Uhlolojikelele olujulile lwe-PCB Laminate Construction

Ama-PCB awumgogodla wezinto zikagesi zesimanje, ezihlinzeka ngenkundla yezingxenye ezihlukahlukene ukuze zixhumeke futhi zisebenze ngaphandle komthungo. Emgogodleni wayo yonke i-PCB kukhona uhlaka oluyinkimbinkimbi lwezendlalelo ezixhumene, ngayinye isebenzela injongo ethile ekuqinisekiseni ukusebenza nokwethembeka kwebhodi.Phakathi kwezinto ezibalulekile i-PCB Laminate Construction, imidwebo yesitaki idlala indima ebalulekile ekuchazeni ukwakhiwa kwebhodi. kanye nezakhiwo zikagesi. Ukuqonda lezi PCB Laminate Construction kubalulekile kubaklami be-PCB nabakhiqizi ukuze bakhe amabhodi esekethe asebenza kahle nasezingeni eliphezulu.

Ingqikithi Yebhodi Lesifunda Eliphrintiwe (PCB) ilele esakhiweni sayo esiyinkimbinkimbi esibandakanya izendlalelo ezimbalwa ezixhunywe yi-Prepregs kanye nezinto ze-Core.

I-Prepreg, evame ukubizwa ngokuthi amashidi afakwe i-resin esigabeni se-B, iyinto ephiliswe kancane eyakhiwe i-resin efakwe kumafilimu amancane. Isebenza ngezinjongo ezimbili ekukhiqizweni kwe-PCB enezingqimba eziningi : isebenza njenge-glue yokubopha amaphethini okuqhuba angaphakathi futhi inikeza ukuvikelwa kokushiswa kwezingqimba eziphakathi. Ngesikhathi sokushiswa, i-resin ye-epoxy ye-Prepreg iyancibilika, igeleze, futhi iqine, ihlanganise ngempumelelo izingqimba zesekethe ngenkathi yakha isithiyo sokuvimbela esithembekile phakathi kwazo.

Ngakolunye uhlangothi, izinto eziyinhloko zakha isisekelo se-PCB—ibhodi eliqinile elinobukhulu obuthile kanye ne-foil yethusi ebekwe ezinhlangothini zombili. I-PCB ejwayelekile enezingqimba eziningi yenziwa ngokulayishwa kwezingqimba ezishintshanayo ze-core kanye ne-Prepregs. Izingqimba ze-Prepreg, ezakha lokho esikubiza ngokuthi “ukumanzisa” noma izendlalelo zokufakelwa, zingahlanganisa izendlalelo eziningi eziyinhloko ndawonye, ​​​​futhi naphezu kokuba nobukhulu bokuqala, zithola ukuncishiswa okuthile ngesikhathi senqubo yokucindezela. Ngokwakhiwa okuphansi kokulahlekelwa, ukwenziwa kwe-HVLP yethusi ngebhodi kufanele kuchazwe kanye nezendlalelo ze-dielectric ngoba ukuqina komqhubi nakho kuthinta imodeli yesiteshi.

Imvamisa, izingqimba ezimbili ezingaphandle kakhulu ze-dielectric ze-PCB ye-multilayer ziyizingqimba zokufakelwa, ezimbozwe izendlalelo ezihlukene ze-copper foil ezisebenza njengezindiza eziqhutshwayo zangaphandle. Ukucaciswa kogqinsi okungahluziwe kwamafoil ethusi angaphandle nangaphakathi kuvame ukuvela ngezinhlobo ezingu-0.5OZ, 1OZ, kanye no-2OZ (okuthi i-1OZ icishe ibe ngu-35um noma 1.4mil). Ngemva kokucubungula, ungqimba lwecwecwe lethusi langaphandle ngokuvamile lukhuphuka ngogqinsi cishe ngo-1 OZ, kuyilapho ukujiya kokugcina kwecwecwe lethusi elingaphakathi lihlala liseduze nenani langempela kodwa lingancipha kancane ngenxa yokuqoshwa.

Ingqimba engaphandle ye-PCB enezingqimba eziningi yakhiwe yi- soldermask , eyaziwa ngokuthi “Amafutha Aluhlaza,” yize ingaba nombala ophuzi noma eminye imibala. Ubukhulu be-soldermask abutholakali kalula, ngoba bukhulu ezindaweni ezingenayo ithusi uma kuqhathaniswa nalezo ezinethusi, kodwa ukuphuma kwethusi kusabonakala lapho kuhlolwa ubuso be-PCB ngendlela ethintayo.

PCB Amapharamitha kanye Materials

Umehluko kumapharamitha we-PCB ukhona phakathi kwabakhiqizi abahlukene, okwenza kudingeke ukuxhumana nonjiniyela befekthri be-PCB ukuze bathole idatha yabo ethile, ngokuyinhloko kugxilwe kugqinsi lwe-dielectric kanye ne-soldermask, engahluka kumkhiqizi oyedwa kuya komunye.

Isendlalelo Sangaphandle I-Copper Foil Ubukhulu be-copper foil obutholakalayo buhlanganisa u-12um, 18um, no-35um. Ngemva kokucutshungulwa, lokhu ngokuvamile kuphumela ekujikeni kokugcina okungaba ngu-44um, 50um, no-67um, okulingana cishe nesisindo sethusi esingu-1 OZ, 1.5 OZ, no-2 OZ ngokulandelana. Qaphela ukuthi uma usebenzisa isofthiwe yokubala i-impedance yokulawula, ayikho inketho yobukhulu bethusi obungu-0.5 OZ ngezendlalelo zangaphandle.

Izinto Eziyinhloko Izinto eziyinhloko ezisetshenziswa kakhulu yi-S1141A, okuyizinto ezijwayelekile ze-FR-4, ezimbozwe ngethusi elizinhlangothi ezimbili, ezinemininingwane ekhethiwe engaqinisekiswa ngqo nomkhiqizi.

Ama -Prepreg Prepreg afika ngezinhlobo ezahlukene zobukhulu bokuqala ezifana ne-7628 (0.185mm/7.4mil), 2116 (0.105mm/4.2mil), 1080 (0.075mm/3mil), kanye ne-3313 (0.095mm/4mil). Lapho kucindezelwa ngempela, ubukhulu buvame ukwehla cishe ngo-10-15um (0.5-1mil), ngakho-ke ubukhulu bengqimba ye-dielectric encane ekwakhiweni kwe-stackup akumele bube ngaphansi kuka-3mil. Ingqimba eyodwa yokufakelwa ingasebenzisa ama-Prepreg amathathu, lapho kungekho noyedwa kulaba abathathu ongaba nobukhulu obufanayo; okungenani i-Prepreg eyodwa ingasetshenziswa, yize abanye abakhiqizi bedinga okungenani ababili. Uma ubukhulu be-Prepreg bunganele, i-foil yethusi ezinhlangothini zombili zenhliziyo ingaqoshwa bese ihlanganiswa ne-Prepregs, kufezwe ungqimba lokufakelwa olujiyile. I-dielectric constant ye-Prepregs iyahlukahluka ngobukhulu bayo, futhi ithebula elilandelayo libala ubukhulu bamamodeli ahlukene kanye ne-dielectric constants yazo ehambisanayo:

I-dielectric constant yebhodi le-laminate incike ezintweni ze-resin ezisetshenzisiwe; Amabhodi e-FR4 ngokuvamile abonisa ububanzi obungaguquki be-dielectric obungu-4.2 ukuya ku-4.7, obuncipha ngobuningi obukhulayo.

Isendlalelo se-Soldermask Ubukhulu besendlalelo se-soldermask ngaphezu kwe-foil yethusi, ekhonjiswe njenge-C2, cishe buyi-8-10um. Ubukhulu besendlalelo se-soldermask ezindaweni ezingenayo ithusi, i-C1, buyahlukahluka ngokusekelwe ekujikeni kwethusi okungaphezulu, okucishe kube yi-13-15um yethusi elijiyile elingu-45um kanye nethusi elijiyile elingu-17-18um lethusi elijiyile elingu-70um. Uma kubalwa nge-SI9000, inani lokujiyile le-soldermask elingu-0.5OZ lanele.

Isigaba Esiphambene Somqhubi Ngenxa yokugqwala, isigaba esiphambene sabaqhubi asisiyindilinga kodwa siyi-trapezoidal. Isibonelo, kungqimba LOKUPHEZULU, lapho ubukhulu befoyili yethusi buyi-1OZ, isisekelo esiphezulu se-trapezoid sifushane cishe nge-1MIL kunesisekelo esingezansi. Ngakho-ke, uma ububanzi bomugqa obuklanyiwe buyi-W=5MIL, ububanzi obuphezulu bungaba cishe yi-4MIL kanti ububanzi obuphansi bungaba yi-5MIL. Umehluko phakathi kwezisekelo eziphezulu nezingezansi uhlobene nobukhulu bethusi, njengoba kuboniswe kuthebula elingezansi ngaphansi kwezimo ezahlukene:

Izibalo ze-Impedance Izibalo ze-Impedance ezijwayelekile zisebenzisa amamodeli alandelayo:

• Imodeli Yomugqa we-Microstrip
• Imodeli ye-Stripline

Kumodeli ye-microstrip, kukhona okunye ukulungiselelwa, okuhlanganisa imodeli engasetshenziswanga ngaphandle kokumbozwa. Ama-dielectric constants u-Er1 kanye no-Er2 kumodeli enemifanekiso ancike kumodeli ethile yangaphambi kokulungiselela esetshenzisiwe; amamodeli abalulekile abalwe ngaphambilini futhi imingcele enemininingwane kufanele itholwe ngokuqondile kumkhiqizi we-PCB.

Uma iphrojekthi isuka ocwaningweni iye kwi-RFQ, buyekeza ukukhethwa kwe-PCB laminate kanye nokuhlanganiswa kwe-BGA okune-fine-pitch ukuze izinto zokwakha, inqubo, kanye nezidingo zokuhlola zihlale zihambisana.

Sekukonke, ukuqonda isakhiwo esiyinkimbinkimbi kanye nezinto zokwakha zePrinted Circuit Board (PCB) kubalulekile ekuklameni nasekukhiqizeni amadivayisi kagesi asezingeni eliphezulu. Izinto zokwakha ze-Prepreg kanye ne-Core zidlala indima ebalulekile ezingqimbeni zokubopha kanye nokuhlinzeka ngokushisa, kuyilapho ama-foil ethusi kanye nama-solder masks kunegalelo ekuqhubeni nasekuvikeleni kwe-PCB.

Umehluko kumapharamitha we-PCB nezinto zokwakha phakathi kwabakhiqizi zigqamisa ukubaluleka kokuxhumana nokuthola idatha ethile yephrojekthi ngayinye. Imidwebo yokunqwabelanisa isebenza njengamathuluzi ayigugu, ihlinzeka ngepulani yokwakhiwa kwe-PCB nezakhiwo zikagesi.

Ngokuqonda izici ezibalulekile zemidwebo yokunqwabelanisa, abaklami bangaqinisekisa ubuqotho nokuthembeka kwemiklamo yabo ye-PCB, ekugcineni kuholele kumadivayisi kagesi asebenza kangcono futhi aqine kakhudlwana.