I-MEGTRON-4

Iyini i-MEGTRON-4?

I-MEGTRON-4, i-Panasonic MEGTRON series laminate, iletha ukusebenza okuphezulu okushisayo nokukagesi kuma-PCB asezingeni eliphezulu, okuyenza ilungele ukudluliswa kwedatha enesivinini esikhulu nevolumu enkulu ezinhlelweni ezifana namaseva namarutha.

Uhlolojikelele Lwempahla

  • Umkhiqizi: Imboni yePanasonic
  • Uchungechunge Lomkhiqizo: MEGTRON4
  • I-Laminate: R-5725
  • Ukukhulelwa kwangaphambilini: R-5620
  • I-Dk evamile @ 1 GHz: 3.83
  • I-Df evamile @ 1 GHz: 0.005

Izici

  • Excellent Mechanical Amandla
  • Ukumelana Nokuzinza Kwe-Thermal Okuthuthukisiwe
  • Ukusebenza Okuphezulu Okushisayo Nogesi
  • Ifanele ama-PCB amaningi kanye nokuminyana kwe-Conductor ephezulu
  • I-Low Dielectric Constant & Dissipation Factor (Ikhono Lesivinini esikhulu)

Izicelo

  • Antenna
  • I-Supercomputer
  • Ithuluzi Lokulinganisa
  • Izisetshenziswa zengqalasizinda ye-ICT

Izakhiwo ezijwayelekile ze-MEGTRON-4

Izakhiwo Amayunithi Indlela Yokuhlola Isimo Value ejwayelekile
Izakhiwo ezishisayo
I-Glass Transition Temperature (Tg) ° C I-DSC Njengoba Yamukelwe 176
TMA 170
I-DMA 210
I-Thermal Decomposition Temperature (Td) ° C I-TGA 360
Isikhathi Sokuhlukaniswa Kwezici (T288) Ngaphandle kweCu imiz IPC-TM-650 2.4.24.1 - > 120
With Cu 30
I-CTE α1 X-eksisi ppm/°C IPC-TM-650 2.4.24 <Tg 12-14
Y-eksisi 13-15
I-Z-Axis 35
I-CTE α2 I-Z-Axis >Tg 265
Izakhiwo zikagesi
Ukumelana Nomthamo MΩ·cm IPC-TM-650 2.5.17.1 C-96/35/90 1 × 109
Ukuphinda Usungulwe MΩ 1 × 108
I-Dielectric Constant (Dk) - IPC-TM-650 2.5.5.9 C-24/23/50, 1 GHz 3.83
I-Disipation Factor (Df) - IPC-TM-650 2.5.5.9 C-24/23/50, 1 GHz 0.005
Izakhiwo
Ukunwa kwamanzi % IPC-TM-650 2.6.2.1 D-24/23 0.14
Amandla e-Peel 1 oz Cu kN/m IPC-TM-650 2.4.8 Njengoba Yamukelwe 1.2
Ukuvutha Isilinganiso UL C-48/23/50 I-94V-0

Amazwi

  1. Amanani aboniswe ngenhla anikezwe njengereferensi yobunjiniyela be-PCB ejwayelekile futhi akufanele aphathwe njengezincazelo eziqinisekisiwe zama-PCB aqediwe.
  2. Idatha yereferensi ebhalwe ohlwini ihambelana nesampula engama-32 mil (0.8 mm) enokwakhiwa okungu-#3313 × 8-ply.
  3. I-MEGTRON4, R-5725, kanye ne-R-5620 yizimpawu zezinto ze-Panasonic Industry. Imininingwane yezinto zamanje kanye nokwakhiwa okutholakalayo kufanele kuqinisekiswe kusetshenziswa imibhalo yobuchwepheshe yakamuva yomkhiqizi.
  4. I-Highleap Electronics inikeza izinsizakalo zokwenziwa kwe-PCB kanye nokuhlanganiswa kwe-PCB. Uma unemibuzo ngokukhiqiza i-PCB, sicela Xhumana nathi.

Isitoreji Sempahla

  • I-R-5725 laminate ne-R-5620 prepreg iyafana nokokusebenza kwethu okujwayelekile kwe-FR-4.
  • I-laminate kufanele igcinwe endaweni epholile eyomile. Gwema ukugoba noma ukunwaya indawo ye-laminate.
  • Uma kungenzeka, gcina i-laminate esitsheni sokuqala.
  • I-Prepreg kufanele igcinwe iqondile endaweni epholile neyomile elawulwayo, 73°‰ (23°ƒ) noma ngaphansi kanye no-50% RH noma ngaphansi.

Ukulungiswa kwe-Laminate Surface

  • I-Shiny Copper evamile ingahlanzwa kusetshenziswa amakhemikhali ajwayelekile embonini ahlanzekile noma ahlanzekile ngomshini.
  • I-Reverse Treat Copper kufanele ihlanzwe kusetshenziswa amakhemikhali ajwayelekile embonini.

I-Inner Layer Bond Treatment

  • I-oksidi emnyama noma emnyama ingasetshenziswa.
  • Okunye Ukwelashwa Kwe-oksidi kusetshenziswa ubuchwepheshe be-Peroxide/Sulfuric etch nakho kungasetshenziswa.

Ukumisa

  • Zomisa izendlalelo zangaphakathi eziqediwe ngokuphelele ukuze ususe noma yimuphi umswakama omunnyiwe noma umswakama ongaphezulu.
  • Kukhethwa ukubhaka okufakwe ku-racked ku-300℉ (150℃) ihora eli-1-2. Ukuze kucutshungulwe i-oxide ehlukile edluliselwayo, eminye imishini ingaba namandla okomisa anele. Kodwa-ke, kunconywa ukubhaka okufakwe ku-racked.
Ifektri Yomhlangano We-Turnkey-PCB

Kusukela ku-High-Speed ​​Stack-Up kuya ku-Finished PCBA

Kumaphrojekthi e-PCB anezingqimba eziningi ahilela i-MEGTRON4, i-Highleap Electronics igxile ekuguquleni umklamo kagesi ovunyiwe ube yindlela yokukhiqiza ewusizo kanye nokwakhiwa kokuhlanganiswa. Ukubuyekezwa kokukhiqiza kuxhuma ukwakhiwa kwe-stack-up, izidingo ze-impedance, ngezakhiwo, izici zethusi, kanye ne-assembly interfaces ukuze ibhodi elingenalutho kanye ne-PCBA yokugcina kulandele isisekelo sokukhiqiza esifanayo.

Ukubuyekezwa Kwesakhiwo Sesignali

Imikhondo yokuvimbela ukulawulwa, ama-differential pairs, izinkomba, isikhala se-dielectric, kanye nokuguqulwa kwezingqimba kuyabuyekezwa kanye ne-PCB stack-up evunyiwe. Lokhu kusiza ekumiseni amapharamitha okukhiqiza adingekayo ekukhiqizweni kwebhodi elinezingqimba eziningi ngesivinini esikhulu.

Ukuhlanganiswa Kokwakhiwa Kwezingqimba Eziningi

Ukubhaliswa kwezingqimba, ukubhoboza, izakhiwo zemigodi ehlanganisiwe, ukulandelana kwe-lamination, ukusatshalaliswa kwethusi, kanye nobukhulu bebhodi eliqediwe kuhlanganiswa ngokwemibhalo yokuklama kanye nokukhiqiza ye-PCB yangempela.

Ukudluliselwa Kokwenziwa Kokuhlanganiswa

Ukuqeda umphezulu, ifomethi yephaneli, izindawo zezingxenye, izidingo zokunamathisela, izindawo zokuhlola, kanye nezidingo zokuhlola kuyabuyekezwa ngaphambi kokukhiqizwa kwe-PCBA ukuze izidingo zokwenziwa kwe-PCB kanye nokuhlanganiswa kwazo zihlale zihambisana.

I-Highleap Electronics inikeza ukwenziwa kwe-PCB enezingqimba eziningi, ukukhiqizwa kwe-impedance elawulwayo, ukuhlanganiswa kwe-SMT/THT, ukuhlolwa, kanye nokuhlolwa okuvela ezakhiweni ze-prototype ngokukhiqizwa kwevolumu. Kumaphrojekthi ahilela i-MEGTRON4 R-5725 / R-5620, izidingo zezinto zifakwa kumadokhumenti e-PCB avunyiwe ngaphambi kokukhiqizwa.

Sithumelele amafayela akho e-Gerber, i-stack-up, kanye ne-BOM ukuze kubuyekezwe futhi kucashunwe ukukhiqizwa kwe-PCB.