Sarudzo yePCB yePCIe 6.0 yeMabhodhi eMotherboard, Risers uye Makadhi ekuwedzera
Kusarudzwa kwezvinhu zvePCIe 6.0 ndekwepuratifomu yese, kwete bhodhi rimwe chete rakasiyana. PCI-SIG inotsanangura huwandu hwedata raw 64.0 GT/s ine PAM4 signalling, lightweight FEC, CRC uye FLIT-based encoding. Saka, motherboard, riser ne add-in card zvinogona kushandisa zvikamu zvakasiyana zvebhajeti yemagetsi kunyangwe zvikatengwa kubva kuvatengesi vakasiyana.
Highleap inoshandura topology yakatenderwa kuita zvidzoreso zvebhodhi: kugoverwa kwelayer, copper profile, differential impedance, via uye backdrill structure, connector geometry uye coupon evidence. Peji rekugadzira harifanirwe kuvimbisa kutevedzera protocol kubva kuzita re laminate; rinofanira kuratidza kuti data rePCB nePCBA rinogona kudzokororwa rinotsigira sei basa remutengi rekutevedzera.
Iyo PCIe 6.0 Topology Inosarudza Zvinodiwa Zvezvinhu
PCIe 6.0 inogona kuonekwa senzira pfupi pakati pemidziyo paPCB imwe chete, kubatana kwemotherboard-to-add-in-card kuburikidza ne edge connector, nzira inopinzwa ne riser, kana puratifomu yakaoma yebhizinesi ine mamwe ma transitions. Zvinhu zvebhodhi zvinobatsira kurasikirwa kwakapararira; connector yega yega uye via field zvinowedzera discontinuity. Nzira pfupi dzakananga dzinogona kudzorwa ne package uye breakout geometry. Nzira refu dze multi-board dzinopa kurasikirwa kwakawanda kune laminate ne copper.
| Topology | Zvinonetsa zvikuru zvePCB | Maitiro ekusarudza zvinhu |
|---|---|---|
| Kubatanidza mudziyo uri mundege kwenguva pfupi | Kubuda kweBGA, kuchinja kwezvikamu, kuenderera mberi kwereferensi uye kutaura kwemunharaunda. | Tanga nekugadzira topology; kuvaka kwakajairika kunoderedza kurasikirwa kwakanyanya kunogona kukwana. |
| Kadhi rekuwedzera rebhodhi reamai | Chinongedzo chemucheto, maviya emubati nemakadhi, kugoverwa kwenzira uye ukobvu hwemakadhi. | Tevedzera mabhodhi ese ari maviri nechinobatanidza; usasarudze bhodhi rega rega wega. |
| Kadhi reMotherboard pamwe neriser pamwe neadd-in | Zvinobatanidza zvakawanda, kureba kwePCB kwakawedzerwa, kurasikirwa kwakaunganidzwa uye kurasikirwa kwekudzoka. | Zvinhu zvinorasikirwa zvishoma uye kudzora stub zvine simba zvinova mukana wakanyanya. |
| Magadzirirwo akadzoserwa nguva kana kuti akapatsanurwa | Bhajeti yezvikamu, nzvimbo, simba remagetsi uye nzira dzemuno dzinomhanya zvakanyanya. | Sarudza zvinhu zvichienderana nechikamu chega chega chemagetsi pane daro rese rehurongwa. |
Mugadziri wesystem anofanira kupa tsananguro yezvikamu, kureba kwenzira, mamodheru ekubatanidza uye chinangwa chechiteshi. Highleap inobva yatarisa kana nhamba yezvikamu, ukobvu uye nzira yekupinda nayo ichigona kugadzirwa. Puratifomu yakazara inogona kushandisa zvinhu zvakasiyana pamabhodhi akasiyana, chero bedzi chikamu chimwe nechimwe chikaramba chiri mukati mechikamu chayo uye cheni yekugovera ichidzorwa.
Nzira pfupi yePCIe 6.0 inogona kushandisa high-Tg FR-4 here?
Zvingangodaro, asi mhinduro yacho inoenderana nehurefu hwenzira, mhangura, package, huwandu hweconnector, equalization uye tolerance. "High-Tg" imhando yethermal, kwete vimbiso yekurasikirwa nechannel. Dzimwe nzira pfupi dzinogona kushanda nemhuri yeFR-4 yakakodzera ine mid-or low-loss; dzimwe nzira dzinoda kuvakwa kwelow-loss. Sarudzo ndeye simulation uye prototype correlation, kwete mutemo weblog universal.
Ko mamaboard nekadhi rekuwedzera zvinofanira kushandisa zvinhu zvakafanana here?
Hazvisi hazvo. Dzinogona kunge dzine hurefu hwakasiyana hwenzira, huwandu hwema layer, ukobvu hwebhodhi, huwandu hwekugadzira uye zvinangwa zvemutengo. Chinokosha inzira kubva kumagumo kusvika kumagumo. Puratifomu inodhura zvishoma inogona kuchengetedza kuvaka kwepamusoro-soro kwechikamu chakareba kana chakanyanya kurasikirwa uku uchishandisa chimwe chinhu chakatenderwa kune imwe nzvimbo. Kuchinjana kweconnector nereference-plane kuchiri kuda kuenzaniswa kwemodheru.
Sarudzo yezvinhu zveMotherboard, Riser neAdd-In Card
Motherboard inowanzo takura nzira yakareba uye yakaoma kunzwisisa, asi inogonawo kuva nekuchinjika kwakanyanya. Kadhi rekuwedzera rinofanira kusangana nezvinodiwa nehukobvu hwemakanika uye chinongedzo chemucheto. Riser inogona kuwedzera zvinongedzo zviviri uye imwe PCB segment muvhoriyamu diki. Saka bhodhi rega rega rinoda stackup inosangana nezvinodiwa zvekugadzira zvemuno pamwe nebhajeti yeshared channel.
Pabhodhi reamai, mugadziri wemidziyo anoongorora BGA pitch, breakout, layer allocation, via count, board size, DIMM kana connector fields uye warp control. Kana kadhi rekuwedzera, kutarisisa kunochinja kuenda kumucheto weminwe, bevel, finished thickness, connector launch, bracket fit uye assembly loading. Riser inogona kunge iri nyore asi inodhura pamagetsi nekuti connectors dzayo uye short traces zvinowedzera discontinuities. Misiyano iyi inofanira kuonekwa muRFQ.
Sarudzo yemhangura negirazi
Mhangura isina chimiro chakanyanya inogona kuderedza kurasikirwa kwemuchina wekugadzira, nepo magadzirirwo akakodzera egirazi achigona kubatsira pakukombama uye kugadzikana kweimpedance. Kuwanikwa kwacho kunoenderana nezvinhu uye ukobvu. Stackup inofanira kutaura kana profil yemhangura ichidikanwa. Dhizaini yacho inofanirawo kufunga nezve routing angle uye pair geometry pane kutarisira kuti zvinhu zvacho zvigadzirise mhedzisiro yese yegirazi-weave.
Kuwanda kwezvikamu hakusi chiyero chekushanda
Kuwedzera ma layer kunogona kurerutsa kuenderera mberi kwe reference uye kuderedza kushanduka, asi kunogonawo kuwedzera ukobvu uye urefu hwe stub. Kuverengwa kwe layer kwakakodzera ndiko kunotsigira breakout, routing density, power distribution, reference planes uye manufacturable kuburikidza nema structures. Highleap inogona kupa mazano e layer mushure mekuongorora BGA nenzvimbo dze connector; stackup ye "16-layer PCIe board" yakajairika haigone kutamiswa pakati pezvigadzirwa.
Chikwata chevagadziri chinofanira kushandisa nzira yakajeka yekufambisa zvinhu zvakasiyana-siyana (differential-pair routing strategy) yekuisa nzvimbo dzakasiyana, nzvimbo dzinoratidza mareferensi, nzvimbo dzinobatanidza zvinhu zviviri (pair unconnecting) uye nzvimbo dzinochinja mareferensi. Fekitori inodzora mareferensi akabudiswa; haigone kugadzirisa peya inoyambuka mukaha usina kukodzera wendege kana kuchinja mareferensi pasina kuronga nzira yekudzoka.
Kuburikidza neStubs, Connectors uye BGA Escape Zvinogona Kutonga Channel
Kusarudzwa kwezvinhu kunocherechedzwa nekuti zviri nyore kuisa padhirowa, asi matambudziko makuru anogona kudzivirirwa anowanzova ejometri. A via stub inogona kurira. Kuburitswa kweconnector kunogona kukonzera capacitance yakawandisa kana inductance. Kuputika kweBGA kunogona kumanikidza mutsipa nekuchinja kwakanyanya. Resin yeDf yakaderera haigone kubvisa kusagadzikana uku.
Kuboorera kumashure kunodiwa riini paPCIe 6.0?
Kuboorera kumashure kunotenderwa kana kureba kwepurasitiki isina kushandiswa kuchikanganisa mugero uye kana stub yasara inodiwa ichigona kugadzirwa. Dhizaini yacho inofanira kutsanangura ma layers akabatana, divi rekuboorera, dhayamita rekuboorera kumashure, kudzika kwechinangwa uye kuchengetedza. Highleap inoongorora kushivirira kwestub yasara pakunyoresa uye kugona kuboorera. Kune mamwe ma stackups, blind vias kana imwe layer assignment inogona kushanda zviri nani.
Ongorora maitiro akadzama ePCB backdrilling usati wataura kukosha kudiki kwasara. Nzira yekugamuchira - microsection, X-ray kana imwe nzira yekudzora yakabvumiranwa - inofanira kuiswa muodha.
Muridzi we connector kutanga
Mutengesi weconnector anogona kupa reference footprint, asi launch yekupedzisira inoenderana nehukobvu hwebhodhi, pad geometry, antipad, return vias uye reference layers. Kuvhurwa kwemakadhi ehost neadd-in kunofanirwa kuenzaniswa sechikamu chenzira imwe chete. Highleap inogona kudzora drill, pad, antipad uye layer registration; mugadziri wesystem anofanira kubvumidza electrical geometry.
Kubuda kweBGA uye kuungana
Midziyo inopinza zvidimbu zvingada via-in-pad, ma-via azere, ma-via akavharwa kana ma-microvia asingaonekwe. Sarudzo idzodzo dzinokanganisa mutengo webhodhi risina chinhu uye kubatanidzwa kweBGA. Kana Highleap iri kubatanidza bhodhi, timu dzekugadzira nestencil dzinogona kuronga kupedzisa ma-pad, coplanarity, vhoriyamu yesolder, kuongororwa kweX-ray uye mukana wekugadzirisa patsva. Zvinodiwa zveBGA PCB assembly zvinofanirwa kuverengerwa nekukurumidza, kunyanya pamapakeji makuru uye mabhodhi akakora ane layer refu.
Kudzora Kugadzira Kunodzivirira PCIe 6.0 Margin
Dhirowa yekugadzira inofanira kushandura modhi yechiteshi kuita zvinhu zvinodzorwa. Izvi zvinogona kusanganisira zvinhu chaizvo nemhangura, ukobvu hwe dielectric, differential uye single-ended impedance, finished trace geometry apo zvakakosha, via uye backdrill details, edge-connector dimensions, bow and twist, uye coupon requirements. Tsamba inoti "PCIe 6.0 compliant PCB" haisi iyo nzira inoyerwa yekugadzira.
Highleap inoshandisa CAM nekuongorora stackup kusimbisa resin fill, copper balance, drill-to-copper spacing, impedance structures, panel scaling uye test coupons. Fekitori inobva yanyora chivakwa chakatenderwa kuti chidzokororwe. Kana core, prepreg kana copper foil ikasawanikwa, shanduko yacho inofanira kuendeswa pamwe ne stackup uye impedance calculation yakagadziriswa pane kuitwa pasi pe broad equivalent-material clause.
Kushivirira kweImpedance uye hukama hwemakuponi
Tafura ye impedance inofanira kuratidza layer, trace type, target, tolerance uye test requirements. Makuponi anofanira kuratidza kuvakwa kwechigadzirwa. Mutengi anofanira kutaura kana kugamuchirwa kwakavakirwa pa coupon TDR, chiyero chechigadzirwa kana zvese zviri zviviri. Ongorora control ye impedance muma PCB anomhanya zvakanyanya kuti udzivise ma callouts asina kujeka.
Kudzora kwakakombama uye upamhi hwemutsetse
Kusiyanisa kunogona kukonzerwa nekusawirirana kwenzira, kurukirirwa kwegirazi uye kuchinja kusingaenzaniswi. Mugadziri anodzora kubhadharwa kwemabasa eunyanzvi, kuchekwa kwemifananidzo nekuvakwa kwayo; mugadziri anodzora mafambiro enzira uye kureba kwemaviri. Kufananidza urefu kwakakosha hakufanirwe kusiiwa kune mitemo yega pasina kufunga nezvenzvimbo dzisina kubatana uye minda yekubatanidza mapini.
Nhoroondo yekupisa kwemusangano
Kadhi rePCIe motherboard kana kuti accelerator rinogona kutakura zvishandiso zvikuru zveBGA uye zvinobatanidza zvinorema. Kudzokorora kakawanda, kusanganisa kwakasarudzwa kana kugadzirisa bhodhi kunogona kuomesa bhodhi. Kusarudzwa kwezvinhu kunofanira kusanganisira kuvimbika kwekupisa, kwete kurasikirwa chete. Zvishandiso zvekubatanidza uye rutsigiro rwekudzokorora bhodhi zvinogonawo kudiwa kudzora warpage.
Ongororo yeUinjiniya yePCIe 6.0 PCB uye Kotesheni
Highleap inogona kupa kugadzirwa kwema prototype, PCBA isina simba rakawanda uye rutsigiro rwekugadzira, asi mutengo unofanirwa kunge wakavakirwa pachikamu chebhodhi chaicho. Isa mufananidzo wePCIe channel kana pfupiso yenzira, kunyangwe kana modhi yese yesystem iri yakavanzika. Fekitori inoda ruzivo rwakakwana kuti isiyanise nzira yakakosha kubva kune yakajairika differential routing.
- Gerber/ODB++, dhizaini yekugadzira, kuchera uye data rekudhonza kumashure;
- zvinhu zvakatenderwa kana mvumo yekupa zano rekuvaka kwakaenzana;
- stackup, copper profile, impedance table uye critical route layers;
- kureba kwenzira yepamusoro, huwandu hwezvinobatanidza uye pfupiso yekuchinja-chinja;
- kuponi, S-parameter, microsection kana zvinodiwa zvekugamuchira divi rimwe chete;
- BOM, centroid, dhizaini yemusangano, purogiramu uye chirongwa chekuedza kushanda;
- huwandu hwemuenzaniso, fungidziro yekugadzirwa, nzvimbo yekutumira uye zvinodiwa pakurongedza.
Mushure mekuongorora, mutengo unogona kusimbisa kuwanikwa kwezvinhu, nguva yekugadzira, kuyedza, kuunganidza, kubhadhara uye sarudzo dzekutumira. Mazuva ekukurumidza anopihwa chete mushure mekunge laminate yakakosha, mhangura nezvimwe zvinhu zvaongororwa. Maodha emuenzaniso anogona kutumirwa neinternational express, nepo maodha ehuwandu anogona kushandisa hurongwa hwekutakura hwakabvumiranwa. Kutevedza nzvimbo kunotsigira ongororo yeinjiniya mushure mekutumira uye chiito chekugadzirisa.
Kuti uwane hurukuro yakakura yekugadzira, ona kugadzirwa kwePCB nekukurumidza . Chirevo chepeji chinofanira kuramba chakarurama: Highleap inogadzira mabhodhi zvichienderana nehurongwa hwakatenderwa nevatengi uye zvinodiwa zvekugamuchirwa zvinoyerwa; kutevedzera kwekupedzisira kwePCIe kunoenderana nesilicon yakazara, package, connector, board, firmware uye system implementation.
Vanorega basa vanochinja nyaya yezvinhu, kwete kudiwa kwekurangwa
Retimer inogona kupatsanura nzira refu kuita zvikamu zvipfupi zvemagetsi, zvichideredza kusvika kunodiwa kubva muchikamu chimwe nechimwe. Inowedzerawo mapakeji, simba, wachi uye nzira dzemuno. Saka zvinhu zvinogona kusarudzwa nezvikamu, asi retimer hairevi kuti hairegeredzi kuburitswa kweconnector kana kuburikidza nemastubs. Nzvimbo yayo inofanira kuverengerwa muongororo ye stackup ne assembly.
Pakutenga, mapuratifomu akagadziriswazve anogona kunge aine shanduko dzakasiyana dzebhodhi uye njodzi dzeBOM. Highleap inogona kutaura bhodhi risina chinhu uye kuunganidza pamwe chete kuitira kuti marongerwo ekumhanya, kutumirwa kwemagetsi, hardware yekupisa uye nguva yekutungamira zvikamu zvifungidzirwe muchirongwa chimwe chete.
Zviyero zvekubatanidza mucheto ndezvemakanika uye zvemagetsi
Makadhi ekuwedzera anoda ukobvu hwakapedzwa hwakarongwa, bevel, contact finish, keying uye outline. Zvinhu izvozvo zvinokanganisa kuiswa uye mashandiro econnector. Kutanga kubva pacontact kuenda ku inner routing kunofanirwa kuenderana ne footprint yakatenderwa uye stackup. Shanduko yezvinhu inochinja ukobvu hwekadhi kana trace geometry inogona kukanganisa fit uye channel response.
Highleap inotarisa zvinodiwa neminwe yegoridhe, bevel uye ukobvu panguva yekuongorora CAM. Mutengi anofanira kupa zvinodiwa zvemakanika emakadhi pamwe nechero zvirambidzo zvekubatanidza nekutengesa. Kana bracket kana stiffener zvabatanidzwa, kushivirira kwayo uye mutoro wayo zvinofanirawo kubatanidzwa.
Kubvumidzwa kwemuenzaniso kunofanira kusanganisira zvikamu zvese zvebhodhi
Kuedza coupon yemotherboard hakuratidzi kuti riser ne add-in card zvinoshandisa zvivakwa zvakaenzana. Chikamu chimwe nechimwe chakakosha chinofanira kunge chine impedance inomirira uye, kana zvichidikanwa, humbowo hwekurasikirwa. Kuedza kwesystem kunofanirwa kushandisa zvinobatanidza netambo zvinotarisirwa. Kana vatengesi vakasiyana vakagadzira zvikamu zvakasiyana, kugovana stackup uye fungidziro dzekuburitsa zvinova zvakakosha zvikuru.
Highleap inogona kugadzira mhando dzakasiyana dzemabhodhi ane hukama pasi pechirongwa chimwe chete uye kuchengetedza zvinyorwa zvakasiyana uye zvinyorwa zvekuongorora. Izvi zvinogona kurerutsa hukama nekuti shanduko mune chimwe chikamu dzinoramba dzichionekwa pane kuvanzwa kumashure kwenzira dzakasiyana dzekutenga.
Hunhu hwekugadzira hunokanganisa kugadzirisa matambudziko ekutevedzera mitemo
Mapakeji makuru eBGA anogona kunge aine maburi, maburi kana kuti ma warpage anoonekwa semapundu anopindirana nehurongwa. Ma connectors anogona kusarongeka kana kukuvara panguva yekudzvanywa. Kuchenesa zvinogona kukanganisa macircuit ekutsigira ane impedance yakawanda. Highleap inogona kusanganisira X-ray, AOI, first-article inspection uye functional testing, asi mutengi anofanira kutsanangura humbowo hunodiwa.
Kana puratifomu ikatadza kutevedzera zvinodiwa, data retained assembly uye bare-board zvinobatsira kuparadzanisa channel geometry kubva kune soldering kana component problems. Izvi zvinoderedza muedzo wekuchinja zvinhu usati waona chikonzero chaicho.
Kutenga zviri nyore hakufanirwe kuderedza simba rekuchinja kwemamiriro ezvinhu
Highleap inotsigira mari yekunze kwenyika uye hurongwa hwekutumira zvinhu, kutsvaga zvinhu uye kudzokorora maodha. Kureruka hazvirevi kuti zvinhu zvinotsiviwa pachena. Zvinhu, zvinobatanidza zvinhu uye zvinhu zvakakosha zvinongoshandurwa chete pasi pemvumo yakabvumiranwa. Mutengo unogona kuratidza zvinhu zvinopihwa nevatengi, zvakatumirwa uye zvinobva kufekitori kuitira kuti muridzi ave pachena.
Mushure mekutumirwa, zvinyorwa zvinoteverwa uye zvinyorwa zvebvunzo zvinotsigira ongororo yeinjiniya. Maitiro ehunyanzvi mushure mekutengesa anotanga neruzivo rwakatenderwa, zviratidzo zvakaonekwa uye huwandu hwakakanganiswa, wobva wasarudza kudzora uye matanho ekugadzirisa.
Kuvimbika kwesimba uye hardware yekupisa zvinogona kukanganisa kuunganidzwa kwechiratidzo
Kugoverwa kwema layer ekumhanya kwakanyanya hakuitiki kwega. Midziyo yePCIe 6.0, ma retimers uye ma switch zvinoda kuendeswa kwemagetsi, kupatsanurwa uye rutsigiro rwekupisa. Kuwedzera ma reference planes ekusimbisa masignal kunogona kuwedzera huwandu hwema layer; kuwedzera heavy copper kana heatsink hardware kunogona kukanganisa ukobvu uye warpage. Ongororo ye stackup inofanira kusanganisira zvese zvinodiwa zvesignal uye simba.
Highleap inogona kuongorora copper balance, power-plane spacing uye assembly hardware, asi mutengi anofanira kupa current, thermal uye mechanical limits. Signal-only stackup isingakwanise kutsigira zvikamu zvekupedzisira haisati yagadzirira kugadzirwa.
Mabhenefiti ekugadzirisa kutevedzera mitemo kubva kubhodhi regoridhe rinodzorwa
Kana chinyorwa chekutanga chapasa bvunzo dzebhodhi nehurongwa dzakabvumiranwa, chengetedza stackup yaro, ruzivo rwezvinhu, data remakuponi akayerwa uye rekodhi yemusangano senzira yekutanga. Mapoinzi ekupedzisira anogona kuenzaniswa nehurongwa uhwu hwakanaka. Kana muganho wekutevedzera mutemo ukachinja, kuferefeta kunogona kuona kana bhodhi, zvikamu, chinongedzo kana firmware zvakachinja.
Highleap inogona kuchengetedza data rekugadzira rakatenderwa uye kuburitsazve chivakwa chakaburitswa zvichienderana nekuwanikwa kwezvinhu. Mutengi anofanira kuchengetedza mhedzisiro yekuyedzwa kwesystem uye magadzirirwo emidziyo. Pamwe chete, zvinyorwa izvi zvinoita kuti hunyanzvi hwekugadzira mushure mekutengesa huve hunobudirira.
Chinyorwa chemitemo: PCI Express 6.0 inoshandisa 64 GT/s PAM4 signalling ine FEC uye FLIT mode. Zvinodiwa zvekutevedzera mitemo zvakadzama zvinoramba zvichidzorwa nezvinodiwa nePCI-SIG uye magwaro epuratifomu yemutengi.
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Nzira yekuwana sei quote yePCBs
Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:
-
- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.