PCB Surface Pedzisa Mhando & Kuenzanisa

MaPCB anoumba hwaro hwemagetsi ese emazuva ano. Sezvo maseketi akabatanidzwa nezvimwe zvikamu zvichiva zvishoma nezvishoma uye zvichiwedzera kuoma, maPCB anofanira kusangana nezvinodiwa zvakanyanya zvekuvimbika kwechiratidzo, kushanda zvakanaka, uye kuvimbika. Chimwe chinhu chakakosha chinokanganisa zviyero izvi kupedzisa kwePCB.

Kupera kwepamusoro, kana kupeta, kunoshandiswa kune isina chinhu PCB inoshanda akawanda mabasa:

• Inodzivirira pasi pemhangura kubva kune oxidation uye kusvibiswa
• Inogonesa uye inosimudzira solderability
• Inobatsira kuwirirana kwechikamu uye kubatanidza
• Inokanganisa kutapurirana kwechiratidzo uye kutendeseka
• Inokanganisa manufacturability uye kugadzirisa

Nesarudzo dzakasiyana siyana dzave kuwanikwa, kusarudza yakakwana yepamusoro pekupedzisira kunosanganisira kuyera kuita, mutengo, kugadzira, uye zvinodiwa zvekushandisa. Ichi chinyorwa chinopa tarisiro yehunyanzvi yeakajairika PCB pamusoro pekupedzisira, kusanganisira iwo akakosha maitiro, zvakanakira uye zvazvakaipira, maapplication akanyatsokodzera mhando yega yega, uye kugadzirisa kufunga.

Kutyaira Zvinhu muSurface Pedzisa Sarudzo

Mafungiro akati wandei anotungamira kusarudzwa kwePCB pamusoro pekupedzisira kune yakapihwa application, inosanganisira:

• Solderability uye Wettability: Iyo yekuputira yepamusoro inofanirwa kunyungudutswa nyore, ichigadzira inowirirana, yakafanana, yakabatana pakati pemapadhi / zvikamu uye solder pasina kusvetuka kubatanidza kana bhiriji. Wettability inomiririra kupararira / kuomerera kweiyo solder yemvura pakupera kwepamusoro.
• Oxidation uye Sherufu Hupenyu: Kupera kwepamusoro kunodzivirira kufambiswa nemhepo kwemhangura nekufamba kwenguva isati yatengeswa kuchengetedza solderability. Hupenyu hwesherufu hunoenderana nekusimba kwekupfeka.
• Bonding Compatibility: Yekubatanidza waya kana kunamatira kune conformal coatings kana potting makomisheni.
• Kushamwaridzana Nezvakatipoteredza: Kutevedza mutemo wekushandiswa kwezvinhu, marara, tsvina, uye hutano hwevanhu / kwezvakatipoteredza nekuchengetedzeka.
• Kuvimbika uye Kusimba: Kuenderera mberi kushanda pasi pemagetsi, zvinopisa, uye zvemakanika kushushikana pamusoro pehupenyu hwechigadzirwa. Inosanganisira kuramba kudziya kana mechanical shock, kuneta, kutama kwemagetsi, nezvimwe.
• Chiratidzo Kutendeseka: Chenesa masaini ane yakadzikiswa crosstalk kana ekunze emissions yekumhanya kwazvo, radio frequency (RF), kana inonzwisa tsitsi.
• Inspectability uye Testability: Kureruka kwe-in-line otomatiki yekutarisa yekuongorora uye yemagetsi kuyedzwa. Clear finishes inogonesa kuongorora; solder masks inogona kukanganisa.
• Mutengo: Zvese zviri zviviri zvekushandisa uye kugadzirisa mari, yakaenzana nekuita.
• Manufacturability: Kuenderana nemaitiro ekugadzira senge solder, kuchenesa, kupeta, uye kusangana. Minimized rework rates.

Kukosha kwechinhu chimwe nechimwe kunoenderana nemhando yechigadzirwa uye mamiriro ekushanda. Semuenzaniso, hupenyu hwesherufu uye oxidation kuramba inogona kunge isina basa muvhoriyamu yakakwira chete-mu-nguva yekugadzira ine shoma yekuunganidza. Nekudaro, zvigadzirwa zvekurapa kana zvemuchadenga zvinogona kugara kwemwedzi kana makore zvisati zvaendeswa, zvinoda hupenyu hurefu.

PCB Kugadzira Maitiro eKutarisisa

A PCB inotsigira michina yemagetsi uku ichipa kubatanidza kwemagetsi pakati pawo. Bhodhi pachayo ndeye insulating fiberglass epoxy laminate yakapfeka nefoiri yemhangura yakaonda kune rimwe kana mativi ese. Iyi foil ine photolithographically yakarongedzwa mumateki nemapadhi, ichigadzira nzira dzekufambisa. Zvikamu zvinotengeswa kumapadhi, kungave kuburikidza negomba kana pamusoro (SMT). Multi-layer mabhodhi anonamira pamwe ekuwedzera conductive uye insulating layer mukati.
Bare boards kubva kuPCB fab inofanirwa kuita akati wandei ekupedzisa maitiro pamberi pehuwandu nezvikamu:

Kugadzirira Pamusoro - Kushambidza nekukwesha mhangura zvakanaka kunobvisa oxidation kana kusvibiswa kubva mukuchengetedza, kutumira kana kubata.

Kushandiswa Kwekupedzisa Pamusoro - Kuputira uku kunoiswa kuburikidza nemaitiro emakemikari akanyorova anotsanangurwa pazasi kune yega yega mhando yekupedzisa. Ukobvu, kuomarara, nezvimwe zvinodzorwa zvakanyanya.

Kuputira masiki esimbi - Pamusoro pebhodhi rese panopinda neinki ye epoxy, pasina ma contact pads uye zvinobatanidza zvinosara pachena. Zvinopa insulation uye zviratidzo.

Kushandiswa kweSilkscreen - Zviratidzo zvakadhindwa zvezvikamu, malogo, zviratidzo zvemabhodhi, zviratidzo zvepolarity nezvimwe zvinobatsira pakugadzira nekugadzirisa matambudziko.

Kuedzwa kwemagetsi - Bhodhi rega rega rinoedzwa mukati medunhu kuti rione kana magetsi anoenderana nezvinodiwa uye kuti rione kana paine zvikanganiso nekukurumidza. Mabhodhi anopasa/anokundikana zvichienderana nezvinodiwa zvemhando yepamusoro.

Iyo yepamusoro inopedzisa inoumba yekunze layer inopindirana pad copper uye yakaiswa solder, uye nekudaro inogona kukanganisa zvakanyanya mhedzisiro yekuzotevera kugadzirisa kana isina kunyatsoenderana navo. Iye zvino tinoongorora anonyanya kufarirwa epamusoro pekupedzisira sarudzo:

Hot Air Solder Leveling (HASL)

Iyo yakareba kwazvo yakamira PCB pamusoro pekupedzisira, inopisa mhepo solder leveling (HASL) inopfeka bhodhi neyakanyungudutswa solder, ichigadzira inotengeswa tin-lead alloy layer. Sezvinoratidzwa nezita rayo, mapanga enitrogen anopisa anotsvedzerera solder yemvura painotonhora, zvichideredza kuvakwa kusina kuenzana. LEad-isina HASL inotsiva tin-silver-copper solders.

Maitiro: Mabhodhi anopinda muHASL sisitimu pane inotakura, ichipfuura pasi pemhepo inoenda mberi yeyakanyungudutswa solder yakabatwa mukamuri manifold. Mushure mekunyudzwa, mapanga emhepo anoputika mapuranga nenitrogen inopisa kana argon gasi kuita kuti solder inotonhoresa iite muchero wakapfeka nekunyorova kwemhangura nguva pfupi solder isati yaoma. Edge rails ine maitiro. Iwo ma paramita - tembiricha, nguva yekuratidzwa, kuyerera kwegasi uye kudzvanywa - inoda kudzora kwakasimba kuti ibudise inowirirana, yemhando yepamusoro kupera.

Unhu Hwakakosha:

• Mutengo wemutengo wakaderera uye wakakwira throughput
• Yakakura tekinoroji ine makore makumi mashanu track rekodhi
• Solder zvakanaka kune tin-based solders uye zvikamu
• Kunyorova kwepamusoro uye kurongeka
• Kufukidzwa kwemhangura yepamusoro kunopikisa oxidation
• Lead-yemahara inowanikwa maererano neRoHS zvinodiwa
• Inooneka inotarisika kupera

Applications:

Nekuita kwakasimba pamitengo yakaderera, HASL inokodzera mutengi asingatengi zvemagetsi, midziyo yemagetsi, mota dzemagetsi, uye nharembozha/networking michina.

Advantages:

• Isingadhuri, yakakwirira-vhoriyamu inokwanisa
• Hurefu hwesherufu
• Consistent solderability
• High etch / kusvibiswa kuramba
• Reworkable
• Inoonekwa kuti iongororwe

payakaipira:

• Haina kurongeka zvakakwana kune yakanaka pitch ICs
• Thermal shock inogona kuchinjika mapuranga
• Metal dissolution nekufamba kwenguva
• Kubatanidza njodzi nemadhizaini akakora
• Kukwetsura nyaya nemarata chaiwo
• Kugadzirwa kwemarara uye tsvina

Organic Solderability Preservative (OSP)

OSP inopfekedza maronda emhangura nefirimu rinodzivirira rinoumbwa nemidazole, triazole, kana mamwe macommunication heterocyclic. Iyi nhete yepolymer layer ingori gumi-10 angstroms makobvu mawadhi kubva kune oxidation kwemwedzi mitanhatu-100 ichibvumira solder kuyerera kana yapisa. Iyo yekupfeka inoiswa nekunyudza kana kupfapfaidza mabhodhi mushure mekuita microetching.

Process:

Kugadzirira kwepamusoro uchishandisa kuchenesa uye microetching inogadzirira mabhodhi eOSP application:

1. mapuranga anopinda mukamuri yakapoteredzwa
2. OSP mhute inopfapfaidzwa zvakaenzanirana pamabhodhi
3. mapuranga anobuda mukamuri uye akaoma
4. kuchenesa kwekupedzisira

OSP mhinduro dzine inodzikamisa maajenti uye pH buffers yekushanda kwakanyanya. Liquid atomization, tembiricha, nguva yekugara, kemikari kudzika uye post-coating kubata kunofanirwa kudzorwa kuti ibudise iyo chaiyo coating mhando uye kuenderana.

Unhu Hwakakosha:

• Ultra-yakaonda transparent coating
• Lead-isina uye zvakatipoteredza-yakachengeteka
• Smoother pane HASL ine planarity yakanaka
• Reworkable kupera
• Mari yekutanga yakaderera pane mamwe machira

Applications:

OSP inoshanda zvakanaka kune isina waya uye inotakurika yevatengi zvemagetsi, zvigadzirwa zveIoT, mota, avionics, uye zvemagetsi zvekurapa uko kuvimbika uye zvinotungamira zvinofanirwa kudzikiswa. Iyo planar yepamusoro inobatsira mapuranga akatsikirirwa.

Advantages:

• Rakareruka-mutengo wakaderera application
• Yakanyanya kuronga kupera
• Hurefu hwehupenyu hwesherufu
• Consistent solderability
• Easy rework of OSP-coated boards
• Inoderedza mabhurugwa mapfupi

payakaipira:

• Inogona kukanzurwa pakubata kana isina kuvharwa
• Yakaganhurirwa solder masking kugona
• Zvakaoma nemaziso kuongorora coverage
• Fafitera repfupi regungano rakambovhurwa
• Kusavimbika kushoma pane IPC kuyedzwa*
• Copper oxidation inotangazve nekukasira pamusoro pe175°C

IPC kuyedzwa kwakabatana neOSP machira nekuwedzera kutadza mazinga pasi pekupisa, humidity, uye vibration kuratidzwa. Nekudaro, vazhinji vanobudirira kushandisa OSP zvisinei.

Kunyudza Sirivha

Kunyudza maPCB mune sirivheri kemikari deposition yekugezera mahwendefa esirivha yakatetepa pamatehwe emhangura, uchishandisa galvanic displacement reaction. Iyo yekupfeka inomhanya 15-25 microinches (0.4-0.6 microns) gobvu. Inopikisa kusvibiswa kana oxidation kwenguva yakareba.

Process:

Microetching inomutsa nzvimbo yemhangura. Mabhodhi anonyudzwa mune acidic sirivheri nitrate kana sirivheri fluoborate mhinduro ine organic stabilizers uye accelerators yakawedzerwa. Ioni dzemhangura dzinochinjanisa nzvimbo nemaoni esirivha anoisa bhodhi. Iwo maparamendi - tembiricha, nguva yekugara, makemikoro ekugadzira uye kutarisisa kwavo - zvese zvinoda kudzora nekungwarira kukwidziridza kusimba uye zvakafanana.

Unhu Hwakakosha:

• Mutengo wakaderera une mwero throughput
• Yakanakisa solderability uye conductivity
• Kudzivirira kusvibisa uye oxidation
• Simba rakanaka rekunamatira uye reworkability
• Inokodzera waya yekubatanidza aluminium

Applications:

Kunyudzwa sirivheri inoshanda kune isina waya kutaurirana, mota infotainment uye ADAS masisitimu, mwenje we LED, uye mamwe magetsi anoenderana nekuvimbika.

Advantages:

• Kuvimbika kwakasimba kwejoint solder
• Kuchengetedza kwepamusoro kwenguva refu
• Yakanyanya flat planar surface
• Mutengo wakaderera pane kupera kwegoridhe
• Lead-isina uye RoHS inoenderana

payakaipira:

• Uso hwepamusoro hunochinja zvishoma nekufamba kwenguva
• Inogona kukweshwa panguva yekubata
• Hupenyu hupfupi hwekushanda hwakambofumurwa
• Zvakaoma pakuongorora-mudunhu
• Higher processing tembiricha

Kunyudza Tin

Kunyudza maPCB akacheneswa mumarata anopisa anoisa chigadziko cherata chinodzivirira panzira dzemhangura. Organic additives inounzwa mubhati yekunyudza inoshandura chimiro cherata resatin kupera kubva kucrystalline hombe kuenda kumicro-crystalline, kudzivirira nyaya dzendebvu.

Process:

Kugadzirira kwebhodhi kunotevera kuburikidza neyakajairwa kucheneswa, microetching, kugezesa mvura uyezve kunyudza asidhi usati wapinda mubhati rekunyudza. Kuchengeta chaiyo tembiricha mutemo weiyo alkaline tin mhinduro pamwe neinodzorwa nguva yekugara, kusimudza kumhanya, uye kuwedzera kwekuwedzera kunotungamira mukuenderana. Deposition inovaka 4-10 microinch (0.1 - 0.25 micron) gobvu matte tin layer.

Unhu Hwakakosha:

• Matte white tin coating
• Yakanakisa solderability yakachengetedzwa
• Layer ukobvu kufanana
• Minimal copper dissolution
• Drop-in solution inotsiva tin-lead

Applications:

Kunyudza marata mabhachi akaoma kunzwisisa, akazara-akazara mabhodhi zvakanaka. Iyo inomira yakakwirira tembiricha alloys sesirivha-mhangura brazing apps. Iyo inokwanisika maitiro zvakare inokodzera yakakwirira-kuvimbika kushandiswa mukudzivirira, aerospace, navigation uye kutaurirana.

Advantages:

• Smooth planar jasi re Ultra yakanaka pitch ICs
• Hapana nyaya dzemashavi
• Reworkable uye kugadziriswa kupera
• Isingapindiki kune oxidation mukuchengetedza
• Flux-shoma soldering kugona
• Mutengo wakaderera wenguva refu

payakaipira:

• Hupenyu hupfupi hwekushanda hwakambofumurwa
• Inokurumidza kusviba uye kugomara
• Kugumisa kunetseka ne matte kupera
• Zvakaoma nemaziso kuongorora coverage
• Tembiricha inonzwisisa maitiro

Immersion Gold (ENIG)

Electroless nickel immersion gold (ENIG) inoisa maviri esimbi akaturikidzana ekudzivirira kwakasimba uye solderability. Chekutanga, auto-catalytic chemical reaction plates nickel mhiri kwemhangura kusvika 3-7 microns ukobvu pasina chero magetsi. Zvino kuita kwekuchinja pakati penickel nemhinduro kunotsiva maatomu epamusoro penickel negoridhe rakatetepa rinongori 0.05-0.15 microns gobvu.

Process:

Iyo yekutanga PCB microetching inogadzirira mhangura. Mabhodhi anopinda mune electroless nickel plating tank. Kana yangogadziriswa, iyi autocatalytic deposition process inoramba ichiisa nickel pasina chero magetsi. Tembiricha, pH buffers, kemikari kudzika uye nguva yekugara inofanirwa kugara yakadzikama kuitira kuenderana. Kutevera kugezwa kwemvura, mabhodhi anonyudzwa mumushonga wegoridhe unopisa uyo unobvisa maatomu enickel, kugadzira goridhe rakatetepa.

Unhu Hwakakosha:

• Mari ine mwero yekudzivirirwa kwakavimbika
• 12+ mwedzi pasherufu hupenyu
• Ndarama yegoridhe inoramba ichinyanya inert
• Solderable pasina preconditioning
• Yakanyanya sandarara pamusoro
• Yakavimbika asi yakaoma nzira

Applications:

ENIG inokodzera zvigadzirwa zvemhando yepamusoro senge bhizinesi maseva, telecom zvivakwa, zvekudzivirira zvemagetsi, avionics, uye zvigadzirwa zvekurapa uko hupenyu hurefu hwesherufu uye kuvimbika kwemunda kunofambisa kukosha pamusoro pemutengo.

Advantages:

• Kugara kwenguva refu oxidation kudzivirira
• Yakanakisa planarity inobatsira yakanaka pitch ICs
• Kuenderana yunifomu ukobvu
• Highly solderable pamusoro
• Hard gold layer inoshingirira kupfeka
• Yakanakira aluminium wire bonding

payakaipira:

• Kudhura kwezvinhu zvakanyanya (goridhe)
• Complex process control
• Brittle nickel layer pasi pegoridhe
• Black pad ngozi nekufamba kwenguva
• Ukobvu hwegoridhe hwakaoma kuongorora

Electrolytic Nickel/Goridhe

Nickel/goridhe platings inoisa maviri esimbi akaturikidzana achishandisa magetsi anosiyana neENIG. Yekutanga inopenya nickel underplating inomhanya zvakanyanya pa100-250 microinches (2.5-6 microns) iyo goridhe inopenya coating isati yadzika pa10-50 microinches (0.25-1.25 microns). Iyi electrolytic process inobvumira kukora, kuomarara kwegoridhe zvidimbu.

Maitiro Ongororo:

Microetched PCBs inopinzwa munickel uye goridhe electrolytic plating matangi mukutevedzana uko akanyudzwa anode uye cathodes anobvumira ikozvino kuyerera ichiisa simbi pamabhodhi. Kunyatso gadzirisa mhinduro chemistry, tembiricha, voltages uye waveform paramita inovimbisa kuenderana. Fixture dhizaini inodzivirira homwe dzemhepo kana density musiyano pamabhodhi.

Unhu Hwakakosha:

• Mukobvu wakaoma goridhe layer
• Inoshingirira kudzokororwa kukwirana
• Lead-isina uye RoHS inoenderana
• Reworkable kupera

Applications:

Zvisungo, zvigunwe zvemupendero, mapoinzi ekusangana uye mapedhi ekubatanidza anoshandisa kusimba ukuwo mutengo uri pakati nepakati uchienderana nepamusoro vhoriyamu-isinganzwisisi maapplication.

Advantages:

• Zvakaoma, zvakanyanya kupfeka goridhe risingachinji
• Mutengo wezvinhu wakaderera vs. ENIG
• Kuvimbika solder majoini
• High throughput process
• Inobvumira kuongorora kuongorora

payakaipira:

• Yakanyanya hunyanzvi hwekunzwa
• Nguva yakareba process
• Brittle layers inogona kutsemuka
• Dense PCBs njodzi plating voids
• Soldermasked nzvimbo dzingada mabhazi

Electroless Ni Electroless Pd Immersion Au (ENEPIG)

ENEPIG inopedza kukwidziridza ENIG, ichitsiva nickel underlayer neelectroless palladium isati yaiswa goridhe kuti iwedzere kudzivirira pamusoro pasina nickel corrosion kana dema pad ngozi. Senzira nyowani, parizvino inodhura kupfuura ENIG zvisinei.

Unhu Hwakakosha:

• Yakanakisa sherufu hupenyu 
• Corrosion inodzivirira uye inert
• Superior oxidation barriers
• Lead-isina uye RoHS inoenderana
• Reworkable kupera

Applications:

ENEPIG inonyatso kuenderana nepamusoro-yakavimbika maapplication ane sherufu refu inogara senge aerospace, kudzivirira, uye zvigadzirwa zvekurapa uko kuvimbika kutungamira ukoshi pane yekutanga mutengo.

Advantages:

• Kuvimbika kwepamusoro uye hupenyu hurefu
• Inobvisa njodzi yepedhi dema
• Ideal for wire bonding zvinodiwa
• Yakanyanya flat planar surface
• Solderable kwemakore 10+

payakaipira:

• Kupera kwemutengo wepamusoro
• Yarebeswa process nguva
• Zvishoma zveindasitiri ruzivo
• Matambudziko ekudzora maitiro
• Zvakaoma kuona

mhedziso

Iyi yekutarisisa kwekutanga kwepamusoro pekupedzisira kwakaratidza kuti PCB yekugadzira inomiririra sei nhevedzano yemaitiro anoenderana apo nhanho imwe neimwe munzira inokanganisa mhedzisiro yeavo vanotevera. Kupera kwepamusoro - kungave Kupisa Mhepo Solder Yakaiswa, Organic Solderability Preservative, Kunyudza Silver, Kunyudzwa Tin, Electroless Nickel Immersion Goridhe, Electrolytic Nickel Goridhe kana zvimwe zvine hukama - zvine simba rakakura.

Mainjiniya chinhu muhupenyu hwesherufu, solderability, kusungirirwa kwechisungo, kuvimbika zvinodiwa, kutendeseka kwechiratidzo, uye zvipingamupinyi zvemitengo pakati pezvimwe zvinotemerwa pakusarudza kupedzisa kweimwe application yavo uye nharaunda yekushanda. Zvimwe zvinotariswa zvinosanganisira manufacturability, throughput, mashandisirwo emidziyo uye kureruka kwekutonga kwemhando.

Kuvavarira kugadzirisa kwakaringana pane iyi matrix yekufunga kunozogonesa kushanda, kwakavimbika uye kudhura-inoshanda zvemagetsi hardware. Sezvo maapplication achifambira mberi uye zvinodiwa zvinokura zvakanyanya kuomarara, tinogona kutarisira kuenderera mberi nehunyanzvi mumasarudzo ekupedzisira epamusoro uye maitiro ekugadzirisa kuzadzisa zvinodiwa.