Zvishandiso zveCopper Coin PCB muSemiconductor Packaging uye Test Boards

Nhanganyaya: Nei Thermal Management Inobata muSemiconductor Boards

Kurongedza nekuongorora maSemiconductor kunosangana nematambudziko ekupisa zvakanyanya sezvo huwandu hwemagetsi huchiramba huchikwira. Munguva yekuedza kupisa uye mashandiro emidziyo yekuedza otomatiki (ATE), michina inoenderera mberi nekushanda kwemagetsi uku ichichengetedza zvinodiwa zvemagetsi chaiwo. Nzira dzechinyakare dzekutarisira kupisa, dzinosanganisira zvidimbu zvemhangura zvakakora uye maPCB esimbi, anowanzo kundikana pakugadzirisa nzvimbo dzinopisa dziri pasi penzvimbo dzine simba guru.

Copper coin PCB zvikumbiro zvabuda senge mhinduro yepamberi yekunangwa kwekupisa kwekuwedzera. Nekuisa zvivharo zvakasimba zvemhangura zvakananga pasi pezvinhu zvinopisa zvinopisa, tekinoroji iyi inogadzira nzira dzakasimba dzakasimba dzekupisa dzinopfuura dzakajairwa lateral nzira dzekuparadzira.

Nhoroondo ye Copper Coin PCB Technology

Chimiro uye Thermal Performance

Chimiro chePCB chakagadzirwa nemari yemhangura chinobatanidza simbi dzemhangura dzakasimba mubhodhi rakaiswa panzvimbo dzinopisa zvakanyanya. Zvinhu izvi zvePCB zvinofambisa simba zvakanyanya zvinogadzira nzira dzekupisa dzakananga kubva panzvimbo dzinoisa zvikamu kusvika kune zvikamu zvinopisa kana mapurati esimbi. Mhangura yakabatanidzwa inowanzova pakati pe1mm kusvika 3mm muukobvu, ine tambo yekupisa ye390 W/m·K zvichienzaniswa neFR-4's 0.3 W/m·K.

Zvakanakira Pamusoro peConventional Thermal Solutions

Ichi chivakwa chinosiyana zvakanyanya kubva kusimbi-musimboti PCBs, iyo inogovera kupisa kumberi kune yakazara aluminium base layer. Copper coin PCB applications inotarisisa kuita kwekushisa chaiko painodiwa, kuchengetedza dhizaini inoshanduka munzvimbo dzisiri dzakakosha uku uchiwana chepamusoro chekupisa kwenzvimbo. Iyo planar surface topology inochengetedza kuenderana neyakajairwa SMT magungano maitiro pasina iyo inopisa interface zvinonetsa zvinowanzoitika muMCPCB dhizaini.

Copper Coin PCB Zvikumbiro muSemiconductor Testing

Primary Application Sectors

Tekinoroji yePCB yemari yemhangura inoshanda munzvimbo nhatu dzinokosha dze semiconductor:

• Rodha mabhodhi eATE masisitimu -Yakakwirira-ikozvino yekuyedza maprotocol anogadzira kupisa kwakadzika pamasokisi emidziyo inoda kubviswa kwemafuta.
• Kusvirwa-mukati mapuranga -Kuwedzera kuvimbika kuyedzwa kunoda kugadzikana kwekushisa munzvimbo dzakawanda dzemashandisi e1000+ maawa ekuyedza.
• Package substrates uye simba modules -Yakananga chip yekunamatira yeSiC neGaN zvishandiso inoda kupisa kwekuita kunosvika kuDBC substrates.

Mapuratifomu aya anogovanisa zvinodiwa zvakafanana: kusimba kwesimba rinopfuura 50 W/cm², tembiricha yekushandisa kubva -40°C kusvika 150°C, uye kugadzikana kwedimensional pasi pekuchovha bhasikoro.

Copper Coin PCB mune Rodha Board Zvikumbiro

Thermal Management paSocket Interface

Mabhodhi eATE anodziya zvakanyanya pasi pema socket emidziyo, uko huwandu hwema pin akawanda uye ma test currents zvinogadzira huwandu hwakawanda hwekupisa. Mari yemhangura yebhodhi re load board inogadzira ma brass emhangura akabatanidzwa zvakanaka netsoka dzema socket, zvichiita kuti migwagwa mikuru inopisa ipfuure zvinhu zve laminate zvine low conductivity.

Iyi nzira yakananga yekupisa inoderedza tembiricha yekusangana ne15 ° C kusvika 25 ° C zvichienzaniswa neyakajairwa FR-4 zvivakwa zvine mhangura inorema. Kudzikira tembiricha yekushanda kunonatsiridza kugadzikana kwemagetsi kugadzikana pachirimo probe interfaces uye kuwedzera socket mechaniki hupenyu nekudzikisa kupisa kwekuwedzera kushushikana.

Design Precision Zvinodiwa

Kubudirira kwemhangura yemhangura PCB kunyorera mumapuratifomu eATE kunoda kumira zvakanaka mukati me ± 50μm ye socket centerlines. Thermal modelling inotungamira mhangura kuwanda saizi kuti ienderane inotarisirwa mitoro yekupisa, kazhinji kuyera yakamisikidzwa mhangura 2mm kusvika 5mm yakakura kupfuura socket rondedzero. Iyi nzira inobata mhedzisiro yekuparadzira kupisa uku ichidzivirira kukanganisika neakatenderedza masaini enzira nzira.

Copper Coin PCB muBurn-in uye Reliability Testing

Tembiricha Uniformity mune Yakawedzerwa Testing

Kupisa kwakanyanya kunoda kupararira kwekupisa nguva dzose munzvimbo dzakasiyana siyana dzemidziyo kwemazana kana zviuru zvemaawa. Magadzirirwo ebhodhi rekupisa mari yemhangura anoisa huwandu hwekupisa pasi penzvimbo yega yega yemudziyo, zvichigadzira nzira dzakafanana dzekuburitsa kupisa dzinodzivirira kupisa pakati penzvimbo dzekuyedza. Kufanana uku kunoita kuti michina yese iwane mamiriro akafanana ekushushikana, zvichisimbisa kuvimbika kwedata.

Iyo yakamisikidzwa yemhangura chimiro zvakare inoderedza bhodhi warpage panguva yekupisa bhasikoro. Nekumisikidza iyo laminate chimiro kuburikidza nehupamhi dimension, mari yemhangura inoderedza kunze-kwe-ndege deformation iyo inogona kukanganisa socket yekubata kumanikidza panguva yekutevedzana kwebvunzo.

Yenguva Yakareba Mechanical Kugadzikana

Thermal performance PCB zvivakwa uchishandisa copper coin tekinoroji inoratidza yepamusoro solder kubatana kuvimbika mukuyedza tembiricha yebhasikoro. Iyo yakaderedzwa yekufamba kwemafuta pachikamu chemibatanidzwa inoderedza kuneta kuunganidza mukubatana. Kuongororwa kwechikamu chemuchinjika mushure me1000 yekudziya kutenderera kubva -40 ° C kusvika 125 ° C kunoratidza kushoma intermetallic kukura uye kutsemuka kupararira zvichienzaniswa neyakajairwa bhodhi zvimiro.

Copper Coin PCB Zvikumbiro muSimba Module Dhizaini

Wide-Bandgap Semiconductor Kubatanidzwa

Kunze kwekushandiswa kwebhodhi rekuyedza, mari yemhangura yekushandisa mamodule emagetsi inotsigira kubatanidzwa zvakananga mumapakeji esilicon carbide ne gallium nitride. Midziyo iyi inogadzira kupisa kwakanyanya kunodarika 200 W/cm² kunoedza kugona kwekupisa kwesubstrate yeorganic. Masisitimu emhangura akabatanidzwa anopa kufambisa kupisa kusvika kuma substrate eDBC ukuwo achichengetedza organic PCB processing inoenderana uye zvakanakira mutengo.

Zvishandiso muPower Electronics

Izvi zvemhangura coin PCB zvikumbiro zvinoshandisa DC-DC converters, motor controllers, uye magetsi ekugovera modules uko kupisa kwemafuta kunokanganisa zvakananga kushanda uye kuwanda kwesimba:

• Yakananga thermal nzira -Mhangura yakamisikidzwa inogadzira sub-2°C/W junction-to-case thermal resistance yezvakajairwa simba kufa saizi.
• Kubatanidzwa kunodhura -Inobvisa zvakaparadzana zvinopisa zvinopisa zvikamu uku uchidzikisa kupisa kwemukati.
• Gungano kugarisana -Inochengetedza yakajairwa kuyerera uye waya yekubatanidza maitiro pasina nyanzvi yekushandisa zvinodiwa.

Dhizaini uye Maitiro Mafungidziro eCopper Coin PCB

Fabrication Process Control

Kugadzira mari yemhangura yakamisikidzwa PCB dhizaini inoda chaiyo yekugaya mhangura kuti igare nemhangura inoiswa, ichiteverwa nekuzadza resin kuti iwane kuenderera kwelaminate. Iyo planarization process inobvisa yakawandisa resin nemhangura, ichigadzira nzvimbo yakati sandara kune inotevera laminate buildup. Kushivirira kwepamusoro-soro kwe ± 25μm inova nechokwadi chekunyoreswa-kune-layer kunyoreswa uye kudzivirira delamination panguva yekufamba kwemafuta.

Resin kuzadza zvinhu zvinoda kupisa kwekuwedzera coefficients inofananidzwa nemhangura uye FR-4 kudzivirira kusanganisa kushushikana kuungana. Epoxy formulations ine 50 kusvika 70 ppm/°C CTE uye tembiricha yegirazi inodarika 170°C inopa kugadzikana kunodiwa.

Thermal Via Integration

Copper coin PCB zvikumbiro zvinowana kushanda kana zvasanganiswa nepamusoro-density thermal kuburikidza nehurongwa hwakatenderedza mhangura yakamisikidzwa. Aya vias anowedzera kupisa nzira kune kunze simbi akaturikidzana kana kupisa dissipation nzvimbo. Kuburikidza nemadhayamita e0.3mm kusvika 0.5mm mumadhindindi e9 kusvika 16 vias per square centimita gadzirisa kupisa kupararira uchichengetedza nzira dzekufambisa.

Kuvimbika uye Kuedza Maonero

Validation Protocols

Copper coin PCB zvikumbiro zvinopinzwa bvunzo dzakasimba pa IPC-6012 Kirasi 3 uye IPC-9701 maitiro ekuita. Thermal shocking cycling pakati petembiricha yakanyanyisa inosimbisa kutendeseka kwechimiro, neyakajairwa bvunzo maprofiles anoita mazana mashanu kusvika ku1000 kutenderera ne15-maminetsi ekugara pa -40 ° C uye 125 ° C.

Muchinjikwa-chikamu microscope panguva yekutenderera inocherekedza mhangura-resin adhesion uye kuburikidza nedhiramu kutendeseka. Kuyedzwa kwesimba rePeel kunoverengera laminate adhesion panzvimbo yemhangura coin, nemaitiro ekugamuchira anowanzo pfuura 1.4 N/mm yemabhondi emukati.

Thermal Performance Verification

Thermal characterization inoshandisa zvose kuenzanisa uye empirical kusimbisa. Finite element ongororo inofanotaura kugoverwa kwetembiricha pasi pemagetsi akatarwa, nepo infrared thermography uye embedded thermocouples inosimbisa kuita chaiko. Yakanyatso shandiswa yemhangura yakamisikidzwa zvimiro zvePCB zvinoratidza kudzika-kusvika-ambient kudzika kwekupisa kwe40% kusvika 60% zvichienzaniswa neakaenzana anorema copper board madhizaini.

Mhedziso: Kuwedzera Frontier yeThermal Kuvimbika

Copper coin PCB zvikumbiro zvinogadzirisa zvinogadzirisa matambudziko ekupisa anotarisana nawo mu semiconductor kurongedza uye kuyedzwa. Nekugadzira nzira dzekupisa dzekupisa dzakananga, dzinosimudzira mashandiro enzvimbo, dzinochengetedza kugadzikana kwemuchina panguva yekupisa bhasikoro, uye nekuona kurongeka kwepasi kwepamusoro-density inobatana. Sezvo kusimba kwesimba uye kuyedzwa kunoda kusimuka, yakamisikidzwa yemhangura mhinduro dzave kiyi yekugonesa kuvimbika kwekupisa mune yepamusoro semiconductor masisitimu.

Highleap Electronics inonyanya kugadzira PCB dzemari dzemhangura dzakanyatsogadzirwa kuti dzishandiswe pakurongedza mabhodhi e semiconductor uye pakuyedza. Nekudzora maitiro epamusoro uye mitemo yakasimba yemhando, tinobatsira mainjiniya kuwana manejimendi yekupisa yakavimbika uye kushanda kwenguva refu mukushandisa kwemagetsi kunodiwa zvakanyanya.