegoridhe zvinotangira paPCIe x1 (18 contacts) kusvika kuPCIe x16 (164 contacts). Chimiro cheminwe chegoridhe chePCIe chinowanzo da 30 microinches (0.76 µm) goridhe rakaoma. Chimiro chekubatanidza chePCIe chinoda kupenya kumativi ese emucheto webhodhi.

Madhiraivha eM.2 neSATA

Midziyo yekuchengetera M.2 inoshandisa chinongedzo chemucheto che67-pin chine matinji egoridhe akaomarara. Iyo M.2 form factor inoda geometry chaiyo yeminwe yegoridhe kuti ibatane nemazvo nematinji echitubu enzvimbo yeM.2. Mamodule eM.2 akagadzirirwa kuiswa kashoma (kazhinji kuiswa kamwe chete), saka zvinodiwa kuti uise cycle yakaderera - asi zvinodiwa kuti ugone kuvimbika pakubata kwemagetsi zvakanyanya nekuti interface inoshanda paPCIe Gen 4/5 speeds.

Mamodule emusana weindasitiri

MaIndustrial PLC modules, VME cards, CompactPCI, VPX, uye custom industrial backplane systems ese anoshandisa gold finger connections pakati pemamodules nebackplane. MaIndustrial applications anowanzo wedzera zvinodiwa zveinsertion cycle (10,000+ cycles dzemamodules anowanzo gadziriswa) uye tembiricha yakakura yekushanda kupfuura maapplication evatengi, zvichikonzera kudiwa kwegoridhe rakakora (2–3 µm) uye nickel underplates dzakasimba. Mabhodhi aya anowanzo pihwa sePCBA units dzakagadzirwa zvakakwana dzakagadzirira kubatanidzwa muma rack systems.

Telecommunication uye networking michina

Makadhi emutsetse, ma transceiver e optical, uye makadhi e blade server muzvivakwa zve telecommunications anoshandisa gold finger connectors. Kusanganiswa kwe data rakawanda uye kuvimbika kwakanyanya kwe insertion kunoita kuti hard gold pa contact idzi ive specification isingakurukurwe.

Zvishandiso zvekurapa uye zvemuchadenga

Midziyo yekuongorora chirwere pamwe nemidziyo yemagetsi yemuchadenga inoshandisa kubatanidza minwe yegoridhe uko kuvimbika kwechinongedzo kunokanganisa zvakananga kuchengetedzeka. Mashandisirwo aya anowanzo tsanangura magumo akakora emhando yegoridhe uye anoda kuteverwa kwakanyorwa kwemaitiro ekuisa plating, kusanganisira marekodhi ekuyera eXRF enzvimbo yega yega yekugadzira.

Kudzora Hunhu uye Kuedzwa kweGoridhe Finger PCBs

Mabhodhi egoridhe anoda matanho chaiwo ekudzora hunhu kupfuura kuongororwa kwePCB kwakajairwa. Zvinhu zvitatu zvakakosha kuyerwa kweukobvu hwegoridhe, kuyedzwa kwekudzivirira kusangana, uye kuongororwa kwechamfer nemaziso.

Kuyerwa kweukobvu hwegoridhe reX-ray fluorescence (XRF)

XRF ndiyo nzira isingaparadzi yekuyera ukobvu hwegoridhe paPCBs. Pfuti yeXRF inotungamira danda reX-ray pamusoro pechigunwe chegoridhe; fluorescence spectrum yechiratidzo chakadzoserwa inoratidza zvinhu zviripo uye ukobvu hwazvo. Kuyerwa kweXRF kunogona kugadzirisa ukobvu hwegoridhe nenickel panguva imwe chete. Isu tinoita XRF sampling pane yega yega goridhe finger boards yakagadzirwa, nemhedzisiro yakanyorwa mupakeji yekutumira. Kune maapplication anoda kudzora maitiro akaomarara (DDR5, aerospace, medical), 100% XRF measurement inowanikwa. Mabhodhi egoridhe finger board ane HDI construction - achibatanidza fine-pitch BGA pads panzvimbo yezvikamu negold finger contacts pamucheto webhodhi - anoda XRF verification kuti isimbise kuti selectal masking yakaparadzanisa ma plating processes maviri nemazvo pasina kusvibiswa.

Kusimbiswa kwekurambana

Pamabhodhi apo zvirevo zvegold finger contact resistance zvakakosha (high-frequency interfaces, low-current analog signals), contact resistance inoyerwa uchishandisa four-waya Kelvin probe arrangement. Nzira yeKelvin inobvisa lead resistance kubva pakuyera, zvichipa kuverenga kwechokwadi kwecontact interface resistance. Kazhinji gold finger contact resistance iri pasi pe10 mΩ kuti contact inyatsoiswa.

Kuedza simba rekuisa nekuburitsa

Pamabhodhi egoridhe eminwe akagadzirwa nehuremu hwechinobatanidza chakati, kuyedzwa kwekuisa nekudzora simba rekushandisa pamapuranga emuenzaniso kunosimbisa kuti ukobvu hwebhodhi, chimiro chechamfer, uye upamhi hwepad zviri mukati mezvinodiwa zvechinobatanidza. Mabhodhi akakora zvakanyanya haazopindi zvizere; mabhodhi ane makona asina kunaka echamfer anogona kukuvadza macontacts echitubu chekubatanidza.

Kuyedzwa kwekunamatira uye kupfeka

Kune mashandisirwo ane zvinodiwa zvakatsanangurwa zvekupinza denderedzwa, kuyedzwa kwekupfeka nekukurumidza pamabhodhi emuenzaniso kunogona kuratidza kuti ukobvu hwegoridhe hwakatarwa huchasangana nenhamba yedenderedzwa. Kuyedzwa uku kunowanzoitwa nemugadziri weconnector panguva yekukodzera connector, asi kunogona kukumbirwa nemutengi wePCB kune magadzirirwo matsva kana vatengesi vatsva.

Mibvunzo Inonyanya Kubvunzwa

Chii chinonzi PCB gold finger?

Chigunwe chegoridhe chePCB mumutsara wemapedhi ekubatana akapetwa negoridhe ari pamucheto webhodhi redunhu rakadhindwa. Kana akaiswa muchikamu chinoenderana kana chinongedzo chemucheto, mapedhi aya anoumba chinongedzo chemagetsi pakati pebhodhi nesystem yekugamuchira. Izwi iri rinobva pakuonekwa kwawo - mutsara wemapedhi ekubatana egoridhe akafanana neminwe. Anoshandiswa mumamodule eRAM, makadhi ePCIe, madhiraivha eM.2, mamodule ebackplane eindasitiri, uye chero imwe bhodhi-ku-bhodhi yekubatanidza inoshandisa fomati yekubatanidza edge.

Upfu hwegoridhe hupi hunoshandiswa paminwe yegoridhe yePCB?

Magadzirirwo eminwe yegoridhe yePCB anoda 1–3 µm yegoridhe rakaoma remagetsi (gold-cobalt alloy) pamusoro pe3–6 µm yenickel isina electro. DDR5 memory modules paJEDEC MO-002 inotsanangura 0.76–1.27 µm yegoridhe panickel ye3–5 µm. Magadzirirwo ePCIe anowanzo da 30 microinches (0.76 µm) zvishoma. Mashandisirwo ane zvinodiwa zvakanyanya zveinserting cycle (10,000+ cycles) anogona kutsanangura 2–3 µm yegoridhe kuti iwedzere kupfeka.

Ndeupi musiyano uripo pakati peminwe yegoridhe yePCB neENIG?

Zvigunwe zvegoridhe zvinoshandisa goridhe rakaoma remagetsi (1–3 µm, gold-cobalt alloy, 130–200 HV hardness) rakaiswa ne electroplating kusvika pakukora kwakanyatsodzorwa. ENIG inoshandisa goridhe rekunyudza (0.05–0.15 µm, goridhe rakachena, 60–80 HV hardness) rakaiswa ne chemical displacement. ENIG yakagadzirirwa kuchinjika, kwete kusakara - inokundikana senzvimbo yekubata mukati me10–20 insertion cycles. Zvigunwe zvegoridhe zvinoshandisa goridhe rakaoma nekuti inogona kutsungirira zviuru zveinsertion cycles isina kupera kusvika ku nickel layer.

Sei minwe yegoridhe yePCB ichida chamfer (bevel)?

Chamfer iri pamucheto wemunwe wegoridhe webhodhi inotungamira bhodhi kupinda panzvimbo yekubatanidza isina kubata matinji echitubu chekubatanidza kana kukwenya pamusoro pegoridhe panguva yekuisa. Pasina chamfer, mupendero wakapinza webhodhi unokwenya matinji ekubatanidza, zvichigona kuakuvadza uye kugadzira marara anokanganisa kuvimbika kwekubatana. Makona echamfer akajairwa ndee30°, 45°, kana 60° zvichienderana nezvinodiwa neconnector. Chamfer inogadzirwa nemuchina nemugadziri wePCB mushure mekuputira, panguva yedanho rekuongorora bhodhi.

Ko ENIG inogona kushandiswa paminwe yegoridhe yePCB panzvimbo pegoridhe rakaoma here?

Kwete. ENIG (goridhe rekunyudza, 0.05–0.15 µm) rakatetepa uye rakapfava zvakanyanya kuti rishandiswe pakubatanidza kubatanidza. Rinopera kusvika panickel layer mukati menguva dze10–20, zvichiita kuti kuramba kubatana kukwire uye chiratidzo chekusashanda zvakanaka chiparare. Kubatana kweminwe yegoridhe kunoda goridhe rakasimba remagetsi (1–3 µm) rine gold-cobalt alloy kuti rirambe kupfeka zvakanaka. Bhodhi rakatarwa seENIG finish rinoshandiswawo sekubata kweminwe yegoridhe richakundikana kushanda nguva isati yakwana.

Ndeapi mitemo yekugadzira inoshanda kuminwe yegoridhe yePCB?

Mitemo mikuru yekugadzira zvigunwe zvegoridhe: (1) Hapana ma-vias ari mukati me1mm kubva pama-finger pads egoridhe — ma-vias anobvumira bhavhu rekuputira kusvika mukati memhangura. (2) Chifukidzo chesolder chinofanira kunge chakavhurika ne0.5–1mm kubva kumipendero ye-finger pad yegoridhe — kupinda kwemasiki kunodzivirira kuputira kwakakodzera. (3) Kona yechamfer yemupendero webhodhi inofanira kuenderana nezvinodiwa neconnector — 30°, 45°, kana 60°. (4) Ukobvu hwegoridhe uye ukobvu hwenickel underplate zvinofanira kutsanangurwa zvakajeka muzvinyorwa zvekugadzira — "zvigunwe zvegoridhe" chete hazvina kukwana. (5) Hapana zvikamu kana solder paste munzvimbo yekubatanidza, kazhinji 5–15mm kubva kumucheto webhodhi.

Unoongorora sei ukobvu hwegoridhe paminwe yegoridhe yePCB?

Ukobvu hwegoridhe hunosimbiswa nekuyera kweX-ray fluorescence (XRF) — nzira isingaparadzi inoyera ukobvu hwegoridhe ne nickel layers panguva imwe chete. Kuyera kweXRF kunotorwa pamabhodhi emuenzaniso kubva panzvimbo yega yega yekugadzira. Kune mashandisirwo akakosha (DDR5, aerospace, medical), kuyerwa kwe100% XRF pabhodhi rega rega kunogona kutsanangurwa. Zvinyorwa zvekuyera zveXRF zvinofanirwa kuiswa mupakeji yemagwaro ekugadzira bhodhi.

Ndeupi musiyano uripo pakati peminwe yegoridhe yakakamurwa neyakajairwa?

Zvigunwe zvegoridhe zvakajairika zvine mapedhi ese akaenzana, zvichigadzira mutsara wekubatana wemucheto wakafanana unoshandiswa muma interfaces akajairwa seDDR memory nePCIe cards. Zvigunwe zvegoridhe zvakapatsanurwa zvine mapedhi ehurefu hwakasiyana mumutsara mumwe chete, saka mamwe ma contacts anosangana pamberi pemamwe panguva yekuisa bhodhi. Kubatanidzwa uku kwezvikamu kunoshandiswa muma connectors uko ma power pins anofanira kubatana pamberi pe signal pins (kudzivirira ma signal circuits kubva kuma hot-insert transients) kana kuti board identification inofanira kuitika isati yabatanidzwa zvizere. Zvigunwe zvegoridhe zvakapatsanurwa zvakajairika muma industrial backplane connectors uye specialized telecommunications equipment.