Umkhiqizi Othembekile we-HDI PCB | Ukulethwa Okusheshayo, Izitaki Eziyinkimbinkimbi, Ukunikezwa Komhlaba Wonke

Izinhlobo ze-HDI PCB

Ama-HDI PCB atholakala ngezinhlobo ezahlukene, nazi ezinye izinhlobo ezivamile zama-HDI PCB:

Highleap Electronics HDI PCB Manufacturing Process

Ukugeleza Kwenqubo ye-HDI Yamabhodi Amantombazane Asemaceleni Amabili kanye Namanye Amantombazane lapho I-Blind Via isitaki ku-Buried Via

Inqubo yokukhiqiza ye-HDI (High-Density Interconnect) yawo womabili Amabhodi Angaphansi Anezinhlangothi Ezimbili kanye Nama-Multilayer ilandela isethi yezinyathelo ezinemininingwane, iqinisekisa ukunemba okuphezulu nokusebenza emkhiqizweni wokugcina. Njengoba sidlula ezinyathelweni zenqubo, amapharamitha angukhiye afana nobubanzi bokulandelela, ukujiya kwethusi, nezigaba ezihlukahlukene zokucwenga zidlala indima ebalulekile ekunqumeni ikhwalithi yokugcina ye-PCB. Ngezansi ukuhlukaniswa kwezinyathelo zenqubo zazo zombili izinhlobo zamabhodi amancane nokucatshangelwa okubalulekile komklamo we-PCB.

Inqubo Yebhodi Lendodakazi Enezinhlangothi Ezimbili (POFV)

Qala nge-substrate → Bhaka kusengaphambili i-substrate ngemva kokusika → Ukunciphisa ithusi (8±1μm) → Gomba izimbobo → Ukukhipha i-Copper → Ucwecwe lwethusi → Ukufakwa okungekuhle → Ukupulaka kwe-resin → Ukupholisha → Ukucwenga ithusi (15±3μm) → Ukucwebezelisa ukucwebezela oku-2 (Izigaba ezimbili zokucwecwa kwebhodi ukuze kwandiswe ukujiya kwethusi emigodini egqitshwe ngo-1μm) → Ukupholisha okungekuhle → Ifilimu eyomile yangaphakathi 1 → Ukuhlolwa kwefilimu eyomile → Ukufakwa kwangaphakathi 15 → Ukuhlolwa kwe-AOI yangaphakathi → I-oxidation ensundu.

Inqubo Yebhodi Lamantombazane Eningi (i-POFV)

Qala nge-substrate → Bhaka kusengaphambili i-substrate ngemva kokusika → Ifilimu eyomile yangaphakathi → Ukuhlobisa kwangaphakathi → Ukuhlolwa kwe-AOI yangaphakathi → I-oxidation ensundu → I-Lamination → Bhaka ngaphambilini 1 → Ukugaya i-Edge → Ukucwenga ithusi (8±1μm) → Gemba izimbobo → I-Deburring → I-Copper plating → I-Copper plating → I-Copper plating → Ukucwenga ithusi (15±3μm) → Ukucwebezelisa (Isigaba 2) → Ukucwebezeliswa kwethusi 1 → Ukucwebezeliswa kwebhodi → Ukucwecwa kwebhodi 1 (Izigaba ezimbili zokuhlobisa ibhodi ukuze kwandiswe ukujiya kwethusi emigodini egqitshiwe ngo-15μm) → Ukupholisha okungekuhle → Ifilimu eyomile yangaphakathi → Ukuhlola Ifilimu eyomile → Ukuhlola uDkt. ukuhlola → I-oxidation ensundu 1.

Izinqubo ezichaziwe ze-HDI zawo womabili Amabhodi Amantombazane Asemaceleni Amabili kanye Nama-Multilayer aqinisekisa ukuthi amabhodi ahlangabezana namazinga aphezulu okuminyana, ukusebenza, nokuthembeka. Amapharamitha wobubanzi bokulandelela, isikhala, nogqinsi lwethusi abalulekile ekuqinisekiseni ukuthi amabhodi ahlangabezana nezidingo ezidingekayo zezinhlelo zokusebenza zesivinini esikhulu kanye nemvamisa ephezulu. Izinyathelo zenqubo, okuhlanganisa ukucwenga, ukunamathisela, nokuhlola, ziqinisekisa ukuthi ungqimba ngalunye lwakhiwe ngendlela efanele futhi luxhumene, okunikela ekusebenzeni okuphelele kanye nekhwalithi yomkhiqizo wokugcina.

Ayikho I-Stacked Laser Blind Vias Vias Multilayer Daughter Board Process with Negative Plating + Resin Plugging (Ayihlangani Nemibandela Yokugcwalisa I-PP)

Qala nge-substrate → Bhaka kusengaphambili i-substrate ngemva kokusika → Ukucwenga kwefilimu eyomile kwangaphakathi → Ukufakwa ngaphakathi → Ukuhlolwa kwe-AOI yangaphakathi → I-oxidation ensundu → I-Lamination → Bhaka ngaphambilini 1 → Ukugaya umphetho → Ukucwenga ithusi (8±1μm) → Gcoba izimbobo → Ipulaki le-Copper → Ipulaki elicwengekileyo Ukucwebelisa → Ukucwebezelisa ithusi (njengoba kudingekile) → Ukupholisha (Isigaba 2) → Ifilimu eyomile yangaphakathi 1 → Ukuhlolwa kwefilimu eyomile → Ukufakwa ngaphakathi 1 → Ukuhlolwa kwe-AOI yangaphakathi → I-oxidation ensundu 1

Ngokusekelwe ekugelezeni kwenqubo engenhla, kusobala ukuthi idizayini yesitaki ye-HDI PCB ithonya kakhulu inqubo elandelayo yobunjiniyela be-CAM. Izinketho ezihlukene zokuklama nezindlela zokukhiqiza zingathinta kakhulu ukudalwa kwamafayela e-Gerber, abalulekile ekukhiqizeni i-PCB. Ngenxa yalokho, imiklamo eyisitaki ye-HDI PCB eyinkimbinkimbi ngokuvamile idinga isikhathi esengeziwe sokulungiselela i-CAM futhi idinga i-QA yobunjiniyela eyengeziwe. Ukuze wonge kokubili isikhathi nezindleko, abaklami kufanele baxhumane nathi kusenesikhathi lapho besebenza ngezitaki ze-HDI PCB eziyinkimbinkimbi. Ngokwamukela le ndlela esebenzayo, izinkinga ezingaba khona zingabonwa futhi zixazululwe ngokushesha, okuholela ezinqubweni ezilula, amaphutha ancishisiwe, nokongiwa kwezinsiza ezibalulekile.

Inqubo ye-Laser Hole Layer kanye nekhono Lokukhiqiza Isekhethi (Isendlalelo sangaphakathi)

Ibhodi Yendodakazi Yama-Multilayer Ngaphandle Kokungcwatshwa Nge-Vias: Ukugcwaliswa Kwemigodi Ye-Electroplating

Lamination → Bhaka kuqala i-substrate → Ukugaya unqenqema → Geza izimbobo (izimbobo zonqenqema lwebhodi) → I-oxidation ensundu 1 → Ukugaya i-laser → Ukwelashwa nge-plasma → Ukuhlanza amakhemikhali → Ukuhlola imbobo eyimpumputhe → Ukucwebezelisa ithusi 2 → Ukucwenga kwebhodi 1 → Ukugcwalisa imbobo ye-Electroplating → ukugcwalisa imbobo ye-Electroplating → ukugcwalisa imbobo ye-Electroplating → ukugcwalisa imbobo ye-Electroplating Ukuhlobisa kwangaphakathi 2 → Ukuhlolwa kwe-AOI yangaphakathi 2 → I-oxidation ensundu 1

Ibhodi Yendodakazi Yezinsimbi Ezingenayo I-Laser Blind Estacked Vias Ngokusebenzisa I-Negative Plating + Resin Plugging (Ayihlangani Nemibandela Yokugcwalisa I-PP)

Lamination → Bhaka kusengaphambili i-substrate → Ukugaya onqenqemeni → Geza izimbobo (izimbobo zonqenqema lwebhodi) → I-oxidation ensundu 1 → Ukugaya i-laser → Ukwelashwa kwe-Plasma → Ukuhlanza amakhemikhali → Ukuhlola imbobo eyimpumputhe → Ukubhola → Ukufakwa kwe-Copper 2 → Ukufakwa okungekuhle kwe-Polish → Ukuhlanganisa i-Resin → Ukucwenga okudingekayo (Isigaba 2) → Ifilimu eyomile yangaphakathi 2 → Ukuhlolwa kwefilimu eyomile → Ukuhlobisa kwangaphakathi 2 → Ukuhlolwa kwe-AOI yangaphakathi 1 → I-oxidation ensundu 2

Le nqubo iqinisekisa ukudalwa okunembile kokuxhumeka okuphezulu kokuminyana kwamabhodi wamadodakazi amaningi. Emabhodini angenawo ama-vias angcwatshwe, izinyathelo ezifana nokubhola nge-laser, ukwelashwa kwe-plasma, nokuhlanza amakhemikhali kwenziwa ukuze kuqinisekiswe ukunemba ngokubunjwa. Ngemuva kokuhlolwa kwembobo eyimpumputhe, i-copper plating, kanye nokugcwalisa imbobo ye-electroplating, ithusi liyancishiswa ukuze lihlangabezane nezimfuneko ezidingekayo.

Kumabhodi angenayo i-laser blind vias enqwabelene, inqubo ihlanganisa ukufakwa okungalungile nokuxhunywa kwe-resin, ukuqinisekisa ukuthi i-vias igcwaliswa kahle. Ukusetshenziswa kwe-laser drilling kanye nezinyathelo ezilandelayo kuqinisekisa ukuhlanzeka nokunembile ngokubunjwa. Inqubo iphetha ngokupholisha, ukunciphisa ithusi, nokuhlola okwengeziwe ukuze kuqinisekiswe ukuthi ibhodi lihlangabezana nezindinganiso zokusebenza zezicelo zesivinini esikhulu kanye nemvamisa ephezulu.

Inqubo ye-HDI PCB Motherboard (Isendlalelo Sangaphandle).

Ukugcwalisa Imbobo Ye-Electroplating + Ukufakwa Kwephethini

I-Lamination → Ukubhaka kusengaphambili 1 → Ukugaya unqenqema → Dmba izimbobo zonqenqema lwebhodi → I-oxidation ensundu → Ukugaya i-laser → Ukwelashwa kwe-Plasma → Ukuhlanza amakhemikhali → Ukuhlola imbobo engaboni → Ucwecwe lwethusi 1 → Ukugcwalisa ibhodi 1 → Ukugcwaliswa kwembobo ye-Electroplating → Inqubo yokuncibilika kwe-Copper → I-Popper Dμsimst (12 ± 3) Ukuncishiswa kwethusi

Iphethini Plating

I-Lamination → Bhaka ngaphambili 1 → I-Edge milling → Geza izimbobo zonqenqema lwebhodi → I-oxidation ensundu → Ukugaya i-laser → Ukwelashwa kwe-Plasma → Ukuhlanza amakhemikhali → Ukuhlola imbobo engaboni → Ukubhola → Inqubo ye-photoresist enhle

I-Negative Plating + Resin Plugging + Pattern Plating

I-Lamination → Bhaka ngaphambili 1 → Ukugaya unqenqema → Geza izimbobo zonqenqema lwebhodi → I-oxidation ensundu → Ukubhola ngelaser → Ukwelashwa nge-Plasma → Ukuhlanza amakhemikhali → Ukuhlola imbobo engaboni → Ukubhoboza inhlaka → Ukubhoboza 1 → Ukufakwa kwe-Copper 1 → Ukufakwa kwe-copper okungekuhle → Ukucwenga okupholisha (15±3μm) → Ukubhola → Inqubo ye-photoresist enhle

Imbobo Yokucwenga + Ukuxhuma I-Resin + UkuPlatha Iphethini

I-Lamination → Ukubhaka ngaphambilini 1 → Ukugaya i-Edge → Imigodi yonqenqema yebhodi → I-oxidation ensundu → Ukubhola ngelaser → Ukwelashwa nge-Plasma → Ukuhlanza amakhemikhali → Ukuhlola imbobo engaboni → Ukubhoboza inhlaka → Ukubhoboza 1 → Ukufakwa kwe-Copper 1 → Ukuplala ibhodi → Imbobo yokupholisha → Imbobo yokupholisha → Imbobo yokupholisha inqubo photoresist

Incazelo Yenqubo kanye Nemingcele Ebalulekile

Izinqubo ezichazweyo zakhelwe ukudala amasekethe e-multilayer ekhwalithi ephezulu yamabhodi omama, kugxilwe ezindleleni ezinjengokugcwalisa imbobo ye-electroplating, ukufakwa kwephethini, nokuxhunywa kwe-resin ukuze kuzuzwe ukuxhumana okuthembekile kukagesi. Ukugcwalisa imbobo ye-electroplating, ukunemba ekuncipheni kwethusi kanye nokugcwaliswa kwembobo kuqinisekisa ubuqotho besignali nokusebenza kahle kumiklamo ephezulu kakhulu.

Ukuze kufakwe i-negative plating kanye ne-resin plugging, inqubo ihilela amasu athuthuke kakhulu ukuze kuqinisekiswe ukuthi i-vias igcwaliswe kahle futhi ingaphezulu lihlala libushelelezi ukuze kufakwe iphethini. Ububanzi obuncane bokulandelela kanye namanani esikhala sokulandelela abalulekile ezinhlelweni zokusebenza ezisebenza kahle kakhulu, okuqinisekisa ukuthi ibhodi lomama liyakwazi ukuphatha amasignali anesivinini esikhulu kuyilapho ligcina ukwethembeka.

Highleap Electronics HDI PCB One-Stop Assembly Service

I-Highleap Electronics ihlinzeka ngensizakalo yomhlangano ye-HDI PCB (High-Density Interconnect), enikeza isixazululo esingenamthungo, sokuma okukodwa sezidingo zakho ze-PCB. Isevisi yethu yokuhlanganisa i-HDI PCB ihlanganisa yonke into kusukela ekuklanyweni nasekufanekiseni kuya ekukhiqizeni nasekuhlanganiseni okokugcina, iqinisekisa ukuthi imikhiqizo yakho ilethwa ngesikhathi, ngokusebenza okuphezulu nokunemba.

Inqubo yethu yokukhiqiza ye-HDI PCB isebenzisa okwakamuva kwezobuchwepheshe, okusenza sikwazi ukukhiqiza amabhodi esekethe aminyene kakhulu abalulekile ezinhlelweni ezidinga amafomu amancane, ukusebenza kwesivinini esikhulu, namandla efrikhwensi ephezulu. Ngesevisi yethu yokuma okukodwa, siphatha zonke izici zenqubo yokuhlanganisa, okuhlanganisa:

• Ukusekela Kwedizayini: Ithimba lethu lisebenza eduze nawe ukuqinisekisa ukuthi umklamo wakho we-HDI PCB uhlangabezana kokubili namazinga okusebenza nawokwenziwa.
• prototyping: Sihlinzeka ngezinsizakalo ze-prototyping ezishintsha ngokushesha, ezikuvumela ukuthi uhlole umklamo wakho ngaphambi kokukhiqiza okuphelele.
• Ukukhiqiza: Kusukela ku-laser drilling kanye nokwakheka kwe-microvia kuya ku-lamination kanye ne-copper plating, sisebenzisa imikhuba engcono kakhulu ekukhiqizeni kwe-HDI PCB ukukhiqiza amabhodi ekhwalithi ephezulu.
• Assembly: Sihlanganisa ama-PCB akho e-HDI sisebenzisa okokusebenza kwakamuva, siqinisekisa ukuthi izingxenye zibekwe ngokunembile, ngokuthengiswa okusebenzayo nokuhlola ukuqinisekisa ukusebenza okuthembekile.
• Ukuhlola Nokuhlola: Izinqubo zethu zokuhlola okuphelele, okuhlanganisa i-AOI (Ukuhlola Okuzenzakalelayo Kokuhlola) kanye nokuhlolwa kwe-X-ray, kuqinisekisa ukuthi ibhodi ngalinye lihlangabezana nezindinganiso eziqinile zekhwalithi.

Ngokunikeza isixazululo sokuma okukodwa, i-Highleap Electronics inciphisa isidingo sabahlinzeki abaningi, inciphisa izikhathi zokuhola nokwenza lula izinto. Noma ngabe udinga ama-prototypes anevolumu ephansi noma ama-run okukhiqiza amakhulu, sizibophezele ekuletheni ama-HDI PCB ekhwalithi ephezulu aklanyelwe izidingo zakho ezithile. Ithimba lethu elizinikele liqinisekisa ukuthi yonke iphrojekthi isingathwa ngokukhulu ukucophelela emininingwaneni nangekhwalithi, okusenza sibe uzakwethu ofanelekayo wezidingo zakho zomhlangano we-HDI PCB.

Amakhono Okukhiqiza we-HDI PCB

Sinikezela ngohlu olubanzi lwamakhono okukhiqiza we-HDI PCB, okuqinisekisa ukunemba okuphezulu nokuthembeka kwezinhlelo zokusebenza ezahlukahlukene. Ubuchwepheshe bethu obuthuthukisiwe busenza sikwazi ukukhiqiza ama-HDI PCB ahlukahlukene, okuhlanganisa ama-Blind Vias HDI PCBs, lapho i-vias ixhuma ungqimba olulodwa kwesinye ngaphandle kokudlula kulo lonke ibhodi; Ingcwatshwe Nge-HDI PCBs, lapho i-vias ixhuma izingqimba zangaphakathi kodwa ingafinyeleli phezulu; Ama-PCB e-Microvia HDI, anama-vias amahle wezinhlelo zokusebenza ezihlangene, eziminyana kakhulu; kanye ne-Laser Drilled Holes, lapho ubuchwepheshe besimanje be-laser drilling busetshenziselwa ukudala ama-microvias anembile nezimbobo, ezilungele imiklamo yesekethe enokuminyana okuphezulu nokubekezelelana okuqinile. Lobu buchwepheshe bufaneleka kakhulu izinhlelo zokusebenza ezidinga indawo encane yebhodi nokusebenza okuphezulu.

Inqubo ye-HDI PCB kanye Namakhono Omugqa

Inqubo yethu yokukhiqiza isekela ukujiya kwethusi okuhlukahlukene, enikeza ukuguquguquka kwezidingo ezihlukile zedizayini. Siphatha ugqinsi lwethusi olusukela ku-0.33 oz kuya ku-1 oz, ngogqinsi lwethusi oluqediwe oluphelele olungu-25μm lwethusi elingu-0.5 oz kanye no-35μm ngethusi elingu-1 oz. Lobu bubanzi busivumela ukuthi sihlangabezane nezicaciso ezihlukahlukene zokusebenza kuyilapho siqinisekisa ikhwalithi engashintshi kuzo zonke izinhlobo zamabhodi ahlukene.

Amakhono ethu okukhiqiza ahlanganisa nobubanzi bemigqa emihle, enekhono lokufinyelela ububanzi bomugqa obuncane njengo-2.0 mil ngo-0.5 oz wethusi kanye no-2.5 ​​mil ngethusi elingu-1 oz. Lobu bubanzi obuhle bubalulekile ekudaleni amadizayini aminyene kakhulu adinga ukunemba nokusebenza kahle, ikakhulukazi ezinhlelweni zokusebenza ezinesivinini esikhulu kanye nemvamisa ephezulu.

I-Advanced HDI PCB Technologies

Sisebenzisa ubuchwepheshe obuphambili ukuze siqinisekise ikhwalithi ephezulu nokusebenza kwama-HDI PCB ethu:

• Emuva Drilling: Isu elisetshenziselwa ukunqamula ingxenye yembobo ecwecwe kusuka kwezinye izendlalelo ezingaphakathi, ukunciphisa izinkinga zesignali yobuqotho nokuqinisekisa ukusebenza okungcono ezinhlelweni zokusebenza ezinesivinini esikhulu.
• Ukugaya/Ukugaya Okujulile Okulawulwayo: Ukubhola okulawulwa ngokunemba kuqinisekisa ukujula nokuqondanisa kwembobo okunembile, okubalulekile emiklamo yezendlalelo eziningi.
• I-Buried Capacitance: Ngokuhlanganisa ungqimba oluncane lwe-dielectric, sithuthukisa ubuqotho besignali ngamandla okusabalalisa okuqaqa, sithuthukise ukusebenza kwamasignali anesivinini esikhulu.
• Ukubekezelelana Kwemigodi: Imishini yethu yokumba enembayo ephezulu isivumela ukuthi sigcine ukubekezelela kwemigodi okuqinile kanye nezindawo zemigodi ezinembile, okubalulekile ekuxhumekeni kwe-interlayer okuthembekile kanye nokufakwa kwe- through-hole.

Ngalobu buchwepheshe bokukhiqiza obuthuthukile, singakwazi ukukhiqiza ama-HDI PCB ahlangabezana namazinga aphezulu kakhulu embonini, aqinisekise ukwethembeka, ukusebenza, nokusebenza kahle kwazo zonke izinhlelo zokusebenza.