Kugadzira uye Kugadzira PCB Yenharembozha

MaPCB emafoni ari pakati pemabhodhi edunhu anonyanya kudiwa akagadzirwa pahukuru—10 kusvika ku12 copper layers dzakamanikidzwa kuita pasi pe1mm yeukobvu, dzichitakura masaini kubva kuDC power rails kuenda kuma antenna feeds e40GHz 5G panguva imwe chete. Kuagadzira nenzira yakavimbika kunoda mhando yakasiyana yemidziyo, kudzora maitiro, uye rutsigiro rweinjiniya pane kugadzirwa kwePCB dzekutengesa kwakajairika.

Highleap Electronics inonyanya kugadzira nekugadzirisa maPCB emafoni evatengi veOEM neODM, ichibata zvese kubva kumasampuli ekutanga einjiniya kusvika pakugadzirwa kwakawanda pasi pedenga rimwe chete. Kugona kwedu kugadzira mabhodhi emagetsi emafoni kunosanganisira zvese zvinodiwa papuratifomu yemafoni parizvino.

Chii Chinoita Kuti PCB Yenhare Isiyane NemaPCB Akajairwa

PCB inofambiswa—inonziwo smartphone PCB, phone circuit board, kana kuti mobile phone motherboard—haisi diki diki yebhodhi remagetsi remaindasitiri kana revatengi. Musanganiswa wezvirambidzo zvarinofanira kusangana nazvo panguva imwe chete hauwanikwe kumwe mukugadzira magetsi.

Kuverengwa kwezvikamu zvinosvika 10–12 zvichienzaniswa ne2–6 zvakajairika zvemabhodhi ekutengeserana akajairika. Ukobvu hwese hwemabhodhi hunofanira kugara pa1.0mm kana pasi payo. Upamhi hushoma hwetrace i50μm (2 mil) zvichienzaniswa ne100–150μm pamabhodhi akajairika. Kuburikidza netekinoroji, mafambiro emagetsi anochinja kubva kumahole emagetsi kuenda kumaHDI laser micro-vias padhayamita ye0.1mm yekuboorera. Uye mafrequency esignal anosvika ku40GHz ye5G mmWave—zvichienzaniswa neanowanzova pasi pe1GHz pamabhodhi akajairika.

Zvipingamupinyi izvi zvinosangana. Kuisa zvikamu zve1,000–1,500 mubhodhi diki pane kadhi rechikwereti uku uchichengetedza 5G RF isolation, nzira dzekupisa dze10W SoC, uye LPDDR5X memory routing pa8,533 Mbps zvinoda maitiro ekugadzira nekubatanidza ayo mafekitori mazhinji ePCB asingakwanise kutsigira.

Tekinoroji yeHDI: Nei Mafoni Achida

Tekinoroji yePCB yeHigh Density Interconnect (HDI) haisi yekusarudza mukugadzirwa kwemafoni emazuva ano—ndiyo yega nzira yekugadzira inotsigira huwandu hweSoC package huripo. Processor ye flagship application iri mu 0.4mm pitch BGA package haigone kufambiswa uchishandisa nzira yemazuva ano kuburikidza netekinoroji; hapana nzvimbo yakakwana yemukati memukati kuti ibudise zviratidzo zvemasaini.

HDI inogadzirisa izvi nekutsiva ma-vias makuru emakanika ne-laser-drilled micro-vias (0.1mm dhayamita) ayo anobatanidza chete ma-layer aanoda, zvichisiya nzvimbo yemukati ye-layer routing iripo. Zvivakwa zve-micro-via zvakarongwa-uko ma-vias akawanda asingaonekwe akavakwa akatwasuka kuburikidza ne-sequential lamination cycles-zvinogonesa huwandu hwe-escape routing hunodiwa nemapakeji emazuva ano eSoC.

Kugadzika kwekugadzira kunoenderana nehuwandu hweSoC package pitch uye interface: 1+N+1 (6–8 layers) yemafoni ari pakati nepakati; 2+N+2 (8–10 layers) yekubatanidza SoC; ELIC 3+N+3 (10–12 layers) ye5G mmWave flagships. Kuti uwane zvirevo zvekugadzira uye nzira dzekugadzirisa cross-section, ona peji reHighleap Electronics' HDI PCB manufacturing .

Zvekutarisa Mugadziri wePCB weMobile

Haasi mafekitori ese ePCB ane HDI anogona kugadzira mabhodhi emhando yepamusoro anotakurika nemitengo yekukura inoita kuti kugadzirwa kwehuwandu kubudirire. Pakubvumidza mutengesi wePCB wenharembozha, zvinhu zvina zvinoparadzanisa vagadziri vanokwanisa kubva kune avo vanozogadzira respins:

• Kuboorera kweLaser pa 0.1mm zvishoma — micro-via dhayamita inoderedza zvakananga huwandu hweBGA routing; mafekitori ane 0.15mm drill haakwanise kutsigira mapakeji eSoC aripo iye zvino
• Kudzora kweImpedance neTDR certification — kupindirana kwekufananidzira chete hakuna kukwana kune 5G RF uye LPDDR5X memory interfaces; data remakuponi akayerwa rinofanira kutumirwa nechikamu chega chega chekugadzira.
• 100% AXI pamapakeji eBGA — Kuongororwa kweX-ray yega yega ndiyo nzira chete yekubata huwandu hwezvinhu zvisina basa mabhodhi asati asvika pabvunzo inoshanda; kutora sampuro hakuna kukwana pakugadzirwa kwemota.
• Kugadzira uye kuungana pasi pedenga rimwe chete — macheni ekutengesa evatengesi vakapatsanurwa anounza kusawirirana kweprofile yekuchinjana kwemari uye miganho yekuzvidavirira kana matambudziko egoho akaonekwa

Highleap Electronics: Kugadzira uye Kugadzira PCB Yenharembozha

Highleap Electronics inogadzira maPCB emafoni eOEMs nemaODMs vachishandisa mapuratifomu eQualcomm Snapdragon, MediaTek Dimensity, uye Samsung Exynos.

Kune magadzirirwo e5G sub-6GHz uye mmWave, tinosarudza laminate kana LCP yakasarudzika ine kurasikirwa kushoma paRF layers—zvishandiso zvakafanana zvekushandisa zvine kurasikirwa kushoma zvinoshandiswa pamutsetse wedu wekugadzira PCB une frequency yakakwira . Tinogadzirawo mabhodhi akapfava emakamera modules uye ma hinge anopetwa, uye maPCB asina waya ekuchaja eQi assemblies—achifukidza huwandu hwePCB hwese hwefoni yemazuva ano ine hukama hwekushandisa kumwe chete.

Muenzaniso wePCB Yekufambisa Kugadzira Kwakawanda: Mashandiro Anoita Maitiro Acho

Mapurojekiti mazhinji ePCB anofambiswa anotanga neongororo yemafaira eGerber. Seti yeGerber, specification yakarongwa, uye huwandu hunotarisirwa zvakakwana kuti uwane mushumo weDFM uye mutengo wekutanga mukati memaawa 24-48. Samples dzeinjiniya dzinowanzo shanda mazuva 7-14 ebhodhi risina chinhu, uye mazuva 3-5 anowedzerwa emuenzaniso wakagadzirwa. Kufanirwa kwedhizaini kunotevera—X-ray cross-section, impedance validation, thermal cycle sampling—ma parameter ekugadzirwa kwevhoriyamu asati avhara. Kuti uwane rumwe ruzivo rwekuti mabhodhi anofamba sei mufekitori yedu, ona peji redu remaitiro ekugadzira PCB .

Tinotsigira zvese turnkey (tinowana zvikamu) uye consigned-material assembly. Kune vatengi vanotama kubva kune mumwe mutengesi, tinopa ongororo yeDFM yemahara yemagadzirirwo aripo—izvi zvinowanzo ratidza chikonzero chikuru chematambudziko egoho aimbonzi akakonzerwa nedhizaini.

Mibvunzo Inowanzo bvunzwa Nezve Kugadzirwa kwePCB dzeNharembozha

PCB yefoni inowanzova nezvikamu zvingani?

Mafoni mazhinji emazuva ano anoshandisa maPCB ane layer 10–12. Midziyo yepakati inowanzo shandisa layer 6–8. Kuwanda kwe layer kunotungamirirwa neSoC platform: Qualcomm Snapdragon 8-series uye MediaTek Dimensity 9000-series magadzirirwo anowanzoda layer 10+ kuti ashandise ma interfaces ese ane high-speed pasina kukanganisa signal integrity.

Ndeipi huwandu hushoma hweodha yekugadzirwa kwePCB yenharembozha?

Highleap Electronics haina huwandu hushoma hweodha yezvigadzirwa zvema prototype. Kushandiswa kwemasample einjiniya emabhodhi mashanu kusvika makumi maviri ndiwo mavambo akajairika. Mitengo yekugadzira huwandu inoshanda kubva kumayuniti angangoita mazana mashanu, uye kugadzirwa kwakazara kunowanikwa kubva kumayuniti zviuru zvishanu zvichikwira.

Ndeapi mafaira andinofanira kutumira kuti ndiwane mutengo wePCB wefoni?

Mafaira eGerber (RS-274X format) uye specification ye stack-up zvakakwana kuti utange. BOM inodiwa pakuunganidza mitengo. Tinogona kushanda nemafaira eODB++, uye timu yedu yeinjiniya ichakumbira chero ruzivo rwusipo panguva yekuongorora kweDFM—haudi pakeji yakazara kuti utange hurukuro.

Unogona kugadzira maPCB emafoni anotsigira 5G mmWave here?

Ehe. Magadzirirwo e5G mmWave anoda zvinhu zve dielectric zvinoderedza kurasikirwa (laminate kana LCP) paRF layers, zvine controlled impedance traces dzakasimbiswa neTDR measurement. Isu tinogadzira hybrid stack-ups tichibatanidza zvinhu izvi ne standard FR4 pa inner layers, uye tinosimbisa RF section impedance ne coupon data rinounzwa ne production lot yega yega.

Ndezvipi zvitupa zvinopihwa neHighleap Electronics pakugadzira PCB dzenharembozha?

Highleap Electronics ine chitupa cheISO 9001:2015 uye inogadzira zvinoenderana neIPC-A-610 Class 2 senzira yekutanga. Zvinodiwa zvekuongorora zveIPC Class 3 zvinowanikwa kana zvikakumbirwa kumapurojekiti ane zvinodiwa zvakavimbika zvakanyanya. Nzvimbo dzese dzekugadzira dzinotumirwa nemagwaro akazara ekutevera anosanganisira zvinyorwa zvenzvimbo, mishumo yekuongorora, uye data rekuyedza impedance.