Sei Uchishandisa Goridhe Pane Pane Sirivha neMhangura muPCB Manufacture?

Mabhodhi edunhu akadhindwa (PCBs) anoumba musana wemagetsi, achipa tsigiro yemagetsi uye kubatanidza magetsi pakati pezvikamu. Mapadhi uye anoteedzera paPCBs anowanzo gadzirwa kubva kumhangura, iyo inokurumidza oxidize kana yaiswa mumhepo. Iyi oxidation inogona kukanganisa solderability uye kushanda kwemagetsi. Naizvozvo, mapeji epamusoro segoridhe, sirivheri kana organic coating anoiswa kudzivirira mhangura kubva mukuora.

Ichi chinyorwa chinoongorora chikonzero chekushandisa inodhura goridhe plating maringe nesirivha yakachipa kana mhangura muPCB yekugadzira.

Mhedziso yeCommon PCB Surface Inopedza

Iwo akafumurwa emhangura anoteedzera paPCB akaputirwa nesimbi coatings kana organic mafirimu kudzivirira oxidation. Iyo yakakurumbira metallic surface finishes inosanganisira:

• Kunyudza sirivheri - Chemical sirivheri plating maitiro
• Organic solderability preservatives (OSP) - Organic inodzivirira mafirimu
• Electrolytic nickel/goridhe - Electroplated nickel pasi pegoridhe
• Electroless nickel / kunyudza goridhe (ENIG) - Electroless nickel wobva wanyudza goridhe

Pakati peizvi, ENIG uye electrolytic nickel/goridhe inoshandisa goridhe kuwedzera corrosion kuramba uye conductivity. Asi goridhe ndirowo kupera kunodhura.

Iko Kudikanwa kweSurface Kunopera paPCBs

MaPCB anoita sepuratifomu yekuisa uye yekubatanidza zvinhu zvemagetsi. Mateki emhangura akaiswa paPCB anopa nzira dzekufambisa dzezviratidzo uye simba.

Zvisinei, mhangura inoumba nyore-conductive copper oxide kana yaiswa muokisijeni uye mwando. Iyi oxidation inogona kutotanga panguva yekugadzira PCB pachayo kana mhangura yaburitswa.

Iyo oxidation process inoenderera mberi sezvo mhangura isina chinhu ichisiiwa ichiratidzwa kune ambient nharaunda. Izvi ndezvechokwadi kunyanya kune soldering pads inoda kutengeswa gare gare kuti ibatanidze zvikamu. Kugadzirwa kweoxide pamapadhi kunokanganisa kunyungudika.

Uyezve, iyo oxidation inowedzera resistivity, iyo inokanganisa magetsi ekubatanidza. Murombo solder majoini somugumisiro anogona kukonzera mudziyo kukundikana kana kuderedza kuvimbika.

Naizvozvo, PCB yekumusoro inopedzisa inoshanda akawanda mabasa:

• Dzivirira mhangura oxidation isati yatengeswa
• Gonesa yakavimbika solder majoini kuumbwa
• Chengetedza kushomeka kwakaderera pamajoini
• Dzivirira mhangura kubva pakuora kwehupenyu hwechigadzirwa

Nei Goridhe Inoshandiswa muPCB Kugadzirwa

Goridhe inopa yakasarudzika mabhenefiti inoita kuti ive simbi yesarudzo yePCB pamusoro inopera mune akawanda maapplication:

Yakanaka Kwazvo Kuramba

Goridhe inonyudza zvakanyanya uye haiite oxidize kana kuodza pasi pemamiriro ekushandiswa akajairwa kana nharaunda. Izvi zvinochengetedza kuchena uye conductivity yegoridhe-yakapfekwa kwemakumi emakore ehupenyu hwechigadzirwa.

High Electrical Conductivity

Ndarama ine yepamusoro yemagetsi conductivity rating mushure mesirivha nemhangura. Asi zvese zviri zviviri sirivha nemhangura zvinowanzoita ngura pamusoro. Goridhe's yakanakisa conductivity inosanganiswa neiyo corrosion resistance.

Flexible Deposition Options

Goridhe rinopfekwa rinogona kuiswa zviri nyore paPCB kuburikidza nemaitiro senge electroless kana electrolytic plating. Ukobvu hunogona kudzorwa sezvinodiwa.

Outstanding Solderability

Ndarama inobvumira kuumbwa kwemajoini akavimbika ekutengesa pasina nyaya dzekunyorova. Iyo solderability inoramba yakasimba panguva yekuchengetedza.

Yakareba Sirufu Hupenyu

Ndarama inochengetedza kuchena kwayo uye zvimiro nekusingaperi. Izvi zvinoita kuti masherufu akareba ararame egoridhe-akapfatwa maPCB.

Ductile Deposits

Ndarama inopa ductile coatings iyo isinganyanyi kutsemuka kana kutsemuka pasi pekupisa bhasikoro kushushikana.

Wire Bonding Mano

Iyo goridhe kupera inobvumira yakakwira goho waya kubatanidza, yakakosha kune microelectronics.

Reworkability

Kupfeka kwegoridhe kunobvumira akawanda kudzokorodza uye kugadzirisa matenderera pasina kurasikirwa nepamusoro pekuvimbika kana zvivakwa.

Lead-Free Compatibility

Ndarama inonyatsoenderana neasina-lead-asina solders uye soldering maitiro.

Zvakaipa zveSilver neCopper Finishes

Sirivha nemhangura zvinopa zvakanakira senge yepamusoro conductivity uye yakaderera mutengo unopesana negoridhe platings. Zvisinei, zvose sirivha nemhangura zvinotambura nemiganhu:

Oxidation uye Corrosion: Sirivha nemhangura zviri nyore oxidize uye corrode munzvimbo dzakapoteredza. Izvi zvinotungamira kukuwedzera kupikisa kuramba uye kushomeka solderability nekufamba kwenguva.

Kuvimbika kwakashata kweSoldering: Kuumbwa kweoxide kunopindira nekunyorova kwakaringana kana uchitengesa. Dissimilar metal interfaces nemasoja inowedzerawo njodzi dzekukundikana.

Yakaderedzwa Sherufu Hupenyu: Oxidation uye ngura zvinokonzeresa pane sirivheri nemhangura nzvimbo dzinotanga pakarepo mushure mekuputirwa. Izvi zvinoda soldering nguva pfupi mushure mekugadzira.

Yakaderera Wire Bonding: Njodzi dzeoxidation dzinounza matambudziko ekubatanidza waya nesirivha / mhangura inofananidzwa negoridhe.

Thermal Cycling Kuvimbika: Sirivha nemhangura oxides zviri nyore kukuvadza pasi pekuchinja kwekushisa kunopesana negoridhe ductile.

Mamiriro Ezvakatipoteredza: Kusvibisa machira esirivha kunogona kuburitsa muchetura sirivheri mumhepo panguva yekushandiswa uye kuraswa.

Yepamusoro Hupenyu Mutengo: Kakawanda kuonda uye kutengesa nyaya dzine sirivheri/mhangura nzvimbo inoshandura mukugadzirisa kwepamusoro, kugadzirisa zvakare uye mutengo wewaranti.

PCB Surface kupedza Maitiro eGoridhe

Electroless Nickel Immersion Gold (ENIG)

Electroless Nickel Immersion Goridhe (ENIG) inzvimbo inoshandiswa zvakanyanya pamusoro pekupedzisira kune akadhindwa edunhu mabhodhi (PCBs). Inoumbwa nematanho maviri-matanho anosanganisira kuiswa kwenickel negoridhe layer pamatehwe emhangura ePCB. Heano kuparara kweiyo ENIG maitiro uye ayo akakosha maitiro:

Electroless Nickel Plating

• Padanho rekutanga, mitsetse yemhangura yePCB inonyudzwa mubhavhu rekugezesa kemikari rine mushonga wenickel munyu, zvinoderedza, uye zvinosimbisa.
• Iyo nickel ions mumushonga inoderedzwa zvakanyanya pamusoro pemhangura, ichiita yunifomu uye inoenderera mberi ye electroless nickel.
• Ukobvu hwenickel layer hunowanzo kubva pa3-6 μm (micrometers). Ukobvu uhwu hunopa kufukidzwa kwakanaka uye hunoshanda sechivharo chekuparadzira pakati pemhangura negoridhe.

Kunyudza Goridhe Deposition

• Mushure meiyo nickel plating, iyo PCB inonyudzwa mumushonga une munyu wegoridhe.
• Maion egoridhe mumushonga anodzikiswa nekemikari, achiisa chidimbu chitete chegoridhe pamusoro penickel kuburikidza nekunyudza.
• Iyo yegoridhe layer kazhinji ine ukobvu kubva pa 0.03-0.15 μm, ichipa yakatetepa asi inoshanda yekudzivirira yakapetwa.

Hunhu Hunokosha uye Mabhenefiti e ENIG

1. Diffusion Barriers: Iyo nickel layer inoshanda sechipinganidzo chekuparadzira, ichidzivirira kutama kwemhangura mudura regoridhe uye zvinopesana. Ichi chipingamupinyi chinobatsira kuchengetedza kutendeseka kweiyo goridhe layer uye inodzivirira kuumbwa kweiyo intermetallic komisheni iyo inogona kukanganisa solder joint kuvimbika.
2. Solderability: ENIG inopa yakanakisa solderability nekuda kweiyo flat uye yakatsetseka yegoridhe pamusoro. Iyo yegoridhe layer inofambisa kunyorova kwe solder panguva yegungano, kuve nechokwadi chekuti majoini akavimbika anotengeswa.
3. Corrosion Dziviriro: Goridhe inoshingirira zvakanyanya kune oxidation uye corrosion, ichipa yakavimbika inodzivirira layer yepasi pasi nickel nemhangura. Uku kuramba kwecorrosion kwakakosha kune maPCB anoshandiswa munzvimbo dzakaoma kana kuoneswa hunyoro.
4. Surface Flatness: Iyo ENIG maitiro inoguma mune yakati sandara uye yakarongwa pamusoro, iyo yakakosha kune yakanaka-pitch surface Mount tekinoroji (SMT) zvikamu. Iyo yakatsetseka yegoridhe yepamusoro inobatsira kuve nechokwadi chekuiswa kwechikamu uye yakavimbika solder yekubatanidza.
5. Kuita Kwakanaka Kwemagetsi: ENIG ine yakanaka yemagetsi conductivity uye yakaderera kuonana kuramba, zvichiita kuti ive yakakodzera kune yakakwirira-frequency uye yakakwirira-kumhanya dhijitari application.
6. Wire Bonding Compatibility: Iyo goridhe layer mu ENIG inoenderana newaya bonding matekiniki anoshandiswa kubatanidza semiconductor chips kuPCB. Iyo yakatsetseka yegoridhe yepamusoro inofambisa yakavimbika waya bonding kubatanidza.

Pakazere, Electroless Nickel Immersion Goridhe (ENIG) inopa yakavimbika uye inosiyana-siyana pamusoro pekupedzisira kwePCBs, ichipa yakanakisa solderability, corrosion resistance, uye kushanda kwemagetsi. Kushandiswa kwaro kwakapararira mumaindasitiri akasiyana siyana, anosanganisira emagetsi evatengi, nharembozha, aerospace, uye michina yekurapa.

Zvimiro zveGoridhe-Plated PCBs maitiro

Solderability Nyaya

Nepo iyo goridhe plating layer ichiratidza kugadzikana kwakanaka kwemakemikari, kugadzikana uku kunorevawo kuti goridhe haigadzirise kuumba yakanaka alloy ine solder, zvichikanganisa kunaka kwemasoja majoini.
Munguva yekugadzira, kana iyo goridhe layer yanyanya kukora, goridhe rinogona kunyungudika mune solder, zvichikonzera brittle solder majoini. Chiitiko ichi chinozivikanwa se "gold embrittlement."

Mashandisiro Matanho

Nekuda kwenyaya dzekutengesa, goridhe plating hariwanzo shandiswa munzvimbo dzinoda kushambadzira kwakawanda. Pane kudaro, inonyanya kushandiswa kwekubatanidza mapoinzi ekubatanidza kana nzvimbo dzakagadzirirwa aluminium waya bonding.
Munzvimbo dzinodiwa kushambadzira, dzimwe nzira dzekurapa pamusoro pepamusoro dzakadai seOrganic Solderability Preservatives (OSP), solder isina lead, kana matin-lead alloys anowanzo shandiswa.

Dhizaini Kufunga

Paunenge uchigadzira PCB ine goridhe yakanamirwa, kunyatsotariswa kunofanirwa kupihwa kune ukobvu hwegoridhe layer uye nzvimbo yekushandiswa kwayo kuona kuti mabhenefiti egoridhe anogona kushandiswa uku uchidzivirira zvipingamupinyi mukutengesa.
Naizvozvo, kunyangwe nekuita kwepamusoro kwegoridhe-yakapfatwa maPCB mune zvimwe zvinhu, pane zvechokwadi zvipimo maererano nekuita kwekutengesa. Izvi zvinogumira zvinoda kunyatsotariswa panguva yekugadzira uye kugadzira.

Mashandisirwo Akakosha eGoridhe-Plated PCBs

Mimwe mienzaniso yeakakosha maapplication anovimba negoridhe-akapfatwa maPCB anosanganisira:

• Aerospace uye Avionics: Kuvimbika kweGoridhe kunovimbisa kuita kwehupenyu hwese mumamishini emuchadenga.
• Medical Devices: Goridhe machira anodzivirira ngura mumidziyo yakasimwa uye diagnostics.
• Undersea Electronics: Goridhe inomira zvakanyanya-kudzvanywa uye saline mamiriro anowanikwa mumidziyo yegungwa.
• Yepamusoro-Speed ​​Digital Circuits: Kuita kweGoridhe kunogonesa-isina kukanganisa data kutapurirana kusvika kune akawanda-GHz ma frequency.
• Microwave uye Radar Modules: Goridhe plating inopa yakaderera kurasikirwa pane microwave frequency.
• Zvibatanidza uye Electromechanical Relays: Goridhe rakaoma pane nzvimbo dzekusangana dzinobata mamirioni ekuchinja kutenderera.
• Photonic/Optoelectronic Systems: Goridhe rinopfekwa rinopa kutarisisa kwakanyanya kunodiwa mune chaiyo optical zviridzwa.

mhedziso

Muchidimbu, goridhe ndiyo yakanakira PCB pamusoro pekupedzisa kwekushandisa kunoda kuvimbika kwekupedzisira, conductivity, corrosion resistance, solderability uye waya bonding performance. Mutengo wegoridhe wekutanga wepamusoro unoruramiswa nekuvandudzwa kwemhando yechigadzirwa, hupenyu hwehupenyu, uye nenjodzi dzakaderedzwa dzekutadza mumasisitimu akakosha. Izvi zvinoita kuti goridhe rikoshese huremu hwayo mukugonesa chizvarwa chinotevera chemagetsi kuti chirambe chichisundira miganhu yekushanda uye kusimba.

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