Mhando dzePCB dzine 8-Layer: Rigid, HDI, Flex & RF | Highleap

MaPCB maviri ane layer masere anogona kuva nehuwandu hwakafanana hwe layer asi anoda nzira dzakasiyana dzekugadzira. Bhodhi rakasimba, bhodhi reHDI rine microvias, circuit inochinjika yese uye rigid-flex assembly zvinhu zvakasiyana. RF laminates, heavy copper, controlled impedance uye special machining zvinogona kuwedzerwa kune izvo zvigadzirwa.

Zviri mukati

• Mhando dzePCB dzine 8-Layer nekuvaka Bhodhi
• Mhando dzePCB dzine 8-Layer zvichienderana nezvinhu zvinodiwa uye zvinodiwa nemagetsi
• Mhando dzePCB dzine 8-Layer dzine Hunhu Hwakakosha hwekugadzira
• Kufananidza Mhando Yenyu yePCB Yezvikamu Zvisere Nezvinodiwa Zvekugadzira

Mhando dzePCB dzine 8-Layer nekuvaka Bhodhi

PCB ine mativi masere yakasimba

Bhodhi rakagadzika rine mativi masere ndiro rinotanga kugadzirwa kana chigadzirwa chichida bhodhi rakagadzika redunhu pane kuti pave nekubatanidza kunokombama. Magadzirirwo eFR-4 ane mativi akawanda anowanzo shandiswa pamaburi akaputirwa; mavhiya epamusoro uye ma laminates asina kurasikirwa zvakanyanya mamwe magadzirirwo, kwete zvinhu zvega zvePCB yakagadzika ine mativi masere. Kuti musiyanise chivakwa chimwe chakasimba kubva kune chimwe, ipai L1–L8 stackup, ukobvu hwebhodhi hwakapedzwa, huremu hwemhangura ne jira, saizi dzemaburi uye chero nzvimbo dzakamanikana dzemukati. Kune chivakwa chemazuva ese, kugona kwekugadzira bhodhi reHighleap rine mativi akawanda inzvimbo inobatsira yekufananidza dhizaini nemaitiro ekugadzira.

PCB yeHDI ine 8-Layer

Kugadzirwa kweHDI kunova kwakakosha kana nzira yeBGA yekubuda mumhepo kana kuti density yekubatanidza ichida ma microvia e laser, ma vias asina kuvharwa kana akavigwa, kana akazadzwa ne-in-pad. Bhodhi reHDI rine mativi masere rinogona kushandisa 1+6+1 build-up kana chimiro che sequential-lamination; hapana kana chimwe chazvo chinorehwa nemashoko ekuti "8-layer HDI." Sarudzo yekugadzira inoenderana nekuti ndeapi ma layer ega ega kuburikidza ne connectors, ingave ma microvias akarongwa kana kuti akarongwa, uye kuzadza nekuvharira zvinodiwa. Layer-by-layer via map inobatsira kupfuura generic HDI label pakutarisa microvia uye sequential-lamination ability zvichienderana ne build-up yakarongwa.

PCB Inochinjika ine Matanho masere

Dunhu rema "flex circuit" rine mativi masere imhando ye polyimide yakagadzirwa ne "multilayer polyimide". Ne "copper layers" sere, nzvimbo yekukombama inowanzo shomeka zvishoma pane "dete" rakatetepa re "flex circuit" rine mativi rimwe chete kana maviri. Taura kana "kukombama" kuchingoitika panguva yekuisa kana kuti kakawanda, uko "ma "curves" anoitika, kuti "coverlay" ipi inopfuura nenzvimbo idzodzo, uye "stiffener arrangement". Kuvimbika kwe "bend" uye "finished" ukobvu hunofanira kuongororwa kuti huve hwechokwadi, kunyanya kana uchitsanangura "multilayer flexible circuits" yechigadzirwa chine nzvimbo yakamanikana.

PCB ine mativi mana yakasimba-yakachinjika

Bhodhi rakamanikana rinosanganisa zvikamu zvezvikamu zvakasimba uye nzvimbo dzinochinjika dzinobatanidza zvinhu muchivakwa chimwe chete. "Zvikamu zvisere" zvinoda mufananidzo unoratidza huwandu hwezvikamu zvemhangura munzvimbo yega yega : chikamu chakamanikana chine zvikamu zvisere chinogona kuchinjika kunzvimbo ine flex ine maconductor mashoma. Nzvimbo dzekuchinja, nzvimbo dzinokombama, maburi akaiswa plated uye zvikamu zve assembly zvinosarudza nzira yekugadzira. Mepu yezvikamu nezvikamu ndiyo nzvimbo yekutanga yekuongorora zvinodiwa zvekuvaka zvakamanikana uye zvekubatanidza ; huwandu hwezvikamu zvakanyanya chete hahuna kukwana.

Mhando dzePCB dzine 8-Layer zvichienderana nezvinhu zvinodiwa uye zvinodiwa nemagetsi

Tsananguro dzinotevera dzinowanzo batsira pakutsvaga mapoka, asi ipfungwa dzekushanda kana zvinhu zvinoshandiswa pakuvaka kwete pamhando dzemabhodhi dzinoenderana.

• PCB ine mativi masere inomhanyisa uye inorasikirwa zvishoma: Yakasarudzwa kana kurasikirwa nechiteshi kuchikosha sehuwandu hwenzira. Sarudza giredhi re laminate, data rakakodzera reDk/Df, chero chinangwa chekupinza-kurasikirwa, zvinodiwa necopper-foil uye ma layers esignal akadzorwa. "High-speed" chete haitauri kuti chinhu chinotsiviwa chinogamuchirika.
• RF kana Rogers/FR-4 hybrid PCB ine 8-layer: Inoshandiswa apo maseketi eRF anoda ma layers akatarwa ane kurasikirwa kwakaderera pamwe chete nezvimwe zvinhu zve dielectric. Taura chaizvo kuti ma layers api anoshandisa Rogers, PTFE kana imwe RF-grade laminate, pamwe chete nema bondply grades uye ma frequency ekushanda anotarisirwa. Musanganiswa we dielectric wakasarudzwa unofanirwa kuongororwa zvichienderana neanowanikwa. Maitiro ekugadzira laminate yeRF; kuverengwa kwemasere hakuratidzi kuti hybrid-lamination inogona kushanda.
• PCB ine mativi masere inodzorwa-inopindwa: Chinodiwa chemagetsi chinogona kushanda pamabhodhi akaomarara, HDI, anochinjika kana anochinjika. Tsvaga zvinangwa zveimpedance zvine magumo rimwe chete kana kuti zvakasiyana, matendero, masaini/mareferensi, zvirambidzo zvejometri uye kana makuponi ekuyera kana mishumo zvichidikanwa.
• PCB ine mhangura ine nhurikidzwa 8: Inoshandiswa panzira dzakasarudzwa dzine simba guru kana kugoverwa kwesimba. kurema kwemhangura kwapera pane imwe neimwe denderedzwa, kwete chete "PCB yemhangura inorema." Fekitori inofanira kuongorora nzvimbo dzakachekwa, kucherwa kwemadziro, ukobvu hwe dielectric uye kuenderana kwayo nezviratidzo zve "fine-pitch signal" kugona kugadzirisa mhangura yakakora.
• PCB ine mativi masere isina Tg kana halogen: Izvi zvinoratidza zvirambidzo zve laminate. Ipai giredhi rezvinhu zvakatarwa kana zvinodiwa nezvinhu zvinoshanda, zvirambidzo zvekupisa uye kuvimbika, uye kana laminate imwe inogona kupihwa mvumo.

Kana sarudzo ichitarisa kuti ndeapi machira ane zviratidzo, pasi kana simba pane kuvaka bhodhi, hurongwa hweHighleap hwemachira masere hunotarisa mubvunzo wekugadzira wakasiyana. Pano, chinangwa chiri pamisiyano yekugadzira pakati pekuvaka nezvinhu zvakasiyana.

Mhando dzePCB dzine 8-Layer dzine Hunhu Hwakakosha hwekugadzira

Kumwe kutsvaga kunotsanangura maitiro akawedzerwa kwete kuvakwa kwePCB kuri pasi. Zvinhu izvi zvinogona kuiswa mubhodhi rakasimba rine nhurikidzwa sere kana, kana zvichienderana, chimwe chivakwa:

• PCB ine zvidimbu zvegoridhe zvine mativi masere: Kune zvinobatanidza mucheto, tsanangura zviyero zvekubatana, kureba/kupfupi kana kuti zvikamu zvemunwe, bevel uye jira rekuonana regoridhe rakasarudzwa. . ENIG note yakajairika haisi iyo inotsiva kupera kwakatsanangurwa kwekupfeka-kubatana.
• PCB ine 8-layer ine maburi akadzama akadzorwa kana nzvimbo dzisina kujeka: Taura hudzamu hwemachining, datum yekuyera, ukobvu hwe dielectric hwasara uye tolerances. Kuwanda kwe layer uye mafaira e outline chete hazvigone kutsanangura mashandiro emachining.
• PCB ine mativi masere ine backdrilling: Taura maburi akabatwa, divi rekuboorera, dhayamita rekuboorera, stop layer yaunoda uye stub inobvumirwa. Zviyero izvi zvinosarudza kana kubviswa kwehudzi hwakadzika hwakadzorwa kuburikidza nestub inogona kusangana nezvinodiwa zvekushanda kwechiratidzo.
• PCB ine mativi masere ine maburi ekuputira emucheto kana maburi akacheneswa: Tsvaga nzvimbo chaiyo yemipendero kana kuti nzvimbo dzine maburi ari pakati nepakati, nzvimbo dzadzo dzemhangura dzakacheneswa uye zvinodiwa kuti pave nepamusoro pechinhu.
• PCB ine zvidimbu zvisere ine jira rakazadzwa kuburikidza ne-in-pad: Tsvaga nzvimbo dzinoshandiswa, zvinodiwa pakuzadza necopper-cap, uye zvinodiwa kuti pave nemapedhi anosonerwa. Izvi zvakakosha pakugadzirwa uye pakubatanidzwa kweBGA.
• PCB yakatetepa zvikuru, yakakora zvakanyanya kana kuti yakakura kwazvo ine 8-layer: Tsanangura zviyero zvakapedzwa, ukobvu uye kushivirira kwakatwasuka, pamwe nechero zvirambidzo zvekugadzirisa mapaneru kana gungano. Saizi yebhodhi repamusoro hairatidze kana chivakwa chisina kujairika chinoenderana nemaitiro.

Bhodhi rinogona kushandisa zvinhu zvakasiyana-siyana pamwe chete, asi musanganiswa wacho unofanira kuongororwa senzira yakakwana yekuunganidza zvinhu uye kugadzirisa zvinhu. Semuenzaniso, mhangura inorema, zvinhu zvakanaka zveHDI uye laminate yakasanganiswa ine dhayi shoma, zvese zvinopa miganhu yakasiyana; kubvumidzwa kwechimwe nechimwe zvakasiyana hakuratidzi kuti kuvakwa kwacho kwakabatana kunogoneka.

Kufananidza Mhando Yenyu yePCB Yezvikamu Zvisere Nezvinodiwa Zvekugadzira

Tsananguro inobatsira yekugadzira inotanga yataura nezvekuvakwa, yozowedzera chete zvinodiwa zvinoshandura mavakirwo ebhodhi iroro. Mienzaniso iyi inoratidza musiyano:

• Kusagadzikana, kudzorwa-kupindira: "PCB yakasimba yeFR-4 ine ma layer masere ine L1–L8 stackup yakatarwa uye ma controlled differential pairs." Inosanganisira huremu hwemhangura, target impedance uye kusimbiswa kunodiwa.
• HDI, gungano rehuwandu hwakawanda: "PCB yakasimba yeHDI ine 8-layer ine 1+6+1 build-up yakarongwa uye yakazadzwa kuburikidza ne-in-pad pasi peBGA yakapfava." Isa mufananidzo wakazara we via mep uye fill/cap; simbisa build-up nemugadziri.
• Chivharo chakasimba, chakapetwa: "PCB ine 8-layer rigid-flex ine 8-layer munzvimbo dzakasimba uye flexible interconnect yakasiyana." Ipa mepu ye copper-layer yenzvimbo yega yega uye mamiriro ekukombama.
• RF hybrid, zvinhu zvakasanganiswa: "8-layer rigid RF/digital PCB ine nzvimbo dzakatarwa dzeRogers neFR-4 laminate." Inosanganisira purogiramu ye dielectric, zvinhu zvinobatanidza, zvinodiwa pakushanda uye zvinangwa zvekugamuchira.

Kune chero rudzi urwu rwezvinhu, ruzivo rwakakosha inyaya yekuunganidza zvinhu zvakaburitswa, data rekugadzira, zvinodiwa nemhangura nezvinhu zvemhando yepamusoro, kuburikidza nekubatanidza uye kudhirowa kwezvinhu zvakakosha. Kana Highleap ichizozadzawo mabhodhi, kupatsanurwa kumwe chete kunofanira kusanganisira BOM, data rekuisa uye zvinodiwa zvekuunganidza uye bvunzo dzebhodhi.

Highleap Electronics inogona kuongorora chivakwa chakatsanangurwa chine mativi masere uye kuona zvinhu zvinoda kusimbiswa kweinjiniya. Chinangwa ndechekuongorora musanganiswa chaiwo wezvinhu , pane kufunga kuti bhodhi rega rega rinotsanangurwa se "8-layer PCB" rinotevedzera nzira imwe chete yekugadzira.