PCB Stackup Guide: Kugadzirisa Yako Yekutenderera Board Dhizaini

PCB stackup

MaPCB anoshanda semusana wezvishandiso zvemagetsi zvemazuva ano, uye dhizaini yavo yakakosha pakushanda uye kuvimbika kwezvishandiso izvi. Chimwe chinhu chakakosha pakugadzira maPCB stackup, iyo inosanganisira kurongeka kwemhangura nezvikamu zvinodzivirira mukati mebhodhi. Gwaro iri richaongorora nyika yePCB stackup, richiongorora kukosha kwayo, kufunga nezvekugadzira, mitemo, uye zviyero, pamwe nekupa mazano akakosha ekugadzira PCB lamination. Pamusoro pezvo, tichakurukura nezvemaumbirwo akasiyana-siyana muPCB stackup design, mutsauko uripo pakati pestandard neHigh -Density Interconnect (HDI) PCB stackups , uye mutsauko uripo pakati pePCB layer stackups dzakasimba uye dzinochinjika.

Chii chinonzi PCB Stackup uye kukosha kwayo?

Tisati tanyura mukuomesesa kwePCB stackup dhizaini, zvakakosha kuti tinzwisise kuti PCB stackup chii uye nei ine kukosha kwakadaro munzvimbo yePCB kugadzira.

PCB Stackup Inotsanangurwa

PCB stackup, inowanzonzi layer stacking, iko kurongeka kwemhangura uye insulating layer mukati medhindi redunhu bhodhi. Uku kuronga kwehungwaru kunoshanda zvakati wandei zvakakosha muPCB dhizaini yemazuva ano:

1. Electromagnetic Compatibility (EMC): Yakakodzera PCB stackup inogona kukwidziridza EMC yedhizaini nekudzikisa kuburitsa uye kuchengetedza dunhu kubva kune ekunze ruzha masosi.
2. Chiratidzo Kutendeseka: PCB layer stack-up inobata basa rakakosha mukuona kutendeseka kwechiratidzo nekudzikisa chiratidzo checrosstalk uye impedance mismatch matambudziko.
3. Thermal Management: Inoshanda stackup dhizaini inogona kubatsira mukupisa kupisa kunogadzirwa nemagetsi zvikamu, zvichibatsira mukuvandudzika kwekutonga kwekupisa.
4. High-Speed ​​Performance: Kune akakwira-kumhanya maseketi, PCB stackup inogona kubatsira kudzikisira nyaya dzine chekuita neradiation, impedance, uye crosstalk.
5. Kubudirira Kwemari: Iyo yakanyatso fungwa yakaturikidzana inogona kutungamira kune inoshanda uye inodhura-inoshanda maitiro ekugadzira.
6. Miniaturization: PCB stackup inogonesa vagadziri kuti vakwane mamwe masekete pane imwechete bhodhi, iyo yakakosha kune compact uye inoshanda zvakanyanya zvemagetsi zvishandiso.

Maitiro ekuronga PCB Stackup Dhizaini?

Kuronga iyo stackup dhizaini yeakadhindwa redunhu bhodhi (PCB) inhanho yakakosha mukuona kuita kwayo, kutendeseka kwechiratidzo, uye kuvimbika. Heino nhanho-ne-nhanho gwara rekuti ungaronga sei PCB stackup dhizaini:

1. Sarudza Nhamba yeMatanho:
   • Ongorora kuoma kwePCB dhizaini yako.
   • Funga nezve density yezvikamu uye routing zvinodiwa.
   • Sarudza pahuwandu hwezvikamu zvinodikanwa, se2-layer, 4-layer, 6-layer, kana kupfuura.
2. Define Layer Types uye Mabasa:
   • Ziva kuti ndeapi maseru achave masignal layer, ndege dzemagetsi, kana ndege dzepasi.
   • Pasi uye ndege dzemagetsi dzakakosha pakugadzika kwemagetsi kugovera uye kuderedza ruzha.
3. Funga Zviratidzo Zvinomhanya-mhanya:
   • Kana dhizaini yako ichisanganisira yakakwira-kumhanya masaini (semuenzaniso, mabhazi edata, masaini eRF), ronga inodzorwa impedance routing uye impedance kuenzanisa.
   • Sarudza iyo dielectric inogara (Dk) yezvinhu zvePCB uye kuverenga kuteedzera upamhi uye nzvimbo yeimpedance yaunoda.
4. Layer Sequence uye Configuration:
   • Sarudza kurongeka uye kutevedzana kwezvikamu mune yako stackup.
   • Funga nezvekugadzirisa kwakaringana kwekutendeseka kwechiratidzo, nzira dzekudzoka kwechiratidzo, uye kutonga kwekupisa.
5. Layer Spacing uye Hukobvu:
   • Rondedzera nzvimbo pakati pematanho, zvinoenderana nezvinhu zvakaita se dielectric kugara uye zvinodiwa zvekuzviparadzanisa nevamwe.
   • Sarudza kukora kwega rega rega, uchifunga nezvezvinhu zvakaita semakanika kugadzikana uye impedance control.
6. Kugovera Simba:
   • Ronga kuti simba richagovaniswa sei mhiri kwePCB.
   • Govera ndege dzemagetsi kune akasiyana voltage mazinga uye kuderedza madonhwe emagetsi.
7. Thermal Management:
   • Taura kuti kupisa kunogadzirwa nezvikamu zvichabviswa sei.
   • Govera zvidimbu zvekuyamura kupisa uye kupisa kunyura kana zvichidikanwa.
8. Signal Layer Allocation:
   • Govera chaiwo masiginecha masiginecha kune akakosha masaini, yakakwira-kumhanya nzira dzedata, uye zvine hunyoro analogi zvikamu.
   • Ronga nzira inobudirira uye chiratidzo chekuzviparadzanisa nevamwe.
9. Via Placement uye Technology:
   • Sarudza nzvimbo uye mhando dzevias (kuburikidza negomba, bofu, kana kuvigwa).
   • Ita shuwa kuti vias akaiswa zvine hungwaru kune masaini nzira uye chikamu chinongedzo.
10. Kusarudzwa Kwezvinhu:
    • Sarudza zvakakodzera PCB zvinhu, kusanganisira substrate zvinhu, mhangura ukobvu, uye prepreg zvinhu.
    • Sarudzo dzezvinhu zvinokanganisa kushanda kwemagetsi, maitiro ekupisa, uye mutengo.
11. Kugadzira Mitemo uye Zvipingamupinyi:
    • Gadzira mitemo yekugadzira, senge yakaderera trace wides, clearance, uye annular ring size.
    • Tsanangura zvipingaidzo zvekugadzira zvinoenderana nekwaniso yemugadziri wako wePCB.
12. Simulation uye Testing:
    • Shandisa maturusi ekufananidza kusimbisa yako stackup dhizaini yekutendeseka kwechiratidzo, impedance, uye mashandiro ekupisa.
    • Funga kuita inodzorwa impedance bvunzo kuti uve nechokwadi chekutevedzera zvinangwa zvekugadzira.
13. Documentation:
    • Gadzira yakazara stackup zvinyorwa, zvinosanganisira layer stack dhayagiramu, zvinyorwa zvezvinhu, impedance profiles, uye mitemo yekugadzira.
    • Zvinyorwa zvakajeka uye zvakarongeka zvakakosha pakugadzira uye kuunganidza.
14. Kudzokorora uye Kudzokorora:
    • Bata mukunyatsoongorora vezera uye dhizaini yekudzokorora.
    • Kumbira mhinduro kubva kune vaunoshanda navo kana vane ruzivo vagadziri vePCB kuti vaone uye kugadzirisa zvingangoitika.
15. Pedzisa iyo Stackup:
    • Mushure mekutarisa zvese zvinhu uye mhinduro, pedzisa PCB yako stackup dhizaini.
    • Ita shuwa kuti inoenderana nezvinodiwa zvepurojekiti yako pakuita, kuvimbika, uye kugadzira.

Inoshanda PCB stackup kuronga chinhu chakakosha chePCB dhizaini, sezvo ichikanganisa zvakananga kushanda uye kuvimbika kwemaseketi ako emagetsi. Kunyatsofunga nezvematanho aya uye kubatana nevagadziri vePCB vane ruzivo kunogona kutungamira kune yakabudirira stackup dhizaini inosangana nezvinangwa zvepurojekiti yako.

Zvinhu zvakakosha zvekufunga nezvazvo Paunenge uchigadzira PCB Stackup

Kugadzira yakasimba PCB stackup kunosanganisira kutarisisa kune akasiyana akakosha zvinhu. Ngationgororei zvinhu izvi zvakadzama:

1. Ground Plane Utilization

Kushandisa ndege dzepasi ndiyo yakanakisa tsika muPCB stackup dhizaini. Ndege dzepasi dzinobatsira masaini enzira zvinobudirira uye dzinoita basa rakakosha mukuderedza ruzha rwepasi.

2. Signal Layer Arrangement

Ronga masaini akaturikidzana nenzira inoderedza kupindira uye crosstalk. Kuchengeta masiginecha ari padhuze kune mumwe nemumwe kunogona kubatsira kugadzira nhovo kubva paradiation kubva kune yakakwirira-kumhanya masaini.

3. Symmetry

Symmetry mukurongeka kwemutsetse kwakakosha pakuchengetedza yakaenzana stackup. Iyo inovimbisa kuita kwakafanana muPCB yese uye inobatsira mukudzikisa zvinogona kuitika.

4. Zvinhu Zvokuita

Funga nezvezvimiro zvezvinhu zvinoshandiswa mune yako stackup. Ongorora zvemagetsi, zvemagetsi, zvinopisa, uye makemikari maitiro kuti uite sarudzo dzine ruzivo.

5. Kudzora Impedance

Kuchengetedza inodzorwa impedance yechiratidzo chechiratidzo kwakakosha, kunyanya kune yakakwira-frequency masaini. Yakakodzera impedance control inovimbisa kutendeseka kwechiratidzo uye kushoma kukanganisa.

Mitemo uye Mayero ekutevera kune Yemhando PCB Stack-up

Kugadzira yemhando yepamusoro PCB stack-up inosanganisira kuomerera kumitemo yakatemwa uye zviyero. Heano mamwe akakosha nhungamiro yekutevera:

1. Shandisa Ground Planes: Ndege dzepasi dzakakosha pakufambisa kwemasaini uye kuderedza ruzha. Iwo anofanirwa kuve akaverengerwa mune yako stackup dhizaini.
2. Akapatsanura High-Speed ​​Signals: Zviratidzo zvepamusoro zvinofanirwa kufambiswa pazvikamu zvepakati pakati pezvikamu zvakasiyana, uchishandisa ndege yepasi senhovo kuderedza mwaranzi.
3. Symmetrical Arrangement: Chengetedza symmetry mune yako stackup yekumisikidza kuitira kuenderana kuita.
4. Layer Thickness Zvinotarisirwa: Ukobvu hwechiratidzo chega chega hunofanira kunyatsosarudzwa, uchifunga nezvezvinhu zvezvinhu.
5. Shandisa Dhizaini Software: Shandisa PCB dhizaini software yekubatsira mukusarudza zvinhu, kuverenga kweimpedance, uye yakazara stackup dhizaini.

Epamusoro 7 Mazano eAdvanced PCB Lamination Dhizaini

Kuwana yakakwana PCB lamination dhizaini kwakakosha pakubudirira kwese kweprojekiti yako. Heano matipi manomwe akakosha ekusimudzira yako PCB lamination dhizaini:

1. Gadzirisa Huwandu hweMasignal Layers: Gadzirisa huwandu hwemasaini masiginecha kune yako application. Yakakwira-frequency kana yakakwirira-simba maapplication, pamwe neaya anoda yakaderera crosstalk, angangoda mamwe masignal layers kuti ave nechokwadi chekuita kwakasimba uye kuvimbika.
2. Balance Ground uye Power Layers:Kuve nechokwadi chekugovera kwakaringana kwepasi uye magetsi akaturikidzana kwakakosha mukuderedza DC kuramba uye kudonha kwemagetsi. Iyi chiyero inosimudzirawo kutendeseka kwechiratidzo nekupa yakagadzikana yereferensi ndege kune yakakwirira-kumhanya masaini.
3. Shandisa Inodzorwa Impedance Traces:Kuchengeta inodzorwa impedance yechiratidzo chetrace kwakakosha, kunyanya mune yakakwirira-frequency application. Inodzorwa impedance inodzivirira kuderedzwa kwechiratidzo uye inova nechokwadi chekuita kunoenderana muPCB yese.
4. Sequential Layer Alignment: Nehungwaru gadziridza yakakwirira-kumhanya masaini masiginecha zvine ruremekedzo kune simba ndege uye microstrip mutsetse ukobvu. Kuiswa kwakaringana kunogona kuwanikwa nekumisikidza masiginecha pazasi pesimba remagetsi, kukurudzira kubatana kwakasimba uye kuderedza kukanganiswa kwemagetsi (Ichimura).
5. Sarudza Zvinhu Nokuchenjera:Sarudza zvekushandisa kune imwe neimwe layer zvichibva pane yako dhizaini zvinangwa, uchifunga nezvemagetsi, mechanika, uye zvinopisa zvivakwa. Ukobvu uye dielectric kugara kwezvinhu zvinogona kukanganisa zvakanyanya kupararira kwechiratidzo uye kutonga kwekupisa.
6. Dzivirira Bow uye Twist: Dhizaina multilayer stackups symmetrically uye shandisa yunifomu yemhangura kugovera kudzivirira uta uye kumonyorora nyaya. Symmetrical dhizaini inosimudzira kugadzikana kwemuchina uye kuona kuti PCB inoramba yakapfava panguva yekugadzira nekushanda.
7. Ronga Routing uye Vias Nekungwarira: Ronga nekufunga kuronda nzira, kuburikidza nemhando, uye nzvimbo, pamwe nehuremu hwemhangura mune yako stackup dhizaini. Bata pamwe nemugadziri wako wekondirakiti (CM) kuomerera kune yakatarwa dhizaini uye kugona kugadzira, kuve nechokwadi chekuita kwakakwana uye kugadzirwa.

Standard vs. HDI PCB Stackup

Sarudzo pakati peyakajairwa uye HDI (High-Density Interconnect) PCB stackups zvinoenderana nezvako chaizvo dhizaini zvinodiwa uye zvinangwa. Ngatienzanise aya marudzi maviri e stackups:

Yakajairwa PCB Stackup

1. Kukodzera: Yakajairwa PCB stackups inosiyana-siyana uye inogona kusangana nezvinodiwa zveakawanda emagetsi maapplication. Vanopa chiyero chakanaka pakati pemutengo, kuita, uye kuoma.
2. Layer Count: MaPCB akajairwa anowanzo kuve nezvikamu zvina kusvika kusere, kunyangwe izvi zvichigona kusiyana zvichienderana nezvinodiwa zvekugadzira.
3. Trace uye Via Saizi: Tsvaira upamhi uye nemasaizi muyakajairwa maPCB ane rupo uye akakodzera kune pakati-kumhanya dhizaini. Izvo zviri nyore uye zvinodhura-zvinobudirira kugadzira.
4. Applications: MaPCB akajairwa anowanzoshandiswa mumhando dzakasiyana dzemagetsi evatengi, zvishandiso zveindasitiri, masisitimu emotokari, uye mamwe maapplication apo dhizaini yepakati-density yakakwana.

HDI PCB Stackup

1. Kukodzera: HDI PCB stackups inogadzirwa kune yakakwira-density uye yakakwirira-kuita maapplication uko miniaturization, chiratidzo chekuvimbika, uye kuwedzera kushanda kwakakosha.
2. Layer Count: HDI PCBs dzinozivikanwa nepamusoro-soro, iyo inogona kubva pamasere kusvika kune makumi maviri, zvichienderana nekuoma kwekugadzira.
3. Trace uye Via Saizi: HDI PCBs inoratidzira yakawanda yakatsetseka yekutevera upamhi, idiki kuburikidza nehukuru (microvias), uye yakawedzera density yenzira. Aya maficha anobvumira zviri nani chiratidzo kutendeseka, kuderedzwa crosstalk, uye kushandiswa kwakanaka kwebhodhi nzvimbo.
4. Applications: HDI PCBs inowanzoshandiswa mumagetsi epamusoro, kusanganisira mafoni efoni, mahwendefa, dhiyabhorosi yekukurumidzira data data, midziyo yekurapa, uye aerospace systems. Ivo vanokunda mukushandisa uko miniaturization uye kushanda kwepamusoro kwakakosha.

Mafungiro eKusarudza Yakajairwa kana HDI PCB Stackup:

• mutengo: MaPCB akajairwa anowanzo kudhura-inoshanda kugadzira nekuda kwemaitiro mashoma ekugadzira. HDI PCBs inogona kudhura.
• Dhizaini Kuomarara: Funga kuoma kwedhizaini yako uye inodiwa layer count. HDI PCBs dzakakodzera kune dzakaoma, dzakakwirira-density dhizaini, nepo maPCB akajairwa akakwana kune mashoma akaomarara maapplication.
• Chiratidzo Kuperera: Kana dhizaini yako ichida kusimba kwechiratidzo uye kuderedzwa kukanganiswa, maHDI PCB ane maficha awo isarudzo iri nani.
• Space Constraints: Kana application yako iine nzvimbo shoma yebhodhi, HDI PCBs inobvumira hukuru hwechikamu density uye miniaturization.

Muchidimbu, sarudzo pakati peyakajairwa uye HDI PCB stackup inoenderana nezvinodiwa zvepurojekiti yako, kusanganisira mutengo, dhizaini yakaoma, chiratidzo chekuvimbika zvinodiwa, uye iripo bhodhi nzvimbo. Mhando yega yega ine zvayakanakira, uye kusarudza iyo chaiyo stackup kwakakosha kuti uwane yaunoda kuita uye kushanda kwechigadzirwa chako chemagetsi.

Akasiyana Zvimiro muPCB Stackup Dhizaini

PCB stack-up dhizaini inosanganisira kuronga zvidimbu zvakasiyana zvezvinhu kugadzira inoshanda uye yakavimbika redunhu bhodhi. Iyo chaiyo chimiro chePCB stackup inogona kusiyana zvichienderana nezvinodiwa zvekugadzira uye kuoma kwedunhu. Heano mamwe akajairika PCB stackup zvimiro:

1. Imwe-Layer PCB:
   • Mune imwechete-layer PCB, zvese zvikamu uye zviteedzere zviri kune rimwe divi rebhodhi, nepo rimwe divi rinowanzo indege yepasi kana inongoshanda senge isina chinhu substrate.
   • Single-layer PCBs akakodzera kune akareruka, akaderera-density magadzirirwo uye anodhura-inoshanda.
2. Kaviri-Layer PCB:
   • Kaviri-layer PCBs ine zvidimbu zviviri zvemhangura zvakapatsanurwa ne dielectric material (kazhinji FR-4).
   • Zvikamu zvinogona kuiswa kumativi ose ebhodhi.
   • Iyi ndeimwe yeakajairika uye inodhura-inoshanda PCB zvimiro zveakasiyana maapplication.
3. Ina-Layer PCB:
   • A mana-layer PCB inosanganisira mana akaturikidzana ezvinyorwa: maviri emukati masaini akaturikidzana uye maviri ekunze pasi kana ndege dzemagetsi.
   • Zvikamu zvemukati zvakaparadzaniswa ne dielectric material.
   • Mana-layer PCBs anowanzo shandiswa mumagadzirirwo akaomarara ane mwero chikamu density uye yakakwirira-kumhanya masaini.
4. Six-Layer PCB:
   • Six-layer PCBs ane matatu masiginera akaturikidzana pakati pevhu remukati nekunze kana ndege dzemagetsi.
   • Vanopa mamwe maitiro ekufambisa uye zvirinani chiratidzo chekuvimbika zvichienzaniswa nechina-layer mabhodhi.
   • Six-layer PCBs inokodzera madhizaini ane pakati nepakati kuomarara.
5. Sere-Layer PCB:
   • Eight-layer PCBs inopa mamwe masignal layers uye pasi / simba ndege dzekuwedzera kuchinjika nzira uye chiratidzo chekuvimbika.
   • Iwo anoshandiswa mumagadzirirwo akaomarara ane akakwira-kumhanya masaini, RF zvikumbiro, uye impedance control zvinodiwa.
6. Multilayer PCB (> 8 Layers):
   • MaPCB ane akaturikidzana sere anoonekwa semabhodhi akawanda uye anogona kuve nemasaini akawanda akaturikidzana, ndege dzepasi, uye ndege dzemagetsi.
   • Aya anoshandiswa mumagadzirirwo epamberi senge akakwira-density akasanganiswa maseketi (ICs), yakakwirira-kumhanya data kutaurirana, uye yepamusoro RF zvikumbiro.
   • Multilayer PCBs inoda kungwarira impedance kuenzanisa uye chiratidzo chekuvimbika kuongororwa.
7. Mixed-Signal PCB:
   • Mumisanganiswa-chiratidzo maPCB, analogi uye madhijitari zvikamu zvinogara, kazhinji zvinoda kunyatsopatsanurwa uye kudzivirira kudzivirira kukanganisa.
   • Iyo stackup inogona kusanganisira yakaparadzana pasi ndege dzeanalog uye dijitari zvikamu kuderedza ruzha.
8. High-Frequency/RF PCB:
   • Yakakwira-frequency uye RF PCBs inoda nyanzvi stackup dhizaini kuchengetedza chiratidzo chekuvimbika.
   • Ivo vanowanzo sanganisira inodzorwa impedance traces uye chaiyo zvinhu zvine yakaderera Dk uye Df kukosha kudzikisa chiratidzo kurasikirwa.
9. Flex uye Rigid-Flex PCB:
   • Flex uye yakaoma-flex PCBs batanidza zvikamu zvinoshanduka uye zvakasimba.
   • Iyo stackup dhizaini inosiyana, ine zvikamu zvinochinjika zvinosanganisira polyimide kana zvimwe zvakafanana uye zvikamu zvakaomarara uchishandisa yakajairwa FR-4.
   • Aya maPCB anoshandiswa muzvishandiso zvinoda kuchinjika uye kusimba, senge midziyo inopfekwa uye maapplication emuchadenga.

Sarudzo yePCB stackup chimiro inoenderana nezvinhu zvakaita sekuoma kwedhizaini, rudzi rwezvikamu zvinoshandiswa, chiratidzo chekuvimbika zvinodiwa, uye mutengo wekufunga. Chimiro chega chega chine zvakanakira uye kutengeserana, uye vagadziri vanofanirwa kunyatso sarudza iyo yakakodzera stackup yekuzadzisa zvinangwa zveprojekiti.

Kusiyana pakati peRigid uye Flex PCB Layer Stackup

MaPCB akaomarara uye anochinjika ane magadzirirwo akasiyana ezvikamu zvezvikamu zvezvikamu nekuda kwezvinodiwa zvemagadzirirwo awo akasiyana uye mashandisirwo aanoda. Heano misiyano mikuru pakati pezvikamu zve ...

Rigid PCB Layer Stackup:

1. Substrate Material: Rigid PCBs dzinoshandisa inflexible substrate zvinhu, kazhinji FR-4 epoxy-based laminates, iyo inochengetedza chimiro chavo uye haikotami.
2. Layer Composition+
3. Kubvuma sanduko: Rigid PCBs hadzina kugadzirwa kuchinjika kana kukotama; vanochengetedza chimiro chakagadziriswa.

Flex PCB Layer Stackup:

1. Substrate Material: Flexible PCBs (flex PCBs) inoshandisa flexible substrate zvinhu, zvakadai se polyimide (PI), iyo inobvumira bhodhi kukotama pasina kuputsa.
2. Layer Composition: The stackup for flex PCBs inosanganisira flexible polyimide layers iyo inogona kukotama uye kuenderana neakananga maumbirwo. Inogonawo kusanganisira zvikamu zvakaomesesa kana stiffener pazvinenge zvakakodzera.
3. Kubvuma sanduko: Flex PCBs dzakagadzirirwa kuchinjika uye dzinogona kukotama, kumonyoroka, kana kupeta kuti dzikwane fomu inodiwa kana chimiro.

Yakajairwa Layer Stackup Zvimiro zveZvese Rigid uye Flex PCBs:

1. Copper Layers: Zvose zvakasimba uye flex PCBs sanganisira mhangura yemhangura yechiratidzo chechiratidzo, kugovera simba, uye ndege dzepasi.
2. Dielectric Layers: Dielectric layers iripo mumhando mbiri dzekuisa insulate uye kupatsanura mhangura.
3. Solder Mask: Marudzi ese ari maviri anoshandisa solder mask layer kuchengetedza uye insulate mitsetse yemhangura.
4. Silkscreen: Silkscreen layers inoshandiswa kumakatani echikamu, mavara, uye mareferenzi madeta.
5. pamusoro Finish: Marudzi ese ari maviri anoda pamusoro pekupedzisira akaturikidzana kudzivirira maronda emhangura uye kupa solderability.

Musiyano mukuru pakati pema layer stackup ema PCB akaomarara neekuchinjika ndewekuchinjika uye kuumbwa kwezvinhu. Ma PCB akaomarara anoshandisa zvinhu zvisingachinjiki zvakaita seFR-4 uye anochengetedza chimiro chakasimba, nepo ma flex PCB anoshandisa substrates dzinochinjika senge polyimide, zvichivabvumira kukotama uye kuenderana nemaumbirwo chaiwo. Stackup yakagadzirirwa zvinodiwa zvakasiyana zvemhando yega yega yePCB uye mashandisirwo ayo.

mhedziso

Dhizaini yePCB stackup chinhu chakakosha pakugadzirwa kwemidziyo yemagetsi yemazuva ano. Nekunzwisisa kukosha kwePCB stackup, kuronga dhizaini nokungwarira, kufunga nezvezvinhu zvakakosha, kutevedzera mitemo nezvinodiwa, uye kushandisa mazano akakosha, unogona kugadzira PCB stackups dzinovandudza mashandiro, kuvimbika, uye kushanda zvakanaka kwezvigadzirwa zvako zvemagetsi. Kunyangwe ukasarudza standard kana HDI stackups uye ukasarudza PCB dzakasimba kana dzinochinjika, stackup yakagadzirwa zvakanaka ndiyo hwaro hwekubudirira mukugadzirwa kwePCB.

Rangarira kuti yakabudirira PCB stackup dhizaini inowanzoda kubatana nevagadziri vePCB vane ruzivo uye mainjiniya edhizaini anogona kupa ruzivo rwakakosha uye hunyanzvi hwakagadzirirwa kune yako chaiyo purojekiti. Nemaitiro chaiwo uye kutarisisa kune zvakadzama, unogona kuwana yakakwana PCB stackup dhizaini inosangana nezvinodiwa zvemazuva ano epamberi emagetsi ekushandisa.