Mugadziri wePCB weEdge Server weHigh-Speed ​​​​& AI Edge Computing

Kana uri kugadzira edge server — mudziyo we1U/2U short-depth, industrial node yakasimba, kana private 5G compute box — PCB haisisiri chinhu chinoshandiswa. Inotakura PCIe Gen4/Gen5 lanes, DDR4/DDR5 buses, multi-gigabit Ethernet, uye high-current VRMs mu chassis iyo inowanzova isina active cooling, inoshanda 24/7, uye inogara mukabati padivi pefekitori kana cell tower. Kusarudza mugadziri wePCB we edge server akakodzera kunokanganisa zvakananga margins ako esignal, thermal headroom yako, field failure rate yako, uye nguva yako yekushambadzira.

Highleap Electronic ifekitari yekugadzira maPCB uye kugadzira maPCB iri muGuangzhou ine makore anopfuura 15 ekuvaka mabhodhi ekushandisa server, kutaurirana, uye maindasitiri. Peji rino ibhuku rinoshanda remainjiniya ehardware nevanotsvaga vanoongorora vatengesi vePCB vema edge server — zvatinovaka, zvatinoyera, uye zvekutitumira kana wagadzirira kutenga.

Zvinofanira Kuitwa nePCB yeEdge Server Kuti Irarame

PCB yeseva yemucheto haisi diki pane bhodhi redatacenter rine huwandu hwakakura. Zvirambidzo zvakasiyana:

• Nzvimbo yekuendesa vanhu kunzvimbo dzakasiyana — nzvimbo dzemafoni, makabati emufekitori, nzvimbo dzekutengesa, magedhi emotokari. Nzvimbo inogona kutenderera kubva pa0°C kusvika pa55°C, kudedera kuripo, uye mafirita eguruva ndiwo ega anowanzo shandiswa pakugadzirisa kupisa.
• Chinhu chinhu — 1U pfupi, hafu yeupamhi 1U, OCP yakavhurika mupendero, kana kuti custom enclosures kusvika kumini-ITX class. Nzvimbo yePCB yakagadzika; huwandu hwema layer uye huwandu hwe routing zvinotora kuomarara.
• Kuwanda kwezviratidzo zvakasiyana-siyana — CPU/SoC ine PCIe Gen4/5, DDR4/5, BMC, maPHY akawanda e10G/25G, M.2 NVMe, uye PoE kana 48V power input ese ane bhodhi rimwe chete.
• Hupenyu hurefu — vatengi vemafoni nemaindasitiri vanotarisira makore manomwe kusvika gumi ebasa remumunda, kwete makore matatu ekuvandudza zvigadzirwa zvevatengi.

Zvipingamupinyi izvi zvinosundidzira maPCB emumucheto weserver kuhuwandu hwema layer akakwira kupfuura hunoratidzwa nehukuru hwechassis, mixed low-loss/FR-4 stackups, controlled impedance pamagetsi ese ane kumhanya kukuru, uye surface finishes dzakasarudzwa kuti dzive dzakavimbika pane kuti dzitaridzike sedzakanaka.

Kugona Kugadzira PCB yeEdge Server paHighleap

Pepa redu rakazara rePCB rigid rinoratidza ma parameter ese, asi zvinhu zviri pazasi ndizvo zvinonyanya kuratidzwa nemagadzirirwo emaseva emucheto:

• Layer count: 4 kusvika 60 layers. Mazhinji e edge server motherboards anogara pakati pe10 kusvika 22 layers.
• Bhodhi gobvu: 0.4 mm kusvika 6.0 mm; ma stackup akajairika emhando yeseva 1.6–3.2 mm.
• Huremu hwemhangura: 0.5 oz yemukati / 1 oz yekunze yemagadzirirwo akasimba ezviratidzo, kusvika ku10 oz mhangura inorema kune ndege dzemagetsi dze48V uye zvikamu zvekugadzirisa.
• Kuronda / nzvimbo: kusvika pa2.5 mil / 2.5 mil pazvikamu zvemukati zvemafan-out ari pasi pe0.5 mm pitch BGAs.
• Microvia: ma microvia akacherwa nelaser anosvika 0.075 mm (3 mil), akarongwa kana kuti akarongwa, achitsigira 2-N-2 ne3-N-3 HDI stackups yeSoC neCPU breakouts.
• Impedance control: ine magumo maviri ±5 Ω (≤50 Ω) kana ±7% (>50 Ω), musiyano ±7%, wakakwana PCIe Gen4/Gen5, DDR5, uye 25G Ethernet.
• Kuchera kumashure: stub control kusvika ±0.1 mm kuti pave nemadhayagiramu emaziso akachena panzira dze25 Gbps+.
• Surface kupera: ENIG, ENEPIG, sirivha inonyudzwa, goridhe rakaoma (rekushandisa makadhi anotsvedza pamucheto), OSP yekushandisa makadhi asingadhuri.

Kune zvikamu zvinomhanya zvakanyanya, tinogara tichivaka nePanasonic Megtron 6 , Megtron 7 , ITEQ IT-968 , TU-883 , uye Isola Tachyon-class laminates, muma stackups akachena kana kuti akasanganiswa. Kune zvikamu zveRF kana zvine nguva chaiyo, tinobatanidza FR-4 ne laminate ine low-loss chaiyo kana laminate ine low-loss chaiyo.

Kuunganidza Zvinhu Zvishoma Uye Sarudzo dzeZvinhu Zvinochengetedza Mari Pasina Kuuraya Margin

Musiyano wemutengo uripo pakati peMegtron-7 stackup yakazara nehybrid (kurasikirwa kushoma chete pamasaini ekumhanya kwepamusoro, pakati peDk FR-4 pamapuraneti) unogona kuva 30–40% pabhodhi rine 16-layer. Musiyano wekushanda, kana hybrid yakagadzirwa nemazvo, unowanzo shandiswa mubhajeti rePCIe Gen4 ne25G SerDes.

Mabhodhi eEdge server haawanzo da zvinhu zvine simba zvakanyanya pane ese machira. Muunganidzwa wakajairika wemutengo watinotora unoita seuyu:

• Chiratidzo chepamusoro nechepazasi: laminate iri pakati pekurasikirwa (semuenzaniso TU-872 SLK kana IT-968) yeSerDes breakout.
• Mapaya emukati anomhanya zvakanyanya: core ine kurasikirwa kwakaderera (Megtron 6 kana yakaenzana) chete pamatanho maviri kusvika mana ane ma PCIe / Ethernet runs akareba.
• Masimba uye ndege dzekutarisa: standard FR-4 (kirasi yeIsola 370HR), iyo inopa mashandiro akawanda e dielectric e capacitance yendege.
• Sub-stackup yemhangura inorema: 2–3 oz mhangura pazvikamu zvekugovera zve12V/48V.

Chikwata chedu chemainjiniya chinoita shanduko iyi sechikamu cheongororo yedu yeDFM tisati tatanga kugadzira prototype - unowana kurudziro yakanyorwa, kwete jira rekuti "shandisa zvawakatitumira." Ona peji redu remaitiro eDFM kuti uone zvatinoongorora.

Isa Gerber Yako Kuti Uiongorore Zvakafanana

Kuvimbika kweSignali: Zvatinoda kubva kuMafaira Ekugadzira Ako

Kuti tipe margins ePCIe Gen5 (32 GT/s) kana 25G/56G Ethernet paPCB yeserver yemucheto, tinoda ma impedance targets, kwete kufungidzira. Nzira inokurumidza yekuwana chinyorwa chekutanga chakachena ndeyekutitumira:

• Kubuda kweGerber X2 kana ODB++
• Mufananidzo we stackup une target impedance values ​​per layer (one-end and differential)
• Dhirowa faira rine tsanangudzo dzemhando (through, blind, built, microvia)
• Zvinyorwa zvekugadzira zvinoratidza kupedzwa kwenzvimbo, ruvara rwemasiki anosungirirwa, silkscreen, uye chero kudzika kwedhirowa rekumashure
• Kune PCBA: BOM ine nhamba dzezvikamu zvemugadziri, faira reCPL/Pick-and-Place, uye huwandu

Tinovaka makuponi e-impedance pane imwe neimwe panel uye tinopa mishumo yeTDR pamwe chete nekutumira zvinhu zviri pamusoro pemabhodhi ane zvidimbu zvisere kana kuti ne-controlled-impedance nets.

Kuungana kwePCB yeEdge Server: Kubva paPrototype kusvika paVhoriyamu

Isu tiri fekitori yePCB fab nePCB assembly, izvo zvinokosha kune edge server hardware nekuti BGA fan-outs uye high-pin-count connectors dzinotonga mabhodhi aya hadzina kutsungirira zvakanyanya zvikanganiso zve fab/assembly handoff.

• Hukuru hwezvikamu: 01005 zvishoma kusvika kuBGA hombe dzine 50 mm square.
• BGA chikamu: kusvika pa 0.35 mm. Tinowanzoisa maBGA e 0.4 mm ne 0.5 mm anoshandiswa pamaCPU emhando yepamusoro, maFPGA uye maASIC anochinja. Ona yedu Kugona kwekuunganidza BGA.
• Press-fit: Zvinobatanidza zvePCIe-edge-finger uye backplane zvine simba rekupinza rinodzorwa.
• kuonorora: 3D SPI, AOI ine mativi maviri, X-ray pane yega yega BGA uye chikamu chakagumiswa pasi, uye ICT kana flying probe.
• Kuronga uye bvunzo: mapurogiramu emukati medunhu eBMC, EEPROM, uye zvikamu zvekugadzirisa; michina yekuyedza inoshanda yakavakirwa zvinoenderana nezvinodiwa zvako.
• Bhokisi kuvaka: kubatanidzwa kwechasi, tambo dzesimbi, uye kuyedzwa kweFAT kana uchida PO imwe chete inofukidza mudziyo wese — ona yedu bhokisi kuvaka musangano basa.

Huwandu hweprototype (mabhodhi 1–20) hunoenda mukati memazuva manomwe kusvika gumi nemana ekushanda kwePCB chete, mazuva gumi nemashanu kusvika makumi maviri nemashanu ekushanda kwemayuniti akabatanidzwa zvizere kana zvikamu zvavepo. Kumhanya kwevhoriyamu kunotorwa zvichienderana neprojekiti yega yega zvichienderana nekuunganidzwa uye kuomarara kweBOM.

Mabhodhi eEdge Server eKuedza Kuvimbika Anofanira Kupfuura Usati Watumira

Vatengi veTelecom nevemaindasitiri vachakumbira chimwe kana kupfuura chezvinotevera — tinogona kuvavakira vese uye kupa mishumo yekuyedza:

• IPC-6012 Kirasi 2 kana Kirasi 3 kuti PCB igamuchirwe zvakasimba, zvichienderana nekuti mutengi wako anoda here kuvimbika kwakanyanya.
• Kirasi yeIPC-A-610 2/3 kuti pagamuchirwe majoini e solder mushure mekuungana.
• Thermal cycling: −40°C kusvika +85°C, madenderedzwa 500–1000, ekunze kana kuti asina kudzorwa emupendero wenzvimbo.
• Kupisa kwakanyanya uye kupisa kwakanyorova zvichienderana nemaprofayiro eJEDEC ezvikamu zviri mubhodhi.
• Kuramba kweCAF: inoshanda pamapuranga ari munzvimbo dzine hunyoro uye dzine bhora rakatsetseka.
• Kuongorora kwechikamu chidiki pazvinhu zvekutanga zvekuisa plating ukobvu, kurongeka kwezvikamu, uye kuburikidza nekuvimbika kwebhareni.

Nei Edge Server OEMs Ichishanda neHighleap Electronic

Hatisi chitoro chePCB chakachipa paAlibaba uye hatisi chitoro chePCB chinongoshanda chete chine nguva yekutungamira kwemavhiki makumi maviri. Tiri pakati pezvinodiwa nemapurogiramu e-edge server: kudzora maitiro e-server-grade, hunyanzvi hweDFM hwechokwadi, kugadzira + kuungana pasi pedenga rimwe chete, uye kuchinjika kwehuwandu kubva pamuenzaniso we5-board kuenda ku5,000-unit production run pamutsetse mumwe chete.

Mamwe mapeji eHighleap anogona kubatsira paunenge uchitarisa purojekiti yako:

• Server Motherboard PCB Assembly
• AI Server PCB Manufacturing
• Mhinduro dzePCB dzekutaurirana
• High Frequency PCB
• Turnkey PCB Assembly

Tora Mutengo weEdge Server PCB Project yako

Titumirei mafaira enyu eGerber kana ODB++, chinangwa chenyu chekuunganidza zvinhu, BOM yenyu (kana muchida kuunganidza zvinhu), nehuwandu hwenyu. Muchawana mushumo wakanyorwa weDFM uye mutengo paPCB chete kana paPCBA yakazara mukati memazuva 1-2 ebhizinesi. Isu tinoshanda kukirasi yenyu yeIPC, runyorwa rwezvinhu zvenyu, uye zuva renyu rekutumira zvinhu — kwete kucatalog yakajairika.

Tanga Edge Server PCB Quote Iye zvino kana kuti bata timu yedu yeinjiniya kuti mukurukure mibvunzo ye stackup, impedance, kana assembly musati maisa mafaira.