Amaphakheji we-BGA

Vula Ukusebenza Kahle kanye Nokonga Izindleko Ngamaphakheji e-BGA e-Highleap: Ukukhiqiza Okulula, Izindleko Zokukhiqiza Ezincishisiwe.

I-BGA PCB Solutions for Compact, High-Pin-Count Application

Ama-PCB e-BGA (Ball Grid Array) abalulekile kuma-electronics adinga usayizi omncane, ukuminyana kwamaphini aphezulu, nokusebenza okuhle kakhulu kokushisayo. Ngokungafani namaphakheji endabuko anomkhombandlela oseceleni, izingxenye ze-BGA zixhuma ngamabhola e-solder ngaphansi kwe-chip—ukulondoloza isikhala nokuthuthukisa ubuqotho besignali.

Lesi sakhiwo sinika amandla:

Ubuningi bezingxenye obuphezulu ngaphandle kokukhulisa usayizi webhodi
Ukushabalalisa okunamandla kokushisa kwamadivayisi ashesha kakhulu noma adinga ugesi
Ukuthembeka kwe-solder okuthuthukisiwe ngokuxhumeka okuzinzile kokugeleza kabusha

Ilungele ama-smartphones, amakhompyutha, amarutha, nogesi wezimoto, ama-BGA PCB asekela ukuqina kwesikhathi eside kumiklamo ehlangene.

I-Highleap Electronics iletha ukukhiqizwa nokuhlanganiswa kwe-BGA PCB ye-turnkey kusuka ku-prototype kuya ekukhiqizweni okukhulu. Sisebenzisa ukuhlolwa kwe-X-ray kwangaphakathi, ukugeleza kabusha kwephrofayela, nezinqubo ezigunyazwe i-IPC ukuze siqinisekise isivuno esikhulu namajoyinti aqinile e-solder—ngisho nasemabhodini ayinkimbinkimbi anendlalelo eziningi.

Ulungele ukwakha nge-BGA? Khuluma nochwepheshe bethu namuhla ukuze uthole ukubonisana kwamahhala noma ikhotheshini.

I-Highleap BGA - I-PCB Prototype Indlela Elula

XHUMANA NATHI

Izinhlobo zephakheji ze-BGA ezivame ukusetshenziswa?

I-BGA (I-Ball Grid Array) iwuhlobo lwephakeji oludumile olusetshenziswa kumasekethe ahlanganisiwe (ama-IC) nezingxenye zikagesi. Ihlinzeka ngendlela ehlangene nethembekile yokukhweza ama-IC kumabhodi esekethe aphrintiwe (ama-PCB). Nazi ezinye izinhlobo zephakheji ze-BGA ezivame ukusetshenziswa:

I-PBGA

I-PBGA (Plastic Ball Grid Array) iwuhlobo lwephakeji ye-BGA esetshenziswa kabanzi. Ifaka i-substrate yepulasitiki enoxhaxha lwegridi yamabhola e-solder ngezansi, exhuma i-IC ku-PCB. Amaphakheji e-PBGA anikeza ukusebenza okuhle okushisayo nogesi futhi atholakala ngosayizi abahlukahlukene nokubalwa kwebhola.

I-CBGA

Amaphakheji e-CBGA (Ceramic Ball Grid Array) asebenzisa i-ceramic substrate esikhundleni sepulasitiki. I-Ceramic inikeza ukuqhutshwa kokushisa okungcono kanye nokuzinza uma kuqhathaniswa nepulasitiki, okwenza i-CBGA ifanele izinhlelo zokusebenza ezisebenza kahle ezidinga ukuchithwa kokushisa okuphumelelayo. Ama-CBGA avame ukusetshenziswa kumaphrosesa, ama-graph chips, namanye ama-IC anamandla amakhulu.

I-TBGA

Amaphakheji e-TBGA (Thin Ball Grid Array) aklanyelwe ukuthi abe nephrofayela encane uma kuqhathaniswa namaphakheji e-BGA endabuko. Asetshenziswa ezinhlelweni lapho isikhala silinganiselwe, njengamakhompyutha aphathekayo, amaphilisi, namadivayisi eselula. Amaphakheji e-TBGA ngokuvamile ane-pitch yebhola encane kanye nogqinsi oluncishisiwe ukuze ahlangabezane nemingcele yosayizi.

I-FBGA

Amaphakheji e-FBGA (Fine Ball Grid Array) ane-pitch yebhola encane uma kuqhathaniswa namaphakheji ajwayelekile e-BGA. Zisetshenziswa ezinhlelweni ezidinga ukuminyana kwamaphini aphezulu nokusebenza okuthuthukisiwe kukagesi. Ama-FBGA avame ukutholakala kumamojula enkumbulo, njengamamojula we-DDR3 kanye ne-DDR4.

uBGA

Amaphakheji e-UBGA (Micro Ball Grid Array) ayizinguqulo ezincane zamaphakheji e-BGA, adizayinelwe izici zefomu ezincane kakhulu kanye nokuminyana kwamaphini aphezulu. Zisetshenziswa kumadivayisi kagesi ahlangene njengama-smartphones, izinto ezigqokwayo, namadivayisi we-IoT. Ama-uBGA anezinkundla zebhola ezincane kakhulu futhi kuyinselele ukuhlangana nokusebenza kabusha ngenxa yobukhulu bazo.

I-CCGA

Amaphakheji e-CCGA (Ceramic Column Grid Array) afaka amakholomu e-ceramic esikhundleni samabhola e-solder oxhumano lukagesi. Amakholomu e-ceramic ahlinzeka ngokuthembeka okungcono namandla okusebenza, okwenza ama-CCGA afanelekele izinhlelo zokusebenza ezinokushaqeka okuphezulu nezimfuneko zokudlidliza, ezifana nogesi wezimoto kanye ne-aerospace.

Lezi yizibonelo ezimbalwa zezinhlobo zephakheji ze-BGA ezivame ukusetshenziswa. Uhlobo oluthile lwephakheji olukhethelwe uhlelo oluthile luncike ezintweni ezifana nemingcele yosayizi, izidingo zokushisa, ukubalwa kwamaphini, ukusebenza kukagesi, nokucatshangelwa kwezindleko.

Izinzuzo BGA Package

Emkhakheni wama-electronics, amaphakheji e-BGA anikeza ukusebenza kahle kwesikhala, amandla okushisa, ukusebenza kukagesi okuzinzile, nokukhiqiza okuhlelekile, ukunciphisa izindleko. I-Highleap, umkhiqizi we-PCB ne-PCBA ohamba phambili, usebenzisa izinzuzo ze-BGA zekhwalithi ephezulu, izisombululo ezingabizi kakhulu. Izinzuzo zephakheji le-BGA zimi kanje:

^

Ukusetshenziswa Kwesikhala Kwe-PCB Okuphumelelayo

Amaphakheji e-BGA anikeza ukusetshenziswa okuphumelelayo kwesikhala se-PCB. Ngezingxenye ezimbalwa ezihilelekile kanye nesinyathelo sonyawo esincane, zisiza ukonga isikhala kuma-PCB angokwezifiso, kuthuthukisa kakhulu ukusebenza kahle kwesikhala se-PCB. Lokhu kubaluleke kakhulu kumishini kagesi ehlangene.

^

Ukusebenza Kwe-Thermal Okuthuthukisiwe

Amaphakheji e-BGA ahamba phambili ekuphatheni okushisayo. Uma i-silicon chip ifakwe phezulu, ukushisa okuningi kungadlulisela kahle phansi ngohlelo lwegridi yebhola. Ngokuphambene, lapho i-silicon chip ifakwe phansi, ingemuva lefayizi lixhunywe phezulu kwephakheji, okuvumela ukupholisa okusebenzayo. Lokhu kusebenza kahle kokushisa kunciphisa ingozi yokushisa ngokweqile futhi kuthuthukisa ukuthembeka kwezingxenye ze-elekthronikhi.

^

Ukusebenza Kagesi Okuthuthukisiwe

Amaphakheji e-BGA ahlinzeka ngokusebenza kukagesi okuzinzile ngezinga elikhulu. Azinazo izikhonkwane ezigobekayo noma eziphukayo, ezinciphisa ubungozi bezinkinga zokuxhunywa kukagesi. Lokhu kuzinza kuqinisekisa ukusebenza okungaguquki nokuthembekile kwamasekethe ahlanganisiwe.

^

Inqubo Ye-Soldering Elula

Amaphakheji e-BGA ngokuvamile afaka amabhola e-solder amakhulu. Lokhu kwenza i-solder yendawo enkulu ilawuleke futhi ibe lula ngesikhathi senqubo yokukhiqiza. Ngenxa yalokho, ijubane lokukhiqiza le-PCB liyakhula, futhi isivuno sokukhiqiza sonke siyathuthukiswa. Ukwengeza, amabhola amakhulu e-solder enza ukusebenza kabusha, uma kudingeka, kuqonde kakhudlwana.

^

Ukulimala Kokuhola Okuncishisiwe

Ukuhola kwe-BGA kuhlanganisa amabhola aqinile, angadabuki kakhulu ekulimaleni ngesikhathi sokuphatha, ukuhlanganisa, noma ukusetshenziswa uma kuqhathaniswa namaphakheji endabuko anemikhondo ebuthakathaka. Lokhu kuqina kunomthelela ekuphileni isikhathi eside nasekuqineni kwezinto zikagesi.

Ekuzuzeni lezi zinzuzo, ukubambisana nabakhiqizi be-PCB abanolwazi kanye ne-PCBA kubalulekile. U-Highleap, umkhiqizi we-PCB ne-PCBA ohloniphekile, umi njengozakwethu onokwethenjelwa ekuboneni izinzuzo zamaphakheji e-BGA. Ubuchwepheshe bethu ekukhiqizeni nasekuhlanganiseni izinqubo kuqinisekisa izixazululo zekhwalithi ephezulu nezingabizi kakhulu zezinhlelo eziningi ze-elekthronikhi.

Hlangana nezidingo ezahlukahlukene zamabhodi esekethe aphrintiwe

Izinto Ezithinta Ikhwalithi Yomhlangano we-PCB BGA?

Izinga le-PCB BGA (i-Ball Grid Array) lingathonywa izici ezihlukahlukene. Ukuqinisekisa ukunakekela okufanele kulezi zici kubalulekile ukuze kuzuzwe imihlangano ye-BGA enokwethenjelwa nesezingeni eliphezulu. Ngokuzinikezela kwe-Highleap kulezi zici kanye nokuqaliswa kwezinqubo zokukhiqiza eziqinile, siletha ngokungaguquki imihlangano ye-BGA yekhwalithi ephezulu nethembekile. Indlela yethu yokuhlanganyela, ehilela abaklami be-PCB, ochwepheshe bomhlangano, nabasebenzi bokulawula ikhwalithi, iqinisekisa ukuphathwa okuphumelelayo kwalezi zici, okuphumela ekuhlanganisweni kwe-BGA okuphumelelayo kwezinhlelo zokusebenza ezihlukahlukene. Nazi ezinye izinto ezibalulekile ezingaba nomthelela kwikhwalithi yomhlangano we-PCB BGA:

1

Isicelo se-Solder Namathisela

Ukusetshenziswa kwe-solder paste kubalulekile ekuzuzeni amalunga amahle e-solder. Izinto ezifana nomklamo we-stencil, ukwakheka kokunamathisela kwe-solder, nemingcele yenqubo yokuphrinta (isb., ukucindezela kwe-squeegee, isivinini, nokuqondanisa) kungathinta ukubekwa kwe-solder paste. Isicelo sokunamathisela i-solder esifanele siqinisekisa inani elanele le-solder yokwenza ukuxhumana okuthembekile.

2

Ukuqondanisa kwengxenye ye-BGA:

Ukuqondanisa okunembile kwengxenye ye-BGA ku-PCB kubalulekile. Ukungaqondani kahle kungaholela ekuxhumekeni okungalungile kwe-solder noma izikhindi phakathi kwamabhola e-solder aseduze. Ukuhlola nokulawula okwanele phakathi nenqubo yokubeka kusiza ukuqinisekisa ukuma okulungile kwengxenye ye-BGA ku-PCB.

3

Iphrofayili ye-Solder Reflow

Inqubo yokugeleza kabusha kwe-solder ihilela ukushisisa i-PCB ukuze incibilikise unamathisele we-solder bese wenza ukuxhumana kwe-solder. Iphrofayili yokugeleza kabusha ifaka phakathi amapharamitha afana nokushisa ngaphambi kwesikhathi, ukucwilisa, namazinga okushisa aphezulu, kanye namazinga okwehla nokwenyuka. Iphrofayela yokugeleza kabusha elungiselelwe kahle iqinisekisa ukumanziswa okufanele nokugeleza kabusha kwe-solder paste, igwema izinkinga ezifana nevolumu ye-solder enganele, i-voids, noma ukugoqa kwebhola le-solder.

4

Ukucatshangelwa Okushisayo

Amaphakheji e-BGA angakwazi ukukhiqiza ukushisa okukhulu ngesikhathi sokusebenza. Ukuphatha okushisayo kubalulekile ukuze kuvinjwe ukushisa okukhulu, okungase kuthinte ukuthembeka kwamalunga e-solder. Idizayini efanele yokushisa, okuhlanganisa ukusetshenziswa kwezinga lokushisa elishisayo, osinki bokushisa, nemikhondo yethusi ye-PCB eyanele, isiza ukuqeda ukushisa kahle futhi ivimbele ukwehluleka okubangelwa ukushisa.

5

Ukucatshangelwa kwe-PCB Design

Idizayini ye-PCB idlala indima ebalulekile kwikhwalithi yomhlangano we-BGA. Izinto zedizayini ezifana nokwakheka kwephedi, ngokubeka, kanye nokwakheka kwemaski ye-solder kuthinta ukwakheka nokuthembeka kwe-solder. Usayizi wephedi ofanele, umumo, kanye nesikhala kubalulekile ukuze kuqinisekiswe ukumanziswa kwe-solder okwanele futhi kuvimbele ukuhlangana kwe-solder noma ukungahambi kahle kwebhola le-solder.

6

Ukukhetha Okubalulekile kwe-PCB

Ukukhethwa kwezinto ze-PCB kungaba nomthelela kwikhwalithi yomhlangano we-BGA. Izinto ezifana ne-coefficient of thermal expansion (CTE) yezinto ze-PCB kufanele zihambisane nengxenye ye-BGA kanye nenqubo yokuhlanganisa. Ama-CTE angafani angaholela ekucindezelekeni okushisayo kanye nokwehluleka kwamalungu e-solder ngokuhamba kwesikhathi.

7

Ukuhlola Nokuhlola

Ukuhlola okuphelele nezinqubo zokuhlola kubalulekile ukuze kuqinisekiswe ikhwalithi yemihlangano ye-BGA. Amasu afana nokuhlola i-X-ray, ukuhlola okuzenzakalelayo kokubona (i-AOI), nokuhlola ugesi kusiza ukuthola amaphutha afana nevolumu yesoda enganele, ukungahambi kahle kahle, izikhindi, noma ukuxhumana okuvulekile. Izinqubo ezifanele zokuhlola nokuhlola zisiza ekuhlonzeni nasekulungiseni noma yiziphi izinkinga ngaphambi kokuba kusetshenziswe umkhiqizo wokugcina.

Highleap BGA Amandla

Umthamo ojwayelekile wokukhiqiza we-BGA efektri yethu umi kanje. Uma unezidingo ezikhethekile, sicela usithinte kwa-Highleap. Sinethimba lenqubo yezobuchwepheshe elichwepheshile:

Ubuncane bobubanzi bephedi ye-BGA ngu-0.2MM (umkhawulo wesampula ungaba ngu-0.15MM).

Ubuncane be-BGA kulayini bungu-3MIL (umkhawulo wesibonelo ungaba ngu-2.5MIL).

Ibanga eliphansi ukusuka onqenqemeni lwephedi ye-solder ye-BGA ukuya onqenqemeni lwe-solder lezinye izingxenye ngu-0.15mm

Ibanga elincane ukusuka enkabeni eyodwa BGA solder pad kuya maphakathi kwenye BGA solder padis 0.35mm.