I-TU-933+ High-Speed PCB Material ye-100G/400G Izindiza Ezingemuva Nokuxhumana
Ukwenziwa kwe-PCB enesivinini esikhulu ngamalayithi e-TU-933+. Ukuqina okuphezulu kuka-Dkt nokulahlekelwa kokufaka okuphansi kwesikhungo sedatha esifunwayo nezinhlelo zokusebenza ze-telecom.
Ukukhiqizwa kwe-PCB Esheshayo Yamaphrojekthi Asebenzisa i-TU-933+
I-Highleap Electronics inikeza izinsizakalo zokwenziwa kwe-PCB kanye nokuhlanganiswa kwe-PCB kumaphrojekthi ebhodi lesifunda lesivinini esikhulu, i-RF, i-HDI, kanye neleya eliningi. Umsebenzi wethu wokukhiqiza usekelwe ekwakhiweni kwe-PCB okuvunyiwe, ukuhlanganiswa, izidingo zezinto ezibonakalayo, imigomo ye-impedance, kanye nemibhalo yokuhlanganiswa.
I-TU-933+, ephinde yahlonzwa emndenini wezinto ze-ThunderClad 3+ ezivela eTaiwan Union Technology Corporation (TUC), iyi-laminate ephansi kakhulu esetshenziswa ekwakhiweni kwe-PCB yesivinini esikhulu kanye ne-RF. I-TU-933+ iyigama eliyinhloko le-laminate, kanye ne-TU-933P+ njenge-prepreg ehambisanayo.
Amaphrojekthi e-PCB ahilela lokhu okubalulekile angafaka:
- Amabhodi e-backplane asheshayo nama-computer board
- Ama-PCB eseva, isitoreji, kanye namakhadi omugqa
- Amabhodi wesekethe we-Telecom kanye nesiteshi esiyisisekelo
- Izicelo ze-RF kanye nokudluliselwa kwesignali
- Imiklamo ye-PCB enezingqimba eziningi enezingqimba eziningi
Kula maphrojekthi, i-Highleap Electronics igxile ezidingweni zezinga le-PCB njengokwakhiwa kwe-stack-up yezingqimba eziningi, i-impedance elawulwayo, ngezakhiwo, ukubhaliswa kwezingqimba, ukubhoboza, izici zethusi, ukuqeda ubuso, kanye nokuhlanganiswa kwe-PCB. Izakhiwo zezinto zokwakha kanye nokwakhiwa okutholakalayo kufanele kuqinisekiswe ngokuhambisana nemibhalo yamanje enikezwe umenzi wezinto zokwakha.
Izinsizakalo zethu zokukhiqiza ze-PCB ziphinde zihlanganise amaphrojekthi asebenzisa ezinye izinhlelo ze-laminate ezivunyelwe ezinciphisa ukulahleka kanye nesivinini esikhulu, okuhlanganisa i-TU-883 , i-TU-872 SLK , izinto ezikhethekile ezinciphisa ukulahleka , kanye nezinto ze-Taconic.
Imininingwane Yobuchwepheshe ye-TU-933+ Laminate
| Property | Value | Isimo / Indlela |
|---|---|---|
| Tg (DMA) | 220 ° C | E-2/105 |
| I-Tg (TMA) | 170 ° C | E-2/105 |
| I-Td (TGA) | 390 ° C | E-2/105 |
| I-CTE (x/y) | 12/13 ppm/°C | I-ambient ku-Tg |
| I-CTE z-axis (α1) | 35ppm/°C | I-Pre-Tg |
| I-CTE z-axis (α2) | 240ppm/°C | Iposi-Tg |
| I-CTE z-eksisi (%) | 2.5% | 50 kuya ku-260 ° C |
| I-Thermal Stress (288°C) | > 120 isekhondi | I-Solder Float |
| T260/T288/T300 | > 60 amaminithi (ngalinye) | E-2/105 |
| Ukuvutha | I-94V-0 | E-24/125 |
| Imvume (Dk) | 3.08 @ 10 GHz | Indlela ye-SPC (RC70%) |
| UDkt | 2.54 | Ukulingisa Impedan |
| I-Loss Tangent (Df) | 0.0020 @ 10 GHz | Indlela ye-SPC |
| Ukumelana Nomthamo | > 10¹⁰ MΩ·cm | C-96/35/90 |
| Ukuphinda Usungulwe | > 10⁸ MΩ | C-96/35/90 |
| Amandla kagesi | > 40 kV/mm | A |
| Ukuhlukaniswa kweDielectric | > 50 kV | A |
| Modulus kaYoung | 23 GPa (Warp), 21 GPa (Gcwalisa) | A |
| Amandla weFlexural | > 60,000 psi (L) / >50,000 psi (W) | A |
| Amandla e-Peel (1 oz Cu) | 4–7 lb/in | A |
| Ukumuncwa komswakama | 0.06% | E-1/105 + D-24/23 |
QAPHELA
- Amanani obuchwepheshe angenhla anikezwe njengereferensi yobunjiniyela be-PCB ejwayelekile. Izidingo zokugcina zokwakha nokukhiqiza ze-PCB kufanele ziqinisekiswe ngokuya ngomklamo ovunyiwe, ukuhlanganiswa, kanye nemibhalo yephrojekthi efanele.
- I-TU-933+ (ThunderClad 3+) iwumkhiqizo we-laminate ovela eTaiwan Union Technology Corporation (TUC). I-Highleap Electronics ikhiqiza futhi ihlanganisa ama-PCB futhi ayikhiqizi i-laminate ye-TU-933+.
- I-Highleap Electronics inikeza ukwesekwa kobunjiniyela kanye nokukhiqiza ezingeni le-PCB, okuhlanganisa ukubuyekezwa kwe-DFM, ukuhlolwa kokuhlanganiswa kwezingqimba eziningi, ukubuyekezwa kokulawulwa kwe-impedance, ukuhlela ukwenziwa, ukuhlanganiswa kwe-PCB, ukuhlolwa, kanye nokuhlolwa.
Kumaphrojekthi e-TU-933+ PCB, ukwesekwa kwethu kuhlanganisa:
- Isibuyekezo se-PCB esisheshayo nesinokulahlekelwa okuncane
- Izidingo zokulawula ukuvimba kanye nokuqondisa isignali
- Ukwenziwa kwe-Multilayer, HDI, kanye ne-complex via-structure
- Ukuhlanganiswa, ukuhlolwa, kanye nokuhlolwa kwe-SMT/THT
- Isilinganiso sokukhiqiza se-PCB kanye nevolumu
Xhumana ne-Highleap Electronics ukuze uthole ukubuyekezwa kokukhiqiza kwe-PCB kanye nesilinganiso.
Kungani Onjiniyela Bakhetha I-TU-933+ Yemiklamo Ye-PCB Esheshayo, Elahleka Kancane
Nakuba sisekela zonke izinhlobo zama-substrates e-PCB, sivame ukuncoma ama-TU-933+ laminates kumakhasimende asebenza ngamasignali anesivinini esikhulu, ikakhulukazi lawo aklama i-10G, 25G, noma i-56G yomkhawulokudonsa.
Izici ezibalulekile ze-TU-933+ zifaka:
- Dk 3.08 ±2%, Df 0.0020 @ 10 GHz – ilungele ukugcina ubuqotho besignali
- Ukunwetshwa kwe-z-axis ephansi - kuqinisekisa ukudlula okuthembekile kuma-stackups we-multilayer
- Ukumelana okuphezulu kwe-CAF - kusekela ukwethembeka kwesikhathi eside ezindaweni ezinokhahlo
- Iyahambisana nezinqubo ezijwayelekile zokucwasa - ukusiza ukunciphisa izindleko
Lezi zakhiwo zenza i-TU-933+ ibe yindlela engcono kakhulu kunezinto ezisezingeni eliphezulu njenge-MEGTRON6 noma i-hydrocarbon laminate ephansi yezinhlelo zokusebenza eziningi ze-telecom, datacom, server, kanye ne-industrial RF.
Kwa-Highleap, sinikeza izeluleko zamahhala zesitaki futhi sisize amakhasimende anqume ukuthi i-TU-933+ noma enye into esetshenziswayo ifaneleka kangcono ekusebenzeni kwawo, izindleko, nezidingo zokukhiqiza.
Ukwakhiwa kwe-PCB Esheshayo Nokuhlanganiswa Kusukela Kumodeli Kuya Ekukhiqizweni
I-Highleap Electronics inikeza izinsizakalo zokwenziwa kwe-PCB kanye nokuhlanganiswa kwe-PCB kumaphrojekthi anesivinini esikhulu, alahleka kancane, i-HDI, kanye nezinhlelo eziningi eziyinkimbinkimbi, kufaka phakathi imiklamo ye-PCB ehilela i-TU-933+ kanye nezinye izinhlelo ze-laminate ezivunyiwe. Ukugxila kwethu ekuhumusheni i-stack-up evunyiwe, izidingo ze-impedance, idatha yokwenziwa, kanye nemibhalo yokuhlanganiswa ibe yinqubo yokukhiqiza elawulwayo.
Ukuze kudizayinwe ama-PCB anezingqimba eziningi nezisheshayo, izidingo zokwenziwa kanye nokuhlanganiswa zingabuyekezwa ndawonye ukuze kuthuthukiswe ukubambisana phakathi kwebhodi elingenalutho kanye ne-PCBA yokugcina.
- Ukukhiqizwa kwe-PCB okuvinjelwayo okulawulwayo kanye nokwahlukana
- Ukucubungula i-HDI ngama-microvia, nge-pad, kanye nezakhiwo ezixhunyiwe nge-plug-by
- Ukuhlanganiswa kwe-multilayer okuyinkimbinkimbi kanye nokwakhiwa kwe-PCB enezingqimba eziningi
- I-ENIG, i-ENEPIG, igolide eliqinile, i-OSP, kanye nezinye izinto eziqediwe ebusweni obucacisiwe
- Umhlangano we-SMT/THT we-BGA, QFN, i-fine-pitch, kanye nezinye izingxenye
- Ukuhlolwa kwe-AOI, i-X-ray, ukuhlolwa kwe-flying-probe, ugesi, kanye nokusebenza okusebenzayo
Kusukela ekubuyekezweni kobunjiniyela kanye nokwakhiwa kwama-prototype ngokusebenzisa ukukhiqizwa nokuhlanganiswa kwe-PCB yevolumu, i-Highleap Electronics isekela amaphrojekthi lapho ubuqotho besiginali, ukwakhiwa kwezingqimba eziningi, ukulawulwa kwenqubo, kanye nokuvumelana kokukhiqiza kubalulekile.
Uma iphrojekthi yakho ihilela i-TU-933+, enye i-laminate elahlekelwa kancane, noma ukwakhiwa okuvamile kwe-FR-4, sithumelele amafayela akho e-Gerber, i-stack-up, i-BOM, kanye nezimfuneko zokuhlanganiswa kokubuyekezwa kokukhiqiza kanye nesilinganiso.
Xhumana ne-Highleap Electronics ukuze uthole iphrojekthi yakho yokukhiqiza nokuhlanganisa i-PCB esheshayo.