BGA neQFN Assembly Ne X-Ray Kuongorora Majoini Akavanzwa Emasolder
Zviri mukati
- Sei BGA neQFN Assemblies dzichida Kudzora Maitiro Akakosha?
- Ndeapi Magadzirirwo ePCB Akaongororwa eBGA neQFN?
- Solder Paste neStencil Apertures Zvinosarudzwa Sei?
- Zvikamu zveBGA neQFN zvinochengetwa uye zvinodzoserwa sei?
- Chii Chinogona Kuonekwa Nekuongorora X-Ray?
- BGA neQFN Assemblies Dzinoedzwa Sei Nemagetsi?
- Ndezvipi Zviganhu zveKugadzirisa BGA neQFN?
- Kumbira Mutengo weBGA neQFN Assembly
- Mibvunzo yekuongorora BGA, QFN uye X-Ray
BGA and QFN assembly with X-ray inspection is required because critical solder joints are hidden beneath the component after reflow. Successful assembly depends on the relationship between the exact package, PCB land pattern, via structure, solder deposit, moisture condition, placement, board support, thermal profile and inspection plan. For fine-pitch BGA production and inspection, the inspection plan should be agreed with the pad design, paste process and acceptance criteria for hidden solder joints.
Highleap Electronics inoongorora BGA, micro-BGA, QFN, LGA, CSP nezvimwe zvishandiso zvakafanana zvinopera pasi sechikamu chePCB assembly yakazara. Kugona uye kufukidza kwekuongorora kunosimbiswa mushure mekuongorora package nebhodhi. X-ray inoshandiswa kupindura mibvunzo yakatsanangurwa; haisi nzvimbo yedhizaini chaiyo, kudzora maitiro kana kuyedzwa kwemagetsi.
Kuti muwane mutengo, tumirai mafaira ePCB, BOM nehuwandu. Highleap inogona kuona zvikamu zveBGA neQFN kubva kuBOM. Taura chero mushumo weX-ray unodiwa, mwero wekushanda kana muganho wekuvimbika kana zvichizivikanwa; zvikasadaro hurongwa hwekuongorora hunoshanda hunogona kurongwa panguva yekuongorora.
1. Sei BGA neQFN Assemblies dzichida Kudzora Maitiro Akakosha?
Majoini eBGA neQFN solder haagone kuongororwa nenzira dzakajairika dzekuona mushure mekuunganidza. Kugadziriswa kwepakeji, kugadzirwa kwepakeji, huwandu hwesolder yethermal-pad, hunyoro uye kugoverwa kwemhangura mubhodhi zvinogona kukonzera zvikanganiso kunyangwe kana kuiswa kwacho kuchiratidzika kunge kwakarurama. Highleap inoongorora sisitimu yese yejoini pane kubvumidza basa kubva pabhora chete.
| Chinhu chepakeji | Dambudziko guru rekugadzira | Kudzora kwakakodzera |
|---|---|---|
| BGA bhora rakarongwa | Kurongeka kwakavanzika, mabhiriji, kuvhurika uye kudyidzana kwewarpage. | Nyika/kuburikidza nekuongorora, nzvimbo, chimiro uye X-ray. |
| BGA/CSP inonzwika zvakanaka | Majoini madiki uye nzvimbo shoma. | Stencil/namatidza, rutsigiro rwebhodhi uye kuongororwa kwepamusoro-soro. |
| Majoini eQFN/LGA | Majoini akavanzwa kana kuti anoonekwa zvishoma ane kumira kwakaderera. | Ongororo yePad/Mask, paste balance uye X-ray. |
| Pedhi hombe yekupisa | Kunyungudutsa kwakawandisa, chikamu chinoyangarara uye patani isina chinhu. | Aperture yakakamurwa, profile uye zvinodiwa zvekugamuchira. |
| Bhodhi rakatetepa kana pasuru hombe | Pakeji uye PCB warpage panguva yekudzokororwa kwemvura. | Rutsigiro rwepaneru, kuenzana kwemhangura uye nzira yekupisa. |
Vatengi vanogona kuongorora pfungwa dzeBGA package uye assembly uye musiyano weBGA neQFN , asi sarudzo yekugadzira yeHighleap yakavakirwa panhamba chaiyo yezvikamu zvemugadziri uye data rePCB.
2. Ndeapi Magadzirirwo ePCB Akaongororwa eBGA neQFN?
Zviyero zvevhu, tsananguro yesolder-mask, fanaut, via-in-pad, copper balance, surface finish, board cruise uye local support zvinokanganisa kugadzirwa kwesolder. Highleap inotarisa kana data rePCB nepakeji zvichienderana uye kana panel inogona kudhindwa, kuiswa, kudzoserwa mvura uye X-ray zvinobudirira.
- Simbisai hukama hwepadhi, pitch uye solder-mask.
- Ongorora kana kuti via-in-pad fanout yakazadzwa/yakavharirwa here kana zvichidikanwa.
- Tarisa aperture yeQFN thermal-pad uye kuburikidza nepattern.
- Ongorora huwandu hwemhangura munzvimbo yako uye huwandu hwekupisa hunotarisirwa.
- Simbisa kuti bhodhi rakabatana sei, kuti bhodhi rinotsigira uye kuti panel yacho yakatsetseka zvakatenderedza mudziyo.
- Tsvaga zvinodzivirira, zvinobatanidza kana zvinhu zviri pedyo zvinogona kuvharira maonero eX-ray.
Ongororo yePCB DFM yakatarisana nemapakeji akavharirwa anofanira kuona njodzi chaiyo yekugadzira uye zvingangoitika. Highleap haidi kuti mutengi atumire pasuru yehunyanzvi yakasiyana kupfuura mafaira ebhodhi akajairwa uye BOM kunze kwekunge paine mamiriro ekuvimbika kana kugamuchirwa achishanda.
3. Solder Paste neStencil Apertures Zvinosarudzwa Sei?
Mari inoiswa mu solder inofanira kutsigira package iri pasi pevhu pamwe nezvinhu zvakapoteredza. Kune ma QFN thermal pads, gomba rimwe chete guru rinogona kuisa paste yakawandisa uye kuwedzera float kana voiding. Kune fine-pitch BGA kana CSP, deposit consistency uye board support zvinova zvakakosha.
| kunyoresa | Kufungisisa nezve stencil | vavariro |
|---|---|---|
| BGA ine mabhora akajairwa | Rutsigiro rwekutamisa nekubatanidza namatidza rwakagadzikana. | Kuumbwa kwemajoini nguva dzose pasina mabhiriji kana kusakwana kwekusonera. |
| BGA/CSP inonzwika zvakanaka | Chiyero chenzvimbo, kuburitswa kwevhudzi uye kugadzikana kwekudhinda. | Deredza kusiyana kwemari inoiswa mubhangi pazvinhu zvidiki. |
| QFN thermal pad | Musuwo wakakamurwa/wakavhurika nepahwindo. | Dzora huwandu hwese hwemhepo uye gadzira nzira dzekubuda negasi. |
| Bhodhi remapakeji akasiyana-siyana | Kugadziriswa kwenzvimbo kana stencil yematanho. | Kuenzanisa zvinodiwa zve solder-volume zvidiki nezvikuru. |
| Via-in-pad | Kuburikidza nekurapa uye nzira yekuvhura muromo. | Dzivisa kurasikirwa kwesolder uye kusawirirana kwemajoini. |
Highleap inogona kushandisa SMT stencil aperture planning uye paste-volume inspection yeBGA neQFN deposits uko njodzi yepakeji nevhoriyamu zvichitsigira kuyerwa. Izvi zvinodzora zvinofanirwa kuenzaniswa nebhodhi pane kupihwa semashoko ekushambadzira.
4. Zvikamu zveBGA neQFN zvinochengetwa uye zvinodzoserwa sei?
Mapakeji anonzwa hunyoro anogona kukuvara nekuchengetwa kusingadzorwi kana kupisa nguva nenguva. Highleap inoongorora mamiriro ekurongedza, hunyoro, kugara kwepasi uye chero chinodiwa chekubika zvakadzorwa. Zvikamu zvinopihwa nevatengi zvinofanirwa kusvika zvakarongedzwa zvinozivikanwa, zvinoenderana nemuchina uye zvakawandisa zvakakwana kuti zvigadziriswe.
Kudzokororwa kwemvura kunofanira kutsigira chisanganiswa che paste, miganhu yezvikamu, thermal mass yebhodhi uye maitiro e warpage. Rondedzero yekusonesa mvura inodzokororwa inotarisa ramp, soak, nguva iri pamusoro pe liquidus, peak uye cooling pane kuvimba nenhamba imwe chete yekupisa.
- Tarisa pasuru yacho uye hunyoro hwayo usati waisa.
- Chengeta uye bata zvikamu zviri pasi pemitemo yakabvumiranwa.
- Dhinda uye tarisa dhaisiro yesolder sezvinodiwa.
- Isa uchishandisa data repakeji rakasimbiswa uye kurongeka kwebhodhi.
- Dzokorora uchishandisa chimiro chinomiririra uye rutsigiro rwepaneru rwakagadzikana.
- Ongorora mayuniti ekutanga anomiririra usati waburitsa huwandu hwakazara.
Kana musanganiswa wepakeji kana bhodhi uine njodzi isingawanzoitika, Highleap inogona kukurudzira kuyedzwa kwekutanga, kuongororwa kwakawedzerwa kana muganho unotenderwa nevatengi usati waisa mitengo yekudzokorora kugadzirwa.
5. Chii Chingaonekwa Nekuongorora X-Ray?
Kuunganidzwa kwePCB kwakaongororwa neX-ray kunogona kuratidza zvinhu zvakavanzika zve solder zvisingaonekwe kubva kumucheto wechikamu. Zvichienderana nemidziyo uye geometry yepakeji, X-ray inogona kuratidza kurongeka, mabhiriji e solder, majoini asipo kana asina kujairika, kuvhurika kwakazara, kupararira kwevasina chinhu uye kugadzikana kwe solder-ball. Haigone kuratidza kuenderera mberi kwemagetsi, simba resimbi kana kuvimbika kwenguva refu.
| Mubvunzo weX-ray | Kucherechedzwa kunogona kuitika | Humwe humbowo hunogona kudiwa |
|---|---|---|
| Pakeji yacho yakarongeka here? | Patani yebhora/pedhi uye zviratidzo zvenzvimbo yepakeji. | Zvinyorwa zvekuisa zvinhu muchikamu chekutanga. |
| Pane mabhiriji akavanzwa here? | Nzvimbo dzakabatana dzesolder pakati pemajoini ari pedyo. | Kuongororwa kwemagetsi kwenguva pfupi uye kuongororwa kwemaitiro. |
| Majoini haasipo here kana kuti haana kujairika? | Zvimiro zve solder zvisina kusimba, zvisina kusimba kana kuti zvisipo. | Kuongorora kwemagetsi, kuongorora chikamu chemagetsi kana kutadza kushanda kana zvichidikanwa. |
| Kuvhara kweQFN kunodzorwa here? | Nzvimbo isina chinhu uye kugoverwa kwacho kunofungidzirwa. | Nzira yekugamuchira yakatsanangurwa nevatengi uye mamiriro ekupisa/kuvimbika. |
| Nhengo yega yega yakavimbika here? | X-ray haigone kupindura izvi zvakananga. | Kusimbiswa kwemaitiro, humbowo hwebvunzo uye kuvimbika. |
Highleap inogona kupa PCB X-ray yekuongorora zvinhu zvichienderana nemutengo wakatarwa. Mutengi anofanira kutaura chero zvinodiwa zvepamutemo zvekugamuchirwa; zvikasadaro Highleap inogona kukurudzira kutanga kwenyaya, kutora sampuli kana kuongororwa kwakakura zvichienderana nenjodzi iri papakeji.
6. BGA neQFN Assemblies Dzinoedzwa Sei Nemagetsi?
Nekuti X-ray ine miganhu, kuongorora kwakavanzika kunofanirwa kusanganiswa neuchapupu hwemagetsi kana hunoshanda. Chinobhururuka kana ICT zvinogona kuona kuvhurika uye kupfupika kana bvunzo iripo. Kuedza kwakashanda kunosimbisa kuti bhodhi rinoshanda kuburikidza nemaseketi akakodzera uye firmware.
SPI, kusimbiswa kwenzvimbo, chimiro uye X-ray.
Kuenderera mberi, kuparadzaniswa, kuongorora ndege kana ICT mukati mekuchengetedzwa kuripo.
Simba, kutaurirana uye mashandiro anoenderana nezvinodiwa.
Batanidza chivako kana kuti mugove wezvinhu, maitiro acho uye mhinduro dzebvunzo kana zvichidikanwa.
Highleap inogona kusanganisa bvunzo dzePCB dzinoshanda uye nzira dzekuongorora dzemagetsi dzePCB neBGA/QFN assembly. Mwero wekuyera unofanirwa kuratidza njodzi yechigadzirwa uye huwandu; kwete mapurojekiti ese anoda chinhu chakatsaurirwa pane yekutanga prototype lot.
Bvunzo yemagetsi inofanira kusarudzwa zvichienderana nekuwanikwa kuripo uye njodzi yechigadzirwa. Highleap inogona kutanga nekutarisa kuenderera mberi kwenzvimbo kana kushanda kwayo pakutanga uye kuisa ICT yakatsaurirwa kana kufukidza kwakavakirwa pamidziyo kana dhizaini nehuwandu hwekugadzira huchienderana nazvo.
7. Ndeipi Miganhu Yekugadzirisa BGA neQFN?
Kugadziriswazve kweBGA neQFN kunounza imwe nguva yekupisa uye kupisa kwenzvimbo kuchikamu nePCB. Mutengi neHighleap vasati vagadzira, vanofanira kubvumirana kana kugadziriswazve kuchibvumidzwa, kuti vangani vanobvumirwa kuedza, kuti ndeapi maongororo anotevera uye kuti bhodhi rinofanira kurambwa riini.
| Sarudzo yekugadzirisazve | Zvinhu zvekufunga nezvazvo | Kuteverwa kunodiwa |
|---|---|---|
| Kugadzirisa mucheto wemuchina wemuchina/QFN | Kusvikika pamwe chete uye kugamuchirwa kwebasa. | Ongororo yekuona kana X-ray uye kuongororwazve kwemagetsi. |
| Kutsiva QFN | Mamiriro epedhi, kucheneswa kwepedhi rinopisa uye kunzwisiswa kwebhodhi. | Hunhu hwakarongwa, X-ray uye kuongororwazve kwakazara kwebasa. |
| Kutsiva BGA | Mamiriro epakeji, kusimba kwepedhi, warpage uye nhoroondo yekupisa kwekare. | Maitiro ekugadzira patsva kwehunyanzvi, X-ray uye bvunzo dzemagetsi/dzinoshanda. |
| Kukundikana kwakawanda | Njodzi yekukuvadzwa kwepedhi kana chikonzero chekugadzirwa/maitiro chisina kugadziriswa. | Rega kugadzirisa patsva woita mainjiniya ekugadzirisa. |
Highleap inogona kuongorora njodzi dzekugadzirisa nekutsiva BGA pamwe neBGA solder-joints . Kugadzirisa kunofanirwa kuonekwa muchinyorwa chekugadzira kana mutengi achida nhoroondo yechikamu chimwe nechimwe.
8. Kumbira Mutengo weBGA neQFN Assembly
Tumira mafaira ePCB, BOM nehuwandu. Highleap inogona kuona mapakeji asina kunyorwa zvakanaka uye kudzorera chero mibvunzo inoenderana nepakeji. Wedzera zvirambidzo zvako zveX-ray, bvunzo kana kugadzirisa kana zviripo; zvikasadaro chirevo chinogona kupa mukana wekushandisa default scope.
Mhinduro yacho inofanira kutsanangura kuwanikwa kwezvinhu, kufungidzira kwestencil, kubata hunyoro, kudzora zvinhu zvekutanga, kuyerera kwemvura, kufukidza X-ray, kuyedza nekugadzirisa miganhu. Kugona kunoramba kuchienderana nekugadzirwa kwepakeji nebhodhi.
Shandisa fomu reBGA neQFN PCB assembly quote kuti utange. Highleap inogona kunyora ma prototypes, NPI, pilot uye kudzokorora kugadzirwa nehurongwa hwakafanana hwekugadzira hwakagadzirirwa package.
Highleap inogonawo kutsanangura kana mifananidzo yeX-ray, mhedzisiro pfupiso kana mishumo yekusapindirana yakabatanidzwa. Izvi zvinodzivirira mutengi kuti afunge kuti maitiro eX-ray anowanzo sanganisira mushumo wepamutemo wemudziyo wega wega.
9. Mibvunzo yekuongorora BGA, QFN uye X-Ray
X-ray inovimbisa here kuti joini yega yega yeBGA yakanaka?
Kwete. X-ray inopa humbowo hunokosha hwakavanzika asi haigone kuratidza zvakananga kuti magetsi anoramba aripo, simbi kana kuti akavimbika kwenguva refu. Inofanira kubatanidzwa nekubatanidzwa kwakarongwa uye kuyedzwa kwakakodzera kwemagetsi kana kushanda.
X-ray 100% inodiwa here paBGA neQFN yega yega?
Hazvisi nguva dzose. Kufukidza kunogona kuva kwekutanga, kutora sampuli kana kuti kuzara zvichienderana nepakeji, dhizaini, njodzi yechigadzirwa uye zvinodiwa nevatengi. Highleap inotaura nezvekufukidza kwakarongwa mukotesheni.
Ko mavoid eQFN anogona kubviswa zvachose here?
Kazhinji hazviwanzoitiki. Chinangwa ndechekudzora nzvimbo isina chinhu uye huwandu hwayo zvichienderana nezvinodiwa nekupisa, magetsi uye kugamuchirwa kwevatengi. Mapatani estencil, kuburikidza nekugadzira, kunama uye kuyererazve kwemvura zvese zvinokanganisa mhedzisiro.
Zvikamu zveBGA zvinopihwa nevatengi zvinogona kubatanidzwa here?
Ehe, zvichienderana nekuzivikanwa kwepakeji, mamiriro ehunyoro, huwandu, kurongedza uye nhoroondo yekugadzirisa patsva. Highleap ichaongorora zvinodiwa pakugamuchira nekugadzirisa isati yasimbisa chivakwa chacho.
Chii chinosanganisirwa nehurongwa hwekuongorora X-ray yeBGA PCB assembly?
Chirongwa chekuongorora cheX-ray cheBGA PCB assembly chinotsanangura mapakeji nemayuniti anoongororwa, zvikanganiso kana zviyero zviri kuongororwa, zvinodiwa zvekugamuchirwa, zvinyorwa zvemhedzisiro uye kuwedzera kana patani isina kujairika yawanikwa.
Ko imwe sevhisi yekuunganidza yeQFN PCB inogona kupawo masevhisi ekusonesa eBGA QFN here?
Ehe. Basa rekubatanidza PCB reQFN rinogona kubatanidzwa neBGA QFN soldering services munzira imwe chete yeSMT. Zvinodiwawo kushandisa stencil, via, hunyoro, profile uye X-ray.
Chii chinofanira kusimbiswa nemugadziri weBGA assembly asati ataura mutengo?
Mugadziri weBGA assembly anofanira kusimbisa package chaiyo, nzvimbo yebhodhi/kuburikidza nekuvaka, panel, mamiriro echikamu, kufukidza kwekuongorora, kuyedza nekugadzirisa zvirambidzo asati aisa mukana uye purogiramu.
Chii chinonzi kuungana kwechikamu chakagumiswa pasi?
Kubatanidzwa kwezvikamu zvakagumiswa pasi kunofukidza mapakeji ane majoini makuru ari pasi pemuviri, anosanganisira BGA, QFN, LGA nezvimwe zvishandiso zvakawanda zveCSP. Maitiro nekuongorora zvinofanirwa kuverengerwa kuti pane mukana mudiki wekuona.
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Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:
-
- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.