Copper Coin PCB Technology yeSemiconductor Applications: Dhizaini, Maitiro, uye Thermal Performance

ziviso

Iyo semiconductor indasitiri inoenderera mberi nekusundidzira simba density miganhu ine yakakura-bandgap zvishandiso sesilicon carbide uye gallium nitride, zvichigadzira zvisati zvamboitika zvekupisa manejimendi matambudziko. Nzira dzechinyakare dzakadhindwa dzemabhodhi ekutonhodza dzinowanzodonha kana uchibata kupisa kunodarika 100 W/cm². Copper coin PCB tekinoroji yakabuda seyakakosha yekupisa mhinduro, inomisikidza yakakwirira-conductivity zvidhinha zvemhangura zvakananga mumabhodhi edunhu kugadzira nzira dzekufambisa dzinoshanda.

Iyi nzira inogadzirisa kudzikisira kweyakajairwa thermal vias nekupa yakakura hombe mhiri-chikamu nzvimbo dzekuitisa kupisa. Sezvo magetsi emagetsi achisimuka akananga kumusoro kwekuchinja ma frequency uye compact fomu zvinhu, copper coin PCB zvimiro zvinounza iyo inopisa mashandiro anodiwa kune yakavimbika semiconductor mashandiro mumotokari inverters, madhiraivha emaindasitiri, uye anovandudza simba masisitimu.

Chii chinonzi Copper Coin PCB Technology

Tekinoroji yemhangura yesimbi inosanganisa zvidhinha zvemhangura yakasimba muPCB substrate, ichigadzira migwagwa yakatsaurirwa inopisa kubva kune zvinogadzira zvinopisa kusvika kune ekunze kupisa sinks. Kusiyana neyakajairwa kupisa kuburikidza nearrays anovimba neakawanda madiki-diameter akaturikwa maburi, mari yemhangura inogadza inoenderera simbi nzira ine kushoma kwemafuta ekupisa. Nheyo yekushanda yakatwasuka: kupisa kunoyerera kubva kune semiconductor junction kuburikidza nepasuru yemudziyo, kupinda mumari yemhangura, uye pakupedzisira kune inokwirisa pamusoro kana inotonhorera interface.

The kunyatsoshanda kuwana pamusoro chokupisa vias anova pachena kana kuongorora kupisa kuramba tsika. Yakajairwa 5mm dhayamita yemhangura yesimbi inogona kuwana kudziya kwekupisa pazasi 0.5 K/W, nepo yakaenzana kuburikidza nearray inogona kunyoresa 2-3 K/W kana kupfuura. Iyi ina-kusvika-nhanhatu-kupeta kuvandudzwa kunoshandura zvakananga mukudzika kwakadzika tembiricha uye inosimudzira mudziyo kuvimbika kwesimba semiconductor application.

Copper Coin PCB Mamiriro uye Dhizaini Mhando

Yakamisikidzwa Copper Coin Configuration

Iyo yakamisikidzwa yemhangura coin dhizaini inoisa chivharo chemhangura mukati mePCB laminate chimiro, kazhinji pakati pematanho emukati emhangura. Iyi gadziriso inochengetedza yakadzika bhodhi pamusoro apo ichipa yakanakisa yekupisa conductivity kuburikidza nebhodhi ukobvu. Mari yacho inobatana nemapadhi ekumisikidza pamusoro kuburikidza nematepi emhangura, achibvumira akajairwa SMT magungano maitiro. Akamisikidzwa madhizaini anoshanda nemazvo kana zvese zviri zviviri kuparadzaniswa kwemagetsi uye kuita kwekupisa kunodiwa.

Exposed Copper Coin Architecture

Zvimiro zvemhangura zvakafumurwa zvine chivharo chemhangura chinoputika kana kubuda kubva paPCB pamusoro, zvichigonesa kusangana kwakananga nechikamu chekupisa pads kana kunyura kwekupisa. Iyi dhizaini inodzikisira kupisa kwechimiro chekudzivirira nekubvisa zvepakati zvinhu zvitubu. Iyo yakafumurwa gadziriso inonyanya kushanda kune press-fit cooling solutions apo semiconductor module inobata zvakanangana necopper coin PCB pamusoro.

Multiple Coin Arrays yeMulti-Chip Modules

Power modules dzimba dzakawanda semiconductor inofa inobatsirwa kubva kune yakasarudzika yakamisikidzwa yemhangura coin arrays. Mari yega yega inopindirana neyega IGBT machipisi, SiC MOSFETs, kana diode zvinzvimbo, zvichigadzira nzira dziri dzoga dzinopisa dzinodzivirira kupisa kupararira pakati pemidziyo iri pedyo. Array spacing inofanirwa kuverengera kune zvinodiwa zvemagetsi ekuchenesa uku uchiwedzera kuvharika kwekupisa. Mitemo yedhizaini inowanzo tsanangura zvishoma coin-to-coin kupatsanurwa kwe1-2mm zvichienderana nevolti ratings.

Kugadzira Maitiro eCopper Coin PCBs

Kugadzirira kwe Substrate uye Cavity Formation

Iyo yemhangura yesimbi PCB yekugadzira maitiro inotanga nechaiyo machining emakomba mukati meiyo substrate zvinhu. CNC kuchera kana laser ablation inogadzira homwe inoenderana nehukuru hwemari ine kushivirira kwakasimba, kazhinji mukati me ± 50μm. Cavity kudzika kunofanirwa kugarisa iyo yemhangura block ukobvu uku uchichengetedza chinangwa chekupedzisira bhodhi ukobvu mushure mekucheka.

Kugadzirira kwepamusoro kweaya mapako kuburikidza nekucheneswa kwemakemikari kana kurapwa kweplasma kunovimbisa kunamatira kwakanyanya panguva dzinotevera dzekugadzirisa matanho. Highleap Electronics inoshandisa otomatiki yekutarisa yekutarisa panguva ino kuti ione chokwadi chegomba risati raiswa.

Kuiswa kweCopper Block uye Alignment

Yakakwira-kuchena kwemhangura zvidhinha, pre-yakagadzirwa kune chaiwo zviyero, inomisikidzwa mumakomba akagadzirirwa uchishandisa mechaniki zvigadziriso kana vacuum pick-ne-nzvimbo masisitimu. Laser alignment masisitimu anosimbisa kurongeka kwemari zvichienderana nemakasi echokwadi, kuve nechokwadi chekunyoreswa kwakaringana nenzvimbo dzepedhi. Iko kushivirira kwekuiswa kunobata zvakananga mari yekupedzisira yemhangura PCB yekupisa kwekuita uye goho regungano.

Lamination uye Copper Kubatanidzwa

Iko kubatanidzwa kwesimbi yemhangura kunoitika panguva yeyakajairwa PCB lamination cycle, uko kupisa uye kumanikidza kunosunga iyo prepreg maseru uku uchichengetedza mari yakamisikidzwa. The coefficient of thermal kuwedzera musiyano pakati pemhangura (16.5 ppm/°C) uye FR-4 laminate (14-17 ppm/°C mu-ndege) inoda kungwarira lamination profile optimization kudzivirira delamination.

Inotevera nzira dzekuisa mhangura dzinogadzira kubatanidza kwemagetsi uye kupisa pakati pemari uye maseketi masekete, kumisikidza iyo yakazara yekupisa nzira yakakosha kune semiconductor kutonhora maapplication.

Kupedza Kwepamusoro uye Kudzora Kudzora

Post-lamination processing inosanganisira mechanic kugaya kana routing kuti uwane yakatsanangurwa bhodhi ukobvu uye kufumura mari yakamisikidzwa kusvika pakadzika hunodiwa. Kurongeka kwepamusoro munzvimbo yemhangura yemhangura kunofanirwa kusangana nezvinodiwa, kazhinji mukati me25-50μm, kuve nechokwadi chekuvimbika chekubatanidza kuumbwa panguva yekubatanidza chikamu.

Yekupedzisira pamusoro pekurapa senge ENIG, OSP, kana kunyudzwa sirivheri inodzivirira yakavhurika yemhangura nzvimbo uchichengetedza iyo inopisa interface kuita. Highleap's quality control maitiro anosanganisira laser profilometry kuti aone flatness yakatarwa isati yatumirwa.

Kupisa uye Kwemagetsi Kuita kweCopper Coin PCBs

Superior Thermal Conductivity

Zvivakwa zvePCB zvemari yemhangura zvinoshandisa conductivity yekupisa yemhangura inosvika 400 W/m·K, inodarika zvakapetwa mazana maviri pane zvinhu zve FR-4 laminate zvakajairwa. Musiyano mukuru uyu we conductivity unogadzira nzira yekupisa isingapindi simba iyo inobvisa kupisa kubva kuma semiconductors emagetsi zvinobudirira.

Finite element thermal analysis ichienzanisa akafanana simba modules inoratidza kuti kushandiswa kwemari yemhangura kunogona kuderedza tembiricha yekusangana ne20-40°C zvichienzaniswa neyakakwenenzverwa yekupisa kuburikidza nemadhizaini pasi pemamiriro emagetsi akaenzana. MuSiC MOSFET zvikumbiro zvinobvisa 150W kubva pa10mm x 10mm tsoka, tembiricha yekusangana inokwira pamusoro pebaseplate inogona kuganhurwa kusvika 15-20 ° C ine chaiyo yemhangura coin PCB dhizaini, nepo kupisa kuburikidza nearrays kunogona kuona 40-50 ° C tembiricha musiyano.

Electrical Performance Characteristics

Beyond thermal benefits, copper coin PCB dhizaini inopa yakaderera-impedance yazvino nzira dzakakodzera dzepamusoro-ikozvino magetsi emagetsi. Iyo yakasimba yemhangura block inopa kushomeka kushomeka kana ichienzaniswa nearrays, kuderedza conduction kurasikirwa uye kugadzirisa simba rekushandura kugona.

MuIGBT module maapplication anotakura mazana emaamperes, kudonha kwevoltage kuyambuka copper coin yekubatanidza kunogona kuve kurongeka kwehukuru hwakaderera pane yakaenzana kuburikidza-yakavakirwa dhizaini. Iri mukana wemagetsi unoenderana nekushanda kwekupisa, zvichiita tekinoroji yemhangura yakakosha kune inotevera-chizvarwa simba modules.

Copper Coin PCB Zvikumbiro muSemiconductor uye Power Electronics

Motokari Power Electronics

Ma inverter emotokari dzemagetsi anomiririra nzvimbo huru yekushandisa tekinoroji yePCB yemari yemhangura. Iyo inverter huru yekubata inowanzo chengeta ma IGBT kana SiC power modules matanhatu kana anopfuura anoshanda pamazinga emagetsi e kilowatt mukati mehuwandu hwakaganhurirwa hwemapakeji. Maumbirwo emari yemhangura anogonesa magadzirirwo aya ane simba rakawanda nekubvisa kupisa kubva panzvimbo yega yega ye semiconductor kuenda ku inverter housing.

Pa-board charger uye DC-DC converters zvakafanana zvinobatsira kubva kune copper coin thermal manejimendi, zvichibvumira vatengesi vemotokari kuti vasangane nezvose zviri zviviri mashandiro uye kuvimbika zvinangwa patembiricha yakanyanyisa kubva -40°C kusvika +125°C.

Industrial Motor Drives uye Renewable Energy

Inosiyana-siyana madhiraivha emaindasitiri emotor, solar inverters, uye mhepo turbine converters inowedzera kutora copper coin PCB dhizaini sezvo masimba emagetsi anokwira mumazana emakilowatts. Aya maapplication anoda kuvimbika kwakasiyana kwemakumi emakore ekuenderera mberi kwekushanda, zvichiita kuti kudziya kwekutonga kuve kwakakosha kudzivirira kutadza kwemunda.

Nzira yesimbi yemhangura inobvumira mainjiniya kugadzira midziyo midiki, yakareruka yekuchinjisa magetsi pasina kukanganisa mativi ekupisa. Highleap Electronics yakapa copper coin maPCB ekushandisa mumaindasitiri uko tembiricha yekushanda inodarika 125°C ambient ine full load dissipation.

High-Frequency GaN Simba Shanduko

Zvishandiso zveGallium nitride zvinoshanda pakuchinjana kwemafrequencies kusvika pa megahertz range, zvichigadzira matambudziko akasiyana ekupisa. Kunyange zvazvo maGaN transistors achirasikirwa nesimba zvakanyanya kupfuura mamwe masilicon, kurasikirwa kwacho kunonyanya kuitika munzvimbo diki, zvichikonzera kupisa kwakanyanya.

Copper coin PCB zvimiro zvinopa iyo yemuno yekupisa mashandiro anodiwa uku ichichengetedza yakaderera parasitic inductance yakakosha kune yakakwira-frequency kushanda. Iyo tekinoroji inogonesa compact GaN inoshandura dhizaini yekufonera, sevha simba rekupa, uye nekukurumidza-kuchaja maapplication.

Copper Coin PCB Kuenzanisa nedzimwe Thermal Management Methods

Copper Coin PCB vs Thermal Via Arrays

Thermal kuburikidza nearrays inogovera kupisa kuburikidza neakawanda madiki-diameter akaiswa maburi, anowanzo 0.3-0.5mm mudhayamita. Kuenzanisa kwekuita kunoratidza kusiyana kukuru:

• Kurwisa kupisa -Makoni emhangura anowana pazasi 0.5 K / W nepo kuburikidza arrays regisheni 2-3 K / W kana kupfuura
• Heat nzira kushanda zvakanaka -Kuenderera mberi kwemhangura misa kunobvisa kutevedzana kwekupokana kubva pahukobvu hwekuisa uye kuburikidza nehurefu hwembiya
• Board ukobvu kukanganisa - Vias inoda zvakaenzanirana zvakanyanya kupisa kupisa pahurefu hweyuniti ukuwo mari yemhangura ichichengetedza kuenderana
• Simba density kugona -Mhangura coin PCB dhizaini inobata 50+ W/cm² zvinobudirira uko kuburikidza nearrays kurwira

Iyo poindi yesarudzo inowanzoitika yakatenderedza 30-50 W/cm² simba density yeyakajairwa FR-4 zvivakwa, uko kupisa kuburikidza nearrays hakugone kuzadzisa tembiricha zvinodiwa kunyangwe nehupamhi kuburikidza nekuwanda.

Mhangura Coin PCB vs Metal Core PCB

MaPCB esimbi anotsiva substrate yeFR-4 nearuminiyamu kana mhangura, zvichipa mashandiro akanaka ekupisa emwenje ye LED uye mashandisirwo emagetsi. Kunyange zvazvo zvichishanda pakuparadzira kupisa kumativi, tekinoroji yeMCPCB inoderedza kuoma kwedunhu kune magadzirirwo akareruka emativi maviri kana maviri.

Copper coin PCB zvimiro zvinopa kuchinjika kwepamusoro, kutsigira multilayer nzira, mapofu / akavigwa vias, uye yakaoma impedance control apo ichiendesa inofananidzwa kana nani kupisa kwekuita munzvimbo yenzvimbo yemari. Zvishandiso zvinoda zvese zviri zviviri kudziya kwepamusoro uye kushanda kwakaomarara kwedunhu zvinofarira nzira dzemari yemhangura pamusoro pedzimwe simbi dzepakati.

Dhizaini Mafungiro eCopper Coin PCBs

Coefficient of Thermal Expansion Management

The CTE mismatch pakati pemhangura (16.5 ppm/°C) uye FR-4 laminate (14-17 ppm/°C mu-ndege, 50-70 ppm/°C z-axis) inogadzira mechanical kushushikana panguva tembiricha bhasikoro. Kushushikana uku kunotarisa kune coin-to-laminate interface uye inogona kutungamira kune delamination kana isina kunyatsogadziriswa.

Dhizaini yekudzikisa nzira dzinosanganisira kusarudza yakakwirira-Tg laminates, optimize chimiro chemari nemakona akatenderedzwa kuderedza kushushikana, uye kudzikisira dhayamita remari maererano nekukora kwebhodhi. Kupisa bhasikoro kuyedzwa kubva -40 ° C kusvika +150 ° C kunosimbisa kutendeseka kwemakanika kwekodha yendarira PCB gungano risati raburitswa.

Surface Planarity uye Kuvimbika kweGungano

Kuchengeta coplanarity pakati pemhangura yesimbi yepamusoro nenzvimbo dzakapoteredzwa dzePCB zvinokanganisa zvakananga solder joint quality panguva yekusangana kwechikamu. Hurefu hwakasiyana hunodarika 50μm hunogona kukonzera kusakwana kunyorova solder, void formation, kana tombstone yezvikamu zviri padyo.

Manufacturing process control inofanirwa kuverengera mhangura dzakasiyana dzekukuya zvichienzaniswa nelaminate material. Madhizaini edhizaini anokurudzira kuchengetedza inokwana 0.5mm kubvumidzwa pakati pechikamu chesolder pads uye coin mipendero kuti igamuchire midiki yehurefu hwekusiyana.

Thermal Simulation uye Validation

Iyo chaiyo yekupisa yekumisikidza yemhangura coin PCB madhizaini inoda matatu-dimensional inogumira chinhu chekuongorora icho chinomiririra anisotropic zvinhu zvivakwa, interface kuramba, uye muganhu mamiriro. Mamodheru ekuongorora akarerutswa anowanzo tarisira pasi kuita kwemafuta chaiwo nekuda kwemhedzisiro uye kupisa kupararira mukati mechimiro chemari.

Highleap Electronics inosimbisa dhizaini yekupisa kuburikidza nezvose zviri zviviri simulation uye kuyedza kuyedza uchishandisa thermal test machipi anodzokorora maitiro chaiwo ekuparadza simba. Iyi nzira yakabatanidzwa inovimbisa kuti kugadzirwa kwemhangura coin PCBs inosangana yakatsanangurwa yekupisa kuita zvinangwa pasi pemamiriro ekushanda chaiwo.

mhedziso

Copper coin PCB tekinoroji inogadzirisa iyo iri kuwedzera yekudziya manejimendi zvinodiwa zvemazuva ano simba semiconductor application kuburikidza nepamusoro kupisa conduction uye dhizaini inoshanduka. Iko kugona kumisikidza yakakwira-conductivity mhangura mizhinji yakananga mukati medunhu bhodhi zvimiro inogonesa masimba emagetsi mainjiniya kusunda miganhu yekushanda uku achichengetedza kuvimbika pamisika yemotokari, maindasitiri, uye yekufonera.

Sezvo SiC neGaN zvishandiso zvinoramba zvichikwira kuenda kumagetsi epamusoro uye machinjiro ekuchinja, copper coin thermal mhinduro dzinoramba dzakakosha pakubvisa kupisa kubva kunowedzera compact semiconductor mapakeji.

Highleap Electronics Copper Coin PCB Kugona

Highleap Electronics inopa yakakwana yemhangura coin PCB yekugadzira mhinduro inotsigirwa neunyanzvi hwakaratidzwa mumagetsi emagetsi:

• Precision kugadzira - ± 50μm kupinza kurongeka neotomatiki yekutarisa yekutarisa uye laser alignment masisitimu.
• Kusimbiswa kwekupisa -Yakazara FEA simulation uye kuyedza kuyedza uchishandisa thermal test machipi ekuonesa kuita
• Quality assurance -Laser profilometry uye yakaomesesa flatness control inovimbisa 25-50μm pamusoro pepurani kutsanangurwa.
• Injiniya rutsigiro -Kudyidzana kwakananga nevatengi kukwirisa kuisirwa mari yemhangura, ukobvu, uye kubatanidzwa kune zvakatemwa zvinopisa zvinodikanwa.
• Zvinoratidza kuvimbika -Kupisa bhasikoro kusimbiswa kubva -40 ° C kusvika +150 ° C kusangana nemotokari uye maindasitiri zviyero

Bata timu yedu yeinjiniya kuti mukurukure kuti tekinoroji yePCB yemari yemhangura ingavandudza sei dhizaini yako inotevera yemagetsi emagetsi uye kugadzirisa matambudziko ako ekutarisira kupisa.