Matambudziko muMetal Core PCB Kugadzirwa uye Maitiro ekuagadzirisa

ziviso

Mabhodhi esimbi anodhindwa esimbi (MCPCBs) ave chinhu chakakosha mumwenje we LED une simba guru, magetsi emotokari, uye masisitimu ekushandura simba nekuda kwekugona kwawo kutonga kupisa zvakanyanya. Zvisinei, matambudziko ekugadzira MCPCB ane zvinhu zvakaoma zvinosiyanisa maitiro aya nekugadzirwa kweFR4 kwakajairika.

Musiyano wakakosha uri mukusunga mhangura kutenderera kune simbi substrates-kazhinji aruminiyamu kana mhangura-kuburikidza nehunyanzvi dielectric layers, kugadzira yakasarudzika yekupisa, mechaniki, uye kugadzirisa matambudziko. Aya matambudziko anobva mukusawirirana kwemidziyo, zvakaomesesa kufuratirwa zvinodiwa, uye inodiwa nharaunda dzinopisa dzinofanirwa kumira.

Ichi chinyorwa chinoongorora zvipingamupinyi zvekutanga zvakasangana panguva yesimbi yepakati PCB yekugadzira uye inopa anoshanda einjiniya mhinduro dzinoona kuenderana uye kuita.

Thermal Kuwedzera Mismatch: Yakakosha MCPCB Kugadzira Dambudziko

Kunzwisisa Dambudziko

Dambudziko guru rekugadzira MCPCB ndere kugadzirisa kupisa kwekuwedzera kusawirirana pakati pealuminium base, foil yemhangura, uye dielectric layer. Coefficients yavo yakasiyana-siyana yekuwedzera kwekushisa (CTE) - inenge 23 ppm / ° C yealuminium, 17 ppm / ° C yemhangura, uye 30-80 ppm / ° C ye dielectrics - inokonzera kushungurudzika kwemukati panguva yekupisa uye kutonhora.

Munguva yelamination pamusoro pe150 ° C, misiyano yeCTE iyi inokonzera delamination, dielectric cracking, kana board deformation. Kukurumidza kupisa kana simbi dzakakora dzinowedzera kushushikana, uku kudzokororwa kuchovha bhasikoro zvishoma nezvishoma kunonetesa kunamatira kwepakati, zvichitungamira kunyaya dzekuvimbika kwenguva refu.

Dzinoshanda Solutions

• Dielectrics Dzakabatana neCTE – Sarudza zvinhu zve dielectric zvine CTE values ​​pakati pemhangura nearuminiyamu. Dielectrics dzakazadzwa neceramic dzinopa kuwedzera kwakaringana uye kufambisa kupisa kwakanyanya (≥2 W/m·K).

• Rondedzero yeLamination Yakadzorwa - Shandisa nzira yekupisa ye 2–3 °C/min ine nguva yakakwana yekugara uchizorora kushushikana usati watonhodza.

• Kuenzana Kwehukobvu - Chengeta chiyero chehukobvu hwesimbi nemhangura chiri pakati pe1:10 ne1:15 kuti kusvuta kugovane zvakaenzana.

• Dhizaini yeSitemu Yakafanana - Chengetedza kugoverwa kwemhangura kwakaringana kuderedza kushanduka panguva yekupisa.

Aya mazano akasanganiswa zvinobudirira kuderedza kukundikana kwakabatana neCTE uye kunatsiridza kuvimbika kweMCPCB.

Warpage Kudzora muMCPCB Manufacturing Matambudziko

Dambudziko reWarpage

Warpage control ndeimwe yakaoma MCPCB yekugadzira dambudziko, kunyanya mumabhodhi akakura kupfuura 200 mm. Kunyangwe kutsauka kwe 0.5 mm kunogona kukanganisa kurongeka kweSMT uye kugadzira mapeji emhepo anoderedza kupisa kwekushisa kune heatsinks.

Asymmetric magadzirirwo ane kusaenzana kwemhangura kugovera pakati pematanho ndicho chikonzero chikuru. Kana rimwe divi rakatakura dense circuitry uye rimwe richiramba rakashama, musiyano we shrinkage panguva yekutonhora unotungamira mukukotama. Kusapindirana lamination pressure kana kusakwana cushioning muvacuum presses inowedzera kuwedzera kusara kushushikana, zvichikonzera warpage mushure mekutonhora.

Zvinoshanda Solutions

• Symmetric Stackup Dhizaini -Shandisa yakaenzana kugovera mhangura pamativi ese edielectric layer kuti aenzane mauto ekukanda panguva yekupisa kwekupisa.
• Kubhadhara Maitiro eCopper - Kune asymmetric marongero, wedzera isingashande nzvimbo dzemhangura kana mesh kune yakatarisana divi kuti uchengetedze chiyero chechimiro.
• Kudzorwa Lamination Pressure - Chengetedza kudzvanywa kwakatenderedza 15-25 kg/cm² uye kutonhora mitengo pazasi 3 °C/min kudzivirira kuvharika kwekushushikana.
• Post-Lamination Annealing - Isa kushushikana-kuzorodza annealing patembiricha 20-30 °C pazasi peiyo dielectric's girazi rekuchinja nzvimbo kuti uvandudze flatness kugadzikana.
• Fixture-Assisted Flattening -Shandisa zvigadziriso zvemagetsi panguva yekurapa kwekupedzisira kuti uwane flatness mukati me 0.3 mm pa 100 mm yehurefu hwebhodhi.

Aya matanho anonyatso kudzikisa warpage uye anovimbisa kugadzikana kwemuchina mukati meMCPCB yekugadzira maitiro.

Lamination uye Dielectric Kutendeseka muMCPCB Manufacturing

Dielectric Cracking Matambudziko

Lamination defects uye dielectric cracking ndiwo makuru ekugadzira MCPCB matambudziko anokanganisa ese ari maviri kuvimbika kuvimbika uye kupisa kwekushisa. Makatsemuka anowanzo kutangira padyo nemicheto yebhodhi kana nemaburi, achigadzira nzira dzinogona kuparara dzemagetsi.

Kunyangwe nzvimbo diki dze delamination dzinogadzira mikaha yemhepo nekudzikisira kupisa kusvika ku100 nguva dzakakwirira pane dzakasungwa matunhu, zvichikonzera hotspots dzenzvimbo dzinomhanyisa kutadza kwechikamu. Zvinowanzokonzeresa zvinosanganisira kushata kweresin kuyerera, yakaderera girazi shanduko tembiricha (Tg) zvinhu, kana mwando wakavharirwa mukati medielectric layer.

Nzira Dzokudzivirira

• High-Tg Dielectrics -Shandisa zvinhu zvine Tg pamusoro pe150 ° C kuchengetedza kugadzikana uye kutsungirira kudzokororwa kupisa bhasikoro.
• Optimized Lamination Pressure -Tanga nekudzvinyirira kwakaderera kusimudzira kuyerera kweresin, wozowedzera zvishoma nezvishoma kusvika kuzere kusungirira kumanikidza kwekunamatira yunifomu.
• Pre-Baking yeKubvisa Unyoro - Bika dielectric sheets pa120 ° C kwemaawa 2-4 isati yaiswa kuti ibvise unyoro hwakanyura.
• Vacuum-Assisted Lamination -Shandisa vacuum masisitimu kuti ubvise mhepo yakavharirwa uye inovhuvhuta, kuve nechokwadi che-void-yemahara bonding uye inopindirana yekupisa kwekuita.

Aya matanho ekudzivirira anovandudza kuvimbika kwedielectric uye inovimbisa kugadzikana kwekushisa kwekuita musimbi yakakosha PCB kugadzira.

Kudhirowa uye Matambudziko Ekuita muMCCBB Manufacturing

Mechanical Processing Matambudziko

Kuomarara uye kupisa kwakanyanya kwesimbi zvinogadzira matambudziko akasiyana ekugadzira MCPCB panguva yekuboora nekufambisa zvinhu. Zvigadziko zvealuminium zvine hukoshi hweBrinell hwe40–80 HB zvinokurumidza kupfeka maburi akajairwa ecarbide drill, zvichikonzera maburi akakura, madziro asina kusimba, uye plating isina kunamira zvakanaka.

Zvigayo zvesimbi kana machipisi akagadzirwa panguva yekugadzirisa zvinogona kukonzera mapfupi kana kukanganisa kuiswa kwezvikamu. Nekuti aruminiyamu nemhangura zvinobudirira zvinobvisa kupisa , nzvimbo yekucheka inoramba yakaoma ukuwo chibooreso chichipisa kuburikidza nekukweshana, zvichikurumidzisa kupera kwezvishandiso uye kusarongeka kwezvikamu.

Optimized Drilling Solutions

• Specialized Drill Tools -Shandisa polycrystalline diamond (PCD) kana yakavharwa carbide bits kuti uwedzere hupenyu hwematurusi 10-20 × zvichienzaniswa neakajairika madhiri.
• Optimized Drilling Parameters -Shanda pa40,000-60,000 RPM nemitengo yekudya ye50-100 mm/min kuenzanisa nemazvo uye kutonga kwekupfeka.
• Zvishandiso Zvakakodzera Zvokutsigira - Shandisa phenolic kana aruminiyamu kupinda uye mabhodhi ekuchengetedza ekupinda nekubuda kwegomba rakachena.
• Peck Drilling Cycles -Shandisa kuchera kwepakati kujekesa machipisi uye kuderedza kupisa kwekuvaka.
• Precision Routing -Sarudza compression-maitiro ekupedzisira zvigayo ane akakodzera nenyere geometry kuderedza kumucheto kubvarura uye burrs.

Aya marongero emuchina anovandudza gomba mhando, kuwedzera hupenyu hwechishandiso, uye kuve nechokwadi chechokwadi chemukati musimbi yakakosha PCB yekugadzira.

Surface Treatment Matambudziko muMCPCB Manufacturing

Oxidation uye Kusvibiswa Matambudziko

Metal core faces oxidize nekukurumidza kana yaiswa kumhepo, kunyanya pasi petembiricha yakakwira yekugadzirisa. Aluminium inoumba oxide layers inotadzisa solder wetting, ukuwo mhangura inogadzira cuprous uye cupric oxides inoshatisa kubata kwemagetsi uye kusimba kwekubatana. Aya MCPCB ekugadzira matambudziko anoda kuchengetedzwa kwepamusoro kwepamusoro kuchengetedza kuvimbika kwegungano.

Dziviriro Strategies

• Nguva Yepamusoro Kupedzisa - Isa machira ekudzivirira pakarepo mushure mekugadzira kudzivirira oxidation panguva yekubata nekuchengetedza.
• ENIG Finish -Shandisa Electroless Nickel Immersion Goridhe kuitira kutengesa kwakanyanya uye hupenyu hurefu hwesherufu hunodarika mwedzi gumi nemiviri.
• OSP Coating -Sarudza Organic Solderability Preservatives senzira inodhura yekudzivirira kwenguva pfupi.
• Utsanana Kudzora - Shamba nemvura yakasvibiswa kuti ubvise masara eionic anogona kukurumidza kuita ngura.
• Unyoro-Uchapupu Packaging - Chengetedza mabhodhi mune vacuum-yakavharwa kurongedza ne desiccants kudzivirira kubva kune oxidation.

Kuita nekukurumidza mushure mekugadzira kupedzisa uye kwakaringana kurongedza maitiro kunovimbisa kugadzikana solderability uye kuvimbika kwenguva refu musimbi yepakati PCB kugadzira.

Kudzora Hunhu uye Kuedzwa muMCPCB Kugadzira Matambudziko

Inspection Complexities

Kuongororwa kwemhando yeMCPCB kunoda nzira dzekuyedza dzakasarudzika kupfuura yakajairwa PCB kuongororwa. Thermal kuramba kuyedza kunofanirwa kunyatso ongorora kutamisa kupisa kubva kudunhu redunhu kuenda kubhesi resimbi pasi pemamiriro ekupisa anodzorwa.

Dielectric breakdown test inosimbisa simba rekudzivirira pamagetsi ari pamusoro pemazinga ekushanda, ukuwo kufefetera kunoda micron-level chaiyo kuti ive nechokwadi chekubata kwemafuta. Izvi zvinhu zvinoita kuti kuoneswa kwemhando kuve imwe yematambudziko makuru ekugadzira MCPCB.

Comprehensive Testing Solutions

Inoshanda MCPCB yemhando yekudzora inosanganisira akawanda anopindirana ekuongorora maitiro:

• Thermal Resistance Testing -Simbisa kupisa conductivity uchishandisa calibrated sensors, kuchengetedza kukosha kwakajairika pazasi 1 °C/W kune akajairwa dhizaini.
• High-Inogona Kuedzwa - Nyorera 2500-3000 VAC kuti uve nechokwadi chekuvimbika kwedielectric uye kuvimbika kwekudzivirira.
• Infrared Thermal Kufananidza -Tsvaga hotspots dzinoratidza kusafambiswa kwemafuta ekufambisa kana yakavanzika yedunhu anomalies.
• Laser-Yakavakirwa AOI Kuongorora -Yera kudzika kwepasi nehupamhi hwepamusoro kuti uone warpage isati yasangana.

Kuita hurongwa hwehuwandu hwekutonga nesampling yenguva dzose inochengetedza kugadzikana kwekugadzira uye inova nechokwadi chekushanda kwakafanana pamatanho ese ekugadzira MCPCB.

mhedziso

Kukunda zvipingamupinyi zvekugadzira zveMCPCB-kubva pakupisa kwekuwedzera kusawirirana uye kutonga kwewarpeji kusvika pakudhirowa nemazvo uye kudzivirira kwepamusoro-zvinoda maitiro einjiniya akazara. Kubudirira kunoenderana nekugadzirisa kusarudzwa kwezvinhu, kugadzirisa maitiro, uye kutonga kwemhando yekuona kugadzikana kwekushanda kwemafuta uye kuvimbika kwenguva refu mumashandisirwo emagetsi epamusoro.

Sei Kusarudza Highleap Electronics

• Advanced Material Engineering -Yakagadzirirwa aluminium, mhangura, uye dielectric sarudzo yekuenzanisa nekupisa uye mechanic kuita.
• Precision Process Control - Yakakwenenzverwa lamination, kudhirowa, uye routing paramita kune yepamusoro flatness uye dimensional kurongeka.
• Hunhu Hwakakwana Kuvimbiswa -Mumba-kupisa kupisa kuramba, dielectric, uye flatness kuyedza kuona yega yega batch yekugadzira.
• Unyanzvi hwekushandisa -Kushanda kwakaratidzwa mukati memwenje we LED, masisitimu emotokari, uye maindasitiri ekushandura magetsi.

Batana neHighleap Electronics kuti muwane mhinduro dzekugadzira dzeMCPCB dzakagadzirwa kuti dzishande zvakanaka, dzive dzakavimbika, uye dziwedzere kunaka. Bata timu yedu yehunyanzvi nhasi kuti mukurukure zvinodiwa pabasa renyu rine simba guru.