Kugadzirisa PCB Dhizaini nePackage-on-Package Technology

Package on Package (PoP) inzira yakabatanidzwa yekurongedza circuit iyo inosanganisa vertical discrete logic uye memory Ball Grid Array (BGA) packages. Iyi tekinoroji inotarisa zvinodiwa neindasitiri yemagetsi zvekupinza zvishoma, saizi diki, kumhanya kwakanyanya kwekugadzirisa masaini, uye zvivakwa zvidiki zvinoiswa muzvigadzirwa zvakaita semafoni nemakamera edhijitari. PoP inobvumira kubatana kwemagetsi pakati pemidziyo yekurangarira iri mupakeji yepamusoro uye michina yelogic iri mupakeji yepasi, zvichiita kuti kuyedzwa kwakazvimirira uye kutsiviwa kwezvikamu izvi. Izvi zvinoderedza mari yekubatanidza PCB uye kuomarara.

Package paPackage (PoP) mamiriro

Kune maviri anoshandiswa zvakanyanya maPoP zvimiro: Yakajairwa PoP Maumbirwo uye TMV PoP Mamiriro.

Yakajairwa PoP Chimiro

Mune yakajairwa PoP, logic zvishandiso zvinoiswa mupasuru yepasi, ine yakanaka pitch BGA solder kugarisa nhamba yakakura yepini kuverenga. Iyo yepamusoro pasuru ine ndangariro zvishandiso kana akaturikidzana ndangariro. Kutsiva iyo isina kukwana pini kuverenga mumidziyo yekurangarira, mutsara wemuganho unogona kuiswa kumucheto wemapakeji maviri. Waya mabhondi ari kuramba achitsiviwa nefiripi chip tekinoroji mupasuru yepazasi kuti ideredze saizi yepasuru, zvichitungamira kune yakajairwa 0.4mm solder pitch. Iyo yepamusoro pasuru, ine dynamic random-access memory (DRAM) machipisi kana DRAM machipi ane flash memory, inoda akatsetseka solder pitches, zvino zvakajairika pa 0.4mm.

TMV PoP Chimiro

Iyo Kuburikidza neMould Vias (TMV) PoP igadziriso pamusoro peiyo PoP yakajairwa, inoshandiswa zvakanyanya mumashandisirwo emagetsi anobatwa nemaoko nekuda kwekunaka kwayo. Kuburikidza mold vias ari pasi pasuru uye pakati pamusoro solder ari pasi pasuru uye solder ari pamusoro pasuru anopa magetsi kubatana pakati pfungwa uye ndangariro mano. TMV PoP inopa zvakanakira senge kuderera kwepasuru saizi, ukobvu, uye warpage, uku ichiwedzera yekubatanidza density, kuita, uye kuvimbika.

SMT Assembly Techniques yePoP

SMT inoita basa rakakosha mukuunganidzwa kwezvikamu zvePoP, ichipa maitiro maviri makuru: pre-yakarongedzerwa PoP uye pane-bhodhi stacking PoP. Idzi nzira dzinosiyana pamaitiro avo ekuturika nekutengesa zvinhu zvePoP paPCB.

1. Pre-stacked PoP: Iyi nzira inosanganisira kurongedza mapakeji epamusoro uye epasi ezvikamu zvePoP asati atengeswa kuPCB. Izvo zvakaturikidzana zvinotengeswa pamwe chete kutanga, kugadzira imwechete pre-yakaturikidzana mudziyo. Ichi chigadziriso chakaturikidzana chinozosungirirwa pamusoro pePCB uye chinoitwa reflow soldering kuti chichengetedze panzvimbo. Pre-yakarongedzerwa PoP inokwenenzvera maitiro egungano nekugadzirira zvikamu zvePoP usati wazviisa paPCB, zvichideredza kuoma kwemaitiro ekusodha.
2. Pa-bhodhi stacking PoP: Mukupesana, pane-bhodhi stacking PoP inounganidza zvikamu zvePoP zvakananga paPCB. Iyo yepazasi pasuru inoiswa paPCB kutanga, ichiteverwa neyepamusoro pasuru, iyo inozobva yanyikwa mu flux kana solder paste isati yaiswa papasi pasuru. Iyo yese stack inozoiswa pasi reflow soldering kugadzira iyo yekupedzisira PoP gungano. Pa-board stacking PoP inopa mukana wekuunganidza zvikamu zvePoP zvakananga paPCB, zvichibvumira kunyatsorongeka uye kutonga panguva yekushambadzira.

Matekiniki ese ane zvaakanakira uye anoshandiswa zvichienderana nezvinodiwa uye kugona kugadzira. Pre-yakarongedzerwa PoP inowanzofarirwa kuve nyore uye kushanda kwayo, nepo pa-bhodhi stacking PoP inopa humwe hutongi pamusoro pekuita kwegungano uye kurongeka kwezvikamu zvePoP.

Package-on-package (PoP) zvikumbiro

SMT Maitiro ePoP Zvikamu

1. Solder Namira Kudhinda kwePoP Pazasi Package: Iyo solder paste kudhinda maitiro inotarwa nechikamu uye pad saizi. Laser-cut uye electroforming stencil templates inowanzoshandiswa. Solder paste kusarudzwa kwakavakirwa pakudhinda clearance, neType IV solder paste iri kuwedzera kushandiswa.
2. PoP Pamusoro Package Dipping: Iyo yepamusoro package inonyikwa mune solder paste kana flux. Kunyura kwakaringana kunovimbisa huwandu hwakakodzera hwesolder paste kana flux inoiswa pasina kukonzera kukanganisa.
3. PoP Component Positioning: Kunyatsomisikidzwa kwepakeji yepamusoro kwakakosha kuti uve nechokwadi chekusangana uye kuti umire kuvhunduka uye kudedera.
4. Reflow Soldering yePoP: Lead-isina soldering matekiniki anosarudzwa nekuda kwekuvimbika kwawo. Nitrogen ine yakaderera oxygen yemukati inoshandiswa kuderedza simbi oxidation uye kuve nechokwadi chekunyorova kwakanaka. Delicate reflow soldering tembiricha curves inodiwa kudzivirira chikamu kana substrate deformation.
5. Optical uye X-ray Kuongorora kwePoP: Kukanganisa kwakasiyana-siyana kunogona kuitika panguva yekuungana uye kushambadzira, kusanganisira yakavhurika solder, kutonhora soldering, bridging, core ingression, nezvimwe. Nzira dzekuongorora dzakaita seAOI, endoscopic inspection, uye X-ray inspection dzinoshandiswa kuona zvikanganiso izvi.

Iyo PoP gungano maitiro inoda kurongeka, kutarisisa kune zvakadzama, uye kuteedzera kumhando dzemhando kuti ive nechokwadi chekushanda kwakavimbika mumidziyo yemagetsi. Kuitwa kwakaringana kwemaitiro aya kunogona kutungamira kumagungano ePoP emhando yepamusoro nekuita kwakanaka uye kuvimbika.

Zvakanakira zvePackage-on-Package (PoP)

Kurongeka kwechinyakare kurongeka kwezvikamu paPCB kuri kuvandudzwa nePackage-on-Package (PoP) tekinoroji, iyo inosuma yakamira stacking chimiro. Ichi chitsva chinosimudzira zvakanyanya dhizaini yePCB nekuwedzera kushandiswa kwenzvimbo uye kugonesa kubatanidzwa kwemamwe mabasa muchikamu chidiki chetsoka, nekudaro kuwana kushanda kwepamusoro mumisanganiswa yezvikamu.

Space Efficiency uye Enhanced Performance

Iyo yakatwasuka yakaturikidzana yezvikamu mukumisikidzwa kwePoP inoshandisa nemazvo nzvimbo shoma inowanikwa paPCB. Izvi zvinoita kuti vagadziri vabatanidze mamwe mabasa uye maficha mumagadzirirwo avo pasina kuwedzera saizi yese yePCB. Pamusoro pezvo, iyo ipfupi yakatwasuka yekubatanidza pakati pepamusoro nepazasi mapakeji inokwenenzvera chinhambwe pakati pezvikamu. Uku kudzikiswa kwehurefu hwekutsvagisa kunotungamira kudzikira kushorwa mudunhu, kuderedza chizvarwa chekupisa uye kunonoka kwechiratidzo, uye kuwedzera mashandiro emagetsi ese edunhu.

Modular Dhizaini uye Nyore Kukwidziridzwa

Imwe yemabhenefiti akakosha ePoP tekinoroji ndeye modular dhizaini, iyo inobvumira zvikamu zvekuyeuka kuti zvichengetedzwe mumapakeji akasiyana. Iyi modular nzira inoita kuti zvive nyore kukwidziridza kana kutsiva ndangariro zvikamu pasina kuchinja iyo microcontroller yese kana application processor. Uku kuchinjika hakungorerutsa maitiro ekusimudzira asiwo kunoderedza mitengo uye nguva yekudzikira zvine chekuita nekutsiva zvinhu zvisina kunaka.

Kuedzwa Kwemunhu uye Kuwedzera Kuvimbika

Kupatsanurwa kwezvikamu zvekurangarira muPoP tekinoroji inogonesa kuyedzwa kwega kwega kwezvikamu zvakasiyana panguva yekugadzira. Iyi nhanho yekuyedza granularity inova nechokwadi chekuti chikamu chimwe nechimwe chinosangana nezvinodiwa, zvichitungamira kukuvimbika kwepamusoro kwechigadzirwa chekupedzisira. Pamusoro pezvo, kugona kuyedza uye kutsiva zvinhu zvega kunowedzera hupenyu hurefu uye kukwidziridzwa kwechishandiso, zvichiwedzera kuvimbika kwayo kwese.

Dhizaini Flexibility uye Kuenderana

PoP tekinoroji inopa vagadziri kuchinjika kukuru mukusarudza ndangariro mapakeji anonyatsoenderana nezvavanoda. Vagadziri vanogona kusanganisa uye kuenzanisa akasiyana mamicrocontrollers uye ndangariro mapakeji chero achienderana neCPU package. Kuenderana uku kunobvumira kuwanda kwemaitiro ekugadzira, zvichiita kuti vagadziri vagadzirise magadzirirwo avo kune chaiwo zvinodiwa uye optimize mashandiro.

Pakazara, tekinoroji yePackage-on-Package (PoP) inopa zvakanakira zvakasiyana-siyana, zvinosanganisira kushanda zvakanaka kwenzvimbo, kushanda kwakawedzerwa, dhizaini yemodular, kusimudzira zviri nyore, kuyedzwa kwega kwega, kuvimbika kwakawedzerwa, kushanduka-shanduka kwedhizaini, uye kuenderana. Zvakanakira izvi zvinoita kuti PoP ive sarudzo inokwezva vagadziri vari kutsvaga kuwedzera kushanda uye kushanda kwemagadzirirwo avo ePCB.

Kana chinodiwa ichi chichikanganisa kuwanikwa kana kuburitswa kwekugadzirwa, chienzanise nezvikamu zvebhodhi redunhu uye kugadzirwa kwePCB ine simba remagetsi usati watumira mafaira ekupedzisira kuti aongororwe.

mhedziso

Kuunganidzwa kwezvikamu zvePoP pamusoro pechinhu inzira yakaoma inoda kunyatsofungisisa nezvemaumbirwo ezvikamu, matekiniki ekusonesa, uye nzira dzekuongorora. Nekufambira mberi kwetekinoroji yePoP, vagadziri vanogona kuwana huwandu hwakawanda hwekubatanidza, zvinhu zvidiki, uye kuvimbika kuri nani mumidziyo yemagetsi.