Sei Copper Coin PCB Inovandudza Kupisa Kwekupisa muMagetsi eMasimba

Nhanganyaya: Iyo Thermal Dambudziko muSimba Semiconductors

Zvishandiso zvemagetsi zvakaita seIGBT, MOSFET, SiC, uye GaN zvinogadzira kupisa kwakawanda panguva yekushanda. Sezvo mafrequency ekuchinja achiwedzera uye huwandu hwesimba huchikwira, kutonga kwakanaka kwekupisa kunova kwakakosha pakuvimbika kwemudziyo uye mashandiro awo. Substrate dzechinyakare dzeFR4 PCB dzine miganhu mukupararira kwekupisa nekuda kwekudzikira kwekupisa kwemhepo kweinenge 0.3 W/mK, zvichienzaniswa ne400 W/mK yemhangura.

Kupisa kunofanira kufamba nemuzvikamu zvakasiyana-siyana zve dielectric uye munzvimbo dzine resin yakawanda usati wasvika kuzvinhu zvekutonhodza zvekunze, zvichigadzira nzira refu dzekupisa uye kuramba kupisa kwakanyanya. Tekinoroji yePCB yemari yemhangura inotarisa dambudziko iri rekupisa nekuisa masilinda emhangura akasimba pasi penzvimbo dzekuisa zvishandiso zvemagetsi, zvichigadzira nzira yakatwasuka inofambisa kupisa kubva panosangana semiconductor kuenda ku heat sink kana chassis.

Copper Coin PCB Thermal Dissipation Principles

Yakananga Vertical Heat Conduction Path

Iyo yakakosha mukana wemhangura yesimbi PCB yekupisa yekupisa iri mukumisa bhiriji rinogara richipisa rinobatanidza chikamu chesolder padhi yepasi yemhangura kana yekunze yekupisa sink interface. Kana yakamisikidzwa mukati mePCB stackup, mari yemhangura inopa yakakwira-conductivity zvinhu zvinotenderera bhodhi ukobvu zvakananga pasi pechigadzirwa chinopisa chinopisa, chichigonesa kukurumidza kupisa kupisa nemhangura yekupisa kwe400 W/mK.

Thermal Performance Kuenzanisa

Mune akajairwa PCB dhizaini, kupisa kunofanirwa kuita nechemberi kuburikidza nemhangura mitezo uye yakatwasuka kuburikidza nefiberglass-resin composite layer. Iyi inotenderera nzira inounza yakakura kupisa kwekudzivirira. Nepo zvinopisa zvinogadzirawo nzira dzekupisa dzakamira, dzinotora nzvimbo shoma yebhodhi uye dzinounza machinjiro pakati pemhangura yakapfava uye chigadziko.

Mari yakasimba yemhangura inopa yepamusoro-chikamu-chikamu nzvimbo yekutamisa kupisa uye inobvisa mhezi dzemhepo uye resin homwe dzinodzikisira kuburikidza nearray kushanda. Kuedza kunoratidza zvimiro zvemhangura zvinowana 30-50% yakaderera junction-to-case thermal resistance kana ichienzaniswa neakaenzana kupisa kuburikidza nemadhizaini mune simba semiconductor application.

Dhizaini Yekuumbwa kweCopper Coin PCB yeKubata Kupisa Kwekunaka

Yakamisikidzwa Copper Coin Configuration

Yakamisikidzwa mari yemhangura masilinda emuchina akaiswa mumakomba mukati mePCB yakakosha zvinhu. Mari iyi inowanzoenda nepakati peimwe kana kupfuura dielectric layer, iine pamusoro payo inotsvedza nechikamu chekumisikidza padhi uye yepasi pasi ichibata inorema yemhangura layer kana yakananga singi yekupisa. Iyi dhizaini inokodzera maapplication uko iyo simba mudziyo tsoka inowirirana neyakajairwa PCB kugadzira kugona.

Kuburikidza ne-Type Copper Coin Structure

Kuburikidza ne-mhando yemhangura yemhangura inotenderera iyo yose PCB ukobvu, ichigadzira isina kukanganiswa nzira yekupisa kubva kune chikamu kusvika pakupisa kunyura. Iyi gadziriso inoshanda zvakanaka kune rimwe-sided simba mabhodhi apo chikamu chinokwira pamusoro uye sink yekupisa inonamira yakananga pasi. Kubviswa kwemukati meinterface kunoderedza kupisa kwekupisa, zvichiita kuti ive yakanaka kune yakakwirira-simba remhangura PCB yekupisa yekupisa zvikumbiro.

Multi-Coin Dhizaini Yekugovera Kupisa Kwenzvimbo

Power modules ine akawanda semiconductor anofa anobatsirwa kubva kune akawanda-mari marongero. Mari yega yega inomisikidzwa pasi penzvimbo yekudziya yega yega, ichigadzira nzira dzinopisa dzakafanana dzinogovera kupisa zvakaenzana pane inotonhorera interface. Madhayamita chaiwo emari anotangira pa5mm kusvika pa25mm zvichienderana nekukura kwechishandiso uye simba rekutsakatika kwemagetsi, nekupatsanurana kwakaringana kudzivirira kusanganiswa kwemafuta uchichengetedza kuvimbika kwebhodhi.

Thermal Resistance Kuderedzwa muCopper Coin PCB

Thermal Resistance Component Analysis

Thermal resistance mumagetsi semiconductor assemblies ine akati wandei akatevedzana zvikamu: junction-to-case resistance mukati memudziyo package, interface resistance pane solder joint, board thermal resistance, uye heat sink interface resistance. Copper coin PCB yekupisa yekupisa inonyanya kunanga iyo board thermal resistance component, iyo inowanzotonga mumagadzirirwo akajairwa.

Quantified Performance Improvements

Zviyero pamamodule eIGBT anoratidza kushandiswa kwemari yemhangura kunopa mabhenefiti akakosha ekupisa:

• Board thermal resistance reduction - Kubva 0.8-1.2 K/W kudzika kusvika 0.3-0.5 K/W kune anofananidzwa tsoka
• Junction kuderedzwa kwekushisa - 60-100 ° C yakaderera tembiricha yekushandisa ye200W magetsi zvishandiso
• Thermal conductance inowedzera - 10-20 nguva yakakura kupfuura yakaenzana FR4 substrate ukobvu
• Kuwedzera kupisa kwekupisa kunatsiridza - 40-60% kuderedzwa kana ichienzaniswa neyakajairika PCB kuvaka

Kudzikisira kwekupisa kunobva kune ese ari maviri akawedzera anoshanda emuchinjiko-chikamu uye kubviswa kwezvinhu zvakaderera-conductivity mugwara rekutanga kupisa, zvakanyanya kushandura kupisa kwekupokana mukati megungano.

Zvishandiso muSimba Semiconductor Modules

IGBT Modules for Automotive Inverters

Magetsi emagetsi ekudhonza inverters anoda yakavimbika mhangura yesimbi PCB yekupisa yekupisa yeIGBT switch inobata mazana emaampere. Iyo yakananga yekupisa nzira inobvumira kupisa kunyura sizing zvichibva pane chaiyo semiconductor miganho pane PCB yekupisa zvinomanikidza, optimize yakazara inverter pasuru vhoriyamu uye huremu uchisangana nemotokari tembiricha yebhasikoro zvinodiwa.

SiC MOSFET High-Frequency Converters

Silicon carbide zvishandiso zvinoshanda patembiricha yakakwira uye ma frequency ekuchinja, achiisa kupisa munzvimbo diki dzinofa. Copper coin zvimiro zvakamisikidzwa pasi peSiC MOSFET mapakeji zvinopa iyo yekupisa inodiwa kudzivirira nzvimbo dzinopisa uchitsigira compact marongero. Musanganiswa uyu unogonesa kuvandudzwa kwesimba remagetsi mumaseva emagetsi emagetsi, solar inverters, uye madhiraivha emotokari.

GaN Power Supply Designs

Gallium nitride transistors inogonesa zvisati zvamboitika miniaturization mune switch-mode magetsi emagetsi. Mhangura coin PCB yekupisa yekupisa inobvumira GaN zvishandiso kuchengetedza mabhenefiti avo madiki etsoka uku uchiona kuti yakaringana kupisa. Iyo tekinoroji inopa inodhura-inoshanda mhinduro yepakati-simba GaN application uko yakazara ceramic kuvaka haina kurongeka mune zvehupfumi.

Kuvimbika uye Mechanical Benefits yeCopper Coin PCB

Enhanced Thermal Cycling Performance

Pamusoro pekuvandudzwa kwekupisa kwekushanda, zvimiro zvemhangura zvePCB zvinowedzera kuvimbika kwenguva refu pasi pemamiriro ekupisa bhasikoro. Iko kuderedzwa kwetembiricha kushanduka kunokonzerwa nekuvandudzwa kwekupisa kunoderedza zvakananga kupisa kuneta kunetseka pamajoini ekutengesa. Kuedza kunoratidza 2-3 nguva kuvandudzwa kwehuwandu hwekudziya kutenderera kusvika kukundikana kwemakoni emhangura zvichienzaniswa neakajairwa dhizaini mukumhanyisa kuyedza hupenyu.

Structural Rigidity Advantages

Iko kusimba kwesimbi yemhangura kunoderedza bhodhi warpage panguva yekushanya kwekushisa. Nekugadzira chimiro chakaoma chakamira kuburikidza nehukobvu hwebhodhi, mari yemhangura yakamisikidzwa inomanikidza deformation yenzvimbo yakatenderedza nzvimbo dzakakosha dzekukwira. Mari yakasimba yemhangura inobvisa iyo interface kushatisa iyo inogona kuitika neaya yekupisa pamusoro pekuwedzera kupisa bhasikoro, uko kuwedzera kwemutsauko kunovhura madiki madiki anowedzera kupisa kwekupisa nekufamba kwenguva.

Dhizaini uye Kugadzira Kufunga kweCopper Coin PCB

Copper Coin Insertion Process Control

Kugadzira simbi yemhangura PCB kunoda kuumbwa chaiko kwegomba uye kuiswa kwemari kuti ive nechokwadi chekubata kwemafuta uye magetsi. Mari yacho inofanira kugara yakapfava nemhangura yakatenderedza kuti igone kuvimbika solder majoini kuumbwa uye kuderedza kubata kubata:

• Kushivirira kudzora - Mukati me ± 0.05mm yekuenderana kuita kwese kugadzirwa
• Kugadzirira pamusoro -Yakaoma mhango uye coin madziro kugadzirira kune yakaderera yekushisa interface kuramba
• Zvido zveflatness -Inovimbisa yakakwana solder majoini kuumbwa uye kupisa kupisa

Surface Finish Impact pane Thermal Contact

Sarudzo yekupedzisa kwepamusoro inobata zvese kutengesa uye kupisa kwekubata kuramba pa coin-to-chikamu interface. Electroless nickel kunyudza goridhe kupera kunopa kwakanakisa flatness uye solderability uchiwedzera kushoma kupisa kwekudzivirira. Organic solderability preservatives inopa mutengo wakaderera asi inoda kungwarira maitiro ekudzora kuchengetedza akatetepa, mayunifomu machira asingatadzise kupisa kupisa.

Mechanical Integration Matambudziko

Copper coin zvimiro zvinogadzira kuomarara kwakasiyana mukati mePCB iyo inofanirwa kutariswa panguva yekugadzira gungano. Yakakodzera prepreg kusarudzwa uye lamination paramita inodzivirira isina kuumbwa kwakatenderedza mari inotenderera. Madhizaini anofanirwa kusanganisira nzvimbo dzakakodzera dzekuchengeta dzakatenderedza mari kudzivirira kushanduka kwemhangura panguva yekudzvanya maoparesheni.

Mhedziso: Kuenda Kwakakwirira-Kuvimbika Simba PCB Dhizaini

Verified Thermal uye Reliability Advantages

• Ipfupi nzira yekupisa - Kuyerera kwakananga kubva kumagetsi kuenda kusimbi kunoderedza tembiricha yekusangana uye kunonatsiridza kushanda zvakanaka kwenzvimbo.
• Kuderedza kupisa kwekudzivirira - Mari yemhangura inoderedza kupindirana-kune-bhodhi kupisa kwekudzivirira neanenge 40 - 60% zvichienzaniswa neyakajairwa multilayer PCBs.
• Kuvimbika kwakawedzerwa - Yakagadzika kupisa conduction kunoderedza kuneta kune solder uye mechanical warpage panguva yakadzokororwa inopisa bhasikoro.

Kukoshera muMazuvano Simba Emagetsi

• WBG mudziyo kuenderana - Inotsigira yakakwirira-frequency, yakakwira-simba-density SiC uye GaN semiconductors inoda kunyatso kudzora kupisa.
• Mutengo-kuita chiyero - Inowana pedyo-ceramic-level kupisa kupisa pasina kutama kuzere kune inodhura simbi kana ceramic substrates.
• Compact thermal design - Inogonesa marongero madiki uku uchichengetedza tembiricha yakachengeteka yekushanda kwemamodule emagetsi.

Dhizaini uye Kugadzira Insight

• Inodzorwa mhangura geometry - Kunatsiridza ukobvu hwemari, chinzvimbo, uye kupfava kunovandudza vertical heat conduction.
• Sarudzo dzekupedzisira dzepamusoro - Yakakodzera plating (Ni/Au, OSP) inosimudzira yemhando yemhando yekupisa uye kuvimbika kwenguva refu.

Injiniya Kutsigira

Highleap Electronics inopa mhinduro dzePCB dzemari yemhangura dzakagadzirirwa kushandiswa kwesimba remagetsi. Hunhu hwedu hwekugadzira hunofukidza zvese zviri mukati uye zvemhando yepamusoro zvemari yemhangura, zvichiita kuti kushanda kwekupisa kuenderane uye kugadzikana kwemuchina wemagadzirirwo emagetsi epamusoro.