Probe Kadhi PCB: Injiniya Yakarurama yeWafer-Level Testing

ziviso

Mukuyedzwa kwewafer-level, iyo probe kadhi PCB inoshanda seyakakosha interface pakati peATE system uye semiconductor wafer, kuve nechokwadi chechokwadi chemagetsi kubata uye chiratidzo chekuvimbika. Sezvo chip geometries ichiramba ichidzikira uye bvunzo zvinodiwa zvichiwedzera kuomarara, nyanzvi dzebvunzo dzekutarisana dzave dzakakosha. Kadhi rekuferefeta PCB rinovhara mukaha uripo pakati pezvetsono arrays uye otomatiki bvunzo zvishandiso, zvichiita kuti vagadziri vaone mashandiro ekufa vasati vapedza dicing uye kurongedza.

Chii chinonzi Probe Card PCB?

Tsanangudzo uye Core Function

Kadhi reprobe PCB ibhodhi rekuyedza rakagadzirwa nehunyanzvi rinobatanidza tsono dzakasiyana-siyana dzeprobe nemidziyo yekuyedza otomatiki. Rinobatsira kutapurirana kwechiratidzo, kugoverwa kwesimba, uye kudzika kwepasi uku richichengetedza kugadzikana kwechiratidzo chekuyedza pakati pemazana kana zviuru zvenzvimbo dzekubata. Bhodhi iri rinoshanda sechimiro chekutsigira michina uye setiweki yemagetsi yekuyedza parametric uye functional yewafer-level.

Zvikamu zvakakosha zveProbe Card PCB

Iyo yakajairwa probe kadhi PCB gungano rinobatanidza zvinhu zvina zvakakosha: iyo probe tsono array ye wafer yekubata, iyo PCB interface layer ine inodzorwa impedance traces, iyo ATE yekubatanidza system, uye mechaniki yekutsigira furemu. Chikamu chega chega chinofanirwa kushanda mukonzati kuti chikwanise kudzokororwa kubatwa kwemagetsi nemafa pads anoyera asingasviki 100 micrometers mupitch.

Probe Card PCB vs. Load Board PCB

Magadzirirwo Dhizaini yeProbe Kadhi PCB

Multi-Layer Stack-Up Architecture

Magadzirirwo ePCB emakadhi eprobe anowanzo shandisa zvikamu zvitanhatu kusvika makumi maviri kana kupfuura kuti zvienderane nezvinodiwa zvakaoma zvekufambisa masaini uye zvekudzivirira. Chikamu chezvikamu chinoparadzanisa mapuraneti ezviratidzo kubva pasi nemagetsi, nezvikamu zvakatsaurirwa zvekudzora zvinotarisira zviratidzo zvekutevedzana kwekuyedza. Kusarudzwa kwezvinhu kunosanganisira high-Tg FR-4, BT resin, kana laminates dzakagadzirwa nelaminate dzakaderera zvichienderana nezvinodiwa zvefrequency uye zvinodiwa zvekupisa.

Advanced Via Technology

Fine-pitch probe arrays inoda sophisticated interconnect solutions:

• Laser-drilled microvias -Gonesa nzira dzakaomarara dzine madhayamita madiki se75 mamicrometer ekugovera-high-density chiratidzo chekugovera.
• Mapofu nekuvigwa vias - Batanidza zvidimbu zvemukati usingadyi nzvimbo yepamusoro, uchiwedzera probe pad density.
• Via-mu-pedhi kuvaka -Inoderedza saizi yepadhi uchichengetedza mashandiro emagetsi, yakakosha kune sub-100µm pitch application.

Impedance Kudzora muProbe Kadhi PCB

Kudzorwa impedance dhizaini yakakosha pakuita. Signal traces inogadzirwa kusvika 50-ohm single-end kana 100-ohm mutsauko, ine layer-to-layer ukobvu kushivirira kunoitwa mukati me ± 10% kuchengetedza kuwirirana. Ndege dzepasi dzakamisikidzwa padhuze nezviratidzo zvinopa yakaderera-inductance nzira dzekudzoka dzinoderedza kukanganiswa kwemagetsi.

Yakanaka-Pitch uye Yepamusoro-Frequency Dhizaini Matambudziko

Ultra-Yakanaka Pitch Zvinodiwa

Yemazuva ano ndangariro uye logic zvishandiso zvinowanzoda probe pitches pazasi 50 micrometer, kusunda miganhu yekugadzira. Izvi zvinoda kunyoresa kurongeka zvirinani pane 25 micrometers pane yese panhizha, inowanikwa kuburikidza nepamusoro ekufungidzira masisitimu uye muripo wekupisa panguva yekugadzira. Chero kusarongeka kunoturikira zvakananga kuprobe tip yekumisikidza kukanganisa uye zvinogona kufa kukuvara.

High-Frequency Signal Kutendeseka

Paunenge uchiyedza michina yekumhanya-mhanya inoshanda kupfuura 10 GHz, probe kadhi PCB dhizaini inofanirwa kugadzirisa kurasikirwa kweganda, kunyura dielectric, uye impedance discontinuities. Yakaderera-kurasikirwa laminates ine dissipation zvinhu pazasi 0.004 inova yakakosha. Kusiyana kwepairi nzira kunoda kwakanyatso kudzora nzvimbo, nehurefu hwakaenzana hwakachengetwa mukati memirimita imwe kudzivirira kukanganisa-kukonzeresa.

Crosstalk Mitigation Strategies

Dense probe arrays anogadzira yakakosha crosstalk njodzi pakati pepedyo nzira dzechiratidzo:

• Ground-signal-ground routing -Inoparadzanisa masaini akakosha ane yakatsaurirwa pasi traces pakati peanoshanda conductors.
• Embedded capacitance zvinhu -Ipa yakagovaniswa decoupling pasina kushandisa bhodhi real estate.
• Solid reference ndege - Shield yemukati masaini masiginecha kubva kune emagetsi coupling pamativi ese e dielectric.

ATE System Interface yeProbe Kadhi PCB

Platform-Specific Connectivity

Probe kadhi PCB magungano anofanirwa kuenderana nemakanika uye emagetsi zvinotsanangurwa nevagadziri veATE vakaita seAdvantest V93000 kana Teradyne UltraFlex mapuratifomu. Interface yekubatanidza inogadzirwa kuti ienderane nepini kuverenga kubva kumazana kusvika kumakumi ezviuru, ine yakatsanangurwa mepu yechiratidzo inoenzanisa nzira dzekuyedza kuongorora nzvimbo. Mechanical kunyoresa maficha anovimbisa inodzokororwa docking alignment.

Grounding Architecture Integration

Kudzika kunoshanda pakati pekadhi rekuongorora PCB neATE system yakakosha pakudzivirira ruzha uye kuyerwa kwechiyero. Mapini akawanda epasi akagoverwa mukati mese interface yekubatanidza inoderedza impedance yepasi uye kudzivirira kuwanda kwazvino. Ndege dzepasi dzakaparadzirwa dzinopa yunifomu yereferensi mukana pane iyo test interface, kubvisa zvishwe zvepasi zvinokanganisa kunaka kwechiratidzo.

Interface Durability Specifications

ATE interfaces inosangana nezviuru zvematenderedzwa ekubatanidza mukati mehupenyu hwavo hwesevhisi. Connector masisitimu anofanirwa kumirisana nekupfeka kwemakanika uku uchichengetedza mashandiro emagetsi. Mabatirwo akaiswa goridhe ane akajairika masimba anovimbisa kuramba kuri pasi pe50 milliohms papini, ukuwo mapini egwara anodzivirira kufamba kweparutivi kunogona kukuvadza matipi ekuongorora.

Kuvimbika uye Kufunga Kwekupisa kweProbe Kadhi PCB

Thermal Management Zvinodiwa

Probe yekuyedza mashandiro anogona kusimudza tembiricha yekadhi PCB pamusoro pe125 ° C nekuda kwekupera simba kubva kune ese ari maviri bvunzo wedunhu uye nemidziyo iri mukuyedzwa. Kusarudzwa kwezvinhu kunofanirwa kuverengera coefficient yemafuta ekuwedzera anoenderana pakati pePCB substrate, probe substrate, uye silicon wafer kudzivirira kushushikana kwemagetsi. Polyimide uye yakakwira-Tg epoxy masisitimu anochengetedza kugadzikana kwedimensional pane tembiricha bhasikoro.

Material CTE Matching

Thermal yekuwedzera kusawirirana pakati pezvishandiso zvinoburitsa kushushikana painterface uye majoini ekutengesa:

• CTE targeting - Zvishandiso zvePCB zvekadhi reprobe zvinosarudzwa kuti zvienderane nekuwedzera kweprobe assembly, kazhinji 12-17 ppm/°C.

• Kugadzikana kwehukuru - Kunodzivirira kudonha kwenzvimbo yekuongorora panguva yekufamba kwekupisa uye kunoita kuti nguva yekushanda kwekugadzira iwedzere.

• Kutendeseka kweInterface - Inochengetedza kuvimbika kwekubatana kwemagetsi kunyangwe kupisa kuchikonzera kushushikana kwezvinhu.

Probe Contact Urefu

Kuvimbika kwemagetsi vakaroorana zvakananga ne probe tsono mechanical kuneta. Sezvo maprobes achidzokorora kubata pad pedhi, mamaki ekukwesha anokura uye kuramba kubata kunowedzera. Iyo kadhi yekuferefeta PCB inofanirwa kuchengetedza kushanda kwemagetsi kunyangwe matipi ekuferefeta achidzikisira, anowanikwa kuburikidza nekushomeka-kupokana kugovera network uye redundant pasi mabatiro.

Manufacturing Techniques eProbe Card PCB

Precision Drilling uye Layer Registration

Laser drilling masisitimu anogadzira mamicrovias ane madhayamita madiki se75 micrometer, achigonesa high-density interconnects inodiwa kune yakanaka-pitch probe arrays. Layer-to-layer kunyoreswa kunofanirwa kuwana huchokwadi mukati memakumi maviri neshanu mamicrometer pane iyo panhizha, zvichidikanwa advanced optical alignment masisitimu uye muripo wekuchinja kwezvinhu panguva yekugadziriswa.

Surface Pedzisa Sarudzo

Kuvimbika kweProbe contact kunoda kupera kwepasi kunopokana neoxidation uku ichipa zvinhu zvemagetsi zvinowirirana. ENEPIG (Electroless Nickel Electroless Palladium Immersion Goridhe) inopa yakanakisa corrosion kuramba uye akawanda reflow kugona. Kunyudzwa kwegoridhe kupedzisa kunopa nzvimbo dzakati sandara dzekumhara, kunyangwe zvipingamupinyi zvenickel zvichidikanwa kudzivirira kusvibiswa kwegoridhe.

Hunhu Hwokusimbisa Maitiro

Vayedzi vekuongorora mapurobe vanoongorora kuenderera mberi kwemagetsi uye kupatsanurwa pasina kushandisa michina yekuedza yakatsaurirwa, inonyanya kukosha pakuvaka PCB card probe card. Huwandu hwekugadzira hunogona kururamisa michina yekuedza yakagadzirwa inoongorora impedance parameters, capacitance loading, uye contact resistance panguva imwe chete. Optical inspection systems inosimbisa saizi yemapedhi uye kurongeka kwekunyoresa isati yagadzirwa.

Zvishandiso uye Maitiro muProbe Card PCB Technology

Primary Application Domains

Probe kadhi PCB magungano anoiswa mukati mekuyedzwa kwendangariro (DRAM, NAND flash), logic IC verification (processors, GPUs), uye RF mudziyo hunhu (simba amplifiers, transceivers). Imwe neimwe dura rekushandisa inoisa zvakati zvinodiwa: ndangariro kuyedzwa kunosimbisa kuenderana kunoenderana nemazana ekufa panguva imwe chete, nepo RF yekuyedza inoisa pamberi pekuchengetedzwa kwechiratidzo mumamirimita-wave frequency.

Kuwedzera Pin Count Demands

Madhizaini emazuva ano anogara achipfuura zviuru gumi zvekuferefeta nzvimbo dzekusangana sezvo kufa kuomarara kunowedzera uye nzira dzekuyedza dzakafanana dzichiwedzera. Izvi zvinotyaira kadhi rekuferefeta PCB yakananga kune yakakwira layer kuverenga, yakatsetseka mutsara wakafara pazasi pe50 micrometers, uye akanyanya kuomesesa emagetsi ekugovera network anounza akagadzikana mavoltages mumapoka makuru.

HDI uye Advanced Integration

Matekinoroji ePCB ane density yakakura uye akafanana nesubstrate ari kugadziriswa kubva kumaapplication emafoni kuenda kuPCB yemakadhi eprobe. Maitiro aya anogonesa maficha akanaka kwazvo ane ma microvia akaunganidzwa, zvichideredza kureba kwenzira yesignali uye kuvandudza mashandiro emagetsi. Mamwe madhizaini epamusoro anobatanidza probe substrate zvakananga nePCB, zvichibvisa nhanho imwe chete yekubatanidza uye kuvandudza planarity.

mhedziso

Iyo probe kadhi PCB inomiririra yakakosha junction poindi mukugadzira semiconductor, uko chaiyo engineering inogonesa otomatiki kuyedzwa kwemasekete akabatanidzwa. Zvido zvekugadzira zvinosanganisira yakanaka-pitch yekubatanidza, yakakwirira-frequency siginecha routing, kugadzikana kwemafuta, uye kunyatsogadzira kwekugadzira kunonetsa kwakajairika PCB kugona. Sezvo semiconductor node dzichiramba dzichiderera uye bvunzo kuomarara kunowedzera, probe kadhi PCB tekinoroji inofanirwa kushanduka kuburikidza nezvinhu zvepamberi uye nzira dzakanatswa.

KuHighleap Electronics, tinogadzira maPCB akagadzirwa nemazvo ekushandisa mukuyedza masemiconductor:

• Yakanaka-pitch HDI kugona -Kunyoreswa kwechokwadi kusvika ku25µm kwenzvimbo dzekuferefeta pazasi 50µm ine laser-drilled microvias.
• Yakadzorwa impedance dhizaini - 50Ω uye 100Ω mitsetse yekufambisa ine multilayer stack-ups kubva pa6 kusvika 20+ layer.
• Advanced surface finishes - ENEPIG uye kunyudza goridhe kune yakavimbika probe kuonana uye yakawedzera hupenyu hwesevhisi.
• ATE papuratifomu hunyanzvi -Madhizaini edhizaini anowirirana neAdvantest, Teradyne, uye mamwe makuru ebvunzo mapuratifomu.

Bata timu yedu yeinjiniya kuti mukurukure kuti kugona kwedu kugadzira PCB makadhi eprobe kunogona sei kutsigira zvinodiwa zvako zvekuyedza padanho rewafer.