Basic PCB Terminology List Iwe Unofanira Kuziva

Nhanganyaya kune Basic PCB Terminology

Kunzwisisa chirevo chine chekuita nePrinted Circuit Boards (PCBs) kwakakosha kune chero munhu ane chekuita nekugadzirwa kwemagetsi, kugadzira, kana kusangana. Kunyangwe iwe uri mainjiniya, tekinoroji, kana anofarira, kuva nekunzwisisa kwakasimba kwePCB teminologi inogonesa kutaurirana kunoshanda uye kunzwisisa mukati memunda. Iri rekutanga PCB terminology runyorwa rinoshanda sechinhu chinongedzo chekuzvijaira iwe neakakosha mazwi uye pfungwa dzinowanzo sangana muPCB-ane chekuita nenhaurirano uye zvinyorwa. Nekuwana ruzivo rwekushanda rweaya mazwi, iwe unenge wakashongedzerwa zvirinani kufamba munyika yePCB uye kuita nhaurirano dzine musoro nezve dhizaini, kugadzira, kuunganidza, kuedza, uye kugadzirisa matambudziko. Ngationgororei akakosha ePCB mazwi anoumba zvivharo zveiyi inonakidza uye ine simba ndima.

 PCB Base Materials

• Substrate: Base insulating zvinhu, kazhinji FR-4 fiberglass.
• Prepreg: Fiberglass sheet ine resin, inoshandiswa mumapuranga akawanda.
• Copper foil: Nhete dzemhangura dzichigadzira masekete.
• Core: Central substrate layer mune multilayer board.
• Resin: Epoxy polymer bonding layers pamwechete.
• Weave: Fiberglass reinforcement pattern.
• Dielectric: Insulating zvinhu pakati conductors; FR-4's dielectric constant is ~4.
• Kuomesa: Maitiro ekubatanidza foil uye prepreg layer uchishandisa kupisa uye kumanikidza.
• High-frequency laminates: Zvinhu zvakaita se laminate yakasarudzika ine kurasikirwa kwakaderera kana Teflon yekushandisa RF/microwave.
• Thermal conductivity: Kugona kwechinhu kuitisa kupisa.
• CTE (Coefficient of Thermal Expansion): Material kuwedzera/contraction pamwe tembiricha.

Kugadzirwa kwePCB

• CAM (Computer Aided Manufacturing): Kushandiswa kwekombuta software kubatsira mukushandurwa kwemafaira ekugadzira ekushandisa uye kugadzira maitiro.
• Etching: Iyo kemikari maitiro ekubvisa mhangura isingadikanwi kubva kuPCB, ichisiya chete inodiwa yemhangura mitsetse nemapadhi.
• Photoresist: Chinhu chinonzwa chiedza chakaiswa kuPCB. Kana yakavhenekerwa nechiedza uye yakagadziridzwa, inoumba chipingamupinyi chekudzivirira pamusoro penzvimbo dzemhangura dzisingafanirwe kuiswa.
• Tenting: Maitiro ekuvhara vias (makomba) ane photoresist kuvadzivirira panguva etching.
• Solder mask: A anodzivirira layer, kazhinji girinhi asi inowanikwa mavara akasiyana-siyana, iyo inoshandiswa pamusoro PCB kudzivirira solder mabhiriji uye kudzivirira mhangura kubva zvakatipoteredza zvinhu.
• Silkscreen: Mutsara weingi mamaki akaiswa kuPCB kuratidza nzvimbo dzekuiswa, mareferenzi madeta, marogo, bvunzo mapoinzi, uye rumwe ruzivo.
• Kupera: Iyo electrochemical maitiro ekuwedzera simbi (kazhinji mhangura) kuPCB, kunyanya mumakomba akacherwa kugadzira vias.
• Panel: Bhodhi hombe ine akawanda ega PCB magadzirirwo. Iyi nzira inoshandiswa pakuita basa rekugadzira. Mushure mekugadzirwa, pani inoputswa kuti iparadzanise maPCB ega.
• Kuomesa: Maitiro ekubatanidza akawanda akaturikidzana ezvinyorwa pamwechete uchishandisa kupisa uye kumanikidza, anowanzo shandiswa mumultilayer PCB.
• PTH (Yakanyudzwa Neburi): Gomba muPCB rave electroplated kubvumira magetsi kubatana pakati akasiyana akaturikidzana bhodhi.
• OSP (Organic Solderability Preservative): Rudzi rwekupedzisa kwepamusoro rinoiswa kuPCB kuti iwedzere kutengesa kwayo uye kudzivirira mhangura kubva kune oxidation.
• HDI (High Density Interconnect): Mhando yePCB dhizaini nekugadzira inoshandisa diki geometries uye yakasimba kushivirira kubvumira zvimwe zvikamu munzvimbo diki.
• Microvia: Iyo diki kwazvo kuburikidza, inowanzo shandiswa muHDI dhizaini, iyo inobatanidza maseru mu multilayer PCB.
• Impedance control: Maitiro muPCB yekugadzira yekuona kuti mamwe matera ane chaiyo impedance, yakakosha kune yakakwirira-frequency dhizaini.
• HASL (Hot Air Solder Leveling): Nzira yekushandisa yakatetepa ye solder pamusoro pemapedhi emhangura paPCB kuvandudza solderability.
• Huremu hwemhangura/ukobvu: Ukobvu hwemhangura yemhangura paPCB, inowanzoyerwa muma ounces paskweya tsoka.
• Surface kupera: Iyo yekupedzisira inodzivirira uye inotengeswa layer inoiswa kune yakafumurwa mapedhi emhangura paPCB. Mienzaniso inosanganisira OSP, HASL, ENIG (Electroless Nickel Immersion Gold), nezvimwe.
• Kuvigwa kuburikidza ne: A via iyo inobatanidza mukati meiyo multilayer PCB uye isingasviki kune ekunze maseru.
• Bofu kubudikidza ne: A via iyo inotanga pane yekunze layer asi inomira pane yemukati layer, isingapfuuri nepakati pebhodhi rose.
• Gerber faira: Iyo yakajairwa faira fomati ine ruzivo nezve dhizaini yePCB, inoshandiswa nevagadziri kugadzira bhodhi.
• Annular Ring: Nzvimbo yemhangura pad inotenderedza gomba rakacherwa muPCB.
• Backdrilling: Iyo nzira yekubvisa chikamu chisina kushandiswa cheyakaputirwa nepakati-gomba kuderedza parasitic capacitance.
• Bare Board: PCB yakagadzirwa asi isina zvinhu zvakaunganidzwa pairi.
• Breakaway Tab: Madiki ma tabo anobata maPCB ega ega pamwechete mukati mepaneti hombe, anozoputswa gare gare.
• Kuba Mhangura: Mhangura mapatani akawedzerwa kune ekunze akaturikidzana ePCB kuti abatsire kuve nechokwadi chendiro yebhodhi pabhodhi panguva yekugadzira.
• Electroless Copper: Mutsara mutete wemhangura wakaiswa kemikari pasina magetsi, unowanzo shandiswa sefanotungamira kune electroplating yakawedzera mhangura.
• ENIG (Electroless Nickel Immersion Gold): Rudzi rwepamusoro pekupedzisira rinoshandiswa paPCBs, rinosanganisira pasi pedhiri re nickel ine yakatetepa yakanamwa yegoridhe pamusoro.
• Epoxy Resin: Mhando yepolymer inoshandiswa kubatanidza zvidimbu zvePCB yakawanda.
• Flash Gold: Iro rakatetepa kwazvo regoridhe rakanamirwa pamusoro penickel, rinoshandiswa zvakanyanya kudzivirira uye kwete kusona.
• Rwomukati Matanho mukati me multilayer PCB, izvo zvisingaonekwe kubva kunze.
• Legend: Rimwe izwi resikikirini, mavara akadhindwa uye mamaki paPCB.
• NPTH (Isina-Yakaputirwa Neburi): Makomba ari muPCB asina kuputirwa nemhangura, anowanzo shandiswa kukwirisa kana mechanical zvinangwa.
• Pad: Chidimbu chezvinhu conductive paPCB apo chikamu chinosungirirwa uchishandisa solder.
• Peelable Mask: Yechinguva solder mask iyo inogona kupepetwa mushure mekutengesa.
• Reference Marker: Mucherechedzo paPCB, kazhinji chiratidzo "+", chinoshandiswa kurongedza panguva yegungano.
• Kugovera: Nzira yekugadzira mitsetse isina kusimba pane pani yePCBs, ichivabvumira kuti iparadzwe nyore nyore mushure mekugadzirwa.
• SMOBC (Solder Mask Pamusoro Pemhangura Yakashama): Maitiro ekuti solder mask inoiswa zvakananga pamusoro pemhangura isina chinhu, uye ipapo mapedhi emhangura akafumurwa anoputirwa.
• Danho uye Dzokorora: Maitiro ekuti imwe PCB dhizaini inodzokororwa kakawanda pane hombe pani kuti ikwidze kugadzira.
• Kuponi Yekuedza: Chikamu chidiki chakawedzerwa kune PCB pani ine zvimiro zvekuyedza, zvinoshandiswa kuratidza maitiro ekugadzira.

PCB Assembly

• Conformal Coating:Chivharo chekudzivirira chinoshandiswa kune yakadhindwa yedunhu bhodhi kudzivirira kukuvadzwa kubva kuhunyoro, guruva, makemikari uye tembiricha yakanyanyisa.
• SMT (Surface Mount Technology): Zvikamu zvinotengeswa zvakananga kumusoro kwePCB pads kwete kuburikidza nemakomba. Iyi tekinoroji inovandudza chikamu density uye inobvumira imwe compact PCB dhizaini.
• Reflow Soldering: Iyo process ye soldering SMT components nekudziya iyo yese PCB gungano muovheni inobatika. Izvi zvinonyungudutsa solder paste, kusimbisa kubatana pakati pezvikamu nePCB.
• Wave Soldering: Nzira yekugadzira inotungamira kuburikidza-mugomba zvikamu kuburikidza nekupfuura PCB pamusoro pemasaisai eyakanyungudutswa solder.
• Hand Assembly: Manual tekinoroji inosanganisira soldering uye mounting components. Inonyanya kushandiswa kune mabhechi madiki, rework, uye kugadzirisa.
• Sarudza uye Nzvimbo: Muchina otomatiki unotora zvinhu uye wozviisa nemazvo paPCB usati watengeswa.
• Screen Kudhinda: Nzira yekushandisa stencil kuisa solder paste kuPCB, zvichiita kuti solder iiswe chaizvo paizoiswa zvikamu.
• AOI (Automated Optical Inspection): Nzira yekuongorora yekuona iyo inoshandisa otomatiki muchina kutarisisa iyo yakaunganidzwa PCB yehurema.
• J-STD-001: Iyo yakabatanidzwa indasitiri chiyero inotsanangura zvinhu, nzira, uye nzira yekusimbisa yekugadzira emhando yepamusoro soldered yekubatanidza.
• BGA (Ball Grid Array): Rudzi rwepamusoro pegomo pasuru yemasekete akabatanidzwa. Inoshandisa solder mabhora pazasi sezvo connectors ayo.
• QFN (Quad Flat No-leads): Imwe mhando yepasi pegomo pasuru yemasekete akabatanidzwa, anoratidzwa nekuve nematerminals pazasi asi pasina anobuda anotungamira.
• Underfill: Epoxy inodzivirira inoshandiswa pakati peBGAs kana mamwe machipisi nePCB. Inobatsira kusimbisa majoini e solder uye kudzivirira kubva kune mechanical stress.
• X-Ray Kuongorora: Nzira yekuedza isingaparadzi uchishandisa X-ray imaging yekuongorora majoini emukati ekutengesa, kunyanya anobatsira maBGA uye mamwe masangano akavanzika.
• Thru-Hole Zvikamu: Zvikamu zvinouya nezvinotungamira zvakagadzirirwa kutengeswa mumakomba-maburi muPCB.
• ECO (Engineering Shanduko Order): Gwaro repamutemo rinoratidza shanduko kune PCB dhizaini kana bhiri rezvinhu. Inoshandiswa kana shanduko dzichidikanwa mushure mechikamu chekutanga chekugadzira.
• Depaneling: Maitiro ekuparadzanisa maPCB ega ega kubva kune makuru mapaneru mushure mekuita kwegungano. Izvi zvinowanzoitika kana akawanda maPCB akagadzirwa pane imwechete pani yekugadzira kunyatsoita.

PCB Parameters

• Layers: Nhamba yezvikamu zvemhangura.
• ukobvu: Ukobvu hwakazara hwebhodhi.
• Nhamba yepamusoro: Ratio yehukobvu kune hushoma hwekutsvakira / nzvimbo yakafara.
• nenamo: Kupatsanurana pakati pemapini kana zvisaririra.
• Track/Trace: Kuitisa copper circuit.
• Space: Mukaha pakati pematanho ari pedyo.
• Mutsara wakafara: Upamhi hwekutsvaga.
• Annular ring: Copper pad nzvimbo yakatenderedza gomba.
• Yakapera gomba saizi: Diameter yegomba rakacherwa mushure mekuputira.
• kubvumidza: Kusiyana kunobvumirwa mumaparameter.
• Kuchenesa: Distance between copper features on the same layer.
• Mask kuwedzera: Pullback ye solder mask kubva kumhangura kumucheto.
• Stackup: Kurongeka kwezvikamu mune multilayer PCB.
• Kudira pasi: Kubatanidza nzvimbo dzakasarudzika kune pasi kuderedza EMI.
• Guard trace: Ground trace pakati pemasaini maviri echiratidzo kudzivirira crosstalk.

PCB Kuedza & Hunhu

• ICT (In-Circuit Test): Nzira yekuyedza umo muchina unotarisa PCB ine vanhu vazhinji, uchitsvaga zvikabudura, kuvhura, kuramba, capacitances, uye humwe huwandu hwakakosha kuti uve nechokwadi chekusangana kwakaringana.
• Flying Probe Test: Mhando yeICT isingade muyedzo. Maprobe anofambiswa anoshandiswa kukurumidza kuyedza maPCB pasina kudiwa kwemubhedha wakatsaurirwa mubhedha-we-zvipikiri bvunzo gadziriso.
• Functional Test: Mushure meICT, iyo PCB inoedzwa inoshanda kutevedzera yekupedzisira nharaunda yemagetsi uye kuona kuti inoita basa rayo rayakada.
• AOI (Automated Optical Inspection): Nzira yekuongorora yekuona apo muchina unotarisisa PCB yakaunganidzwa yechikamu uye kuremadza.
• X-ray kuongorora: Kusina-kuparadza kuyedzwa kuongorora masolder majoini pasi peBGAs kana zvimwe zvinhu izvo soldering isingaonekwe neziso rakashama.
• Boundary Scan (JTAG): Iyo nzira yekuyedza inoongorora kubatanidza solder uye kuona kushanda kwezvimwe zvikamu.
• Kusvirwa-mukati Test: Mabhodhi anopihwa simba uye anoiswa mukupisa kwekushushikana kuti aone kutadza kwekutanga.
• Environmental Stress Test: Kufumura iyo PCB kune akati wandei mamiriro ezvakatipoteredza kuti ive nechokwadi chekushanda mukati mekupisa, humidity, uye zvimwe zvakatipoteredza.
• Thermal Cycling: Kuedza mhinduro yePCB kune shanduko yekushisa kuti uone zvingangoita solder joint kukundikana.
• Vibration uye Shock Test: Inoteedzera zvinonetsa zvemagetsi izvo PCB ingatarisana nayo mukati mehupenyu hwayo kuti ive nechokwadi chekuvimbika.
• Golden Board: Bhodhi rereferensi rinozivikanwa kuti harina hurema iro rinofananidzwa nemaPCB anogadzirwa.
• DFT (Design For Testability): Kugadzira PCB nenzira inoita kuti ive nyore kuyedza, kuve nechokwadi chakanyanya mhedzisiro uye kugadzirisa zvine hunyanzvi.
• FCT (Functional Circuit Test): Muedzo unotarisa kana PCB ichishanda sezvakarongerwa, kazhinji kusanganisira firmware uye kupindirana kwesoftware.
• Coverage Analysis: Kuongorora kuti yakawanda sei yePCB yedunhu inoedzwa neazvino nzira dzekuyedza.
• FA (Kutadza Kuongorora): Kana pakatadza bvunzo, FA inoitwa kuti inzwisise chikonzero chekutadza.
• Goho Analysis: Inoyera chiyero chemapuranga akanaka anogadzirwa kune ese mabhodhi anogadzirwa. Iyo yakakosha metric yekuongorora kushanda kwekugadzira uye mhando.
• Kugona Kwekuita (Cpk): Chiyero chezviverengero chekuongorora kana maitiro achigona kuburitsa chinobuda mukati memiganhu yakatarwa.
• DPPM (Kukanganisa paMiriyoni): Metric inoyera mwero wekukanganisa kwemaitiro ekugadzira.
• RoHS Compliance Testing: Inovimbisa kuti gungano rePCB rinoomerera kune Restriction yeHazardous Substances Directive, iyo inomisa kushandiswa kwezvinhu zvine njodzi.
• Kuenderera mberi uye Kuzviparadzanisa Muedzo: Inova nechokwadi chekuti kubatanidza magetsi kwakazara uye kuti hapana kubatanidza kusingatarisirwe.

PCB Kugadzirisa & Kugadziriswa

• Spin zvakare: Maitiro ekuvandudza uye kugadzira vhezheni itsva yePCB marongero kugadzirisa nyaya dzakaonekwa mune yakapfuura vhezheni.
• Errata: Yakanyorwa nyaya dzinozivikanwa kana kukanganisa paPCB. Inopa ma workaround kana kugadzirisa kune vashandisi nevagadziri.
• Vanosvetuka: Mhinduro dzenguva pfupi uchishandisa waya kubatanidza mapoinzi maviri paPCB, inowanzo shandiswa kunzvenga nzira yakatyoka kana kugadzirisa chikanganiso chekugadzira.
• Rework: Maitiro ekugadzirisa kukanganisa paPCB dzakatounganidzwa. Izvi zvinogona kusanganisira kutsiva chikamu, soldering, uye mamwe mabasa.
• Hot Air Rework: Kushandisa pfuti yemhepo inopisa kuita desolder uye kutsiva zvisizvo zveSMT zvikamu pasina kukuvadza zvikamu zvevavakidzani.
• BGA Rework Station: Midziyo yakasarudzika yekubvisa uye kutsiva Ball Grid Array (BGA) mapakeji, ayo anoda kurongeka chaiko uye kutonga kupisa.
• Hand Soldering: Manual soldering tekinoroji inoshandiswa kutsiva chikamu, kuwedzera jumpers, kana kugadzirisa solder mabhiriji.
• Desoldering: Maitiro ekubvisa solder kubva pajoinhi, kazhinji kushandisa zvishandiso senge solder wick, desoldering pombi, kana mhepo inopisa.
• Pad Repair: Kugadzirisa mapedhi akasimudzwa kana akakuvadzwa paPCB, kazhinji uchishandisa epoxy uye foil yemhangura.
• Trace Repair: Kudzoreredza gwara rakakuvadzwa kana rakatyoka uchishandisa conductive inki, tepi yemhangura, kana waya dzejumper.
• Conformal Coating Rework: Kubvisa nekuisa zvakare chivharo chekudzivirira kubva muchikamu chePCB kufambisa kugadzirisa.
• Kugadzirisa: Chiito chekugadzirisa PCB nekucheka zvisaririra, kuwedzera jumper waya, kana kuita dzimwe shanduko dzemuviri kugadzirisa zvikanganiso zvekugadzira kana kuwedzera mashandiro.
• Underfill Removal: Kubvisa epoxy kubva pasi pechikamu (seBGA) kufambisa kubviswa kwayo nekutsiviwa.
• Reballing: Maitiro ekutsiva mabhora ekutengesa ari pasi peBGA kana imwe bhora grid package.
• Thermal Profileing: Kugadzirisa iyo inopisa mbiri yemidziyo yekutengesa kuti ienderane nezvinodiwa chaizvo zvePCB, kuve nechokwadi chekuyerera kwakaringana solder uye kunamatira kwechikamu panguva yekudzokorora.
• Yakatarisana neIR (Infrared): Kushandisa infrared heaters kuisa kupisa kune imwe nzvimbo yePCB, zvichibvumira kubviswa kwakanangwa kwechikamu pasina kukanganisa bhodhi rose.
• Epoxy Kurapa: Kushandisa kupisa kana UV mwenje kuomesa yakaiswa epoxy, inowanzo shandiswa panguva yepedhi kana kutsvaga kugadzirisa.
• Kukohwa kwechikamu: Kubvisa zvinhu zvinoshandisika kubva pabhodhi rakakanganisika kuti zvishandiswezve kana kuongororwa.
• PCB Kuchenesa: Kubvisa zvisaririra, zvinosvibisa, kana marara mushure mekugadzirisa maitiro uchishandisa zvinonyungudutsa kana ultrasonic cleaners.
• Inspection: Kushandisa magnification, AOI, kana X-ray maitiro ekuona kunaka kwekugadzirisa nekugadzirisa basa.

mhedziso

Kazhinji, mazwi ane chekuita nemaPCB anosanganisira zvinhu zvakasiyana-siyana zvekugadzira magetsi, kugadzira, kuunganidza, kuyedza, kudzora mhando, uye kuvimbika. Sezvaunonyatsoongorora zvakadzama mundima yePCB engineering, mazwi aya achave akajairika kwauri. Gwaro iri rinogona kushanda senzvimbo inokosha yekuvandudza ndangariro yako uye kusimbisa kunzwisisa kwako mazwi akakosha ePCB. Nekuwedzera ruzivo rwako rwemazwi ePCB, uchave wakagadzirira zviri nani kufamba nematambudziko ePCB engineering uye kubatsira mukusimudzira masisitimu emagetsi matsva.

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2.Conformal Coating Process muPCBA
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