10 Layer High-Speed PCB Engineering yeDDR5 nePCIe
Mufananidzo 1. PCB ine machira gumi ekumhanya kwepamusoro-soro yeDDR5 nePCIe routing.
Zviri Mukati
- Tanga neChannel, Kwete Protocol Label
- Zvinoitwa neData Rate - uye Zvisingakuudze
- Gadzira Bhajeti Yekuisa-Kurasikirwa uye Kusagadzikana
- Sarudza Zvinhu, Mhangura uye Geometry Pamwe Chete
- Kuburikidza nekuchinja, kudzoreredza kumashure uye kubuda
- Kusimbiswa Kwekugadzira Pamberi Pekugadzira uye Mushure Mekugadzira
- Ruzivo Runodiwa Kuti Uwane Mutengo Wekugadzira Unokurumidza
- Makona Ekugadzira uye Ekushanda Kwemhando
- Mamiriro eMitemo uye Miganhu yeKushandiswa
- Kubva paKutevedzera kusvika paKubatana kweChinyorwa Chekutanga
Bhodhi rine zvidimbu gumi rinogona kutsigira ma "digital link" anoda simba, asi huwandu hwezvikamu chete hahuratidzi kuti zvinoenderana nezvinodiwa. Mhedzisiro yacho inoenderana ne "channel" yakazara: "transmitter package", "breakout", "vias", "routed transmission line", "connector" kana "cable interface", "receiver package" uye "equalization". Bhodhi rine "premium laminate" rinogona kuramba richikundikana nekuda kwe "resonant" kuburikidza ne "stub" kana "break turn path"; "channel" pfupi pane "material" isingadhuri inogona kupfuura kana shanduko dzacho dzagadzirwa zvakanaka.
Peji rino rakarongwa zvichienderana neinjiniya yechiteshi. Rinoparadzanisa chokwadi cheprotocol yeruzhinji kubva kumiganhu chaiyo yefomu, rinoratidza maitiro ekugovera kurasikirwa uye discontinuity margin, uye rinotsanangura humbowo hunogona kupihwa nemugadziri wezvinhu. Geometry yakadzama ndeye mu impedance-control specification , nepo layout execution iri mu routing guide.
Tanga neChannel, Kwete Protocol Label
"PCIe Gen6 inokwanisa," "112G material" uye "800G PCB" itsananguro dzisina kukwana. Protocol inogona kuoneka mumhando dzakasiyana dzezvinhu zvine ma connectors akasiyana, ma reach uye channel masks. Mwero wedata wakafanana unogona kuendeswa pane short chip-to-chip link, motherboard-to-add-in-card link kana backplane ine loss allocation yakasiyana zvikuru.
| Dhizaini yekupinza | Chii chinofanira kuzivikanwa usati wagadzira |
|---|---|
| Chinangwa chekutevedzera mitemo | Tsanangudzo yebase, CEM kana chimwe chinhu cheform factor, chibvumirano cheIEEE/OIF, gwara rememory-controller kana mask yemutengi. |
| Magumo echiteshi | Ingava bhajeti iri pakati pemapakeji, pakeji neconnector, connector neconnector kana kuti board chete. |
| Frequency range | Nyquist frequency pamwe chete neharmonics kana bandwidth yakakwira inodiwa nemuenzaniso wekutevedzera mitemo. |
| Topology uye kusvika | Kureba kwenzira, shanduko dzezvikamu, huwandu hwezvinobatanidza, mafambiro ekuputika uye chero chikamu chetambo kana mezzanine. |
| Kufungidzira kwekuenzanisa | Kusasimbisa transmitter, CTLE/DFE inogamuchira uye presets dzinobvumidzwa. Izvi hazvigone kutsiviwa nesarudzo yezvinhu. |
| Mari yekugadzira | Kushivirira kweImpedance, dielectric uye copper model, kuburikidza neprocess, back-drill capacity uye coupon plan. |
Mutengesi haafanire kuvimbisa rutsigiro rwechishandiso kubva kuzita rezvinhu uye huwandu hwema layer chete. Mhinduro ine mutoro ine zvichemo: chivakwa chiri kurongwa chinogona kutaurwa uye kuvakwa mushure mekunge zvinodiwa nemutengi zvekurasikirwa, impedance uye shanduko zvaenderana ne stackup yakaburitswa.
Zvinoitwa neData Rate - uye Zvisingakuudze
Mwero wedata unoratidza pokutangira pakuongorora kwespectral, asi modulation inokosha. PCI Express 5.0 inoshanda pa32 GT/s ichishandisa NRZ, ichipa frequency ye16 GHz Nyquist. PCI Express 6.0 inoshanda pa64 GT/s ichishandisa PAM4 uye inochengetedza frequency ye16 GHz Nyquist uku ichiwedzera mashandiro eFEC neFLIT. PCI Express 7.0 vhezheni 1.0 yakaburitswa muna 2025 pa128 GT/s ichishandisa PAM4, iyo inofambisa frequency yeNyquist kuenda ku32 GHz. Izvi hazvitsananguri bhajeti rekurasikirwa kwebhodhi; form-factor specification inoshanda.
| Muenzaniso weinterface | Chokwadi chinobatsira pakuronga PCB | Chii chichiri kufanira kubva pane zvakataurwa nehurumende |
|---|---|---|
| PCIe 5.0 | 32 GT/s NRZ; 16 GHz Nyquist. | Chifukidzo chekurasikirwa nechiteshi, kugoverwa kwemapakeji, modhi yekubatanidza, topology uye nzira yekutevedzera zvinodiwa zvechimiro chakasarudzwa. |
| PCIe 6.0 | 64 GT/s PAM4; 16 GHz Nyquist; mashandiro eFEC/FLIT. | Nzira inobvumidzwa, kurasikirwa kwekudzoka, crosstalk uye transmitter/receiver facts. |
| PCIe 7.0 | 128 GT/s PAM4; 32 GHz Nyquist. | Miganhu yechimiro-chinoburitsa uye kusvika kwakanangana nekushandisa. |
| 112 Gb/s PAM4 nzira | Kazhinji 56 GBd uye 28 GHz Nyquist. | Mask yeIEEE kana OIF yakakodzera, nzira yeCOM, chinongedzo uye fungidziro dzepakeji. |
| 224 Gb/s PAM4 nzira | Kazhinji 112 GBd uye 56 GHz Nyquist. | Chibvumirano chekushandisa, pasuru yekutarisa, chigadzirwa chekuyedza uye kusvika kwakabvumidzwa. |
| DDR5 | Chimiro chendangariro chinoenderana nechinhu chimwe chete; zvinodiwa zvinosiyana zvichienderana nechinodzora, DRAM, module uye topology. | Nguva yemutengesi, topology, kurodha, kugumisa, modhi yepakeji uye zvirambidzo zvebhodhi. |
Nyquist frequency haisiyo frequency yakanyanya kukosha. Nguva yekukwira, jitter, equalization uye discontinuities zvinogadzira kunzwa pamusoro peNyquist. Panguva imwe chete, kushandisa frequency yakakwira pane imwe neimwe kuverenga kunogona kudzvinyirira bhodhi zvakanyanya. Shandisa bandwidth uye masks nenzira inoshanda yekutevedzera mitemo.
Gadzira Bhajeti Yekuisa-Kurasikirwa uye Kusagadzikana
Bhajeti rechiteshi rinofanira kuverengerwa chikamu chimwe nechimwe chiri pakati pematanho ekutarisa kutevedzera mitemo. Semuenzaniso, zvinhu zvePCI-SIG zveveruzhinji zvakaratidza bhajeti re36 dB total channel insertion-loss bhajeti pa16 GHz yePCIe 5.0 CEM channel. Nhamba iyoyo ndeyechiteshi ichocho chakatsanangurwa uye haifanirwe kuverengerwa kune yega yega 32 GT/s topology. Mugadziri webhodhi anofanira kubvisa package, connector, add-in-card kana baseboard allocations zvinoshanda pakuitwa kwechirongwa asati asarudza kuti ingani trace loss iripo.
Kurasikirwa hakusi chinhu chimwe chete chisingaperi che dB-pa-inch
Kuchinja kwekurasikirwa kwetrace ne frequency, line width, dielectric thickness, copper profile, glass construction uye ingave nzira yacho iri microstrip kana stripline. Data-sheet Df haigone kushandurwa kuita universal reach. Connector uye via loss zvinoenderanawo ne frequency, uye stub resonance inogona kugadzira deep notch yakamanikana inokuvadza kupfuura avhareji yekurasikirwa.
Kurasikirwa nekudzoka uye crosstalk consume margin zvakare
Chinongedzo chinogona kusangana nenhamba yekurasikirwa kwekuisa uye choramba chichikundikana nekuti kusagadzikana kweimpedance, kushandurwa kwemode, kutaura kwepedyo kana kure, kana ruzha rwekupa simba zvinovhara ziso. Saka, ongororo yeserial-link inofanira kushandisa zviyero zvinodiwa zveprotocol - zvakaita sechannel operating margin, COM, statistical eye kana vendor-specific link model - pane trace-loss spreadsheet chete.
| Chikamu chebhajeti | Maitiro akajairika ekutevedzera | Kuvimba nekugadzira |
|---|---|---|
| Nzira yakafanana | Kubviswa kwe2D field-solver ne frequency-dependent dielectric uye kondakita kurasikirwa. | Kugadzirwa kwezvinhu, foil, chikamu chakachekwa uye dielectric yakadzvanywa. |
| Chiratidzo kuburikidza ne | Muenzaniso we3D EM kana muenzaniso weraibhurari wakasimbiswa unosanganisira mapedhi, maantipadhi uye stub yasara. | Saizi yechibooreso, plating, layer span, back-drill tolerance uye kunyoreswa kwayo. |
| Chinongedzo chetsoka | Modhi yemutengesi pamwe nekuburitswa kwebhodhi. | Mapad stack, mareferensi ekushandisa, antipad uye nzvimbo dzekubvumidza mafambiro endege. |
| cross talk | Kubviswa kwemunhu anenge abatwa nechisimba kuburikidza nehurefu hwechokwadi uye kuchinja kwakafanana. | Kupatsanurana kwezvikamu, kuwanda kwenzira, kuenderera mberi kwenzvimbo uye hunyanzvi hwekugadzira. |
| Pakeji nemudziyo | IBIS-AMI, S-parameter kana modhi yekutevedzera mitemo yemutengesi. | Kazhinji hazvidzorwi nebhodhi risina chinhu asi zvakakosha pakugoverwa kwemidziyo. |
Mufananidzo 2. Kurongeka kwechiratidzo chePCB chine maturikidzwa gumi ekumhanya kwepamusoro.
Sarudza Zvinhu, Mhangura uye Geometry Pamwe Chete
Kusarudzwa kwezvinhu kunofanirwa kuenderana nechiteshi chakabviswa, kwete tafura yeprotocol. Sisitimu ye dielectric, copper roughness uye stackup geometry zvinoshanda pamwe chete. Mutsetse wakafara pane dielectric yakatetepa unogona kuderedza kurasikirwa kwe conductor asi uchishandisa nzvimbo ye routing; zvinhu zve lower-Dk zvinogona kushandura upamhi hunodiwa kune impedance imwechete; foil yakapfava zvikuru inogona kuderedza kurasikirwa asi inoda maitiro ekunamatira akakodzera.
Magadzirirwo ehybrid anoisa sisitimu yekurasikirwa zvishoma kutenderedza machira ane nzira dzinonzwa zvakanyanya uku achishandisa chinhu chemazuva ano chakajairwa. Anogona kunge asingadhuri, asi material pair chaiyo, bonding layer uye press cycle inofanira kuburitswa. Gwaro rekusarudza material rinotsanangura kuti sei MEGTRON, I-Tera, Tachyon uye specialty low-loss laminate families dzisingakwanise kutorwa seautomatic equivalent.
Usapa mazita emhando dzakasiyana dze "laminate" kumarudzi e "protocol generations".
Mashoko akadai sekuti "MEGTRON 6 inotsigira masendimita masere ePCIe Gen5" kana kuti "Tachyon inodiwa pa112G" haavimbike nezvinhu zvakawanda. Nzira pfupi ye112G inogona kuvharwa pane masisitimu akati wandei ane kurasikirwa kushoma; nzira refu ine ma connectors akawanda inogona kuda kuvakwa kwekuderedza kurasikirwa kana dhizaini yakasiyana yesisitimu. Kubuda kwakakodzera imuganhu wakaedzwa wenzira chaiyo uye modhi yekugadzira.
Kuruka nekucheka girazi
Pa 112G zvichikwira, musiyano wekunonoka kwenzvimbo kubva pakuruka kwegirazi unogona kuenzaniswa nebhajeti ye skew yemukati me intra-pair. Girazi rakapararira, kona ye routing, upamhi hwe trace uye nzvimbo ye pear zvinofanirwa kusarudzwa nekuvakwa chaiko. Mufananidzo webhodhi unofanirwa kuratidza chero magirazi akaganhurirwa kana kuti skew mitigation inoshandiswa ne layout.
Kuburikidza nekuchinja, kudzoreredza kumashure uye kubuda
A through via inosanganisira pad capacitance, barrel inductance uye barrel section isina kushandiswa iri pasi kana pamusoro pechiratidzo chekubatanidza. Chikamu ichocho chisina kushandiswa chinoita se stub. Resonance yayo inoenderana nehurefu hwemagetsi uye nzvimbo ye dielectric, saka tafura yakatarwa ye "maximum stub by protocol" ingori planning heuristic. Chinosara chinogamuchirwa chinofanira kubva ku channel model uye kugona kwe depth-control kwemutengesi.
Back-drilling
Kuboorera kumashure kunobvisa bharero risina kushandiswa nekushandisa chibooreso chechipiri chakadzama. Dhizaini yacho inofanira kutsanangura divi rakaboorerwa, dhairekitori, stub yasara, kushivirira kudzika kwakabvumidzwa, dhiri rakakura, kuchengetedza zvinhu zviri pedyo uye nzira yekusimbisa. X-ray, process coupons, microsection kana marekodhi ehudzamu hwemuchina anogona kushandiswa zvichienderana nehurongwa hwemhando. "X-ray yakasimbiswa pabhodhi rega rega" haifanirwe kuvimbiswa kunze kwekunge odha yacho ichida uye mitengo yesampuli.
Ma-blind vias neHDI
Ma microvia asingaonekwe anogona kupfupisa shanduko uye kuvandudza huwandu hwema breakout, asi zvivakwa zvakarongwa zvinounza pfungwa dzekuvimbika pakati pema interfaces. Rudzi rwe via runosarudzwa kubva kuBGA escape, layer reach, routing uye qualification - kwete chete kubva pa data rate. Nzira yemazuva ano ye through via ine antipad yakagadzirwa zvakanaka uye back-drill inogona kushanda zvakanaka kupfuura microvia yakarongwa zvisina kukodzera.
Kuchinja kweReference
Kana chiratidzo chikachinja layer, kudzoka kwaro kunoda nzira iri pedyo pakati pemareferensi ekare neatsva. Kana mareferensi ese ari pasi, mavias ekusona anogona kupa nzira iyoyo. Kana referensi ikachinja pakati pesimba nepasi, nzira yekuparadzanisa yakaiswa zvakanaka inogona kudiwa. Nzvimbo yacho inosarudzwa nekuchinja kwegeometry uye frequency; mutemo wepasi rose we50 mil hausi wekutsiva ongororo.
Mufananidzo 3. Kuunganidzwa kwePCB ine machira gumi ekumhanya kwepamusoro uye ongororo yechiteshi.
Kusimbiswa Kwekugadzira Pamberi Pekugadzira uye Mushure Mekugadzira
Pamberi pekugadzirwa
Ongororo yekutanga yekugadzira zvinhu inofanira kusimbisa stackup, zvivakwa zvezvinhu, makirasi e impedance, copper model, critical via transitions, back-drill definition uye coupon plan. Kuti uwane malink anomhanya zvakanyanya, enzanisa post-layout extraction ne compliance model uye sanganisira manufacturing corners kwete nominal geometry chete.
| Kununurwa | Zvarinoratidza | Izvo zvisingaratidzi |
|---|---|---|
| Kuverengerwa kwe stackup uye impedance kwakaburitswa | Maitiro ekugadzira anoenderana nechimiro chakasarudzwa. | Kutevedzera mitemo zvizere. |
| Kuisa-kurasikirwa kana kutevedzera nzira | Kushanda kwemagetsi kunotarisirwa panzira nemakona akagadzirwa. | Kugadzirwa ikoko kuchaenderana nechinhu chisina kutaurwa kana foil. |
| S-parameters kuburikidza/chinobatanidza | Maitiro ekuchinja pamusoro pebandwidth yakaratidzwa. | Kushanda kwemhando yakasiyana yepad stack kana drill process. |
| Mushumo weTDR wekuponi | Mumiriri wechiratidzo cheimpedance yechimiro che coupon. | Kurasikirwa, kutaura nevanhu kana kusaenderera mberi kwenzira dzese dzemuno. |
| Material traceability | Giredhi/roti rakapihwa rinoenderana neodha. | Kuenzana otomatiki nemuenzaniso wekufananidzira kunze kwekunge kuvaka kwakabatana. |
| Kusimbiswa kwemuchina wekudzosera shure | Kudzika kana kuti kuenderana nepurani yakatarwa. | Zadza muganhu wechiteshi pasina modhi yemagetsi yakabatana nayo. |
Mushure mekugadzirwa
Zvinyorwa zvebhodhi risina chinhu zvinogona kusanganisira bvunzo dzemagetsi uye mhinduro dzekudzivirira dzinodzorwa kana dzarairwa. Mapurogiramu ekumhanya-mhanya anogona zvakare kukumbira makuponi ekupinza-kurasikirwa, kuyerwa kwemusana, zvikamu zvidiki, zvitupa zvezvinhu kana data reS-parameter rekutanga. Pakeji yemagwaro anodiwa inofanira kubvumwa usati watenga; hazvina musoro kutaura kuti repoti yega yega yepamusoro inoenda nebhodhi rega rega.
IPC-TM-650 inosanganisira nzira dzekuongorora kupererwa kwechiratidzo uye kuyedzwa kwekurasikirwa nechiratidzo, asi mutengi anofanira kutsanangura kuponi inomiririra, muganho wekugamuchirwa, sampuli uye kugoverwa kwenzvimbo. Kune chigadzirwa chakakosha-chinotevedzera mitemo, batanidza data remakuponi nemuenzaniso wenzira yakabviswa pane kutora kuponi sechitupa chakazvimiririra.
Ruzivo Runodiwa Kuti Uwane Mutengo Wekugadzira Unokurumidza
Mutengo unogona kukurumidza chete kana pasuru yehunyanzvi yapera. Ipa data rekugadzira zvinhu, mafaira ekudhirowa neroute, netlist, zvirambidzo zvekuburitsa zvinhu kana zvekudhirowa, tafura yeimpedance, mutemo wekubvumidza zvinhu, zvinodiwa nemhangura, kudhirowa kwekudhirowa kumashure, tsananguro dzakadzora hudzamu, kupedzisa kwenzvimbo, kirasi yebhodhi, huwandu uye mishumo inodiwa.
Kune magadzirirwo anoenderana nechiteshi, ipaiwo magadzirirwo einterface/form-factor, mabasa e critical layer, maximum route kana extracted loss targets, chero zvinhu zvinorambidzwa kana magirazi, uye kana mugadziri anogona kugadzirisa controlled geometry. Ziva zvinhu zvinoda mvumo yevatengi CAM isati yachinja.
Nzira yekugadzira uye zvinyorwa zvinotsanangurwa mugwaro rekugadzira rine zvidimbu gumi . Mutengo unofanirwa kuongororwa kubva pakuvaka kwakazara, kwete kubva pa "mari yekuwedzera inomhanyisa" yakatarwa.
Kumbira Ongororo yePCB yeHigh-Speed 10 Layer
Makona Ekugadzira uye Ekushanda Kwemhando
Mhedzisiro yemugero wezita haina kukwana kuti chigadzirwa chibudiswe. Modhi yakabviswa inofanira kunge iine makona chaiwo ekurasikirwa kwepamusoro nepashoma: ukobvu hwe dielectric, Dk/Df, upamhi hwakachekwa, roughness yemhangura, kuburikidza nekunyoresa uye back-drill residual. Tembiricha inogonawo kuchinja maitiro e dielectric uye receiver margin. Chinangwa hachisi chekubatanidza nyaya dzese dzakaipa zvisina musoro, asi kuziva mavariables anotonga margin uye kusimbisa kuti procurement tolerance inoadzora.
Batanidza data rekufananidzira nekugadzira pakutanga. Kuponi yeTDR inogona kusimbisa impedance, kuponi yekurasikirwa inogona kusimbisa modhi yakasarudzwa ye dielectric/copper, uye kuponi yekumashure kana chikamu chidiki inogona kusimbisa fungidziro ye residual-stub. Kana data rakayerwa rikasiyana nemodhi, gadziridza modhi kana maitiro usati washandisa kuvaka sepuratifomu inoshandisika zvakare.
Kutevedzera protocol kunoramba kuri mutoro wesystem
Mutengesi wepabhodhi risina chinhu anogona kusimbisa kuvakwa, kuenderera mberi kwemagetsi, kupindirana kwemumiriri uye makuponi akabvumiranwa. Haagone kusimbisa PCIe, Ethernet kana memory link yakakwana isina michina yakaunganidzwa, mapakeji, zvinobatanidza, firmware uye setup yekuyedza kutevedzera mitemo. Mutauro wewebhusaiti unofanirwa kusiyanisa "yakagadzirwa zvinoenderana nezvinodiwa nemutengi zvinoburitswa nekukurumidza" kubva ku "protocol certified."
Mamiriro eMitemo uye Miganhu yeKushandiswa
Mazita einterface anofanirwa kusanganiswa ne revision uye form factor inoshandiswa nechigadzirwa. PCI Express 7.0 Version 1.0 yakaburitswa muna 2025, nepo miganhu yebhodhi ichiri kutsamira pamagwaro e base uye form-factor anoshanda. IEEE 802.3df-2024 inovhara 400 Gb/s uye 800 Gb/s Ethernet. Kushanda pa 1.6 Tb/s Ethernet uye mamwe ma 200/400/800 Gb/s physical layers kuri kuenderera mberi pasi pe IEEE P802.3dj, saka dhizaini yakavakirwa pabasa iroro inofanira kuratidza draft chaiyo kana specification yemutengi inoshandiswa. Mapurojekiti eOIF 224G-class anotsanangurawo mapoka akawanda ekusvika pane imwe nzira yePCB.
Musiyano uyu unokosha pakugadzirwa nekuti mamasiki ekurasikirwa, fungidziro dzepakeji, zvinobatanidza, zvigadziriso zvekuyedza uye equalization zvinosiyana nekushandiswa. Mutengesi haafanire kushandura "800G," "1.6T" kana "224G" kuita chinhu chakagadzika, kureba kwetrace kana kukosha kwekudzokera shure pasina tsananguro yenzira inotonga.
Kubvumidzwa kweHigh-Speed Channel
- Tsvaga nzira yekugadzirisa interface, chimiro chefomu, magumo uye nzira yekutevedzera mitemo.
- Goverana kurasikirwa, kurasikirwa kwekudzoka, crosstalk uye discontinuity margin mumapakeji, bhodhi, mavias uye zvinobatanidza.
- Sarudza laminate, copper profile uye geometry kubva mugero rakabviswa pane kubva pane protocol label.
- Makona ekugadzira emhando yepamusoro eukobvu hwe dielectric, Dk/Df, roughness yemhangura, upamhi hwemutsetse, kuburikidza nekudzika uye kunyoreswa.
- Tsanangurai ma coupons anomiririra impedance uye kurasikirwa zvakasiyana kubva pakuyedzwa kwekutevedzera mitemo yechikamu chechigadzirwa.
- Budisai magadzirirwo akafanana ekugadzirisa magadzirirwo emifananidzo, magadzirirwo emifananidzo, magadzirirwo emifananidzo uye magadzirirwo emifananidzo.
Kubva paKutevedzera kusvika paKubatana kweChinyorwa Chekutanga
Modhi yechiteshi inonyanya kubatsira kana chinyorwa chekutanga chakagadzirwa chichigona kuenderana nefungidziro yacho. Hurongwa hwehukama hunofanirwa kuona kuti ndeapi mativi uye zvinhu zvinoshanduka zvichayerwa, kuti ndeapi makuponi achaedzwa uye kuti mhedzisiro iyoyo ichavandudza sei modhi.
| Kuisa modhi | Humbowo hunogona kuwanikwa muchinyorwa chekutanga |
|---|---|
| Chikamu che dielectric chakadzvanywa uye chikamu chemutyairi chakakamurwa | Chikamu chidiki kana kuti kuponi ine mativi akawanda inoratidza ukobvu chaihwo uye chimiro chetrapezoidal trace geometry. |
| Characteristic impedance | Kuponi yeTDR inomiririra inoyerwa nenzira yakabvumiranwa. |
| Kurasikirwa kunoenderana nekakawanda-kunoenderana nekutevera | Mutsetse wekutumira wakakodzera kana kuponi yekurasikirwa nekuisa, yakavharirwa panodiwa. |
| Kuboorera kumashure kana kupofumadza kuburikidza nejometri | Kuyera kudzika, X-ray pazvinenge zvakakodzera, kuponi yekuchinja chikamu kana kuti yakatsaurirwa. |
| Kutangisa chinobatanidza kana kuburitsa pakeji | Maumbirwo akatsaurirwa ekuburitswa, chigadzirwa chemutengesi kana kuyerwa kwekutevedzera mitemo yezvigadzirwa. |
Kubatana hazvirevi kumanikidza data rakayerwa kuti rienderane nemuenzaniso wakanaka. Zvinoreva kugadzirisa modhi nekugadzirwa chaiko kwakagadzirwa uye kuona kana channel ichiri kusangana nemuganhu pamatanho ekushanda nepamakonero. Kana hukama huchiratidza kuti copper roughness, resin content kana via depth zvakasiyana nefungidziro, chiito chekugadzirisa chingave shanduko yekudzora zvinhu, shanduko patsva kana muganho wenzira wakagadziridzwa - kwete kungoshivirira impedance.
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Kugadzira PCB yeTMM3 yeRF Modules
Kugadzira maPCB eTMM3 kunonyanya kubatsira kana RF module...
Kugadzirwa kweTMM6 PCB
Kugadzirwa kweTMM6 ipeji rekudzora maitiro epakati peDk...
Nzira yekuwana sei quote yePCBs
Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:
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- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.