Mugadziri wePCB weSevha Yekuchengetera Zvinhu muBhizinesi

Highleap Electronics inogadzira PCB yemaseva ekuchengetedza emakambani eOEM, maODM ehyperscaler, vanopa masevhisi ekuchengetera egore, uye vanovaka masisitimu ekuchengetera emucheto. Portfolio yedu inosanganisira mabhodhi makuru emaseva ekuchengetera (single-controller, dual-controller active/active, scale-out storage cluster nodes), NVMe backplanes yePCIe Gen4 neGen5 hot-swap drives (U.2, U.3, E1.S, E3.S), SAS backplanes uye SAS expanders yehybrid nebulk-storage chassis, HBA carrier boards uye NVMe switch carriers , RAID controller carrier boards , NVMe-oF host uye target adapter boards , uye seti yakazara yemabhodhi ekutarisira nekuvaka mukati mechassis yekuchengetera yemazuva ano. Mabhodhi akavakwa zvinoenderana neIPC -A-600 Class 2 standard ine kugamuchirwa kweClass 3 iripo , yakasimbiswa neIATF 16949 , yakakodzera Tier-1 storage OEM AVL , ine zvinyorwa zvekutonga shanduko uye zvirongwa zvekuendesa zvakarongwa zvinotsigira mapuratifomu ekuchengetera emakore akawanda.

Zviri Mukati

1. Zvinodiwa neOEM dzeServer dzekuchengetedza kubva kuMugadziri wePCB
2. Mainboard eServer Storage anovaka — Imwe Chete, Dual-Controller, Scale-Out Node
3. Kugadzira NVMe Backplane — Gen4, Gen5, U.2/U.3/EDSFF
4. SAS Backplanes, Expanders & Hybrid Drive Chassis Builds
5. Kugadzira HBA, RAID & NVMe Switch Carrier Board
6. NVMe-oF Host & Target Adapter Bhodhi Rinovaka
7. Kubatsira Highleap seMugadziri wePCB weServer Yenyu Yekuchengetedza

1. Zvinodiwa neOEM dzeServer dzekuchengetedza kubva kuMugadziri wePCB

Mapurogiramu emaseva ekuchengetedza anoshanda pamatanho akasiyana ehupfumi kupfuura emakombiyuta emakombiyuta. Mavhoriyamu anowanzo kuve akakwira papuratifomu imwe neimwe (mutsetse mumwe chete wezvigadzirwa zvekuchengetedza unogona kutumira mayuniti anopfuura 50,000 pagore kuburikidza ne hyperscaler uye nzira dzebhizinesi); hupenyu hwezvigadzirwa hwakareba (makore 5-7 ari pamusika akajairika); rutsigiro rwezvikamu zvekuchengetedza uye rutsigiro rwemayuniti anotsiviwa mumunda runosvika makore 7-10 kupfuura kuguma kwekugadzirwa. Mugadziri wePCB anotsigira chirongwa chekuchengetedza ari kuzvipira kunguva idzodzo. Isu tinopa mudura rese remaseva ekuchengetedza pasi pemhando imwecheteyo iyo inosimudzira mapurogiramu edu ekugadzira maPCB emaseva.

Zvinodiwa nechikwata cheinjiniya

• Kubatana kwekugadzira backplane yeNVMe: kubatanidzwa kwechinongedzo chekuchinjana kwekupisa, nzira yekudzora-impedance kubva padivi rekutyaira kuenda padivi rekutonga, ma-vias akaboorwa kumashure eGen5 NVMe stub control.
• Kubatanidzwa kweDrive Dense DFM: Mabhawa ekutyaira ane 24, 36, 60, kunyange 90 pa 4U chassis — nzvimbo yePCB yemusana idiki kana tichienzanisa neconnector uye huwandu hwerouting hunodiwa.
• Ongororo yeSAS expander layout: ma expander ane ma ports akawanda (ma ports 24 kusvika 36 pa chip) anoda kurongwa nekungwarira kuti achengetedze SAS signal integrity pa 12/22.5 Gbps.
• Mhangura inorema yekugovera simba rechasi yekuchengetera: Madhiraivha anopfuura makumi matanhatu anodhonza 600W+ kana asina kushanda, akawanda zvikuru kana basa rakawanda risingashande; ndege dzemagetsi dzemubhandi dzinoda mhangura inosvika 2-3 oz pamatanda akatsaurirwa mukati mebhandi. multilayer pcb kuunganidzwa.
• Magwaro ekugadzirisa zvinhu: Kugara kwenguva refu kwechigadzirwa kunoreva kuti zviitiko zveEOL zvichaitika; nzira dzakanyorwa dzekutsiva dzakakosha.

Zvinodiwa nechikwata chekutenga zvinhu

• Kuzvipira kwemakore akawanda kwekugovera: Nzvimbo dzekuchengetera zvinhu dzinotumirwa kwemakore 3-5; dzimwe nzvimbo dzinotumirwa mamwe makore 5-7.
• Kugona kunokonzerwa nekufanotaura: Kudiwa kwekuchengetedza zvinhu zve hyperscaler kunogona kuwedzera ne5-10× muchikamu chimwe chete papuratifomu itsva; kugoverwa kwesimba rekuchengetedza zvinhu zvichienzaniswa nekufungidzira kuri kuenderera mberi kwakakosha.
• Kufanirwa kweAVL pamatanho akasiyana: Makambani ekuchengetedza eTier-1, vadyidzani veODM vane hyperscaler, uye vanobatanidza vatengi vese vanogona kuchengetedza maAVL akasiyana.
• Kujeka kwemutengo padanho rePCB: zvinhu, huremu hwemhangura, huwandu hwezvikamu, uye kuiswa kwepaneru zvese zvine chekuita nemutengo weyuniti; ongororo yakajeka yeBOM-level inotsigira zvirongwa zvekuderedza mutengo.
• Kutenga chinobatanidza chinochinja-chinja: Mamwe mapurogiramu anowana SAS kana NVMe connectors sezvinhu zvakatumirwa; mutengesi anobata kuunganidza pasina kutora zvinhu zvacho semuridzi.
• Magwaro ekutevedzera EMC: Zvigadzirwa zvekuchengetera zvinhu zvinoedzwa neFCC, CE, uye kumwe kuyedzwa kwemutemo; dhizaini yePCB uye kuenderana kwekugadzirwa kwayo kunotsigira kupasa bvunzo pakutanga.

Kutevedzera mitemo uye kurongeka kwemhando yehurongwa

• Chitupa cheIATF 16949: zvekutanga zvevatengesi vePCB vepamusoro-soro.
• ISO 9001: hwaro hwehurongwa hwemhando yepamusoro hwepasi rose.
• Kuzivikanwa kweUL: yezvigadzirwa zvekuchengetera zvinoda chitupa chekuchengetedza.
• Rutsigiro rwekupatsanura ECCN: yezvigadzirwa zvekuchengetera zvinhu zvinodzorwa nekutengeswa kunze kwenyika zvinoshandira hurumende, misika iri pedyo nedziviriro, kana misika yakakosha yezvivakwa.
• Mishumo yezvicherwa zvine chekuita nekusawirirana: Chikamu 1502 kutevedzera zvakanyorwa zvakanyorwa nezvemishumo yemutengesi wechikamu chidiki.

2. Mabhodhi Ekuchengetedza Masevha Mainboard Anovaka — Imwe Chete, Dual-Controller, Scale-Out Node

Mabhodhi makuru eseva yekuchengetedza ane mhando dzakasiyana dzemagadzirirwo kupfuura mabhodhi makuru eseva ekuverenga. Mapatani makuru atinovaka:

Mabhodhi makuru emutongi mumwe chete (kupinda uye kuchengetera maSMB)

• Architecture: soketi imwe chete yeCPU (kana single SoC) ine chinongedzo chakananga kune drive backplane uye host network interfaces.
• Sarudzo dzeCPU: Intel Atom yekupinda; Intel Xeon-D, AMD Ryzen Yakaiswa muzvigadzirwa zvekupinda zvine simba repamusoro.
• Layer count: Zvikamu 8-12 zvakajairika.
• I / O: Maports e2-4 GbE, USB 3.x yekutarisira konsoro, nzvimbo yePCIe yekuwedzera HBA.
• Bhuku: SMB yakawanda uye nzvimbo yekuchengetera mapurosesa; dhizaini yePCB inodhura zvishoma.
• Material: 370HR kana IS410 zvichienderana nemutengo wakatarwa; FR408HR kana PCIe yepamusoro ichidikanwa.

Mabhodhi makuru anoshanda/anoshanda maviri (mabhodhi ekuchengetera mabhizinesi)

• Architecture: ma controller maviri ekuchengetera zvinhu ari mu chassis imwe chete ane mukana wekugovaniswa kwe backplane; failover uye load-balancing mukati me array.
• Kuwanda kwechikamu chemutongi wega wega: kazhinji 12-18 zvidimbu.
• Chinongedzo chepakati pevanodzora: kubatana kwekukurumidza pakati pevanodzora (PCIe Gen4/Gen5, NTB, kana custom) kuti pave nekubatana kwecache uye failover state synchronization.
• Chimiro che backplane chinogovaniswa: macontroller ese ari maviri anosvika pamadhiraivha ese achishandisa nzira dzeSAS kana NVMe dzisina basa.
• Rutsigiro rwekuchengetedza bhatiri: nzvimbo yemagetsi neyemagetsi yeBBU kana supercapacitor cache backup.
• kuvimbika: Kugamuchirwa kweIPC Kirasi 3 kwakajairika; kuwanikwa kwakavimbika kwema capacitor, connectors, nezvimwe zvikamu.

Mabhodhi makuru ekuchengetera zvinhu akayerwa (nzvimbo yekuchengetera yakagoverwa)

• Architecture: server mainboard ine software yekuchengetera zvinhu (Ceph, MinIO, Lustre, GlusterFS, custom hyperscaler stack) ine NVMe yemuno yakabatana uye network ine bandwidth yakawanda.
• Sarudzo dzeCPU: mapurosesa eXeon, EPYC, ARM HPC ane soketi imwe chete kana mbiri.
• Layer count: 12-20 zvikamu.
• Network inowanikwa: 100G kana 200G NIC yekufambisa zvinhu; mamwe madhizaini ehyperscaler anosanganisira 400G.
• NVMe inotyaira: mubhodhi reM.2 pamwe nemadhiraivha eU.2 kana EDSFF ari pamberi.
• Kushandiswa kwakajairika: kuchengetwa kwezvinhu zvakawanda zve hyperscaler, kuchengetwa kwakatarwa nesoftware yebhizinesi, kuchengetwa kwenzvimbo dzekuchengetedza dzeveruzhinji dzegore.

JBOF (kungoti-boka-re-flash) uye maseva eNVMe akakora

• Architecture: maNVMe enclosures ane huwandu hwakawanda hwemakombiyuta ane macomputer mashoma emunharaunda; chinangwa cheNVMe-oF chevanodzora vekunze vakabatanidzwa.
• Kuwanda kweDrive: Madhiraivha eNVMe ane madhiraivha makumi maviri nemana, makumi matatu nematanhatu, makumi matanhatu, kana kunyange makumi mapfumbamwe zvichikwira pachasi imwe neimwe.
• Basa guru rebhodhi: NVMe switch uye management; controller yabviswa muJBOF.
• Network: 100/200/400G Ethernet kana InfiniBand NVMe-oF interface.
• Kuomarara kwePCB: Backplane ndiyo PCB yakaoma kupfuura dzose musystem; mainboard iri nyore.

Kugadzirwa kwebhodhi guru reJBOD (kungori-boka-re-madisk)

• SAS expander mainboard: kazhinji 6-10 layers neSAS expander chip (Broadcom SAS3xxx series) uye SAS connectors kune external host(s).
• Rutsigiro rweDrive bay: Mabheya ekutyaira ane 24, 60, kana 90 ane 3.5″ kana 2.5″ mu 4U kana 5U chassis.
• Kutarisira magetsi nekutonhodza: kutonhora kwakapararira uye kutarisa simba mu chassis yese.

3. Kugadzira NVMe Backplane — Gen4, Gen5, U.2/U.3/EDSFF

Dhizaini uye kugadzirwa kwePCB yemusana weNVMe ndeimwe yenzvimbo dzinonyanya kuomera mumidziyo yeserver yekuchengetera zvinhu. Kuwanda kwedhiraivha, kuvimbika kwekuchinjana kwemhepo, uye masaini ekumhanya zvakanyanya zvese zvinosangana pamusana.

Kugadzirwa kwemapuranga ePCIe Gen5 NVMe

• Mwero wechiratidzo: 32 GT/s panzira imwe neimwe; madhiraivha ane migwagwa mina ndiwo akajairwa, ane migwagwa mina padhiraivha dzebhizinesi.
• Kusiyana kweimpedance: 85Ω ±5% pazvisaririra zvakakosha.
• Kureba kwekutevera: ma trace e backplane kubva pa drive connector kuenda ku host/switch anowanzova 2-8 inches; bhajeti shoma yekurasikirwa pa 16 GHz Nyquist.
• Material: I-Tera MT40 inogamuchirwa kune machaneli mapfupi eGen5; Tachyon 100G inokurudzirwa kune mapuraneti ane maport akawanda kana kuti marefu.
• Kuboorera kumashure: zvinosungirwa paGen5 signal vias; chibooreso chekumashure kusvika ku ≤8 mil stub yasara.
• Layer count: 12-20 zvidimbu zvichienderana nehuwandu hwedhiraivha.

Kugadzirwa kwemapuranga ePCIe Gen4 NVMe

• Mwero wechiratidzo: 16 GT/s pamugwagwa wega wega.
• Kusiyana kweimpedance: 85Ω ± 10% yakajairika.
• Material: FR408HR kana I-Tera MT40 zvichienderana nehurefu hwezvishandiso uye huwandu hwezvinhu.
• Kuboorera kumashure: zvinokurudzirwa asi kushivirira kwakasununguka kunogamuchirika kupfuura Gen5.
• Layer count: Zvikamu 10-16 zvakajairika.

Kugadzirwa kwemapuranga emusana eU.2 neU.3

• Chinobatanidza cheSFF-8639: Chinobatanidza cheU.2/U.3 chinotsigira SAS, SATA, uye NVMe muchimiro chimwe chete.
• Chinhu chekutyaira: 2.5″ × 15mm kana 7mm ukobvu; saizi yakajairika ye server bay.
• Common configurations: Masevha e12-bay 2U, masevha e24-bay 2U, masevha e36-bay 4U.
• Kubatanidzwa kwechinongedzo chekuchinjana kwemoto: nzvimbo chaiyo yekubatanidza ine ±0.10 mm inoshivirira kuvimbika kwe-blind-mate.

Kugadzirwa kwemapuranga emusana eE1.S neE3.S EDSFF

• E1.S (yaimbova E1): ruler form factor yemadhiraivha ekutakura zvinhu pamberi; sarudzo dzeukobvu hwe5.9 mm, 9.5 mm, 15 mm, 25 mm.
• E3.S: SSD form factor pakati peU.2 neruler, kushandiswa kwakakura muna 2024-2025.
• Kuwanda kwehuwandu: EDSFF inobvumira kuwanda kwemadhiraivha pachasi imwe neimwe kupfuura U.2.
• Kufunga nezve backplane: nzvimbo yekubatanidza madhiraivha ne screws dzekuisa madhiraivha; marongerwo eSFF akajairwa.
• Vatyairi vevhoriyamu: Magadzirirwo ehyperscaler (EDSFF yaitungamirirwa zvakanyanya nezvinodiwa nehyperscaler) ikozvino yava kuwedzera kusvika kuzvigadzirwa zveOEM zvebhizinesi.

Kuyerera kwemhando yepamusoro yekugadzira backplane

• Kusimbiswa kwenzvimbo yekubatanidza: Kuyerwa kweCMM pachinyorwa chekutanga chinosimbisa nzvimbo yekubatanidza yeSFF-spec.
• Kusimbiswa kweImpedance: Kuponi yeTDR papaneru yega yega yekutevera marongero ekudzivirira anodzorwa.
• Kuedzwa kwekuisa zvinhu uchishandisa Hot-swap: kuyedzwa kwekusangana kwemasero pamienzaniso inomiririra.
• Kusimbiswa kwekugona kwemagetsi endege yemagetsi: chikamu chidiki chinosimbisa ukobvu hwemhangura mumagetsi emagetsi.

4. SAS Backplanes, Expanders & Hybrid Drive Chassis Builds

SAS inoramba iri nzira huru yekuchengetera zvinhu zvakawanda uye yekuchengetera zvinhu zvakasiyana-siyana uko kushandiswa kwesimba uye mari yeNVMe isingabvumidzwe. SAS-12 (12 Gb/s) uye SAS-22.5 (22.5 Gb/s, SAS-4) dziripo; SAS-3 (12 Gb/s) inowanikwa kwose kwose mukugadzirwa.

Kugadzirwa kweSAS-12 backplane

• Mwero wechiratidzo: 12 Gb/s pachiteshi chimwe nechimwe.
• Kusiyana kweimpedance: Chinangwa che100Ω ±10%.
• Material: FR408HR kana 370HR yendege dzemumashure dzinofamba netsoka pfupi; I-Tera MT40 yekufambisa nzendo refu.
• Rutsigiro rweDrive: SATA, SAS, SAS dzine maport maviri ese anotsigirwa pa backplane imwe chete.
• Layer count: Zvikamu 8-14 zvakajairika.

Kugadzirwa kweSAS-22.5 (SAS-4) backplane

• Mwero wechiratidzo: 22.5 Gb/s pachiteshi chimwe nechimwe.
• Material: I-Tera MT40 kana FR408HR yemachaneli marefu; 370HR inogona kugamuchirwa kumachaneli mapfupi.
• Kuboorera kumashure: inokurudzirwa pazviratidziro zvechiratidzo chakakosha.
• Bhuku: iri kubuda mumabasa ekuchengetera zvinhu zvemabhizinesi a2024-2025; icharamba ichienderera mberi kusvika 2026-2027.

Kugadzirwa kwebhodhi rekuwedzera reSAS

• Machipisi ekuwedzera: Broadcom SAS35x40 (maports makumi mana), SAS35x36 (maports makumi matatu nematanhatu), uye zvimwe zvigadzirwa zveMicrochip zvakafanana.
• Layer count: Zvikamu gumi kusvika gumi nemana zvichienderana nehuwandu hwechiteshi uye huwandu hwenzira dzinofambiswa.
• Application: Chassis yekuchengetera ine 24-bay, 36-bay, 60-bay, 90-bay ine expander imwe chete pa zone kana magadzirirwo akasiyana-siyana e expander.
• kuvimbika: Kukundikana kweexpander kunokanganisa madhiraivha ese akabatanidzwa; kuwanikwa kwema capacitor nema connectors kwakavimbika zvikuru.

Kugadzirwa kwemapuranga emusana eHybrid (SAS + NVMe)

• Architecture: Mamwe ma drive bays anotsigira madhiraivha eSAS neNVMe kuburikidza neSFF-8639 universal connector.
• Kuzivikanwa kwekutyaira: backplane necontroller vanoona mhando yedhiraivha uye masaini enzira zvakakodzera.
• Kuwanda kwenzira: mapuroteni ese ari maviri anoendeswa kune yega yega bay drives layer count yakakwira kupfuura single-protocol designs.
• Kusarudzwa kwezvinhu: Zvinodiwa zveNVMe routing ndizvo zvinonyanya kusarudzwa kwezvinhu zve hybrid backplanes.

Mabhodhi ekunze eSAS / mini-SAS HD cables

• Chassis yekunze yeJBOD: mini-SAS HD (SFF-8644) kana kuti SAS-4 active cables dzekunze kwedhiraivha.
• Kugadzirwa kwebhodhi retambo: mabhodhi madiki ane mafrequency akakwira anoisa zvibatanidza zvekunze zvine controlled-impedance interface kune inotonga yekuchengetera mukati.

5. HBA, RAID & NVMe Switch Carrier Board Manufacturing

Nzira yekudzora zvinhu zvekuchengetedza — maadapta emabhazi ehost, maRAID controllers, uye maswichi ejira reNVMe — anoshandiswa pamakadhi akatsaurirwa kana kuti akabatanidzwa mumabhodhi makuru ekuchengetedza. Isu tinogadzira madhizaini ekutakura zvinhu oga uye madhizaini ebhodhi guru.

Kugadzirwa kwebhodhi rekutakura reSAS HBA

• Machipisi akajairika: Broadcom MegaRAID, Adaptec SmartRAID, Microchip SmartIOC.
• Chinhu chechimiro: kadhi rePCIe slot rakajairika rine zvibatanidza zvekunze zve mini-SAS HD.
• Layer count: 8-12 zvikamu.
• Material: FR408HR kana 370HR.
• Bhuku: makadhi akawanda anotumirwa kuburikidza nezvigadzirwa zvekuchengetera zvinhu zvebhizinesi.

Kugadzirwa kweNVMe HBA / NVMe switch carrier

• Machipisi akajairika: Microchip PM8536 SmartIOC, jira reBroadcom NVMe switch, madhiraivha eNVMe anochinjika zvakanyanya.
• basa: kuunganidza madhiraivha akawanda eNVMe ari kumashure kwekubatanidza kwePCIe imwe chete.
• Kurongeka kwePCIe Gen4/Gen5: kudzorwa kweimpedance, kuchera kumashure paGen5 vias yakakosha.
• Layer count: 10-14 zvikamu.
• Material: I-Tera MT40 yakajairika.

Kugadzirwa kwemutakuri wemidziyo yeRAID controller

• Mapurosesa eRAID-on-chip (RoC): Broadcom MegaRAID 9xxx series, Adaptec SmartRAID 3xxx series.
• Ndangariro yecache: cache yeDDR4 yakatsaurirwa pamuchina wekutakura; cache backup uchishandisa supercap kana BBU.
• Chinhu chechimiro: kadhi rePCIe slot rakajairika; zvimwe zvigadzirwa zviri muOCP NIC form factor.
• Layer count: Zvikamu gumi kusvika gumi nemana zvine marongerwo akasiyana-siyana ezviratidzo.

Kugadzirwa kwemakadhi ekuchengetera zvinhu eOCP NIC 3.0

• Chinhu chakajairika chechimiro: Zvidzoreri zvekuchengetera zvinhu zveOCP NIC 3.0 mezzanine carrier hosting, maadapter eNVMe-oF, kana ma straightener ekugadzira machira.
• Kugona kuchinjana zvinhu nemagetsi: inotsigira kugadziriswa kwemakadhi ekuchengetera zvinhu mumaseva anoshanda.
• Vhoriyamu mumagadzirirwo emhando yepamusoro: zviri kuramba zvichiva chinhu chikuru chevanodzora nzvimbo dzekuchengetera zvinhu zve hyperscaler.

6. NVMe-oF Host & Target Adapter Board Builds

NVMe pamusoro peFabrics (NVMe-oF) inobvisa nzvimbo yekuchengetera yeNVMe kubva kuserver yehost, zvichiita kuti nzvimbo yekuchengetera igovaniswe pakushanda kweNVMe. Maadapter eNVMe-oF (muJBOFs uye maarrays ekuchengetedza) uye maadapter eNVMe-oF (mumaseva ecomputer) ndiwo mutsara wezvigadzirwa zvePCB uri kukura.

Kugadzirwa kwebhodhi readapter reNVMe-oF

• basa: adapta yerutivi rwekutanga inoratidza nzvimbo yekuchengetera yeNVMe-oF iri kure seNVMe yemuno kune host.
• Network inowanikwa: 25/100/200/400G Ethernet kana InfiniBand.
• Machipisi akajairika: MaDPU eNVIDIA BlueField (anoshandawo seNVMe-oF host ne offload), Pensando DPU, Marvell Octeon, maASIC akagadzirwa.
• Layer count: 14-18 zvikamu.
• Material: Tachyon 100G kana I-Tera MT40 zvichienderana nehukuru hwemasaini uye kureba kwechiteshi.

Kugadzirwa kwebhodhi readapter reNVMe-oF

• basa: adapta yedivi rakatarwa ichiratidza madhiraivha eNVMe emunharaunda senzvimbo dzeNVMe-oF kune network.
• Architecture: inowanzobatanidzwa muJBOF mainboard kana storage array controller.
• Performance optimization: ASIC kana FPGA-accelerated target inobvisa CPU.

RDMA pamusoro pezvaunofanira kufunga nezveConverged Ethernet (RoCE)

• Kutonga kweRoCE v2: RoCE v2 ndiyo inotungamira mukufambisa NVMe-oF mukushandiswa kwe hyperscaler; mamwe mabhizinesi anoshandisa FC-NVMe kana NVMe/TCP.
• Zvinodiwa zveNIC: MaNIC anokwanisa RDMA ane 100G kana kupfuura ndiwo anodiwa nemuridzi wedhijitari.
• Jira reEthernet risingarasikirwe: RoCE v2 inoda magadzirirwo akanyatsonaka ejira re network; zvigadzirwa zveOEM zvekuchengetera zvinowanzo sanganisira gwara remagadzirirwo ejira nezvigadzirwa zvavo zveNVMe-oF.

Makadhi eFC-NVMe (Fibre Channel NVMe-oF)

• Use kesi: Nzvimbo dziripo dzeFibre Channel SAN dzichitamira kuNVMe-oF pamusoro peFC.
• Makadhi eHBA: 32G FC ne64G FC HBAs dzinotsigira zvese SCSI/FCP yekare uye maprotocol emazuva ano eNVMe-oF.
• Maitiro ekugadzira: Kuderera kwehuwandu hwemayuniti zvichienzaniswa neNVMe-oF yakavakirwa paRoCE, asi kudiwa kwebhizinesi kwakasimba.

7. Kushanda neHighleap semugadziri wePCB yeServer yako yekuchengetedza

Kune maOEM emaseva ekuchengetera, maODM ehyperscaler, uye vatengesi vekutonga zvitoro vanoongorora vadyidzani vePCB, modhi yedu yekubatana inosiyana zvichienderana nehuwandu hwepurogiramu:

Zvirongwa zvekuchengetedza sevha huru

• Zvivakwa zvemuenzaniso: Muenzaniso wezvimedu 25-100 pamazuva manomwe ekushanda ekugadzirisa mabhodhi makuru ane zvikamu 12-18.
• Mienzaniso yezvidzidzo: Zvidimbu 200-1000 zvine magwaro akazara ePPAP.
• Kugadzirwa kwemutyairi wendege: Kutanga kwevhoriyamu kunoenderana nekugadzirira kwevatengi kutanga.
• Kugadzirwa kwehuwandu: Kutumirwa kwakarongwa kuchienzaniswa nekufungidzira kuri kuenderera mberi; kugona kwakachengetwa zvichienderana nekuzvipira.

Zvirongwa zveBackplane

• Kusimbiswa kwenyaya yekutanga yemakanika: Kuyerwa kweCMM kunosimbisa nzvimbo yekubatanidza zvichienderana neSFF spec.
• Kusimbiswa kwechinhu chekutanga chemagetsi: Kusimbiswa kweTDR impedance pakutevera kweimpedance inodzorwa.
• Kuenzanisa kwekuvimbika kwekuchinjana kwemvura: kuyedzwa kwekutenderera kwekusangana panzvimbo dzekutyaira dzinomiririrwa.
• Kuronga huwandu hwevhoriyamu: Kudiwa kwemari yemumugwagwa kunowanzoenderana nechiyero chakatarwa kana tichienzanisa nenhamba yevaripo; kuronga kwakavakirwa pakufanotaura kuri nyore.

Mapurogiramu eHBA, RAID, uye switch carrier

• Kubatana kwakasimba kweDFM: Dhizaini yeASIC vendor reference ndiyo inowanzo tangira; tinochinjika kurongeka kwevatengi vedu.
• Zvinhu zvePCI zvakajairika: inoderedza njodzi yekushandisa maturusi uye kugadzira zvinhu.
• Kukura kwevhoriyamu: Makadhi ekutakura anowanzo tumirwa nehuwandu hwakawanda kupfuura mainboards; kugoverwa kwesimba kunokosheswa.

Highleap ine chitupa cheISO 9001 uye IATF 16949. Isu tinogadzira maPCB ekuchengetedza kubva pazvikamu zvina kusvika pazvikamu makumi maviri nemana, tiine HDI kugona kwe fanout yakakora inodiwa padhuze neNVMe switch ASICs hombe, controlled impedance kusvika ±5% paGen5 critical traces, heavy copper kusvika 3-4 oz ye backplanes dzine simba rakawanda, uye full PCB surface finish coverage (ENIG, immersion silver, OSP, lead-free HASL). Standard quick-turn delivery ye storage server prototypes imazuva mashanu kusvika masere ekushanda e backplanes uye mazuva manomwe kusvika gumi ekushanda e storage server mainboards.

Tumira mafaira eGerber, data rekudhirowa, kutsanangurwa kwestackup, huwandu hwakakosha, uye nguva yepurogiramu kuburikidza ne online quote portal yedu kuti uwane mhinduro yemaawa makumi maviri nemana. Kune mapurogiramu akaomarara - akawanda-mabhodhi emhuri enzvimbo itsva dzekuchengetera, hyperscaler-specific AVL flows, mapurogiramu ekuchengetedza ehupenyu hurefu - timu yedu yekuchengetera inogona kutaura zvakananga kuti ikurukure chiyero uye kugona. Kune kuvaka backplane yekuchengetedza kwakagadziriswa pamutengo wakakwira uko Gen4/Gen3 signaling yakakwana, ona kugona kwedu kweFR4 PCB kugadzira.