Custom Ceramic PCB Manufacturing

Review ceramic substrates, metallization options and circuit requirements for your OEM project. The quotation tools below support engineering review of the material, board geometry, quantity and fabrication scope.

CERAMIC PCB QUOTE & MANUFACTURING

Isilinganiso se-PCB ye-Ceramic | Ukukhiqizwa kwe-PCB ye-Ceramic ngokwezifiso

Custom ceramic PCBs manufactured to your material, substrate, metallization and circuit requirements. Send your Gerber files or project specifications for engineering review and accurate quotation.

I-Ceramic PCB I-Al₂O₃ I-AlN Si₃N₄ DBC I-AMB Ifilimu Elikhulu Ifilimu elincane
01

Izinto Ze-Ceramic

Al₂O₃, AlN, Si₃N₄ and other ceramic substrate options can be reviewed according to your project requirements.

02

Ceramic PCB Technologies

DBC, AMB, thick-film, thin-film and other ceramic metallization structures can be evaluated for your design.

03

Custom PCB Construction

Ceramic thickness, copper thickness, circuit geometry, dimensions and metallization requirements can be specified.

04

Engineering-Based Quotation

Submit your Gerber files, drawings or specifications for engineering review before final pricing is confirmed.

Need a Custom Ceramic PCB? Send your PCB files and requirements for engineering review and quotation.
Need assembled ceramic circuit boards? Ceramic PCB Assembly →
CERAMIC PCB OPTIONS

Ceramic PCB Types We Manufacture

Select the ceramic material and substrate technology required for your project. Final manufacturability and pricing are confirmed after engineering review of the actual design and specifications.

CERAMIC MATERIALS

Ceramic Substrate Materials

Ceramic material can be selected according to the electrical, thermal, mechanical and manufacturing requirements of the project.

01

Al₂O₃ Ceramic PCB

Aluminum oxide ceramic substrates for custom ceramic circuit and electronic substrate applications.

U-ALUMINA
02

I-AlN Ceramic PCB

Aluminum nitride ceramic substrates for applications requiring high thermal conductivity and controlled thermal performance.

ALUMINUM NITRIDE
03

Si₃N₄ Ceramic PCB

Silicon nitride ceramic substrates for demanding high-power and high-reliability electronic applications.

SILICON NITRIDE
04

ZTA / HPS Ceramic PCB

Toughened alumina ceramic substrate options for projects requiring specific mechanical and reliability characteristics.

TOUGHENED CERAMIC
CERAMIC PCB TECHNOLOGIES

Ceramic Metallization & Substrate Technologies

Different ceramic PCB structures can be reviewed according to circuit geometry, copper requirements and project specifications.

01

I-DBC Ceramic PCB

Direct Bonded Copper ceramic substrates for custom power and electronic substrate requirements.

DIRECT BONDED COPPER
02

I-AMB Ceramic PCB

Active Metal Brazed ceramic substrates for high-current and high-reliability electronic applications.

ACTIVE METAL BRAZING
03

Thick-Film Ceramic PCB

Thick-film ceramic substrates for specialized circuits, hybrid assemblies and custom electronic applications.

THICK FILM
04

Thin-Film Ceramic PCB

Thin-film ceramic substrates for fine-feature circuits and high-density electronic applications.

THIN FILM
Custom ceramic PCB requirements are welcome. Material, substrate technology, dimensions, ceramic thickness, copper thickness, circuit geometry and quantity can be reviewed according to your project.
PCB ONLINE QUOTE

Configure Your PCB

Choose the board construction, base material and fabrication requirements to get an instant indicative price range. Final pricing is confirmed after engineering review.

Need engineering review? Quote by Sales →
Instant estimateUpdates as specifications change No account requiredConfigure before contacting sales Engineering reviewFinal price confirmed by Highleap
Basic ConfigurationBoard essentials
PCB Construction
Construction defines the valid base-material library and cost model.
Base Material
Loading material library…
Layers
22–60 Layers Get Quote → 22–60 layer PCBs require engineering review and are not instant-priced.
Dimensions
X mm
Board Format
Choose how the boards will be supplied for fabrication.
Quantity
pcs
Total Area: 0.0500 m²
PCB SpecificationsFabrication details
Thickness
Outer Copper
Solder Mask
Silkscreen
Solder mask and silkscreen must use different colors.
Surface Finish
OSP is the lowest-cost baseline. HASL is available in leaded (SnPb) and lead-free versions.
Advanced ProcessManufacturing requirements
Controlled Impedance
Min Track / Space
Min Hole
Via Process
Electrical Test
Delivery
Special Process
Quote PreferencesBudget and notes
Target Price
$ total
Optional budget target for sales review.
Remarks

Thatha i-Quote esheshayo

Ukulungele ukucaphuna iphrojekthi yakho elandelayo ye-PCB?

Kusukela ekwakhiweni kwe-prototype kuya ekukhiqizweni okuphezulu, i-Highleap isekela ukukhiqizwa kwe-PCB enezingqimba eziningi, ukulawulwa kwe-impedance, ukubuyekezwa kobunjiniyela okusheshayo kanye nensizakalo yokucaphuna ephendulayo kumakhasimende omhlaba wonke.