Ongorora iyo PCBA Mhosho uye Defect Resolution Matanho

Printed Circuit Board Assembly (PCBA) ndiyo musimboti wekuvaka uye kushanda kwemasystem emazuva ano emagetsi - kubva kumidziyo yevatengi uye otomatiki yemaindasitiri kusvika kumapuratifomu ekurapa uye emuchadenga. Sezvo huwandu hwekubatanidza huchiwedzera uye majometri ezvikamu achiderera, miganhu yekuvimbika inoderera zvakanyanya. Kusagadzikana kamwe chete kwe micro-crack, void, contamination site, kana impedance kunogona kukonzera njodzi huru mumunda.

Saka, kuvimbika kwePCBA hakusisiri dambudziko rekuongorora - inyanzvi yeinjiniya yemhando dzakasiyana-siyana inosanganisira dhizaini yekugadzira, sainzi yezvinhu, kudzora maitiro, fizikisi yezvakatipoteredza, uye manejimendi yehupenyu. Chinyorwa chino chinopa hurongwa hwakarongeka hwehunyanzvi hwekunzwisisa nzira dzekukundikana, ongororo yezvikonzero, uye nzira dzekudzivirira mainjiniya muhupenyu hwese hwePCBA.

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1) Kuvimbika kwePCBA muMagetsi Emazuva Ano

Kukundikana kwemagetsi hakuwanzoitiki ipapo ipapo. Kukundikana kwakawanda kunobva mukusarongeka kwemaumbirwo kana makemikari kunounzwa panguva yekugadzira kana kugadzira, kwozoshanduka nekuda kwekushushikana kwekupisa, kwemakanika, kwemagetsi, kana kwezvakatipoteredza.

1.1 Kuvimbika Inzvimbo Yehurongwa

Kuvimbika kwePCBA kunokonzereswa ne:

• Muganho wekugadzirwa kwemagetsi
• Kuenderana kwezvinhu uye kufananidza kweCTE
• Kugadzikana kwesimbi inosungirirwa
• Kunzwa kwehunyoro (MSL)
• Kugona kwekugadzira maitiro (Cpk)
• Kusangana nekushushikana kwezvakatipoteredza

Kushanda zvakanaka kweinjiniya yekuvimbika kunobatanidza nzvimbo idzi pane kubata kukundikana sezvikanganiso zvakaparadzana. Kuti udzivise njodzi dzekugadzira, batanidza DFM nekukurumidza (ona cheki yekuongorora yeDFM yemahara ).

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2) Nzira dzeKukundikana: Zvikonzero Zvikuru uye Mhedzisiro yeSisitimu

2.1 Zvikamu zveKukundikana Kwekutanga

2.2 Migumisiro Inowanzo Kukundikana

• Kuderedza kana kukanganisa kwechiratidzo
• Maitiro ekubatana nguva nenguva
• Thermal runaway
• Filament inofambisa anodic (CAF)
• Dielectric kuputsika
• Kuputsika kwebasa rose

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3) Kuongororwa kweNjodzi dzeDhizaini uye Uinjiniya hweKudzivirira

3.1 Kusakwana Kwekubvisa Zvinhu Uye Kusakwira Kwezvinhu

Kutyorwa kwemutemo wekubvisa zvinhu ndiko kunokonzera kubuda kwearc, kubatanidza solder, uye kusvibiswa kwemhepo. Kutara nzvimbo kunofanira kufungwa nezvako:

• Inoshanda magetsi
• Dhigirii rekusvibiswa kwezvakatipoteredza
• Kuunganidzwa kwekushivirira kwekugadzira
• Conformal coating ukobvu

DRC yemazuva ano inofanira kusanganisira gwara reIPC-2221 neIPC-9592 pane kushandisa defaults dzeCAD dzakajairika.

3.2 Kushaikwa kweElectromagnetic Compatibility (EMC)

Kusadzora zvakanaka nzira yekudzoka, kupatsanurwa kwenzvimbo dzinoenderana, kana kusakwana kwekubatanidza zvinhu zvinokonzera kuburitswa kwemhepo nemagetsi.

Nzira dzekudzivirira dzinosanganisira:

• Ndege yepasi inoenderera mberi iri pasi pemakwara ekumhanya kukuru
• Inodzorwa impedance nzira
• Nzvimbo yakaderedzwa yedenderedzwa
• Kubatanidzwa kweCommon-mode choke
• Kudzvinyirirwa kweFerrite paI/O interfaces

3.3 Kusashandiswa zvakanaka kwekupisa

Zvikamu zvine simba guru zvinoda kuenzanisa kwekupisa kubva pakubatana kuenda kune nharaunda. Kuregeredza huremu hwemhangura, kuburikidza nekusona, kana kuti kutungamira kwemhepo kunokurumidza kuneta kwesolder uye kudonha kwezvikamu.

4) Nzira Dzakakwana Dzekugadzira Matambudziko uye Kudzora Maitiro

4.1 Kusawirirana kweSolder uye Kusawirirana kweWetting

Zvikonzero zvikuru:

• Kusagadzirwa zvakanaka kwe stencil aperture
• Kuisa paste yakawandisa yesolder
• Kudzokorora tembiricha zvakanyanya
• Component misalignment

Zviito zvekudzivirira (ruzivo rwekuita kweSMT pano: Maitiro ekuunganidza SMT PCB ):

• SPI (Solder Paste Inspection)
• Reflow profile optimization
• Kudzora mhepo ine nitrogen
• Kusimbiswa kweAOI + X-ray

4.2 Kuisa maPlating Voids muPTH

Kuumbwa kwechinhu chisina chinhu kunokonzerwa nekusakwana kwe desmear, ma smear residue ekuboorwa, kana mhepo yakavharirwa panguva yekushandiswa kwe electroplate.

Nzira dzepamusoro dzekudzora dzinosanganisira:

• Kuchinja kwemagetsi kwepulse plating current
• Kuongororwa kwekufanana kweplasma desmear
• Kusimbiswa kweX-ray
• Kutarisa ukobvu hwemapuratifomu ekuverenga nhamba

4.3 Kusvibiswa kweIonic neOrganic

Kusvibiswa kweFlux residue kana Na+/Cl− ionic kunogona kuderedza Surface Insulation Resistance (SIR) uye kukonzera kukura kwedendritic.

Kuderedza njodzi kunosanganisira:

• Kusimbiswa kwekuchenesa mvura yeDI
• Kuedzwa kweROSE
• Kuongorora kweIon chromatography
• Kusefa kwemhepo yakachena mumba

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5) Kushushikana Mumunda, Kugadzirisa Kukuvadzwa uye Kuora Kwehupenyu Hwese

5.1 Kubuda Kwemagetsi (ESD)

Kukuvadzwa kweESD kunogona kuva nenjodzi huru kana kuti kusingaonekwe. Kunyangwe kuputsika kweoxide kusingaonekwe kunoshandura maparamita e transistor.

• Matambi emaoko akadzika
• Kurongedza kunofambisa
• TVS diodes
• Masisitimu epasi eESD

5.2 Kuneta Kwekufamba Nemhepo Kunopisa

Kusawirirana kweCTE pakati pemhangura (17 ppm/°C), FR4 (~14–18 ppm/°C), uye solder (~22 ppm/°C) kunokonzera kushushikana kwecyclic.

• Kuzadza pasi pemapakeji eBGA
• Matavi emhangura akakora
• Low modulus encapsulants
• Matanho eInterposer

5.3 Kuvhunduka Kwemuchina uye Kudedera

Kudengenyeka kwemhepo kunokonzera kutsemuka kudiki pamisungo yesolder uye kuburikidza nemabara.

• Kufananidza kupfeka
• Kusimbiswa kwemuchina kwezvinhu zvinorema
• Potting compounds
• Zvigadziko zvekudzivirira kuvhunduka

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6) Kuora Kwezvakatipoteredza uye Kuchembera Kwezvinhu

6.1 Kuoxidation uye Kusagadzikana kweKupedza Pamusoro

Kuomeswa kwemhangura kunowedzera kuramba kubatwa uye kunoderedza kugona kwayo kusundirwa.

• ENIG (Ni/Au barrier)
• Kunyudza sirivheri
• Dziviriro yeOSP
• Kurongedza kwemushonga

6.2 Kukundikana Kunokonzerwa Nehunyoro

Kupinda kwehunyoro kunotungamira ku:

• Kuumbwa kweCAF
• Dielectric kuputsika
• Kuzvimba kwePolymer
• Popcorn inotsemuka panguva yekuyerera kwemvura

Mabhegi ekudzivirira hunyoro, nzira dzekubika, uye machira ekudzivirira kubva mumvura inzira dzakakosha dzekudzivirira hunyoro. Kune nzvimbo dzakaoma, dzidza nezvemachira ekudzivirira kubva muvhu.

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7) Nzira dzepamusoro dzekuongorora kukundikana kwePCB

7.1 Matekiniki Asingaparadzi

• Kuongorora zvinoonekwa (optical microscopy)
• X-ray fluoroscopy (BGA, kuonekwa kwechinhu chisina chinhu) — ona Gwaro rekuongorora X-ray
• Kuskena Acoustic Microscopy (SAM)
• Infrared thermography

7.2 Matekiniki Ekuparadza Uye Ekuongorora

• Kucheka-cheka kwechikamu chidiki
• Kuongorora Electron Microscopy (SEM)
• Kuongororwa kweEnergy Dispersive Spectroscopy (EDS)
• X-ray Photoelectron Spectroscopy (XPS)
• Differential Scanning Calorimetry (DSC)
• Thermomechanical Analysis (TMA)

Nzira idzi dzinogonesa kutsanangurwa kwesimbi, kuyerwa kweukobvu hwesimbi, kuzivikanwa kwekusvibiswa, uye kusimbiswa kweTg. Kuti uongorore denda riri mukati, tarisawo AOI inspection.

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8) Kuvaka Nzira Yekuvimba Nevanhu Vasina Kuvharwa

Kuvimbika kwePCBA kwechokwadi kunoda:

• Dhizaini Yekugadzira (DFM)
• Dhizaini Yekuvimbika (DFR)
• Statistical Maitiro Kudzora (SPC)
• Kukundikana Modhi uye Effects Analysis (FMEA)
• Chiito Chekugadzirisa Chikonzero Chekutanga (RCCA)
• Kuvandudzwa Kunoenderera Mberi Kwemhinduro

Hapana maitiro ekugadzira asina chikanganiso. Zvisinei, kunzwisisa kwakarongeka kwefizikisi yekukanganisa kunobvumira kubviswa kwezvikonzero pane kudzorwa kwenguva pfupi. Kana uchida mafambiro ekugadzira ekupedzisira + ekuongorora, funga nezve turnkey PCB assembly.

Tibatei nhasi kuti muwane sevhisi yakazara yekuongorora kukundikana kwePCBA.