Yini Eyenza Ama-RFSoC + GPU PCB Ahluke?

Ibhodi eliboniswe ngenhla lihlanganisa izizinda ezimbili zokucubungula ezidingayo. I-RFSoC iphatha ukuguqulwa kwedatha okusheshayo kanye nokucutshungulwa kwesignali okuhleliwe, kuyilapho i-Jetson AGX Orin inikeza ukusheshiswa kwe-GPU kwemithwalo yemisebenzi edinga ukubalwa. Phakathi kwazo kukhona inkumbulo, isitoreji, amandla, iwashi kanye nemisebenzi yokuxhumana okusheshayo. Lokho kugxila kushiya inkululeko encane yokuphatha ukwenziwa nokuhlanganiswa njengokuhlukile ezinqumweni zokuqala zokwakheka.

Ngakho-ke, maqondana nokukhiqiza, umbuzo obalulekile awukona nje ukuthi i-PCB iyadlula yini ukuhlolwa komthetho wokuklama. I-trace geometry, izindiza zokubhekisela, ngokushintshashintsha, ukuhlukaniswa kwezingxenye, ukusatshalaliswa kwethusi kanye nezindlela zokushisa konke kufanele kuhlale kusebenza lapho umklamo uba ibhodi elingokoqobo.

Ukwakhiwa Kwehadiwe Okuyinhloko Kweplatifomu ye-RFSoC

Le pulatifomu yenzelwe izinhlelo zokusebenza ezidinga amandla njengokucubungula isignali ye-radar, ukuxhumana okusheshayo, ukuqagela kwe-AI, ucwaningo lwempi ye-elekthronikhi, i-SDR prototyping , kanye nocwaningo noma ukufundisa. Ukwakhiwa kwayo kuhlanganisa ukuguqulwa kwe-wideband RF nokucubungula kwe-FPGA kanye nokusheshisa kwe-GPU, ngakho-ke i-PCB kufanele ivumelane nezindlela ezibucayi ze-analog/RF kanye nezixhumi zedijithali ezixineneyo.

Isigaba se-RF sisebenzisa ukwakheka kwe-8T8R okunokuhlukaniswa kwesiteshi okuchazwe okungenani okungu-60 dB kanye ne-SFDR okungenani okungu-55 dBc. Lezo zibalo zenza isakhiwo se-PCB esibonakalayo sibaluleke. Ukuziphatha kwe-laminate, i-geometry yethusi, ukuqhubeka kwe-reference-plane kanye nokushintshana kwesixhumi konke kungathinta indlela isakhiwo esenziwe ngayo esiziphatha ngayo uma kuqhathaniswa nomklamo ohlosiwe.

Ukubekwa kwe-interface kuyingxenye yomklamo we-PCB

Ukubuka kwangaphambili okunelebula kuyasiza ngoba kukhombisa ukuthi indawo yokuxhumana yangaphandle akuyona nje iqoqo lezixhumi. Amachweba anesivinini esikhulu njenge-100G QSFP28 kanye nezindlela ezihlobene ne-PCIe zidinga ukuhanjiswa okulawulwayo kumadivayisi okucubungula, kuyilapho i-USB, i-Ethernet, i-DisplayPort, i-GPS kanye nezixhumi zokulungisa iphutha nazo zidinga ukufinyelela okusebenzayo kwemishini.

Isimiso esifanayo sisebenza esibonakalayo sokulungisa iphutha se-Type-C esinomsebenzi we-USB-to-JTAG kanye ne-UART. Isixhumi esisebenza kahle ngogesi kodwa esinzima ukusifinyelela ngesikhathi sokuhlolwa kokukhulisa noma ukukhiqizwa singayibambezela yonke inqubo yokuqinisekisa. Ngakho-ke, ukubekwa kwesixhumi kufanele kubuyekezwe kanye nomzila, imikhawulo yokuvala kanye nokufinyelela kokuhlola.

Kumaphrojekthi anezidingo ze-RF ezifanayo kanye nesivinini esikhulu, insizakalo yokwenziwa kwe-PCB ye-Highleap evame kakhulu ingaba yinto efanele lapho ukulawulwa kwe-impedance, ukukhethwa kwe-laminate kanye nobuqotho besignali kuba yizidingo zokukhiqiza eziphambili.

Izinto Okucatshangelwayo Ngokukhiqizwa kwe-PCB Ngezimpawu ze-RF Nesivinini Esiphezulu

Umbono wangemuva webhodi unezela enye ingxenye ebalulekile yesithombe sokukhiqiza: i-PCB kufanele ifake imvilophu yomshini edingekayo ngenkathi isanikeza indawo yokugcina, ukuhambisa, ukusekela kanye nokufinyelela ekuhlanganiseni. Lokhu kubaluleke kakhulu uma izingxenye zesivinini esikhulu zibekwe ezinhlangothini zombili zebhodi elincane.

I-Stack-up ne-impedance elawulwayo

Ubukhulu obubonakalayo obuboniswe ekubukeni kwebhodi buyingxenye nje yomkhawulo wokukhiqiza. Kumanethiwekhi e-RF kanye nesivinini esikhulu, ububanzi bokulandelela, ukujiya kwethusi, ukujiya kwe-dielectric kanye nezakhiwo ze-laminate kunquma i-impedance ephumelayo. Lawa manani kufanele avumelane nomenzi kunokuba athathwe kusukela ekuqoqweni okujwayelekile.

Izinsizakalo zokukhiqiza ze-PCB ze-Highleap zisekela ukwakhiwa kwe-controlled-impedance kanye ne-high-frequency. Umbuzo obalulekile wokukhiqiza ukuthi ingabe i-production stack-up yangempela ingaphinda ikhiqize njalo yini imicabango kagesi esetshenziswa ngesikhathi sokuhlelwa.

Umzila ongemuva, indawo yokugcina kanye nokususwa kwemishini

Indawo engemuva ye-NVMe iyisibonelo esihle sokuthi kungani ukubuyekezwa kukagesi nokwemishini kufanele kwenzeke ndawonye. Isitoreji se-M.2 sidinga ukususwa kwesixhumi kanye nemodyuli, ukwesekwa kokuyifaka kanye nokufinyelela ekuhlanganisweni. Ngesikhathi esifanayo, ithusi elizungezile kanye nomzila kumele kugcinwe amandla, isisekelo kanye nezidingo zesignali yesivinini esikhulu.

Usayizi webhodi oshiwo ongu-245 × 165 mm kanye nobukhulu obungu-2.5 mm nawo kudingeka uhlale uhambisana nendawo ebiyelwe, izindawo zokufaka kanye nezikhundla zokuxhuma. Ukubuyekezwa kokukhiqiza kufanele kuqinisekise lezi zinkomba zemishini ngaphambi kokuba kukhishwe idatha yokukhiqiza.

Ngezakhiwo kanye nezindlela zokubuya ze-RF

I-via ngayinye idala ushintsho olubonakalayo. Ezindleleni ezinesivinini esikhulu noma ze-RF, ububanzi bokubhoboza, i-geometry yephedi, ubukhulu be-antipad kanye nendlela yokubuya kungathinta ukuziphatha kwesignali. Ukuthunga phansi kanye nokuqhubeka kwendiza yereferensi kubaluleke ngokulinganayo eduze kwe-RF kanye noshintsho lwesivinini esikhulu.

Ukusatshalaliswa kwethusi kanye nokuziphatha kokushisa

Ibhodi eliphethe i-RFSoC, i-GPU, i-DDR4 kanye nezixhumi eziningi zesivinini esikhulu nalo linesidingo esikhulu samandla nokushisa. Ngakho-ke ukusatshalaliswa kwethusi kufanele kuhlolwe ikhono lokuthwala lamanje, ukuziphatha kokulethwa kwamandla, izindlela zokushisa kanye nebhalansi yokukhiqiza kunokuphathwa njengenkinga yokuhambisa kuphela.

Khetha izinqubo ezikhethekile kuphela uma umklamo uzidinga

Ibhodi le-RFSoC eliyinkimbinkimbi alidingi i-HDI ngokuzenzakalelayo, ama-laminate angavamile noma ukwakhiwa kwe-ceramic. Lezo zinqubo kufanele zikhethwe lapho ubuningi be-routing, imvamisa, ukuziphatha kokushisa noma ezinye izidingo eziqinisekisiwe zivumelana nazo. Inqubo yokukhiqiza kufanele ilandele imfuneko yobunjiniyela, hhayi okuphambene nalokho.

Izinselele Zokuhlanganiswa Kwe-PCB Zezingxenye Ezinobuningi Obuningi

Umbono we-PCBA ohlangothini olungaphambili ubonisa lapho izinqumo zokukhiqiza ziba yinkinga yokuhlanganisa. I-RFSoC, i-GPU, imemori, amadivayisi kagesi, izixhumi nezinye izingxenye zigxile endaweni elinganiselwe, okushiya isikhala esincane sokubekwa okungalawulwa noma inqubo yokuhlanganisa engakahlelwanga mayelana nokwakheka.

Ukubekwa kwengxenye akukwazi ukuhlukaniswa nobuqotho besiginali

Ebhodini elinjengaleli, ukuhambisa ingxenye ukuze kuthuthukiswe ukufinyelela kwenhlangano kungashintsha ubude bokuxhumana okunesivinini esikhulu, indlela ye-RF, indlela yamandla noma indawo yokushisa etholakalayo. Ngakho-ke, ukubekwa kufanele kulinganise ukufinyelela kwenhlangano nezidingo zikagesi zomklamo wokuqala.

I-BGA kanye nokuhlanganiswa kwephimbo elihle

Amaphakheji e-FPGA kanye neprosesa agxilisa amalunga amaningi e-solder endaweni encane. Ukuphrinta nge-solder-paste, ukunemba kokubekwa, iphrofayili yokugeleza kabusha kanye nokusekelwa kwebhodi konke kuba okubalulekile. Ngenxa yokuthi amalunga amaningi afihliwe ngaphansi kwamaphakheji e-BGA, ukuhlolwa kwe-X-ray kuyisithasiselo esibalulekile ekuhlolweni okubonakalayo kanye ne-AOI. Imiklamo yenkampani ye-RFSoC ene-processor exinene kanye ne-memory interfaces ingabelana ngezinkinga zokuhlangana nezidingo zebhodi le-multilayer le-server-class , ngenkathi igcina izindlela zayo zokwamukelwa kwe-RF.

Insizakalo yokuhlanganisa i-PCB ye-Highleap isekela ukuhlanganiswa kwe-SMT, imbobo edlulayo kanye nobuchwepheshe obuxubile nge-AOI, i-X-ray kanye nokuhlolwa kokusebenza. Ku-PCBA exinene, isu lokuhlola kufanele kuvunyelwane ngalo ngaphambi kokukhiqiza kunokwengezwa ngemva kokuvela kwenkinga yokuhlanganisa.

Izinto okufanele uzicabangele ngokuhlanganiswa kwe-thermal kanye ne-mechanical

I-GPU kanye ne-RFSoC akuzona nje izingxenye ezinenani eliphezulu; futhi zinegalelo elikhulu ekusebenzeni kokushisa kwebhodi. Ikhwalithi ye-solder, ukuhambisana kwezingxenye, izixhumanisi zokushisa, ukunamathiselwa kwe-heatsink noma kwemishini kanye nokuvuleka kwezingxenye eziseduze konke kungathinta ukuhlanganiswa okuqediwe.

Izindaba zemibhalo yomhlangano

Idatha ephelele ye-BOM, ukukhetha nokubeka, umdwebo womhlangano, ulwazi lwe-polarity, amanothi enqubo ekhethekile kanye nezidingo zokuhlola kunikeza ithimba lokukhiqiza umgomo wokukhiqiza ocacile kakhulu. Ku-PCBA eyinkimbinkimbi, imibhalo engacacile ingadala ingozi enkulu yokukhiqiza kunenselele yokubeka uqobo.

Uma ukwenziwa, ukutholakala kwezingxenye, i-SMT, ukuhlanganiswa kwemigodi kanye nokuhlolwa kudingeka kuhlale kuhlanganiswe nge-NPI kanye nokukhiqiza, ukuhamba komsebenzi wokuhlanganiswa kwe-PCB okuvulekile kunganciphisa ukudluliselwa kwabaphakeli.

Ukuhlolwa Nokuqinisekiswa Ngaphambi Kokulethwa

Umbono wokugcina webhodi akufanele uphathwe njengobufakazi bokuthi i-PCBA isilungile ngoba nje zonke izingxenye zigcwele. Ipulatifomu enokuguqulwa kwe-RF, ukucutshungulwa kwe-FPGA, ukubalwa kwe-GPU, i-DDR4, i-PCIe, inethiwekhi ye-optical kanye nezixhumi eziningi zangaphandle zidinga uhlelo lokuhlola olubonisa leyo misebenzi.

Isixhumi esibonakalayo se-Type-C esinomsebenzi we-USB-to-JTAG kanye ne-UART singasekela ukubekwa kwebhodi kanye nokulungisa amaphutha. Ukufinyelela kokuhlola kufanele kucatshangelwe ngesikhathi sokuhlelwa ngoba ukufinyeleleka kwesixhumi, izindawo zokuhlola kanye namaphuzu okuhlola kuba nzima kakhulu ukushintsha ngemva kokwenziwa.

Ukuhlolwa kufanele futhi kuhlukaniswe ngezigaba ezifanele. Imibuzo yokuhlanganisa impendulo ye-AOI kanye ne-X-ray; ukuhlolwa kukagesi kuhlola ukuxhumana okuyisisekelo; i-JTAG/UART isekela ukwaziswa; kanye nokuhlolwa kokusebenza noma kwe-RF okunquma ukuthi ibhodi eliqediwe liyahlangabezana yini nezidingo zesistimu ezihlosiwe.

Ukuhamba komsebenzi wokuhlanganiswa kwebhodi lesifunda le-Highleap kufaka phakathi ukubuyekezwa kwe-DFM, ukuqinisekiswa kwezingxenye, ukuhlolwa kanye nokuhlolwa. Kuma-elekthronikhi asheshayo, ukuchaza ukufinyelela kokuhlola kanye nezidingo zokuhlola okusebenzayo kusenesikhathi kungenza ukuqinisekiswa kokukhiqiza kusebenze kangcono kakhulu.

Okufanele Ukubukeze Ngaphambi Kokuthumela I-PCB Esheshayo Emkhakheni Wokukhiqiza

Ngaphambi kokukhipha ibhodi elinjengaleli, ithimba lobunjiniyela kufanele liqinisekise ukuthi iphakheji yokukhiqiza ichaza izidingo zomzimba nezikagesi ngokucacile ngokwanele ukuze kukhiqizwe kabusha. Ukuhlola okulandelayo kuwusizo kakhulu kunokubuza nje ukuthi amafayela e-Gerber avuleka kahle yini.

Iphakheji Yesilinganiso Esinconyiwe

Ukuze uthole isibuyekezo sokukhiqiza esinenjongo, nikeza idatha yokwenziwa kwe-PCB, izidingo zokuhlanganisa noma zokuvimba ezivunyiwe, i-BOM, ifayela lokukhetha nokubeka, umdwebo wokuhlanganisa kanye nanoma yiziphi izidingo ze-RF ezikhethekile, ukuhlolwa noma ukuhlolwa. Ebhodini elinezixhumi eziningi zesivinini esikhulu, izidingo zokusebenza ezifanele ziwusizo kakhulu ngoba zisiza ithimba lokukhiqiza ukuthi libuyekeze ukwakhiwa okungokoqobo ngokumelene nohlelo lokusebenza oluhlosiwe.

Uma iphrojekthi isesesigabeni se-prototype, i-Highleap iphinde inikeze ukwesekwa kwe-PCB prototyping ukuze inqubo yokukhiqiza ihlolwe ngaphambi kokudlulela enanini elikhulu lokukhiqiza.