Kugadzira PCB dzezvikamu zvisere dzemaPrototypes neVolume Production

Highleap Electronics inopa kugadzirwa kwePCB ine mativi masere uye kuunganidzwa kwePCB kune mabhodhi akajairwa ane mativi akawanda uye magadzirirwo akaomarara akaongororwa neinjiniya. Isu tinoshandisa magadzirirwo eFR-4, HDI, rigid-flex, high-speed uye RF, mixed-material laminations, heavy-copper boards uye maficha akakosha ekugadzira ma prototype, batch uye kudzokorora maodha ekugadzira.

Kune maPCB ane layer masere ane zvinhu zvakatarwa, controlled impedance, special drilling, edge contacts kana ma mechanical features asina kujairika, kugadzirwa kunoongororwa zvichienderana ne stackup yakazara, drawings uye order requirements. Mixed-dielectric projects hadzisi dzeRogers/FR-4 chete: ma laminate grades akumbirwa uye bonding system ndiyo inosarudza nzira yekugadzira.

Zvivakwa zvePCB zveLayer 8 Zvatinogadzira

Highleap inoongorora maodha ePCB ane layer sere pakuvaka, kusanganiswa kwelaminate, mavia, mhangura, kupedzisa pamusoro uye machining akakosha. Sarudzo dzekugadzira dziri pazasi dzinogona kutsanangurwa imwe neimwe kana pamwe chete; kuenderana uye mahwindo ekugadzirisa aripo zvinosimbiswa kuti zvivepo. Zvinhu zvinoda hunyanzvi hwakatsaurirwa hazvifungidzirwe kuti ndizvo zvinovaka zvakajairika.

Zvivakwa zvePCB zvakaoma uye zvinhu zvepasi

• Kugadzirwa kwePCB kwakajairika kweFR-4 PCB ine mativi masere
• Mabhodhi emhando yepamusoro eTg FR-4
• Zvivakwa zvePCB zvine nhurikidzwa sere zvisina halogen
• Mapurasitiki akaomarara akavakirwa papolyimide anodziya zvakanyanya, anogona kuongororwa
• Mabhodhi emhando dzakasiyana-siyana ane mutsetse wakanaka uye nzvimbo dzakatsetseka
• Mabhodhi eBGA akakora uye zvikamu zvesimbi zvakapfava
• Mabhodhi akakoshwa uye akapfava
• MaPCB akaomarara ane mativi masere
• MaPCB ane mativi masere akakora zvakanyanya
• Mabhodhi ane mativi masere akakura uye akakura
• Mapurani asina kurongeka uye mabhodhi ane zvidimbu zvakawanda
• Mabhodhi masere ane mapaneru emusangano weotomatiki

Mapurasitiki eHybrid lamination, maPCB ane mafrequency akawanda uye anomhanya zvakanyanya

• Kugadzira PCB yeRogers/FR-4 ine 8-layer
• Mavakirwo eTaconic/FR-4 ane mativi masere
• Mavakirwo eIsola ane zvidimbu zvisere ekurasikirwa zvishoma/FR-4 akasanganiswa
• Zvivakwa zvePanasonic Megtron/FR-4 zvemhando ye8-layer hybrid
• Matanda eNelco ane machira masere ekumhanya kwepamusoro/FR-4 akasanganiswa edielectric
• Magirazi akasanganiswa eArlon RF/FR-4 ane mativi masere
• PTFE/FR-4 maPCB emhando dzakasiyana-siyana
• Ma hydrocarbon laminate/FR-4 hybrids akazadzwa neceramic
• Zvivako zvakasiyana-siyana zve dielectric zvine high-Dk uye low-Dk
• Misanganiswa yemhando dzakasiyana-siyana yekurasikirwa kwakaderera uye RF laminate
• Mabhodhi edhijitari/RF anomhanya-mhanya ane mativi masere
• Mavakirwo emhando dzakasiyana-siyana ane maDf akaderera, anoisa-anorasikirwa zvishoma
• Mabhodhi ane magumo maviri uye akasiyana-siyana anodzorwa-anogumira
• RF/microwave signal-layer uye reference-plane constructions
• Foiri yemhangura isina kunyatsogadzirwa uye RF bondply yakavakwa
• Zvivakwa zveRF zvine LCP- kana PPO, zvichienderana nekukodzera kwemaitiro acho

Pakusanganiswa kwezvinhu zvakasiyana-siyana, Highleap inopa sarudzo dze laminate dzinoshandiswa kakawanda uye hybrid-stackup . Rondedzero yeRogers/FR-4 lamination inotaura nezvemusanganiswa mumwe chete unowanzo kumbirwa, kwete huwandu hwakazara hwekugadzira zvinhu zvakasiyana-siyana.

HDI PCB, mavia uye kubatana kwe multilayer

• MaPCB eHDI ane layer 8 ane microvias dzakaboorwa nelaser
• MaPCB ane jira remapofu uye akavigwa
• Kubatanidza maburi nepakati uye zvakasanganiswa
• Zvivakwa zveHDI 1+6+1
• Zvimiro zveHDI zvinotevedzana zve 2+4+2
• Dzimwe nzira dzakatenderwa dze multi-stage lamination sequences
• Microvia dzakarongwa uye microvia dzakarongwa
• Ma microvia e laser azere nemhangura
• Mabhodhi akazadzwa uye akavharirwa kuburikidza nepad (VIPPO)
• Mavhairasi akazadzwa ne resin uye akavharirwa mukati
• Mavhairasi akavharirwa/akarongwa pasi pemapedhi eBGA akapfava
• Kuboorera kumashure kwesarudzo uye kubviswa kwakadzama kuburikidza nestub
• MaPCB ekutiza eBGA ane nzira yakanaka
• Madhayamita emaburi akakosha, zviyero zvechinhu uye kushivirira kwekuboorwa

Kune laser vias uye build-up sequencing, tarisa kugona kweHighleap kwekugadzira high-density interconnect . Mapurojekiti ane signal-layer via-stub limit anogonawo kutsanangura controlled-depth backdrilling.

Zvivakwa zvinochinjika uye zvakasimba-zvinochinjika zvine mativi masere

• Kugadzirwa kwePCB ine mativi masere akaomarara
• Zvivakwa zvePCB zvinochinjika zvine jira remhangura sere
• Mabhodhi akaomarara ane zvikamu zvisere munzvimbo dzakaomarara
• Zvivakwa zvakasimba zvine ma "flex-flex" akasiyana-siyana
• Maseketi e polyimide anochinjika akawanda
• Sarudzo dze laminate dzinochinjika uye dzisinganamati
• Magadzirirwo emadziro anokombama uye anokombama zvine simba, zvichienderana nekukosha kwawo
• Mabhodhi akaomarara-anochinjika uye akapfava-anochinjika ...
• Kugadziriswa kweimpedance uye RF zvakasimba-flex kuvaka
• Zvikamu zvakawanda zvinochinjika uye shanduko dzakasimba-dzinochinjika
• Chifukidziro, zvinhu zvinosimbisa zvinosarudzwa uye mahwindo akakombama akasarudzwa
• Firimu reEMI-shielding rinosarudzwa munzvimbo dzine flex yakawanda, kana richitsigirwa
• Masangano anochinjika ane macontacts ekubatanidza uye mapedhi akavhurika

Sarudzo dzekugadzira dzeHighleap dzakasimba uye magadzirirwo ePCB anochinjika akawanda akakosha pakuziva huwandu hwema layer uye sisitimu yezvinhu munzvimbo yega yega.

Mhangura inorema, ine simba rakawanda uye ine simba rinopisa

• Kugadzirwa kwePCB ine mhangura ine nhurikidzwa nhatu
• Zviyero zvemhangura zvakasanganiswa pakati pezviratidzo nezvikamu zvesimba
• MaPCB emagetsi ane mativi masere ane simba remagetsi
• Zvivakwa zvemukati nekunze zvemhangura zvinorema
• Zviratidzo zvekubvisa zvakasimba zvakasanganiswa nendege dzemagetsi
• Magadzirirwo ekupisa anoitwa kuburikidza nekupisa uye magadzirirwo ekupisa akasimba
• Mari yemhangura neyakagadzirwa nemhangura, zvinogona kuongororwa
• Zvivakwa zvesimbi kana zvimwe zvinoparadzira kupisa, zvichienderana nekukodzera
• Kupatsanurwa kwemagetsi akawanda uye magadzirirwo akatarwa ekugadzira/kubvisa
• Misanganiswa yezvinhu zvakawanda zvinoda kupisa

Kune mapurojekiti anobatanidza zvidimbu zvemhangura zvine simba guru nedenderedzwa rezviratidzo, tarisa zvinodiwa pakugadzira mhangura ine simba uye tsanangura huremu hwemhangura zvakasiyana pazvikamu zvega zvega.

Zvigunwe zvegoridhe, kupedzisa pamusoro uye kugadzira nemazvo

• MaPCB ane zvidimbu zvisere ane minwe yakasarudzika yegoridhe
• Kubata minwe neminwe kwenguva refu/pfupi uye yakapatsanurwa
• Kurongeka kwekubatana kwemativi, kutenderera uye kusina kufanana
• Zvibatanidza zvemakadhi zvakachekwa
• ENIG, ENEPIG uye musanganiswa wekupedzisa wakasarudzika
• OSP, sirivha yekunyudza, tini yekunyudza uye HASL isina mutobvu inopedzisa
• Kuputira bhodhi-edge uye kuputira mucheto wesimbi
• Makomba akachekwa uye maburi akaputirwa hafu
• Nzvimbo dzakaputirwa uye nzvimbo dzisina kunyatsogadzirwa
• Nzvimbo dzekugaya dzakadzika dzakadzorwa uye dzemapofu
• Homwe dzakatsikwa, nzvimbo dzakadzika uye maburi asingaonekwe
• Nzvimbo dzakavhurika dzakakosha uye zvidimbu zvemukati
• Maburi ekuisa akaboorwa uye akanyudzwa necountersunk
• Maburi anokwana zvakasimba
• Kuongororwa kweEdge, V-scoring uye kupatsanurwa kwepaneru yakarongwa
• Kuvhura mask yekusarudza uye kuburikidza ne tenting/plugging
• Macontact eink yekabhoni uye maficha akakosha ekufambisa akadhindwa, kana achitsigirwa
• Masiki inokweshwa inobviswa uye zvinhu zvinosarudzwa zvemasiki anokweshwa, kana zvichitsigirwa

Nzvimbo dzinoshandiswa pakugadzira simbi dzinofanira kunge dziripo; jira reminwe rakaoma-goridhe harichinjiki nemapedhi egoridhe-kunyudzwa.

Kusimbiswa kwekugadzirwa: Aya magadzirirwo kana maitiro akakosha anowanikwa kuti aongorore purojekiti, kwete vimbiso isina muganho yemusanganiswa wega wega une zvikamu zvisere. Kugoneka kwekupedzisira, miganhu yemidziyo, kuwanikwa kwezvinhu uye zvinodiwa zvekugamuchirwa zvinosimbiswa zvichienderana nemafaira ekugadzira usati wagamuchira odha.

MaPrototypes ePCB ane Layer 8, Batch Orders uye Volume Production

Highleap inotsigira mapurojekiti ePCB ane nhurikidzwa sere kubva kumasampuli einjiniya kusvika kumapilot lots, kuburitswa kwakarongwa uye kugadzirwa kwakapetwa. Zvinodiwa zvinoshanda zvinosiyana zvichienderana nedanho reodha:

• Muenzaniso uye kukurumidza kutendeuka: Ipai gadziridzo yazvino, zvinhu zvinofanirwa kusimbiswa, zvirambidzo zvezvinhu uye zuva rekutumirwa kwakumbirwa. Ma laminates akakosha uye kugadziriswa kwezvinotevera zvinogona kukanganisa purogiramu.
• Kumhanya kwevhoriyamu shoma uye kwepilot: Tsanangura kupatsanurwa kwehuwandu, humbowo hwekuongorora, chero zvinodiwa pakuungana uye shanduko dzekuvakwa kwemuenzaniso usati waburitswa mutyairi.
• Kugadzirwa kwezvikamu zvakawanda uye zvakawanda: Isa zvinhu zvakatenderwa, mutemo wekuchinjana zvinhu, fomati yepaneru, huwandu hwegore hwezvinhu zvakatarwa, zvinodiwa pakugamuchirwa kwenzvimbo uye fungidziro.
• Kudzokorora maodha uye kutamiswa kwemutengesi: Goverana nhamba yechikamu chakaburitswa, nhoroondo yekudzokorora, mvumo yakakosha yemaitiro uye magwaro ekuongorora anodiwa kuti zvinhu zvitsva zvienderane nebhodhi rinokwanisa.

Kana uchida kugadzirwa kwebhodhi remhando ye eight-layer rigid-flex, HDI kana mixed-dielectric hybrid, sanganisira huwandu hwekutanga hweodha uye kudiwa kunoramba kuchidzokororwa. Huwandu hwega hahugadzirise kuwanikwa kwezvinhu, kuwanda kweprocess kana nguva yekutanga; izvo zvinoongororwa zvichienderana nekuvakwa kwakatenderwa.

Ongororo yeUinjiniya yezvivakwa zvePCB zvine mativi masere zvakaoma

Highleap isati yaburitswa, inoongorora data rekugadzira zvinhu kuti ione ma parameter anodzora basa racho: ma grade e laminate ne bondply, mativi masere emhangura, ukobvu hwakapedzwa uye huremu hwemhangura; kuburikidza nekubatanidza nekuboorera; geometry yebhodhi; kupedzisa; uye chero zvinangwa zvekushanda kana kuongorora.

• Kuiswa kwemagetsi uye kusaina kwemagetsi: Simbisa hurongwa hwe dielectric hwakarongwa, ma reference layers uye impedance targets. Mvumo yemutengi inodiwa kuti pave neshanduko dzinokanganisa mashandiro anodzorwa. zvinhu zvinofungwa nezvazvo pakuunganidza zvinhu zvine mativi masere zvinogadziriswa zvakasiyana nebasa iri rekugadzira.
• Kubvumidzwa kwemaitiro akakosha: Tsvaga kusanganisa zvinhu, kupatsanura kwakaitwa ne sequential lamination, ma blind/built vias, via fill/cap, backdrill limits, controlled-depth features uye selective plating.
• Kuenderana kwedata rekugadzira: Ita shuwa kuti data reGerber kana ODB++, mafaira ekudhirowa, mifananidzo yekugadzira uye kugadziriswa kwebhodhi zvinotsanangura chivakwa chimwe chete.
• Zvisizvo zvemaitiro: Kana paine chinhu chinotsiva, muripo wekutsvaga kana chinhu chakagadziriswa, nyora pasi zvachinosaririra uye uwane mvumo usati wagadzira.

Ongororo yeHighleap yeDFM isati yagadzirwa inobatsira kuona zvinhu zvisiripo uye kusawirirana mukugadzirwa kwezvinhu zvisati zvaburitswa.

Hunhu hwePCB hweLayer 8 uye Kugamuchirwa kweKugadzirwa

Kuongorora kunofanirwa kuenderana nezvinodiwa zvechigadzirwa zvakabvumiranwa pane kutaura kuti "zvemhando yepamusoro." Kune mabhodhi ane zvidimbu zvisere, chirongwa chekugadzira nekugamuchira chinogona kusanganisira kuongororwa kwemukati mezvikamu, kunyoreswa kwezvikamu, kusimba kwegomba rakaputirwa, kupedzisa kwenzvimbo, zviyero zvekupedzisira uye kuyedzwa kwekuenderera mberi/kupatsanurwa kwebhodhi risina chinhu.

Maodha ekudzivirira anodzorwa, RF, HDI kana special-reliability anogona zvakare kutsanangura makuponi ekudzivirira, mhedzisiro yechikamu chidiki, mishumo yekuzivikanwa kwezvinhu kana kuteverwa. Isa kirasi yekugamuchirwa inodiwa, kugadziriswa kwakajairwa, sampling kana ruzivo rwemishumo muRFQ kuitira kuti chiyero chekuongorora chigone kutengeswa uye kubvumwa. Bvunzo yemagetsi yakapasa isina bhodhi yega haitsigire kurasikirwa kwekuisa, kutsungirira kweflex kana chimwe chinodiwa chega chega.

Kugadzira uye Kugadzira PCB yezvikamu zvisere

Highleap Electronics inopawo mabhodhi akaunganidzwa ane nhurikidzwa sere. Mapurojekiti anogona kuongororwa pamwe chete kuti agadzire maPCB asina chinhu, atenge zvikamu, assembly yeSMT neburi, assembly yeBGA uye bvunzo dzakatarwa dzekushanda kuburikidza nebasa redu rekugadzira nekubatanidza maPCB.

Pabhodhi reHDI rakasanganiswa, rigid-flex kana mixed-material, panelization, soldering exposure, component placement uye test access zvinofanirwa kuongororwa pamwe chete nekugadzirwa kwebhodhi risina chinhu. Isa BOM ine nhamba dzezvikamu zvemugadziri, dzimwe dzakatenderwa, data rekusarudza nekuisa, madhirowa ekuunganidza uye chero firmware kana mirairo yekuyedza kana PCBA iri chikamu cheodha yako.

Zvekutumira Kuti Uwane Mutengo Wekugadzira PCB Wezvikamu Zvisere

Tumirai pasuru yekugadzirwa yazvino, kwete chete "masheya masere," saizi yebhodhi uye mutengo wakatarwa. Ruzivo runotevera runogonesa kuongorora chiyero chaicho cheodha yenyu:

• Mafaira ekugadzira eGerber kana ODB++, data rekudhirowa reNC uye kudhirowa/kugadziridzwa kwakadzorwa.
• Kuunganidzwa kwemachira masere, purogiramu yepakati/yakagadzirirwa kugadzirira kana yekubatanidza, mamakisi elaminate uye huremu hwemhangura nechikamu.
• Rondedzero yebhodhi, ukobvu hwakapedzwa, saizi, kushivirira uye zvinodiwa zvepaneru, pazvakatsanangurwa.
• Kuburikidza nemamepu, ruzivo rwe laser-via kana backdrill, zvinodiwa zvakazadzwa, maburi akakosha uye manotsi ekubatanidza machira.
• Zvinangwa zvekusagadzikana/kurasikirwa, kupedzwa kwenzvimbo uye mishumo inodiwa yekuongorora kana kuyerwa.
• Muenzaniso, chiyero chekuongorora uye/kana huwandu hwehuwandu, kufanotaura uye zuva rekutumirwa rakumbirwa.
• BOM, mafaira ekuisa, mifananidzo yekuunganidza uye zvinodiwa zvebvunzo zvinoshanda zvePCBA odha.