ITEQ IT-170GRA1TC PCB Mugadziri uye Sevhisi Yekusimbisa Zvinhu
Highleap Electronics inoongorora zvikumbiro zveITEQ IT-170GRA1TC zvemaPCB eseva, ekuchengetera, erouter, eswitch, uye ekutaurirana. Tisati tataura, tinosimbisa zvinorehwa neshoko rekuti "TC", kuvakwa kwelaminate/prepreg chaiko, mhangura, humbowo hwezvakatipoteredza, uye kuwanikwa. Mushure mekubvumidzwa, tinogona kuronga kugadzirwa kwe multilayer, controlled impedance, back drilling, lead-free assembly, ongororo, uye kuyedzwa.
IT-170GRA1-Type High-Speed PCB Manufacturing Scope
Kana zvinhu zveITEQ zvanyatsosimbiswa, Highleap inogona kutsigira mabhodhi ane ma multilayer anomhanya zvakanyanya ane fine-pitch BGA breakout, controlled impedance , back drilling , sequential lamination, uye complex interconnect structures. Magadzirirwo anoda any-layer interconnect anoongororwa se system yakazara ye microvia hierarchy, stackup, reliability target, uye inotarisirwa yield; hazvina kuganhurirwa kune generic 1+N+1 kusvika 3+N+3 example.
Zvakakosha: Highleap inotsigira masampuli, kuvakwa kwezvitupa, uye kugadzirwa kwehuwandu. Kuti zvive nyore kuwana huwandu, kurasikirwa, kana kuvimbika, timu yemainjiniya inosimbisa nzira inogadzirwa uye hurongwa hwekuongorora usati waburitsa odha.
Best fit
Sevha ine tambo dzemagetsi dzemhando yepamusoro (High-Tg), isina halogen, inonyatsozivikanwa neCAF, nzvimbo yekuchengetera, router, switch, maindasitiri, uye kutaurirana.
Dambudziko guru
Kubata chivakashure chisina kusimbiswa sehumbowo hwekuti pane kurasikirwa, kurapwa kwemhangura, mamiriro eUL, kana kuti kutevedzera nharaunda.
Highleap scope
Kusimbiswa kwezvinhu, kuunganidzwa kwezvinhu, kupindira, CAF/kuongorora maitiro, vias/back drill, PCBA isina lead, kurongeka, kuongororwa, uye kuyedzwa.
Mashoko ekuwedzera pamutengo
Gwaro chairo reTDS/source, zvinodiwa nezvakatipoteredza/UL, kuvaka, mhangura, stackup, SI, vias, huwandu, PCBA, uye data rekuyedza.
Kutanga Simbisa Zvinorehwa ne "IT-170GRA1TC"
Matrix yezvinhu zveruzhinji yeITEQ inoratidza mhuri yeIT-170GRA1 sechinhu chine Tg yakawanda , halogen-isina, CAF-inodzivirira, uye ine kurasikirwa kwakaderera pakati. Chidimbu chaicho che "TC" hachifanirwe kubatwa segiredhi rakasiyana rakasimbiswa kunze kwekunge mutengi kana mutengesi apa magwaro anodzorwa anochitsanangura. Chinogona kureva kuvaka kwedunhu, copper treatment, distributor code, customer adjective, kana chimwe chinhu chekutenga.
Kushanda zvakanaka kweprojekiti mushure mekusimbiswa
- maseva, nzvimbo yekuchengetera zvinhu, marouter, maswichi, uye magetsi ekutaurirana;
- zvigadzirwa zvinoda Tg yakawanda, halogen-isina humbowo, uye CAF-resistant positioning;
- nzira uko standard FR-4 iri pamucheto asi zvinhu zvinorasikirwa zvakanyanya hazvidiwi;
- ma multilayer asina mutobvu anoda kurongeka kwekutevera zvinhu.
Mira ujekese kuti riini
- Chinhu chega chakanyorwa ndechekuti “IT-170GRA1TC” chisina gwaro rekwakabva;
- purojekiti iyi inofunga kuti chivakashure chinovimbisa mhangura, kurasikirwa, UL, kana mamiriro ezvakatipoteredza;
- dhizaini yacho inoda kushanda kwakaderera zvakanyanya uye isingatsigirwi nedata rakasimbiswa;
- mutengi haazobvumidze kuvakwa kwelaminate/prepreg chaiyo.
Mhinduro chaiyo yeHighleap mukutengeserana ndeyekutarisa hunhu hwemunhu asati atenga zvinhu kana kushanda zvakanaka. Kugadzira dhatabhesi remashoko risina chokwadi kwaizokonzera kutadza kwekutenga nekutevedzera mitemo.
Highleap Manufacturing Scale Mushure mekusimbiswa kwezvinhu
Kana kuzivikanwa kwezvinhu uye kuvakwa kwabvumidzwa, Highleap inogona kuongorora ma "rigid multilayer" kuti ionekwe se "prototype", "low-volume", uye "production builds". Mabasa anogona kusanganisira "stackup engineering", "controlled impedance", "back drilling", "blind/buryed vias", "CAF-focused process review", "lead-free assembly", "BGA X-ray", "through-hole/press-fit operations", "cleaning", "coating", uye "functional testing" yakatsanangurwa nevatengi.
| Makuriro | Ongororo yeHighleap | Mvumo yemutengi |
|---|---|---|
| Kuzivikanwa kwezvinhu | Tsanangudzo chaiyo yeITEQ TDS, "TC", kugadzirwa kwelaminate/prepreg, mhangura, UL/IPC, kuzivisa zvakatipoteredza, kuwanikwa uye kuteverwa. | Bvumidza giredhi rakanyorwa uye chero imwe nzira yakarongwa. |
| Kugadzika uye kuvimbika kwechiratidzo | Magadzirirwo egirazi, huwandu hwe resin, ukobvu hwakadzvanywa, profile yemhangura, impedance, chinangwa chekurasikirwa, kuburikidza nemastubs, back drill, uye makuponi. | Bvumidza geometry uye hwaro hwebvunzo. |
| CAF uye kuburikidza nekuvimbika | Nzvimbo, mhando yemaburi, kucheneswa kwevhu, kuputirwa kwepurasitiki, kuchena, hunyoro, kumanikidzwa kwemagetsi, uye makuponi anomiririra. | Tsanangura nzvimbo yechigadzirwa, mhando yemhando, uye humbowo hwekuvimbika kwacho. |
| Musangano usina mutobvu | Kudzora hunyoro, kuwanda kwemvura inoyerera zvakare/profile, kushushikana kweBGA/connector, warpage, X-ray, kuchenesa, uye kuputira. | Ipa BOM, dhizaini yemusangano, zvirambidzo zveprofile, uye hurongwa hwekugamuchira. |
| Kuchengetedza | Nzvimbo yezvinhu, mufambi, kuongororwa, kutsauka, CoC, uye zvinyorwa zvekutumira. | Taura zvinodiwa pakunyora chitupa uye kuchengetedza gwaro racho. |
Peji harifanirwe kutaura kuti rine simba rekuverenga nhamba pasi rose. Chinhu chine Tg yakawanda chinogona kushandiswa mumabhodhi ari nyore kana akaomarara; kugona kwayo kunoenderana nehuwandu hwema layer, ukobvu, saizi, maburi, copper, tolerances, uye bvunzo.
High Tg, Halogen-Free, CAF, uye Loss Zvinodiwa Zvakasiyana
Mazita aya anowanzo sanganiswa pamwe chete muRFQs, asi anopindura mibvunzo yakasiyana.
High Tg
Inoratidza maitiro ekuchinja kwekupisa pasi penzira yakatarwa yekuyedza. Inotsigira lamination inoda simba uye kuunganidza pasina mutobvu , asi haivimbise kuburikidza nekuvimbika mushure menguva dzakawanda dzekutenderera kwemvura.
Halogen-isina
Inogadzirisa miganhu yakatarwa yechlorine nebromine kana ichitsigirwa nechirevo chaicho chezvinhu. Hazvina kufanana nekutevedzera RoHS, uye PCBA yakapedzwa ingangoda kusimbiswa kwakasiyana kwemasiki ekusolder, zvikamu, mavara, manamati, uye machira.
Kuramba kweCAF
Inotsanangura nzvimbo yezvinhu zvinodzivirira kukura kwefilament inofambisa mhepo. Kuvimbika kwenzvimbo chaiyo kunoenderanawo nekureba kwenzvimbo, mhando yemaburi nemadziro, resin/girazi, kuchena, hunyoro, voltage, tembiricha, uye nguva.
Kurasikirwa kwepakati nepakati
Inogona kuvandudza mukana wechiteshi unomhanyisa zvikuru kana ichienzaniswa neFR-4, asi haifanirwe kutengeswa sekurasikirwa kwakaderera zvikuru pasina data remagadzirirwo chaiwo uye nzira yacho. Kukosha kwe public matrix kubva kuchinyorwa chepakutanga kunenge Dr 3.80 uye Df 0.009 pa 50% resin content; haifanirwe kukopwa zvisina kujeka mu impedance kana loss model ye suffix isina kusimbiswa.
Kuronga Stackup kweServer neCommunication PCBs
Chinhu chacho chinofanira kusarudzwa zvichienderana nezvinodiwa chaizvo zvemugero uye nharaunda. Sevha inodzora ine nzira pfupi ingada kuvimbika kwekupisa uye CAF kupfuura kurasikirwa kwepamusoro. Switch kana puratifomu yekuchengetera ine nzira refu ingada kurasikirwa kushoma, kubhoorwa kwemusana, uye profile yemhangura inodzorwa.
Ipa zvinhu izvi zvekugadzira
- interface, mwero wedata, nguva yekukwira, kureba kwenzira yepamusoro, huwandu hwezvinobatanidza, uye topology;
- kupindirana uye kushivirira, chinangwa chekuisa-kurasikirwa kana chemucheto weziso, uye kakawanda kekuyedza;
- kuvakwa kwepakati/prepreg, girazi remhando, resin iri mukati, copper profile, uye ukobvu hwakapedzwa;
- kuburikidza nechimiro, tafura yekuboorera kumashure, muganho wezvimedu zvinosara, minda yekudhinda, uye kubuda kweBGA;
- nzvimbo yekushanda, nzvimbo yemagetsi, hunyoro, kutenderera kwekupisa, uye zvinodiwa neCAF;
- magadzirirwo ekubatanidza asina mutobvu, rutsigiro rwebhodhi, masinki ekupisa, zvinosimbisa, uye muganho wewarpage.
Highleap inogona kupa mazano ekugadzira zvinhu zvakaunganidzwa uchishandisa zvinhu zviripo, asi mutengi haafanire kuda ukobvu husingawanikwe uku achirambidza zvinhu zvose zvakaenzana. Mutemo unobvumidzwa unoderedza njodzi yekugovera zvinhu pasina kubvumira kutsiva kusingadzoreki.
Kugadzira uye Kudzora Kuungana
- Kuongororwa kuri kuuya: simbisai chokwadi chechinhu chacho, nzvimbo yacho, mhangura, magwaro ekuvaka, magwaro ezvakatipoteredza, uye kuchengetwa kwezvinhu.
- Kuisa zvinhu pamwe chete ne lamination: enzanisa mhangura, resin fill, symmetry, press cycles, ukobvu, registry, uye warpage.
- Kuboora nekuchera: kudzora kunaka kwechibooreso, kubviswa kwe resin, chiyero cheaspect, annular ring, uye ma interfaces anonzwa CAF.
- Kuputira mhangura: ongorora ukobvu hwemaburi nemadziro, nzvimbo dzinoiswa maburi, kuburikidza nekuzadza, kukura kwemhangura pamusoro, uye zvikamu zvidiki.
- Kufungidzira/kuchekwa uye kuvharirwa: bhadhara mhangura chaiyo uye ongorora zvinhu zvinodzorwa nemakuponi.
- Kuungana kusina mutobvu: gadzirisa hunyoro, dzokorora chimiro uye kuverenga, BGA/connector stress, AOI/X-ray, kuchenesa, uye kuputira.
- Kuburitswa kwekupedzisira: bvunzo yemagetsi yekubatanidza, impedance, microsections, humbowo hwezvakatipoteredza, zvinhu zvakawanda, CoC, uye kutsauka.
Kuramba kweCAF hakuratidzwi nemutsara wedatasheet. Kugadzirwa kwebhodhi uye maitiro aro zvinofanirwa kudzivirira madziro emaburi akakuvara, kusvibiswa, nzvimbo isina kukwana, hunyoro, uye kumanikidzwa kwemagetsi kusingadzoreki.
Zvinhu Zvinodiwa Nemari uye Nguva Yekutungamira
| mutyairi | Sei zvichichinja mashoko ari mukotesheni | Chiito chinodiwa |
|---|---|---|
| Kusimbiswa kwezvisungo uye magwaro | Kujekeswa kwemutengesi, zvitupa zvakakosha, humbowo hweUL/IPC, uye kubvumidzwa kwevatengi zvinowedzera nguva yeinjiniya nekutenga. | Tumira gwaro rekwakabva rinotsanangura "TC." |
| Kuvaka uye kupa zvinhu | Girazi chairo, huwandu hwe resin, mhangura, ukobvu, MOQ, uye nzvimbo zvinokanganisa mutengo nekuwanikwa. | Bvumidza dzimwe nzira dzinogona kutengwa kuburikidza nekudzora shanduko. |
| Kuverengwa kwezvikamu uye drill kuburikidza/kumashure | Zvinodiwa zvimwe zvinhu, ma "press cycles", kuboora, kuputira, kudzora kudzika kwemvura, uye kuongorora. | Shandisa chivakwa chiri nyore kwazvo chinosangana ne routing uye SI. |
| Kuongororwa kweCAF/kuvimbika | Makuponi, kusvibiswa kwezvakatipoteredza, IST kana bvunzo dzevatengi zvinowedzera sampuro, michina, uye mishumo. | Tsanangura muenzaniso wechirongwa uye zvinodiwa pakupasa/kukundikana. |
| Uchapupu hwekuti chigadzirwa chapera chisina halogen | Zviziviso zvinogona kudiwa pamasiki anosonesa, inki, zvikamu, manamati, uye zvinhu zvekubatanidza, kwete laminate chete. | Taura kana chinodiwa ichi chichishanda kune zvinhu zvePCB kana kuti PCBA yakazara. |
| Assembly yakaoma | MaBGA makuru, press-fit, coating, kuchenesa, kuronga mapurogiramu, uye functional test zvinogona kutora mari yakawanda. | Tumira mafaira ePCBA neRFQ yekutanga. |
Highleap inosimbisa nguva yekutengeswa kwechinhu ichi mushure mekunge chavharwa. Mutengo unokurumidza wakavakirwa pachivakashure chisina kusimbiswa hausi mutengo wakasimba.
RFQ uye Pakeji Yekusimbisa Zvinhu
Tumira chikumbiro chezvinhu zvinodzorwa nevatengi, mutengesi TDS achitsanangura "IT-170GRA1TC," zvinodiwa nezvakatipoteredza uye zveUL/IPC, dzimwe nzira dzinobvumidzwa, kuvaka laminate/prepreg, mhangura, stackup, impedance uye loss targets, via/back-drill table, saizi, ukobvu uye warpage limits, zvinodiwa zvepaneru, huwandu, fungidziro, delivery target, uye test plan.
Kune PCBA, sanganisira BOM, zvimwe zvinotenderwa, centroid, mifananidzo, ruzivo rweBGA/press-fit, mitemo yekudzokorora, kuchenesa, kuputira, kuronga, bvunzo yekushanda, uye kutevedza kunodiwa.
Kana chivakashure chikasagona kusimbiswa, Highleap inofanira kudzorera chikumbiro chekujekesa kana chirevo chakatsanangurwa zvakajeka kuti chibvumidzwe. Hazvifanirwe kushandura kusava nechokwadi kuita chikumbiro chenhema.
Zvimwe zvinhu zvine chekuita nazvo: zvinodiwa paPCB isina halogen , zvinhu zvePCB zvinodzivirira CAF , uye kusarudzwa kwezvinhu zvinomhanya zvakanyanya.
Mibvunzo Inowanzo bvunzwa Nezvekutengeserana
IT-170GRA1TC yakafanana neIT-170GRA1 zvechokwadi here?
Mhuri yeIT-170GRA1 inozivikanwa pachena, asi chivakashure chaicho che "TC" chinofanira kusimbiswa kuburikidza neITEQ yazvino kana magwaro anodzorwa nevatengi vasati vataura uye vagadzira.
Highleap inogona kugadzira nekubatanidza zvinhu izvi here?
Mushure mekusimbiswa kwezvinhu, mapurojekiti akakodzera e multilayer anogona kuongororwa kuti aonekwe kuti agadzire sei, kudzora impedance, kuchera vias/back, kuwana zvikamu, kuunganidza, kuongorora, uye kuyedza mashandiro.
Chinhu chinorasikirwa zvishoma here?
Inofanira kutorwa sekirasi ine vanhu vashoma pakati pekurasikirwa kunze kwekunge pepa reruzivo rakatenderwa uye nzira yekuyedza ichitsigira chimwe chikumbiro. Nzira refu kana dzinoda zvakawanda dzingada mhuri yakasiyana yezvinhu.
Ko halogen-isina zvinoreva here kuti inoenderana neRoHS?
Kwete. Izvo zvinodiwa zvakasiyana. Halogen-isina halogen inodzora huwandu hwehalogen hwakatsanangurwa; RoHS inodzora zvinhu zvine njodzi zvakanyorwa. PCB kana PCBA yakapedzwa ingangoda humbowo hwezvinhu zvakawanda.
Chii chinodiwa pamutengo wekambani?
Ipa tsananguro chaiyo yezvinhu, kuunganidzwa kwezvinhu, mhangura, impedance/kurasikirwa, kuburikidza nekuvaka, saizi, huwandu, fungidziro, kutumirwa, pasuru yekuunganidza, magwaro ezvakatipoteredza, uye hurongwa hwekuyedza.
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Nzira yekuwana sei quote yePCBs
Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:
-
- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.