Gwaro reKugadzira uye Kuedza kwePCB yeSemiconductor Test

ziviso

PCB yekuedza semiconductor inoshanda senzvimbo yakakosha pakati pemidziyo yesemiconductor nemidziyo yekuedza otomatiki panguva dzakasiyana dzekuedza. Aya mabhodhi edunhu akadhindwa ane hunyanzvi anogonesa kubatana kwemagetsi, kutumira masaini, uye kutonga kwekupisa mukati memaitiro ekusimbisa michina.

Musika we semiconductor bvunzo PCB unosanganisira matatu ekutanga mapoka: Burn-In Mabhodhi ekuvimbika kuongorora pasi petembiricha yakakwira, Probe Kadhi PCBs yewafer-level yekuyedza, uye Load Mabhodhi ekupedzisira pasuru kuyedzwa paATE masisitimu. Sezvo semiconductor kurongedza kufambira mberi kune yakakwira density uye nekukurumidza kumhanya, bvunzo bhodhi kuita kunokanganisa zvakananga mitengo yegoho, chokwadi chekuyedza, uye kugona kwekugadzira kwese.

Mhando dzeSemiconductor Test PCBs

Burn-In Boards (BIB)

Burn-In Boards inoisa midziyo ye semiconductor kuti ikurumidze kushushikana mamiriro ezvinhu, kazhinji inoshanda patembiricha iri pakati pe125°C ne150°C kwenguva yakareba. Aya semiconductor bvunzo mabhodhi anofanirwa kuchengetedza kuvimbika kwemagetsi uku achishingirira kuchovha bhasikoro uye kushushikana kwemagetsi. Iyo dhizaini inotungamira kupisa kwekuwedzera kuenderana nemidziyo yekuyedza, yakakwirira-tembiricha kugadzikana kwezvinhu, uye yakawanda-saiti yekuyedza kugona kukwirisa kubuda panguva yekuvimbika kuongorora.

Probe Card PCBs

Probe Kadhi PCBs inopa mechanical hwaro uye yemagetsi nzira yeprobe tsono dzinobata semiconductor wafers panguva yekuyedzwa. Aya mabhodhi anoda kugadzikana kwakasiyana-siyana kuchengetedza nzvimbo chaiyo yekuferefeta, kazhinji mukati meiyo micron-level kushivirira. Iyo dhizaini inosimbisa yakaderera-kurasikirwa siginecha kuendesa kune yakakwira-frequency kuyedzwa, inodzorwa impedance nzira, uye kushoma kwekuwedzera kwemafuta kuchengetedza probe kuonana kwechokwadi mukusiyana kwetembiricha.

Load Boards

Load Boards interface pakati peakaputirwa semiconductor zvishandiso uye otomatiki bvunzo zvishandiso, kushandura ATE tester zviwanikwa kune mudziyo-chaiwo mapini masisitimu. Aya semiconductor bvunzo maPCB anobata akakwira-kumhanya masaini edhijitari, chaiwo analogi zviyero, uye kuendesa simba panguva imwe chete. Iyo dhizaini inotarisa pakuchengetedza kwechiratidzo chekuchengetedza, simba rakakwana rekugovera network, socketing kuvimbika kwezviuru zvekuisa matenderedzwa, uye kudziya kwekutonga kwezvishandiso zvinogadzira kupisa kwakanyanya panguva yekuyedzwa kwekushanda.

Dhizaini Mitemo yeSemiconductor Test PCBs

Signal Kutendeseka Zvinodiwa

Yakakwira-kumhanya semiconductor bvunzo PCB dhizaini inoda yakadzorwa impedance yekufambisa mitsara ine kushivirira kazhinji mukati ± 10%. Yakasiyana pairi nzira inochengetedza inopindirana nzvimbo uye yakabatana munzira yese yechiratidzo, nepo nhanho dzevarindi kana ndege dzepasi dzichideredza crosstalk pakati pematanho ari padyo. Masiginecha akakosha anoda kureba anoenderana mukati me 0.5mm yenguva-inonzwa maapplication, uye kuburikidza neshanduko inofanirwa kuchengetedza impedance kuenderera kuburikidza neyakakodzera anti-pad sizing.

Thermal Management nezvavanofunga

Burn-in board madhizaini anosanganisira thermal simulation kufanotaura nzvimbo dzinopisa uye kuratidza kuenderana kwekuwedzera kwemafuta nema socket magungano. Kusarudzwa kwezvinhu kunonangidzira yakaderera coefficient yekuwedzera kwekupisa, kazhinji pasi pe16 ppm/°C, kuderedza warpage panguva yekushanda kwepamusoro-tembiricha. Thermal vias pasi pezvishandiso zvine simba guru rinowedzera kupisa, ukuwo ukobvu hwemhangura huchikwira kusvika pa2-3 oz mumatanho ekugovera magetsi anovandudza kugona kubata uye kupisa kwemhepo.

Kusarudzwa kwezvinhu

Mabhodhi ekuyedza eSemiconductor anoshandisa ma laminates anoshanda zvakanyanya ane tembiricha yekuchinja kwegirazi inodarika 170°C pakushandiswa kwekutsva. Zvinhu zvinorasikirwa zvishoma zvakaita seMegtron, laminate yakasarudzika yakaderera, kana substrates dzeIsola dzinotsigira kutumirwa kwechiratidzo che high-frequency ne dissipation factors iri pasi pe0.01 paGHz frequency. Layer stackup optimization inoenzanisa zvinodiwa ne signal layer, power plane distribution, uye board thickness miganhu yese uku ichichengetedza ma aspect ratios anogadzirwa.

Kugadzira Kufunga kweSemiconductor Test PCBs

Precision Processing Zvinodiwa

Semiconductor bvunzo PCB kugadzira kunoda kushivirira kwakasimba pane akajairwa mabhodhi ekutengesa. Zvivako zvepamberi zvinoshandisa laser yakananga imaging kune yakanaka-mutsara pateni uye chaiyo ficha tsanangudzo. Zvikuru zvekugadzira zvinosanganisira:

• Minimum trace specifications - Mutsetse wakafara uye nzvimbo yakadzika kusvika ku75 μm inotsigira yakakwirira-density nzira yezvinodiwa.
• Kuburikidza nekunyatso drilling -Kurongeka kwenzvimbo mukati me ± 50 μm inova nechokwadi chekubatana kwakavimbika mune akawanda stackups.
• Layer registration control -Kurongeka kushivirira mukati me75 μm chengetedza kuburikidza nekuvimbika mukati me12+ layer zvivakwa.

Surface Pedzisa Sarudzo

Kusarudzwa kwekupedzwa kwepamusoro kunobatanidza kugona kusvetukira, kuramba kubatwa, uye kugara kwenguva refu kwezvishandiso zve semiconductor test. Electroless Nickel Immersion Gold inopa hunyoro hwakanaka hwezvinhu zvinotsvedza zvakanaka uye kutenderera kakawanda kwemvura. Organic Solderability Preservative inopa zvakanakira pakugadzira zvinhu zviri nyore, nepo hard gold plating paminwe yekubata inoita kuti isapfekwe nemaburi e load board, inowanzo ratidza 30-50 microinchs yegoridhe pamusoro pe nickel underplate.

Hunhu Kudzora Nzira

Yakakwana yekuongorora mapuroteni anosimbisa semiconductor bvunzo PCB mhando isati yatumirwa. Automated optical inspection inosimbisa trace geometry, solder mask kunyoreswa, uye pamusoro pekupedzisira mhando. Kuongorora kweX-ray kunoongorora zvemukati kuburikidza nekuumbwa uye kurongeka kwemutsetse mune yakaoma multilayer mabhodhi, nepo kubhururuka kuongororwa kwekuongorora kunosimbisa kubatana kwemagetsi pasina zvigadziriso zvetsika. Network kuongororwa kuyerwa kunosimbisa impedance kudzora pane dzakakosha masaini nzira, uye inopisa bhasikoro qualification inotevedzera kupisa-mumamiriro ezvinhu kuratidza kuvimbika kwechimiro.

Zvakajairwa Zvinetso uye Mhinduro muSemiconductor Bvunzo PCB Dhizaini

Thermal Stress Management

Kushanda kwekupisa kwakanyanya kunokonzera kuwedzera kwakasiyana pakati pezvinhu zvebhodhi, zvikamu, uye masokisi, zvichikonzera kupwanyika uye kushushikana kwemuchina. Mhinduro dzinosanganisira dhizaini ye symmetrical stackup, kusarudzwa kwezvinhu zvine ma coefficients ekuwedzera kwekupisa anoenderana, uye kusimbiswa kwemuchina kuburikidza ne cores dzakakora kana simbi dzakasimba. Kugadziriswa kwehukuru hwebhodhi kunoenzanisa zvinodiwa zvehutsi hwekupisa nekutarisa kushanduka kwekupisa nekukurumidza mukushandiswa kwekupisa mukati.

Peji rino ndere hardware yePCB yekuyedza semiconductor, nzvimbo dzemasokisi, zvinhu, uye manotsi ekugadzira. Kuti uwane nzira dzekuedza dzakawanda, shandisa gwara rekuyedza bhodhi redunhu ; kuti urambe uchienderera mberi, uzviparadzanise, uye usimbise bhodhi risina chinhu, sanganisira zvinodiwa zvekuyedza magetsi ePCB.

Signal Kutendeseka Optimization

High-speed signal transmission inotarisana nekurasikirwa kubva ku dielectric absorption, ganda maitiro, uye impedance discontinuities pachikamu chekushandura. Dhizaini yekudzikisa nzira dze semiconductor bvunzo PCBs dzinosanganisira:

• Nzira diki dzemakwara -Kudzikisira kureba kwekuteedzera kunoderedza kuderedzwa kwechiratidzo uye nguva skew.
• Impedance control kusimbiswa -Electromagnetic simulation inosimbisa tambo yekufambisa isati yagadzirwa.
• Via optimization maitiro -Kuchera-kumashure kunobvisa stub resonances iyo inosvibisa yakakwirira-frequency chiratidzo chemhando.
• Kushandiswa kwechiratidzo chakasiyana -Inoderedza yakajairwa-modhi yekunzwa ruzha pamadaro marefu ekufambisa.

Socket Interface Kuvimbika

Load board socket magungano anosangana nemichina kupfeka, kubata kuramba kudzikisira, uye kurongeka nyaya pamusoro pezviuru zvemayedzo ekutenderera. Mhinduro dzinosanganisira vatengesi vesocket kutanga mukuita dhizaini uye kupa yakaringana bhodhi ukobvu pasi penzvimbo dzekuisa socket.

Precision alignment maficha anovimbisa inodzokororwa mudziyo chinzvimbo ukuwo yekubata Hardware inochengetedza zvishandiso panguva yekuyedzwa. Kugara uchigadzirisa mapuroteni ekusangana kuchenesa uye kutsiva kunowedzera socket yekushanda hupenyu munzvimbo dzekugadzira.

mhedziso

Semiconductor bvunzo PCB dhizaini uye kugadzira kunoda hunyanzvi hwekuita dhizaini yakakwira-frequency wedunhu dhizaini, kuongorora kupisa, uye nemazvo ekugadzira maitiro. Kubudirira kunoenderana nekunzwisisa zvinodikanwa zvakasiyana-siyana zvekutsva-mukati mabhodhi, probe kadhi PCBs, uye mitoro mabhodhi paunenge uchiisa yakakodzera dhizaini mitemo uye kudzora kwekugadzira kweakavimbika semiconductor yekuyedza mhinduro.

Highleap Electronics inopa yakakwana semiconductor bvunzo PCB kugona:

• Injiniya rutsigiro - Dhizaini yekubvunza kutendeseka kwechiratidzo, kutonga kwekupisa, uye optimization yekusarudza zvinhu.
• Precision PCB kugadzira -Yepamberi yekugadzira maitiro anosangana nekushivirira kwakasimba kwehupamhi hwemutsara, kuburikidza nekunyoresa, uye impedance control.
• Quality assurance -Kuzadza mapuroteni ekuongorora anosanganisira AOI, X-ray, bvunzo dzemagetsi, uye hunhu hwekupisa.
• PCB Assembly masevhisi -Kuiswa kwechikamu, socket kubatanidzwa, uye kushanda kwekuyedza kweturnkey mhinduro.

Bata Highleap Electronics kuti mukurukure zvinodiwa nePCB yenyu yekuongorora semiconductor uye kuti ruzivo rwedu runotsigira sei maapplication ekuyedza akaomarara.