I-High-Performance Flexible PCB Material – iDuPont™ Pyralux® AP
Hlola i-DuPont™ Pyralux® AP, i-top-tier adhesiveless polyimide laminate elungele ukwenziwa kwe-PCB eguquguqukayo neqinile. Isekelwa yi-Highleap Electronics.
I-DuPont™ Pyralux® AP Flexible Laminate
I-Pyralux® AP iyi-laminate eguquguqukayo yethusi esebenza kahle kakhulu, eyenziwe nge-polyimide egobile eyenzelwe amasekethe aguquguqukayo anezingqimba eziningi kanye nezinhlelo zokusebenza ze-PCB eziqinile . Njengoba ingenayo ingqimba yokunamathela kanye nokuqina okuhle kakhulu kokushisa nobukhulu, i-Pyralux® AP ihlangabezana nezidingo eziqinile zezindawo ze-elekthronikhi ezinokwethenjelwa okuphezulu.
- Ukuzinza okuhle kakhulu kwe-dimensional kanye ne-thermal ngaphansi kwezimo ezimbi kakhulu
- Ilungele izinhlelo zokusebenza ze-PCB eziguquguqukayo eziningi kanye ne-rigid-flex
- I-UL 94V-0 iqinisekisiwe futhi iyahambisana ne-IPC 4204/11
- Uhlu olubanzi lwenhlanganisela yethusi nokuqina kwe-dielectric etholakalayo
Le nto isetshenziswa kakhulu kugesi wezimoto, kumishini yezokwelapha, kumasistimu we-aerospace, kanye nemishini yokuxhumana ye-5G.
I-Pyralux®
Iminikelo yomkhiqizo we-AP
| Ikhodi yomkhiqizo | Ubukhulu be-Dielectric (mil) | Ukuqina Kwethusi (oz/ft²) |
|---|---|---|
| AP 7163E | 1.0 | 0.25 |
| AP 7164E | 1.0 | 0.33 |
| I-AP8515R | 1.0 | 0.5 |
| I-AP9111R | 1.0 | 1.0 |
| AP 7156E | 2.0 | 0.25 |
| AP 7125E | 2.0 | 0.33 |
| AP 8515E | 1.0 | 0.5 |
| I-AP8525R | 2.0 | 0.5 |
| I-AP9121R | 2.0 | 1.0 |
| I-AP9222R | 2.0 | 2.0 |
| I-AP8535R | 3.0 | 0.5 |
| I-AP9131R | 3.0 | 1.0 |
| I-AP9232R | 3.0 | 2.0 |
| I-AP8545R | 4.0 | 0.5 |
| I-AP9141R | 4.0 | 1.0 |
| I-AP9242R | 4.0 | 2.0 |
| Impahla ye-Laminate | IPC TM-650 (* noma enye) | I-AP-9111 1 mil dielectric |
I-AP-9121 2 mil dielectric |
AP-9131–9161 3-6 mil dielectric |
|---|---|---|---|---|
| Ukunamathela ku-Cu (Amandla e-Peel) Njengokwakhiwa, i-N/mm (lb/in) Ngemuva kwe-solder, N/mm (lb/in) |
Indlela ye-2.4.9 | 1.6 (9) | >1.8 (10) | >1.8 (10) |
| 1.6 (9) | >1.8 (10) | >1.8 (10) | ||
| I-Solder Float ku-288°C (550°F) | Indlela ye-2.4.13 | Pass | Pass | Pass |
| Ukuzinza kweDimensional Indlela B, % Indlela C, % |
Indlela ye-2.2.4 | –.04 ukuze –.08 –.05 ukuze –.08 |
–.04 ukuze –.08 –.04 ukuze –.07 |
–.03 ukuze –.06 –.03 ukuze –.06 |
| I-Dielectric Thickness Tolerance,% | Indlela ye-4.6.2 | ± 10 | ± 10 | ± 10 |
| Isilinganiso sokuvutha kwe-UL | *UL-94 | I-V-0 | I-V-0 | I-V-0 |
| I-Dielectric Constant*, 1 MHz | Indlela ye-2.5.5.3 | 3.4 | 3.4 | 3.4 |
| I-Disipation Factor*, 1 MHz | Indlela ye-2.5.5.3 | 0.003 | 0.002 | 0.002 |
| Amandla e-Dielectric, kV/mil | Indlela ye-2.5.6.1 | 6-7 | 6-7 | 6-7 |
| Ukuphikiswa Kwevolumu, ohm-cm | Indlela ye-2.5.17.1 | E16 | E17 | E17 |
| Ukumelana Nobuso, ohms | Indlela ye-2.5.17.1 | >E16 | >E16 | >E16 |
| Umswakama kanye ne-Insulation Res., ohms | Indlela ye-2.6.3.2 | E11 | E11 | E11 |
| Ukumuncwa komswakama, % | Indlela ye-2.6.2 | 0.8 | 0.8 | 0.8 |
| Amandla Okuqina, i-MPa (kpsi) | Indlela ye-2.4.19 | > 345 (> 50) | > 345 (> 50) | > 345 (> 50) |
| Ubude, % | Indlela ye-2.4.19 | > 50 | > 50 | > 50 |
| Isiqalo Amandla Enyembezi, g | Indlela ye-2.4.16 | 700-1000 | 900-1200 | 900-1200 |
| Amandla Okukhula kwezinyembezi, g | Indlela ye-2.4.17.1 | > 10 | > 20 | > 20 |
| Ukumelana Namakhemikhali, imiz. % | Indlela ye-2.3.2 | Dlula, >95% | Dlula, >95% | Dlula, >95% |
| I-Solderability | *IPC-S-804, M. 1 | Pass | Pass | Pass |
| I-Flexural Endurance, imiz. imijikelezo | Indlela ye-2.4.3 | 6000 | 6000 | 6000 |
| I-Glass Transition (Tg), °C | - | 220 | 220 | 220 |
| Modulus, kpsi | - | 700 | 700 | 700 |
| Endizeni i-CTE (ppm/°C) T | - | 25 | 25 | 25 |
| Endizeni i-CTE (ppm/°C) T>Tg | - | 40 (est.) | 40 (est.) | 40 (est.) |
- I-Pyralux® AP iwumkhiqizo we-DuPont.
- Amanani obuchwepheshe anikezwa njengereferensi yobunjiniyela obujwayelekile kuphela. Sicela ubheke imibhalo yamanje yomkhiqizi wezinto ezibonakalayo ukuze uthole imininingwane eqinisekisiwe.
- I-Highleap Electronics ingumkhiqizi we-PCB ozimele kanye nomhlinzeki wesevisi yokuhlanganisa futhi ayiyona inkampani ekhiqiza i-Pyralux® AP.
Izinzuzo Eziyinhloko Nezicelo ze-Pyralux® AP
I-Pyralux® AP iletha ukusebenza okuhamba phambili embonini kubaklami nabakhiqizi bama-PCB aguquguqukayo. Inikeza izakhiwo zikagesi ezingaguquki kanye nokuthembeka okuphezulu kokushisa kwezinhlelo zokusebenza ezibucayi.
Izinzuzo Eziyinhloko:
- I-Coefficient Ephansi Yokwanda Kwe-Thermal (CTE) - ilungele ama-multilayer e-rigid-flex
- Ukunamathela okuphezulu phakathi kwethusi ne-polyimide ukuze kuqiniswe ubuqotho besekethe
- Ukulawulwa okuhle kakhulu kwe-dielectric ukushuba kwemiklamo elawulwayo ye-impedance
- Ukusebenza okuzinzile ezindaweni ezinokhahlo: umswakama ophezulu, ukuhamba ngebhayisikili okushisayo, nokuchayeka kwamakhemikhali
Izinkundla Zokufaka Isicelo:
- Imishini yokuxilonga yezokwelapha (isb., amasistimu wokuthwebula izithombe, okugqokekayo)
- I-Defence kanye ne-aerospace electronics (amasistimu wesathelayithi, ama-avionics)
- Izinhlelo zokuxhumana ngesivinini esikhulu kanye nezimpondo ze-5G
- Ama-ECU ezimoto, izinzwa, nezilawuli zikagesi ezingaphakathi kwekhabethe
Ukukhiqiza i-PCB Eguquguqukayo nge-Pyralux® AP Ecacisiwe Yikhasimende
I-Highleap Electronics inikeza izinsizakalo zokukhiqiza nokuhlanganisa i-PCB eguquguqukayo kanye ne-rigid-flex PCB ngokusekelwe emidwebweni yamakhasimende, izidingo zokuhlanganisa, kanye nezinto ezicacisiwe ze-laminate. Amaphrojekthi achaza i-Pyralux® AP angabuyekezwa ukuze kutholakale ukutholakala kwezinto kanye nezidingo zokukhiqiza ngaphambi kokukhiqiza.
Amakhono Okukhiqiza e-PCB Aguquguqukayo
- Ukwenziwa kwe-PCB okuguquguqukayo okunesendlalelo esisodwa kanye nesendlalelo esiningi
- Ukwenziwa kwe-PCB okuqinile kanye ne-lamination enezingqimba eziningi
- Ukubhoboza nge-laser kanye nomshini
- Ukucutshungulwa kwe-Coverlay kanye ne-lamination
- Ukufakwa kwe-PCB okuvinjelwe ngokulawulwayo
- Ukuhlanganiswa kwe-SMT, i-THT, ukuhlolwa, kanye nokuhlolwa
I-Pyralux® AP ihlonzwa kuleli khasi kuphela njengezinto ze-PCB ezikhethwa ngamakhasimende. I-Highleap Electronics ingumkhiqizi we-PCB ozimele kanye nomhlinzeki wesevisi yokuhlanganisa.
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