Maitiro ekutengesa BGA zvikamu: Nhanho-ne-Nhanho Gwaro

Chii chinonzi BGA

BGA, kana Bhora Grid Array, imhando yepamusoro-soro yekurongedza inoshandiswa kune akasanganiswa maseketi (ICs). Kusiyana neyakajairwa pin-grid arrays, BGA mapakeji anoshandisa ruzhinji rwemabhora madiki ekutengesa seanobatanidza. Aya mabhora ekutengesa akarongwa mugridi pateni pazasi pepasuru, achibatanidza zvakananga IC kuPCB.

BGAs inopa kushanda kwepamusoro mu-high-density application nekuda kwekugadzirisa kwayo kwakanyatsonaka, iyo inobvumira kuwirirana kwakawanda munzvimbo diki. Iyi tekinoroji yekurongedza inonyanya kubatsira mumashandisirwo apo nzvimbo iri pamutengo wepamusoro uye kushanda kwepamusoro kunodiwa, senge munharembozha uye malaptop.

Sei Uchishandisa BGA Packages

BGA mapakeji anoshandiswa zvakanyanya mumagetsi edunhu nekuda kwezvikonzero zvakati wandei. Chekutanga, kurongeka kwavo kwegidhi-kunge kwemabhora ekutengesa kunobvumira huwandu hwepamusoro hwekubatanidza, huchiita kuti ive yakakodzera kune yakaoma, yakakwira-pini-kuverenga maIC. Density iyi inogonesa kushanda kwakawanda munzvimbo diki, chinhu chakakosha mukuita miniaturizing zvishandiso zvemagetsi.

Uyezve, maBGA anopa zviri nani kupisa kwekushisa, zvichiita kuti pave nekunyanya kupisa kupisa, izvo zvinokosha mumagetsi ekushanda kwepamusoro. Ivo zvakare vanopa yakagadziridzwa mashandiro emagetsi nekuda kwekudzika inductance uye zvirinani chiratidzo chekuvimbika, zvichiita kuti ive sarudzo inosarudzika yeakakwira-kumhanya maapplication.

BGA Soldering Matambudziko

Kurongeka uye Kuiswa Kwazvo

Imwe yematambudziko akanyanya mukutengesa BGA zvikamu ndeyekunyatso kurongeka uye kuiswa. MaBGA ane mabhora madiki ekutengesa ane mapiche akanaka kwazvo, anoda kunyatsoenderana nemapedhi anoenderana paPCB. Kunyangwe kusarongeka kudiki kunogona kutungamirira kune isina kukwana kana kupfupika kubatana. Izvi zvinoda kushandiswa kwemichina yepamusoro yekuisa uye nzira dzekugadzirisa. Kurongeka kwakakosha kwakakosha kwete chete kumisikidza yakavimbika yekubatanidza magetsi asiwo nekuona kugadzikana kwemakanika kwechikamu pabhodhi. Yepamberi optical masisitimu anowanzo shandiswa kurongedza maBGA nemazvo maitiro ekutengesa asati atanga.

Thermal Management

Kutarisira kupisa zvakanaka panguva yekusvira BGA kwakakosha nekuda kwenjodzi yekupisa zvakanyanya, izvo zvinogona kukuvadza BGA kana PCB. Kupararira kwekupisa kusina kuenzana kunogona kutungamira mukukombama kana kusakwana kwekusvira, zvichikonzera kusasimba kwemajoini. Kuve nechokwadi chekuti tembiricha inogara yakarongeka uye inodzorwa panguva yese yekusvirazve kwakakosha. Izvi zvinosanganisira danho rekudziisa zvishoma nezvishoma kuderedza kuvhunduka kwekupisa, kudzora kwakanyatsojeka panguva yekusvirazve kuti solder inyungudike zvakaenzana, uye danho rekutonhodza rinodzorwa kuti majoini esolder asimbiswe zvakanaka. Maovheni ekudzivirazve epamberi ane kudzora tembiricha kwakanyatsojeka anowanzo shandiswa kugadzirisa matambudziko aya zvinobudirira.

Kuongorora Matambudziko

Kuongorora BGA solder majoini kunopa akasiyana matambudziko nekuda kwechimiro chavo. Kusiyana neyakajairwa zvikamu zvinoonekwa solder majoini, BGA solder mabhora akavanzwa pasi pepakeji. Izvi zvinoita kuti zviome kuona kutarisa kunaka kweiyo soldering.

Kugadzirisa izvi, nzira dzepamusoro dzakadai se X-ray kuongorora dzinoshandiswa. Kuongorora kweX-ray kunobvumira hunyanzvi kuti vaone kuburikidza neBGA package uye kuongorora majoini ekutengesa nezvenyaya senge voids, bhiriji, kana kusakwana solder. Iyi nzira haina-kuparadza uye yakakosha pakuona kuvimbika kweBGA solder mumagetsi akaomarara.

Solder Ball Nyaya

Solder bhora nyaya muBGA soldering inomuka kana solder mabhora akabatana pamwe chete kana kutadza kuumbwa nemazvo, zvichitungamira kune zvingangoita zvemagetsi zvikabudura kana maseketi akavhurika. Izvi zvinogona kuitika nekuda kwekuwandisa kana kusakwana solder paste, tembiricha isiriyo yekuyerera, kana kubata zvisina kunaka kwezvikamu.

Kuti udzivise nyaya idzi, kunyatso kudzora pane solder paste application kwakakosha. Pamusoro pezvo, kwakaringana reflow profiling inodiwa kuti ive nechokwadi chekuti solder inonyungudika uye inoomesa nemazvo. Kuita matanho akasimba ekutonga kwemhando panguva yeese paste application uye reflow process kwakakosha kuderedza kuitika kwenyaya dzebhora rekutengesa muBGA musangano.

Solder BGA Zvikamu Maitiro

Kushandisa Solder Paste

Iko kushandiswa kwe solder paste muBGA soldering inhanho yakakosha inoda kunyatsojeka. Stencil, yakanyatsogadzirirwa PCB marongerwo, inoshandiswa kuisa solder paste nemazvo kuPCB pads. Iyi stencil inovimbisa kuti yakaringana solder paste yakaiswa, izvo zvakakosha pakugadzira yakasimba uye yakavimbika majoini ekutengesa. Iyo solder paste inowanzo ine mabhora madiki e solder uye flux musanganiswa, iyo inobatsira mukuyerera kwakaringana uye kusungirirwa kwemabhora anotengeswa pachikamu cheBGA kune PCB pads panguva ye reflow soldering process.

BGA Chikamu Kuiswa

BGA chikamu chekuisa inhanho yakakosha inoda kunyatsojeka. Michina yekunhonga-ne-nzvimbo inoshandiswa kunyatsoisa zvikamu zveBGA paPCB. Michina iyi inoshandisa optical masisitimu kuti ienderane neBGA's solder mabhora nemapedhi anoenderana paPCB. Iko kurongeka kweiyo kurongeka kwakakosha nekuti kunyangwe kurongeka kushoma kunogona kutungamira kune zvisina kufanira kubatana kana kupfupi-kutenderera. Iyo nzira inosanganisirawo kungwarira kubata kwezvikamu kuti udzivise chero kukuvadzwa kune solder mabhora, kuve nechokwadi chakavimbika solder joint panguva reflow process.

Reflow Soldering

Reflow soldering inhanho yakakosha muBGA chikamu chekutengesa maitiro. Munguva iyi, gungano rose - PCB ine solder paste yakashandiswa uye yakanyatsoiswa BGA components - inoiswa pasi pekupisa kunodzorwa muhovhoni inoyerera. Ovheni zvishoma nezvishoma inokwidza tembiricha yekunyungudutsa solder paste pasina kukuvadza zvikamu. Kunyungudika uku kunogadzira majoini anodiwa ekutengesa pakati peBGA's solder balls uye mapedhi ePCB. Kiyi yekubudirira reflow soldering kuchengetedza tembiricha chaiyo, inova nechokwadi chekudziya uye kutonhora, kudzivirira nyaya senge solder bhora deformation kana isina kukwana soldering.

Kudzora iyo Tembiricha Profile

Kudzora tembiricha profile panguva reflow soldering chinhu chakakosha cheBGA solder process. Iyo mbiri inowanzo sanganisira preheating, kunyura, kuyerera, uye kutonhora nhanho, imwe neimwe inoda chaiyo tembiricha yekudzora kuti ive nechokwadi chakakwana soldering. Preheating zvishoma nezvishoma inosimudza tembiricha yePCB kudzivirira kupisa kwekupisa, uku kunyura kunobvumira kupisa kupinda mugungano rose zvakaenzana. Iyo reflow chikamu inonyungudutsa solder paste, kugadzira majoini pakati peBGA zvikamu nePCB. Pakupedzisira, kutonhora kunodzorwa kunosimbisa solder pasina kukonzera kushushikana. Kutarisira kwakakodzera kweiyo mbiri kwakakosha kudzivirira kukanganisa senge majoini anotonhora, voids, kana kupisa, izvo zvinogona kukanganisa kutendeseka kwemajoini ekutengesa.

kuonorora

Mushure mekutengesa, zvikamu zveBGA zvinoda kuongororwa zvine hungwaru nekuda kwemajoini avo akavanzika. Maitiro epamberi akadai seX-ray kuongorora anowanzo shandiswa kuona pasi peBGA package uye kuongorora kubatanidza solder. Ongororo iyi inoongorora nyaya dzakaita senge solder bridging, voids, kana kusakwana soldering, kuve nechokwadi chekuti kubatana kwega kwega kunosangana nemhando yepamusoro. Mune zvimwe zviitiko, otomatiki optical inspection (AOI) inogona zvakare kushandiswa kuongororwa kwepamusoro-soro. Ichi chikamu chakakosha pakuona kuvimbika uye kushanda kwePCB yakaunganidzwa.

rework

Kuziva Zvakaipa

Kuziva kukanganisa muBGA soldering kwakakosha pakuona kudiwa kwekugadzirisa zvakare. Kukanganisa kwakajairika kunosanganisira bhiriji rekutengesa, voids, kana kusakwana solder inotungamira kumajoini asina simba. Nzira dzekuongorora dzepamusoro, dzakadai se X-ray imaging, dzinowanzoshandiswa nokuda kwechinangwa ichi, sezvo dzichibvumira kuona kwakadzama kwemajoini ekutengesa pasi peBGA package, iyo isingaonekwi nemaziso. Kuongororwa kweX-ray kunobatsira pakuona kukanganisa kwemukati nekupa mufananidzo wakajeka weiyo solder yekubatanidza, zvichiita kuti nyanzvi dzitarise dzakananga nyaya dzinoda kushandazve.

Kubvisa BGA Zvikamu

Kubvisa zvikamu zveBGA kubva kuPCB zvinoda kunyatsoita uye kutarisirwa. Kuita uku kunowanzo sanganisira kushandisa mhepo inopisa rework station kana infrared soldering system. The midziyo inoshandiswa zvakafanana kupisa chikamu BGA kune solder's melting point, kuve nechokwadi chokuti chikamu chose chinopisa pasina kupisa chero nzvimbo chaiyo. Kana solder yanyungudutswa, chikamu chinogona kusimudzwa zvinyoronyoro kubva pabhodhi. Izvo zvakakosha panguva iyi kuita kuchengetedza kutendeseka kwePCB, kudzivirira kukuvadzwa pamapadhi kana maronda. Kudzivirira kupisa kwakakodzera kunodiwawo kuchengetedza zvimwe zvikamu zviri pedyo kubva pakunyanya kupisa.

Iko Kukura Kwekuda kweBGA mune Yepamusoro-Kuitwa Kwemagetsi

Ball Grid Array (BGA) kurongedza kuri kuwedzera kukurumbira mumagetsi ekushanda kwepamusoro, kunyanya mumaindasitiri umo madiki fomu chinhu uye kuita kwakasarudzika kwakakosha. Nekudiwa kwezvidiki, zvinoshanda zvakanyanya zvichikwira, BGA tekinoroji inopa compact asi inoshanda zvakanyanya mhinduro yekubatanidza maseketi akaoma. MaBGA anoshandiswa mumhando dzakasiyana siyana dzekushandisa, kusanganisira nharembozha, malaptop, mitambo yekutamba, uye inomhanya-mhanya network network.

Mune nharembozha, BGAs inogonesa kubatanidzwa kwe-high-pin-count processors uye memory machipisi, ayo anodiwa pakupa masimba emazuva ano mafoni uye mahwendefa. Kugona kwavo kubata zvinopisa kupisa kunoita kuti ive yakakodzera kune compact zvishandiso uko nzvimbo uye kupisa manejimendi zviri pamutengo wepamusoro.

Uyezve, nekukura kwemaindasitiri akaita se5G, hungwaru hwekugadzira, uye mota dzinozvimiririra, BGA's high-speed signal kuperera uye thermal management properties zviri kuwedzera kudiwa. Sezvo tekinoroji ichishanduka, kugona kweBGAs kutsigira kufambira mberi uku kunoita kuti ive chinhu chakakosha mukugadzirwa kwemagetsi anoshanda epamusoro.

Maitiro eKuvandudza Yako PCB Gungano neBGA Technology

Kubatanidza tekinoroji yeBGA mune yako PCB gungano maitiro kunopa zvakati wandei, kunyanya kana kugadzira uye kugadzira yakaoma, yepamusoro-inoshanda zvemagetsi. MaBGA anogonesa mapini epamusoro munzvimbo diki, achidzikisa tsoka yePCB yako uku uchichengetedza hukuru hwemagetsi uye kutonga kwekupisa.

Imwe yemabhenefiti makuru ekushandisa maBGAs muPCB gungano ndiko kugona kuzadzisa marongero akanyanya, achibvumira zvimwe zvikamu munzvimbo diki. Izvi zvinonyanya kubatsira kune zvemagetsi zvevatengi, uko compact dhizaini yakakosha. Kushandiswa kweBGAs zvakare kunoderedza njodzi yekushatiswa kwechiratidzo uye inova nechokwadi chekuti zvikamu zvinokwanisa kubata masaini akakwira-frequency nekuvimbika kukuru.

Pamusoro pezvo, maBGA anobatsira mukupisa kupisa kuri nani zvichienzaniswa neyakajairwa pini-yakavakirwa mapakeji. Izvi zvakakosha kune zvishandiso zvinogadzira kupisa kwakawanda, senge makadhi emifananidzo kana yepamusoro-soro processors. Yakatengeswa nemazvo BGA yekubatanidza inobatsirawo kuchengetedza kutendeseka kwechishandiso nekufamba kwenguva, kuve nechokwadi chekuti zvikamu zvinogara zvakachengeteka zvakabatanidzwa kubhodhi kunyangwe kupisa bhasikoro uye kushushikana kwemagetsi.

Kuti ukwidzise PCB gungano rako neBGA tekinoroji, zvakakosha kuti uve nechokwadi chekuiswa chaiko uye kusona chaiko. Kushandisa nzira dzepamusoro dzakadai sekuongorora X-ray uye kushandisa yepamusoro-soro reflow soldering michina inogona kubatsira kuona kuti chikamu chega chega cheBGA chakaiswa zvakanaka uye chinotengeswa, kuderedza mikana yekuremara kana kukundikana kwechigadzirwa chekupedzisira.

mhedziso

Soldering BGA zvikamu zvinoda kunyatsotarisisa kune zvakadzama, kunyatsonzwisisa maitiro ekutengesa, uye michina chaiyo. Kubva pakushandisa solder paste kusvika pakuongorora uye nekugona kugadzirisa zvakare maPCB akatengeswa, nhanho imwe neimwe yakakosha pakushanda uye kuvimbika kwechigadzirwa chekupedzisira. Mastering BGA solder matekiniki haangovimbisi emhando yepamusoro PCB magungano asi zvakare anosimudzira kushanda kwese kwemidziyo yemagetsi.

KuHighleap Electronics, isu tine hunyanzvi mukugadzira uye kugadzira maPCB nemazvo , kusanganisira kusungirirwa kweBGA. Nekushandisa kwedu kwepamberi, ruzivo rwakadzama muindasitiri, uye kuzvipira kune mhando, tinova nechokwadi chekuti maPCB enyu anosangana nemazinga epamusoro ekushanda uye kuvimbika. Kunyangwe muchitsvaga maprototyping anokurumidza kana kugadzirwa kukuru, timu yedu yakagadzirira kugadzirisa zvaunoda uye kupa mhedzisiro inoshamisa. Batanai nesu nhasi kuti tigadzire magadzirirwo enyu emagetsi nemhinduro dzePCB dzemhando yepamusoro.