Kugadzira uye Kugadzira maPCB eChromebook eOEM Mainboards

Kugadzirwa kwePCB dzeChromebook mainboard

Zviri mukati

  1. Kubva paKugadzira PCB yeChromebook kusvika paKugadzira Package Yakadzorwa
  2. Chromebook PCB Inofambisa Routing, Memory uye Display Interfaces
  3. Kubatanidzwa kweUSB-C, Kuchaja, Kusina Waya uye Peripheral
  4. Kugoverwa kweMagetsi uye Kuwanda kweThermal paCompact Mainboards
  5. Zvinodiwa pakugadzira Multilayer, HDI uye Fine-Pitch Pazvinenge Zvichidiwa
  6. Kuungana kweBGA/SMT uye Kuongorora maChromebook Mainboards
  7. Kuedza Kunoshanda, NPI uye Kudzokororwa-Kugadzira Kudzora
  8. Kusarudza Mubatsiri weKugadzira neKugadzira maPCB eChromebook

Chromebook PCB inowanzo kurukurwa sebhodhi guru remakombiyuta rinotakura mabasa ekuverenga, kurangarira, kuchengetedza, kutonga simba uye mabasa makuru eI/O emudziyo weChromeOS. ChromeOS hardware inowanikwa mumapuratifomu akasiyana-siyana e processor uye mafomu, saka mugadziri haafanire kufunga kuti bhodhi rimwe chete rakagadziriswa, nhamba yezvikamu kana seti yezvikamu.

Highleap Electronics inotsigira mabhodhi akagadzirwa nevatengi kubva padata rekugadzira rakaburitswa kuburikidza nePCB assembly, kutsvagisa zvikamu zvakatenderwa uye kuyedzwa kwakatsanangurwa nevatengi. Basa rekugadzira nderekuchengetedza chinangwa chemutengi chemagetsi nekanika uku achidzora mapakeji akakora, mambure ekumhanya zvakanyanya, kushandurwa kwesimba uye sarudzo dzinoenderana nekuvandudzwa.

Mamwe mabhodhi einterface, mabhodhi eUSB kana ma flex interconnect anogona kunge aripo mune mamwe magadzirirwo, asi isarudzo dzezvivakwa kwete chinhu chinotsanangura maChromebook ese. Saka chinyorwa ichi chinotarisa pane mainboard uye chinotarisa ma assemblies echipiri chete kana data rechigadzirwa chakaburitswa richida izvozvo.

1. Kubva paChromebook PCB Architecture kusvika paControlled Production Package

Bhodhi guru rinowanzo batanidza processor yeapplication kana processor platform, memory , storage, wireless connectivity, display links, audio, camera interfaces, charging uye system power. Kupatsanurana chaiko kunosiyana zvichienderana neplatform. RFQ yakachengeteka inotanga nekuburitswa kumwe chete kwakadzorwa pane tsananguro ye "Chromebook motherboard".

Tsananguro yezvivakwa inokosha nekuti bhodhi shop neassembler zvinongoona chikamu chemamiriro ezvinhu esystem. Puratifomu yeprosesa, tekinoroji yekurangarira, topology yekuchengetera, mabasa e embedded-controller, huwandu hweport uye envelopu yemakanika zvese zvinogona kuchinja nzira yekubuda, kutevedzana kwemagetsi, kuiswa kweconnector uye mukana wekuyedza. Saka, package yekugadzira haifanire kungoratidza chete PCB revision asiwo BOM variant, fitted/DNI options, firmware image uye chero platform-specific assembly notes dzinodiwa kuti pave ne configuration chaiyo.

Pakeji yekugadzira

Zvinotaurwa nevatengi Kushandiswa kwekugadzira Control point
Gerber/ODB++ uye dhizaini yekugadzira Inotsanangura data rema layer, ma drills, outline uye stack-up notes Usafungidzira kuti chinhu chakaita sei kana kuti chiri muchimiro chakafanana nechakagadzirwa nehurongwa chete.
BOM nedzimwe nzira dzakatenderwa Inotsanangura zvikamu zvakabatanidzwa uye zvakasiyana-siyana Chengetedza zvikamu zve processor-platform uye zvemagetsi zvakabatana neshanduro yakaburitswa.
Mufananidzo wekusarudza-uye-nzvimbo uye wekuunganidza Inodzora kurongeka uye sarudzo dzakagadzirwa Gadzirisa kusawirirana kweDNI uye dzimwe nzira dzekugadzirisa matambudziko usati waisa.
Mechanical data Kudzora hukama hwechinobatanidza, heatsink uye chassis Tarisa bhodhi, maburi ekuisira uye mavharidziro ezvikamu.
Mirayiridzo yeFirmware/yekuyedza Inotsanangura maitiro ekugadzira mapurogiramu uye kugamuchirwa Siyanisa kuongorora kwemaziso kubva pakuongorora mashandiro.

Muganhu weDFM

Ongororo yePCB DFM inogona kuona mibvunzo yekugadzirwa kwezvinhu, asi haifanirwe kugadzirisa chinyararire nzira yekufambisa mapurosesa, topology yekurangarira kana dhizaini yesimba. Izvozvo zvinoramba zvichidzorwa nedhizaini yakaburitswa nemutengi.

Kune mapurogiramu eOEM, nzvimbo yekushandura inoshanda ipakeji yekuburitsa inogadzirwa. Zvinhu zvisati zvaitwa, mainjiniya nekutenga zvinofanirwa kukwanisa kupindura mibvunzo mina: kuti ndeapi mastack-up anoburitswa, ndeapi zvikamu zvinotenderwa zvechokwadi, ndeapi masayizi emakanika akakosha pakuiswa, uye kuti ndeapi mabasa anofanira kuratidzwa asati atumirwa. Kana mhinduro idzodzo dzichiri kugoverwa mumaemail kana ma prototype notes, kudzibatanidza pamberi peNPI kunowanzo kudzivirira njodzi kupfuura kuwedzera kuongorora mushure mechiitiko chacho.

Pakeji yekugadzira yebhodhi guru reChromebook inofanira kutsanangura zvakawanda kupfuura PCB isina chinhu. BOM, data rekuisa, dhizaini yekugadzira, dhizaini yekuunganidza, dhizaini yemakanika, referensi yefirmware uye chirongwa chekuyedza zvinofanirwa kuona hardware imwechete yakaburitswa. Sarudzo dzepurosesa-puratifomu dzinogona kuchinja huwandu hwendangariro, zvishandiso zvekuchengetera, mamodules asina waya, seti dzekubatanidza kana circuitry yemagetsi ukuwo dhizaini yebhodhi ichiramba yakafanana. Pasina kutonga kwakajeka kwesarudzo, kutenga nekubatanidza zvinogona kuvaka bhodhi rakakodzera rine magadzirirwo asina kukodzera.

Saka ongororo yeDFM inofanira kusiyanisa chinangwa chekugadzira kubva kune hunhu hunodzorwa nefekitori . Mutengi anotsanangura magadzirirwo emagetsi, zvinangwa zve stack-up, makirasi akakosha enet, zvikamu zvakatenderwa uye zvinodiwa zvekugamuchira. Mugadziri anoongorora kana zvivakwa zvekuboorera, mhete dze annular, nzvimbo dze solder-mask, copper balance, panelization, component spacing uye assembly access zvichigoneka. Muganho uyu wakakosha nekuti mugadziri haafanire kuchinja chinyararire escape-speed escape, power-via field kana connector datum kuti zvive nyore kugadzira.

  • Batanidza SKU yega yega kune imwe BOM/CPL/firmware/test revision pane kuvimba netsananguro dzekutenga-order.
  • Tsvaga mambure anodzorwa-anopindira uye chero coupon kana zvinodiwa mumushumo mupakeji yekugadzira.
  • Ipa ruzivo rwemakanika rwezvidziyo zvinopisa, zvidzitiro, masipika, makamera uye nzvimbo dzeUSB-C kana izvi zvikaiswa.
  • Tsanangura dzimwe nzira dzinotenderwa nevatengi vasati vashaya; maIC anoenderana nepuratifomu haafanirwe kutsiviwa nemutengo/pakeji chete.

2. Chromebook PCB Inofambisa Mafambiro, Memory uye Display Interfaces

Mabhodhi emakombiyuta akakora anogona kunge aine DDR memory buses, high-speed storage links , USB, display interfaces nedzimwe nets dzinoona nguva. Kugadzira kunofanira kuchengetedza kuvakwa kwe dielectric kwakaburitswa, kuenderera mberi kwe reference-plane, copper geometry uye kuburikidza nekushandiswa kunoshandiswa nechikwata chekugadzira.

Kudzora kugadzirwa kwemagetsi nekukurumidza kunotanga nekuchengetedza fungidziro dzinoshandiswa panguva yekurongeka. Bhazi rekurangarira rinogona kunge richinzwisisa kureba, kutsveyama, kuenderera mberi kwereferensi uye kuburikidza nekuverengwa, nepo zvisungo zvekuchengetedza kana kuratidza zvinogona kuganhurirwa nebhajeti rakasiyana rekurasikirwa kana impedance. Izvi hazvisi zvipingamupinyi zvinochinjika. Dhirowa yekugadzira inofanirwa kuratidza zvivakwa zvinodzorwa uye kuunganidzwa kwechinangwa chemugadziri kuitira kuti fekitori igone kuverenga geometry yakapedzwa kubva mumamiriro chaiwo e laminate nemhangura pachinzvimbo chekubata peya yega yega yakasiyana semutemo mumwe chete.

Kana paine kudzorwa kweimpedance, dhizaini yacho inofanira kuongororwa senzira yekuunganidza zvinhu uye geometry pane kuita senzira yekutarisa hupamhi hwetrace. Nzira yekugadzira inogona kuenderana nezvinodiwa zvePCB zvinokurumidza kugadzirwa uye tafura yeimpedance yemutengi.

  • Chengetedza ndangariro nedzimwe nzira dzinoenderana nenguva dzakabatana nemitemo yehurefu hwemutengi, kutsveyama uye topology.
  • Dzivisa kupatsanuka kwendege kana kusawirirana kwenzira dzekudzoka kana nzira dzichimhanya zvakanyanya.
  • Bata ma connector breakouts, BGA escape vias uye layer transitions sechikamu che channel.
  • Shandisa HDI kana microvia chete kana zvinodiwa zvekuwanda uye kubuda kwedata zvichizvitsigira; hazvisi zvekumanikidzwa kune ese maPCB eChromebook.

DFM inofanirawo kuongorora shanduko pane kungoongorora zvikamu zvema "trace segments" marefu chete. Kuputika kweBGA, nzvimbo dzinodzika nemutsipa, kuburitswa kweconnector, ma "test pads" uye nzira dzinoyambuka mugwagwa zvinogona kutonga chiteshi kunyangwe nzira yakatwasuka ichidzorwa zvakanaka. Kana shanduko ye "dielectric", "copper huremu" kana "via construction" inokurudzirwa kuti igadziriswe, simba remagetsi rinofanira kudzoserwa kumutengi kuti abvumidzwe. Maitiro iwayo anochengetedza mutengesi ari mubasa rakakodzera: kushandura dhizaini inotenderwa nekukurumidza kuita kugadzirwa kunodzokororwa pasina kuchinja maitiro ayo echiteshi chinyararire.

Mubvunzo unonyanya kukosha wekugadzira zvinhu zvinomhanya hausi wekuti interface inoshambadza chii asi kuti channel geometry inoburitswa nechikwata chekugadzira . Mabhazi eDDR, ma storage links, USB uye display paths zvinogona kuva ne impedance targets dzakasiyana, spacing rules, reference-plane requirements uye skew budgets. Bhodhi rebhodhi rinofanira kugamuchira ruzivo rwakakwana kuti ribudise dielectric thickness, copper thickness uye trace geometry nguva dzose; zvikasadaro faira reunyanzvi rakafanana rinogona kugadzira channel yemagetsi yakasiyana mushure mekuchinja kwezvinhu kana stack-up.

Kuburikidza nekuchinja kunofanirwawo kuongororwa zvichienderana nezvigadzirwa. BGA escape inogona kumanikidza mitsipa kana shanduko dzakawanda dzema layer, uye shanduko dze reference-plane dzinogona kukanganisa return current kunze kwekunge kusona uye hurongwa hweplane hwakagadzirirwa ivo. Kune dense memory routing, assembler inofanirawo kuchengetedza kurongeka kwepakeji uye configuration ye memory yakagadzirirwa nekuti mhando ye routing haigone kutsiva mudziyo usina kururama kana placement variant. Saka kudzora kugadzira uye assembly configuration management zvinofanirwa kubatwa se system imwe chete pane mabasa maviri evatengesi vakaparadzana.

Nzvimbo yekugovera mainjiniya

Usati wataura mutengo, tara mambure anonzwa impedance kana topology uye ziva stack-up yakaburitswa. Izvi zvinopa fekitori hwaro hwakasimba hwekusarudza zvinhu, impedance modeling uye kuronga makuponi pachinzvimbo chekuikumbira kuti ifunge zvinodiwa kubva muchikamu chechigadzirwa.

3. Kubatanidzwa kwe USB-C, Kuchaja, Kusashandisa Waya uye Kushanda Panze

Madhizaini mazhinji eChromeOS anoshandisa USB-C mukubatanidza data, kuchaja uye kuratidza mabasa , asi mabasa anotsigirwa anoenderana nepuratifomu uye implementation yeport. Saka USB-C inofanira kugadzirwa kubva padesignal defined port architecture inoratidza controller, power-path, mux kana redriver zvinodiwa, ESD protection uye connector mechanics.

USB-C iri pabhodhi guru reChromebook ibasa resystem, kwete kungoshandiswa senzira yekupinda. Zvichienderana nepuratifomu, port inogona kusanganisira kuona CC, USB Power Delivery control, high-speed muxing, SuperSpeed ​​data, display routing, charging-path control uye protection components. Iyo embedded controller kana imwe system firmware inogona kutora chikamu musarudzo dzeport nechaja, saka hardware revision uye firmware configuration inofanira kuramba yakabatana panguva yeNPI uye kudzokorora kuvaka.

Mamodules asina waya kana zvishandiso zvisina waya zvakasungirirwa zvinodawo kutariswa neBOM yakatenderwa, mirairo yekuchengetedza antenna uye nzira yekuisa pasi. Kamera, odhiyo nedzimwe nzira dzekubatanidza dzine voltage shoma dzinogona kunzwisiswa nekuiswa kweconnector uye kuendesa tambo kunyangwe kana data rayo rakaderera pane macomputer interfaces ekutanga.

Dzivisa kukanganisa kunowanzoitika mune zvemukati

Usataure kuti chiteshi chega chega cheChromebook USB-C chinopa kugona kwakafanana kwekuchaja, kuratidza kana data. Mapuratifomu eChromeOS akasiyana, uye zvinodiwa zve schematic plus port zvakaburitswa ndizvo zvinoburitsa chokwadi.

Ma interfaces asina waya neanoshanda pamativi akasiyana anogadzira mhando dzakasiyana dzenjodzi. Kuchengetedzwa kweAntenna, kudzika kwemodule, nzira yekudzivirira uye zvipingamupinyi zvekuvapo pamwe chete zvinofanirwa kuenderana nehurongwa hwemakanika, nepo kamera, odhiyo uye zvibatanidza zvidiki zvinochinjika zvichitsamira zvakanyanya pakutungamira, kuchengetedza uye kufambisa tambo. Saka ongororo inobatsira yekugadzira inoongorora hurongwa hwemagetsi pamwe chete nedhirowa rekuvhara. Izvi zvinobata zvikanganiso zvingasaonekwa neongororo yePCB yakazvimiririra, senge RF keep-out yakavharwa nesimbi kana connector yakanyatsogadzirwa isingasvike mushure mekubatanidzwa kwekupedzisira.

Kubatanidzwa kweUSB-C muenzaniso wakanaka wekuti sei seti yemafaira ekugadzira ichifanira kuratidza basa rechiteshi chaicho. Chigadziko chinogona kutakura data reUSB, simba rakabvumiranwa uye traffic ine chekuita nekuratidzira mune mamwe magadzirirwo, nepo kumwe kushandiswa kuchigona kuratidza seti diki yezvinhu. Dambudziko rekugadzira nderekushandiswa kwemuviri: kupararira kwenzira inomhanya zvakanyanya, CC/PD circuitry iripo, zvishandiso zvekudzivirira, connector shell grounding, nzira dzeVBUS dzemagetsi akakwira uye rutsigiro rwemakanika. Kuiswa kweconnector kunofanirawo kuenderana nekuvhurwa kwechassis kuitira kuti kuiswa kwetambo kakawanda kusaise majoini e solder kana kukanganisa bhodhi.

Kushandiswa kweWireless kunowedzera dambudziko rakasiyana. MaRF modules, maantenna feeds, ma shield cans uye nzvimbo dzinochengeterwa kunze zvinogona kukanganiswa nekudururwa kwemhangura, hardware yekumisikidza uye macircuits ari pedyo ekumhanya kwepamusoro kana switching. Kuchinja kwePCB kugadzira kunoita sekusina njodzi padigital net kunogona kushandura antenna nharaunda kana nzira dzekudzoka. Pakutamiswa kwekugadzirwa, antenna keep-outs, shield-frame footprints uye RF components dzakatenderwa dzinofanira kudzorwa, uye chero imwe wireless module inofanira kuongororwa kuti ionekwe kuti footprints, firmware, certification uye antenna compatibility zviri nani pane kubatwa se generic replacement.

Highleap Electronics • Kugadzira PCB & PCBA

Ongororo yeKugadzira Chromebook Mainboard

Goverana mafaira ebhodhi, BOM uye zvinodiwa pabvunzo kuti uongorore PCB nePCBA.

Kumbira Mutengo wePCB weChromebook → Kurukurai nezveMainboard Assembly →

✓ Ongororo yeDFM neDFA ✓ Muenzaniso wekudzokorora kugadzirwa ✓ Kugadzirwa nekubatanidzwa kwePCB

4. Kugoverwa kweMagetsi uye Kuwanda kweThermal paCompact Mainboards

Simba remuchina wekugadzirisa magetsi, memory uye interface rinogadzira huwandu hwemagetsi nekupisa. Mugadziri wePCB anofanira kuchengetedza copper geometry, thermal-via patterns uye plane connections izvo zviri chikamu chekugadzirwa kwemagetsi nekupisa kwemutengi. Kuchinja kwemhangura kunoitirwa chete kuti zvive nyore kugadzira kunogona kuchinja kudonha kwemagetsi, kugovera magetsi kana kupararira kwekupisa.

Kusimba kwesimba kunofanira kuongororwa njanji nechitima pane kupfupikiswa se 'mhangura inorema yakakomberedza processor.' Matanho ekushandura simba remagetsi akakwira anoda mapfupi emagetsi, kupararira kwemhangura kwakakodzera uye kuburikidza ne arrays, nepo ma low-voltage core rails anogona kunzwa kupindirana ne plane impedance uye kuiswa kwe connection. Mugadziri wePCB anofanira kuchengetedza ma geometries aya nekuti kutetepa kwemutsipa, kuchinja kuburikidza ne count kana kuchinja plane relief kunogona kukanganisa kudonha kwe voltage, transient response uye local heating.

Kudzora kupisa kwebhodhi kunoenderanawo nechinhu chakapedzwa, heatsink kana spreader, nzira yemhepo uye mutemo wesimba refirmware. Matekiniki ePCB ekugadzirisa kupisa anogona kutsigira hurukuro yekugadzira, asi PCB isina chinhu haigone kuvimbisa tembiricha yekupedzisira yemuchina kana nguva yekushanda kwebhatiri.

Simba kuvimbika

Chengetedza nzira dzemagetsi dzisina kupindira zvakanyanya , kuburikidza nezvivakwa uye kubatanidza tsoka zvichienderana nedhizaini yakaburitswa.

Nzira yekupisa

Ongorora nzvimbo huru dzemhangura, nzvimbo dzinopisa uye nzvimbo dzakacheneswa pamwe chete nedhirowa remuchina.

Nzvimbo yekuchaja

Shandisa ma connector ane simba rakawanda pamwe ne power-conversion components senzvimbo dzine njodzi pamagetsi uye pakugadzira magetsi.

Kusimbiswa kwekupisa kunoenderanawo nesystem. PCB inogona kuparadzira kupisa kuburikidza neplanes uye vias, asi tembiricha yekupedzisira inoenderana neheat spreaders, thermal interface materials, enclosure conduction, airflow uye firmware power limit. Kuti ugadzire, tsanangura kuti ndeapi maficha ethermal anodzorwa nePCB drawing uye ndeapi ari ekupedzisira system qualification. Kupatsanurwa ikoko kunodzivirira kukanganisa kwakajairika: kukumbira mutengesi webhodhi kuti avimbise tembiricha ye enclosure inogona kungosimbiswa paChromebook yakaunganidzwa.

Nzvimbo yekutarisa ongororo yeinjiniya

Kana Chromebook mainboard yako iri kuchinja kubva kuEVT/DVT kuenda kuNPI, tumira stack-up yakaburitswa, controlled-net table, BOM, placement data uye test outline pamwe chete. Ongororo yakatarisana yekugadzira inogona kuratidza matambudziko estack-up, BGA, USB-C uye variant-control usati wavhara build kutenga kwezvikamu.

Mabhodhi makuru ecompact computing ane ma domains akawanda emagetsi anoshanda pamwe chete: adapter kana USB-C input, bhatiri rekuchaja, rails dzinogara dziripo, processor core rails, memory rails uye peripheral supplies. PCB haisarudze dhizaini yemagetsi, asi inofanirwa kutevedzera copper cross-section, plane connections, kuburikidza nekuverengwa uye component land patterns dzinoshandiswa ne design iyoyo. Kubiwa kwe copper kusina kuongororwa, neck-downs kana kuburikidza nekuchinja munzira ine high-current kunogona kuwedzera resistance kana concentrate heat kunyangwe bhodhi richiri kupasa continuity testing.

Ongororo yekupisa inofanira kutarisa pakuenderera mberi kwekupisa . Mapakeji e processor, ma regulators, zvishandiso zvekuchaja uye ma inductors ane simba guru zvinogona kuvimba ne copper planes, exposed-pad vias, shields kana mechanical heat spreaders. Mupi wePCB anofanira kuona kuti mapatani e thermal-via, solder-mask openings uye copper balance zvinogadzirwa pasina kuchinja nzira yaunoda. Chikwata chezvigadzirwa, panguva iyi, chinofanira kupa miganhu yekupisa nemamiriro ekuyedza nekuti tembiricha yemushandisi uye kushanda kwenguva refu zvinoenderana ne enclosure yakazara, firmware power policy uye basa rekushanda—kwete PCB chete.

Ongororo inobatsira isati yagadzirwa

Kana bhodhi riine nzvimbo ine muchina wekugadzirisa/kuchaja, tumira ruzivo rwekugadzira pamwe chete nehuremu hwemhangura hwaunoda, kuburikidza nechimiro uye zvirambidzo zvekupisa zvemakanika. Highleap inogona kuongorora kugona kwekugadzira zvinhu zvisati zvaiswa, izvo zvinobatsira kupfuura kuedza kugadzirisa dambudziko rekupisa kana kuti kusatsetseka mushure mekutanga kuunganidzwa.

5. Zvinodiwa pakugadzira Multilayer, HDI uye Fine-Pitch Pazvinenge Zvichidiwa

Bhodhi guru reChromebook rinogona kushandisa dhizaini yemazuva ano ine layer yakawanda kana HDI yakawanda zvichienderana ne processor package, memory placement, board area uye I/O density. Hazvina kunaka kupa universal layer count kana via type ku category.

Sarudzo yekushandisa kuvaka kwakajairika kwe multilayer, blind vias, microvias kana HDI stack yepamusoro inofanirwa kubva pazvinodiwa zve routing density uye reliability. Fine-pitch packages dzinogona kubatsirwa ne via-in-pad kana sequential structures, asi imwe neimwe lamination cycle uye via technology inowedzera process controls iyo inofanira kusimbiswa. Ongororo yekugadzira inofanirwa kufukidza capture-pad geometry, plating, resin fill pazvakatsanangurwa, registration, annular-ring margin uye chero reliability reliability related ne stacked kana staggered microvias.

Kune magadzirirwo anoda ma microvia , ma blind/built vias kana fine BGA escape, fekitori inofanira kuongorora bhodhi senzira yekugadzira HDI. Kunyoresa, dielectric control, copper balance, via reliability uye finished thickness zvinofanira kusungirirwa kudhirowa chaiko kwekugadzira pane resipi ye laptop-board.

Nheyo imwe cheteyo inoshandawo kune zvinhu: ma laminates eFR-4-family anogona kukwana kune nzira dzakawanda, nepo bhajeti rinorema rekurasikirwa rinogona kukurudzira kusarudzwa kwezvinhu. Sarudzo chaiyo inobva pane chinangwa chemutengi chechiratidzo-kusimba uye stack-up, kwete kubva pazita rechigadzirwa.

Ukobvu hwebhodhi uye kuenzana kwemhangura kunokoshawo pamabhodhi makuru nekuti mapakeji makuru eBGA uye maconnector marefu anogona kukanganiswa nekukasira. Saka kusarudzwa kwezvinhu hakufanirwe kungofunga nezvekurasikirwa nekukurumidza chete asiwo zvinodiwa neTg/Td, maitiro e-z-axis, kufambirana kwelamination uye chimiro chaicho chekudzoreredza. Chirevo chehunyanzvi chinofanira kuratidza stack-up yakaburitswa uye maitiro akakosha zvakasiyana, zvichibvumira kutenga kuona kuti ndeapi madhizaini ari mukati medhizaini uye ndeapi anogona kurerutswa mune ramangwana.

HDI inofanira kusarudzwa nekuti nzvimbo yekubuda kwepakeji uye nzvimbo yebhodhi inoda izvozvo, kwete nekuti "Chromebook PCB" inofungidzirwa kuti inoreva ma microvia. Ma processor eFine-pitch, soldered memory uye dense I/O zvinogona kuita kuti ma blind vias, stacked/staggered microvias kana sequential lamination zvive zvinobatsira, asi mamwe mapuratifomu anogona kugadzirwa ne conventional multilayer through-via construction. Sarudzo chaiyo inoenzanisa routing density, kuvimbika, lamination count, registration capacity, cost and tarisiro production volume.

Kuti HDI ibudiswe, dhizaini yekugadzira inofanira kutsanangura dhayamita yelaser-via, macapture pads, kutevedzana kwekuvaka, kuzadza mhangura kana kutarisira maplate pazvinenge zvichidikanwa, uye chero kurapwa kwe-via-in-pad. Kupera kwepad uye planarity zvine basa pasi pemaBGA akapfava nekuti ma-vias akazadzwa asina kuenzana anogona kuderedza mukana wekuunganidza. Bhodhi rebhodhi rinofanirawo kuongorora kugoverwa kwemhangura pakati pema-build-up layers; mhangura yakakora yemuno iri pedyo nenzvimbo dzisina kusimba inogona kuomesa maplate uye kutonga kwedimensional. Aya ma control ekugadzira akabatana ne stack-up chaiyo, kwete generic "high-density PCB" claims.

6. Kuungana kweBGA/SMT uye Kuongorora maChromebook Mainboards

Kuungana kwebhodhi guru kunowanzo sanganisa SMT yakapfava neBGA kana mamwe mapakeji akagumiswa pasi. Kudhinda kwakapfava, kunyatsoisa zvakanaka, kuongorora mafambiro echinhu chitsva uye kusimbiswa kwekutanga kwakakosha nekuti kukanganisa kwekutarisa kana sarudzo kunogona kukanganisa huwandu hwese hwechinhu.

Dense Chromebook PCBA idambudziko rekusanganiswa kwezvinhu: ma "passive" madiki, ma "IC" akadzimwa pasi, ma "shield cans", ma "connectors" uye zvimwe zvikamu zvinopinda nepaburi kana kuti zvinoiswa mumakanika zvinogona kugara pamwe chete pabhodhi rimwe chete. Maitiro ekugadzira zvinhu anofanira kutsanangura nzira yestencil, vhoriyamu yekunamira, kutevedzana kwenzvimbo uye chimiro chekupisa chakatenderedza musanganiswa chaiwo wezvikamu. Ma "processors" anodhura, ndangariro nezvishandiso zvinorongwa zvinodawo kudzora zvikamu zvinopinda uye kubata hunyoro zvinoenderana nezvinodiwa nepakeji nevatengesi.

Nzira yekugadzira inogona kubatanidza BGA PCB assembly neAOI yekubatanidza majoini anoonekwa uye kuongororwa kweX-ray uko majoini akavanzika anoda kuongororwa kwakanangana. Nzira yekuongorora inofanira kunge yakavakirwa panjodzi; AOI kana X-ray hazvitsivi kuyedzwa kwebasa remamabhodhi akabatanidzwa.

  • Simbisa michina inogamuchira hunyoro uye inodhura usati waburitsa tambo.
  • Simbisa zvigaro zvekubatanidza uye mashandiro emakanika zvichienderana nezvirambidzo zvekontena.
  • Chengetedza miganhu yekugadzirisa patsva nemitemo yekubvumidza yakajeka kune maBGA uye maconnector ane pitch yakanaka.
  • Shandisa pasuru imwe chete inodzorwa nemaitiro ekugadzira zvinhu (revision-controlled assembly paBOM, CPL) uye madhirowa.

Kuongorora kunofanira kuitwa nematanho akasiyana. AOI inobatsira pamamiriro e polarity, kuvapo uye mamiriro e solder anooneka; X-ray inogona kuongorora majoini akasarudzwa akavanzwa; kuongorora kwekutanga kunoongorora data rekuisa uye sarudzo; uye bvunzo inoshanda inosimbisa kuti bhodhi rakaungana rinopa simba, rinoverenga uye rinotaurirana. Chinhu chikuru ndechekusatora nzira imwe chete yekuongorora. Bhodhi rakanyatsojeka rinogona kukundikana nekuda kwe firmware, BOM variant isiriyo, marginal high-speed channel kana connector/mechanical issue.

Bhodhi guru rakakora rinofanira kubatanidzwa nehurongwa hwekuita hunoziva njodzi dzakasiyana-siyana dzezvikamu. Ma "passive" madiki anoda kudhindwa nekuiswa panzvimbo yakagadzikana; ma "BGA" nema "bottom-terminated packages" anoda kudzorwa, kuyererazve uye kuongororwa kwe "hidden-joint"; ma "long connectors" nema "sockets" anoda "coplanarity" uye rutsigiro rwe "mechanical". Kusimbiswa kwekutanga kwakakosha zvikuru pama "option-rich boards" nekuti "mismal memory", "regulator", "oscillator" kana "connector" zvinogona kunge zviri zvemagetsi asi zvisingaenderane ne "firmware" kana "target SKU".

Kuongorora kunofanira kurongwa. AOI inogona kuona nzvimbo dzakawanda dzinoonekwa, polarity uye zvikanganiso zve solder, asi haigone kuongorora zvese zvakavanzika zveBGA. X-ray inogona kuratidza gross voiture, mabhiriji, opens kana head-in-pillow indicators zvichienderana nehunhu hwepakeji uye mufananidzo, asi hazvisati zvaratidza hunhu hwekushanda. Saka kuburitswa kwekugadzirwa kunofanirwa kusanganisa zvidzoreso zvekuona/AOI, X-ray yakanangwa yemapakeji ane njodzi, kuronga kana zvichidikanwa uye kuongororwa kwebasa. Mitemo yekugadzirisa inofanira kubvumirana pachine nguva kune ma processor ane kukosha kwepamusoro uye ndangariro kuitira kuti kutenderera kwekupisa kudzokororwe kusave nzira yekudzoreredza isingadzoreki.

Kumbira Ongororo yeKugadzirwa kweChromebook PCB

7. Kuedza Kunoshanda, NPI uye Kudzora Kugadzira Kudzokorora

Chirongwa chekuyedza kugadzirwa kwedhijitari chinofanira kubva pamidziyo yemutengi nefirmware. Zvichienderana nezvishandiso zviripo uye mukana wekuwana, kuongororwa kunogona kusanganisira maitiro emagetsi, mapurogiramu, boot kana kuverenga, mabasa akasarudzwa eUSB/display, kutarisa kwewaya, maitiro ekuchaja uye mamwe ma interfaces anotsanangurwa nevatengi.

NPI inofanira kubatwa senzira yekudzidza, kwete senzira yekugadzirwa kwezvinhu zvakawanda. Nyora pasi kutsauka kwese kwakawanikwa panguva yekugadzira, kugadzira stencil, kuisa, kudzokorodza, kuronga, kuenderana kwemechanical uye bvunzo yekushanda, wobva wavhara zvinhu izvozvo mupakeji yekugadzira yakaburitswa usati waisa bhokisi rinotevera. Kune mainboard yekombiyuta, kutevedza kunofanira kubatanidza PCB revision, BOM revision, programmable-device version uye test program pamwe chete kuitira kuti kutadza kuchazoitika kugadzirwezve pasina kufungidzira.

Chirongwa chekugadzira chinogona kuronga bvunzo dzePCB dzinoshanda pamwe chete neprototype neNPI builds . Chinhu chakakosha kudzora ndechekutevedza: firmware version, BOM variant, hardware revision uye test limit zvinofanirwa kuratidza configuration imwechete isati yaburitswa build kuti idzokorore kugadzirwa.

Chinangwa chemuenzaniso

Kushandiswa kweprototype kunofanirwa kuratidza zvinopfuura kugona kutengeswa. Kunofanira kuratidza mibvunzo yekuunganidzwa, njodzi dzekugadzira, zvikanganiso zvakasiyana, zvinodiwa pakugadzira uye kusawirirana kwemakanika zvisati zvava matambudziko ekugadzira zvakare.

Kuongororwa kwebvunzo dzekugadzira kunofanirwa kuenzana nezvinogona kudzokorora nefekitori. Kutevedzana kwesimba, maitiro ekutanga eboot, kuchaja/kushanda kweUSB-C, nzira dzakasarudzwa dzekuratidzira kana USB uye kumwe kuongorora kwakatsanangurwa nevatengi kunogona kushanda; kufanirwa kwepuratifomu yakazara chiitiko chakasiyana. Kutsanangura muganhu iwoyo mukotesheni kunovandudza kushandurwa nekuti mainjiniya anoziva humbowo huchapihwa uye kutenga kunogona kuenzanisa vatengesi pachiyero chimwe chete chinoyerwa pane zvipikirwa zvisina kujeka zve '100% bvunzo.'

Kuvharwa kwebvunzo dzinoshanda kunofanirwa kubva mumaitiro angangoita ekukundikana uye mukana uripo. Kuyerera kwebhodhi guru kunogona kusanganisira kuramba kana kuongorora kwenguva pfupi usati watanga, simba remagetsi rinodzorwa, firmware programming, boot kana enumeration checks, memory/storage recognition uye optional interface verification. Kana bvunzo yakazara yekushanda isina kushanda, mufananidzo wekuongorora wakavakirwa chinangwa kana utility yekuedza mutengi inogona kupfupisa nguva yekufamba kwese uku uchiri kushandisa hardware yakakosha.

NPI ndipo panofanira kugadziriswa nzira yekuyedza. Nyora kuti ndeapi matambudziko akabatwa neAOI, X-ray, programming uye functional test, wobva wavhara nzvimbo dzisina kujeka usati wagadzira volume. Ma "golden units", cable sets, fixtures, firmware versions uye acceptance limit zvinoda kugadziriswa kwadzo. Izvi zvinodzivirira dambudziko rekuchinjisa rakajairika umo PCB inoramba isina kuchinja asi test laptop itsva, adapter, cable kana firmware image inoshandura mhedzisiro inooneka yekupasa/kukundikana. Kudzokorora kugadzirwa kunofanira kudzoreredza magadzirirwo ekugadzira-uye-kuyedza akasimbiswa, kwete kuigadzirazve kubva kumaemail.

8. Kusarudza Mubatsiri weKugadzira neKugadzira maPCB eChromebook

Pachirongwa chePCB cheChromebook , zvinodiwa zvemutengesi zvinofanirwa kutarisa njodzi dzebhodhi chaidzo: kunyoreswa kwematanho akawanda, kudzorwa kweimpedance, kuungana kweBGA yakawanda, kudzora kugadzirisa, kurangwa kwekutsvaga uye nzira yekuyedza inoenderana nepuratifomu yemutengi. Fekitori inofanirwa kukwanisa kutaura kuti ndeapi madhiri anodzorwa mukati uye kuti ndeapi anoda zvinodiwa nevatengi.

mhedziso

Bhodhi guru reChromebook rakavimbika haritsanangurwi nehuwandu hwema layer hwakatarwa kana chimiro cheHDI chinodiwa. Rinotsanangurwa nekushanda kwakatendeka kwedhizaini yepuratifomu yakaburitswa, kugadzirwa nekukurumidza kunodzorwa, kuunganidza kwakarongeka uye zviyero zvekuyedza zvinoyerwa.

Kuongororwa kwemutengesi kunofanirwa kunge kwakavakirwa pauchapupu. Bvunza kuti fekitori inodzora sei kugadziriswa kwestack-up, data re impedance, maparamita eBGA process, zvishandiso zvinonzwa hunyoro, X-ray criteria, zvikamu zvinochinjana uye magadzirirwo ekuyedza. Kune bhodhi remakombiyuta rine density yakakura, kugona kugadzira multilayer PCB chikamu chimwe chete chezvinodiwa; muunganidzi anofanirawo kutarisira ma semiconductor anodhura, majoini akavanzwa uye maSKU variants pasina kurasikirwa nekuteverwa.

Mashoko anobatsira anofanira kuita kuti miganhu yescope ionekwe: kugadzirwa kwebhodhi risina chinhu, kufungidzira kwezvinhu uye impedance, modhi yekuwana zvikamu, mashandiro ekuunganidza, kuongorora, kuronga, bvunzo inoshanda, zvigadziriso uye mishumo. Izvi zvinobvumira kutenga kuenzanisa zvakafanana pane kusarudza mutengo wakaderera usingabatanidzi matanho akakosha ekuita. Kune chirongwa chitsva chePCB cheChromebook , kutumira data rekugadzira rakaburitswa, BOM, CPL, dhizaini yekuunganidza uye tarisiro yekuyedza panguva imwe chete zvinopa Highleap mamiriro akakwana ekuona zvinokonzeresa mitengo uye goho risati ragadzirwa kekutanga.

Poindi yekushandura yeRFQ

Kuti utange kuongorora kugadzirwa, sanganisira stack-up, controlled-impedance notes, BGA package list, BOM/CPL revision, firmware kana programming requirements uye ma interfaces auri kutarisira kuyedza. Highleap inogona kutora mashoko ebhodhi nePCBA zvichienderana nenzira yakatarwa yekugadzira panzvimbo petsananguro yemotherboard.

get-instant-quote

varumbidzwa Posts

Nzira yekuwana sei quote yePCBs

Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:

    • Gerber, ODB++, kana .pcb, spec.
    • BOM rondedzero kana iwe uchida kusangana
    • uwandu
    • Kuchinja nguva
Pamusoro pekugadzira PCB, isu tinopa huwandu hwakakwana hwemagetsi masevhisi, anosanganisira PCB dhizaini, PCBA, uye turnkey mhinduro. Kunyangwe iwe uchida rubatsiro neprototyping, dhizaini yekusimbisa, kutsvagisa chikamu, kana kugadzirwa kwakawanda, isu tinopa yekupedzisira-kusvika-kumagumo rutsigiro kuti uve nechokwadi chekubudirira kweprojekiti yako.

Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.






    Quick Note: Chikwata chedu chinokutumira email munguva pfupi mushure mekutumira. Kuti uve nechokwadi chekuti wagamuchira mhinduro yedu, tinokurudzira kutarisa SPAM/JUNK FOLDER yako kana usingaone meseji yedu muinbox yako.